CN210379111U - Miniaturized piece formula pottery hall integrated circuit packaging structure - Google Patents
Miniaturized piece formula pottery hall integrated circuit packaging structure Download PDFInfo
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- CN210379111U CN210379111U CN201921560087.2U CN201921560087U CN210379111U CN 210379111 U CN210379111 U CN 210379111U CN 201921560087 U CN201921560087 U CN 201921560087U CN 210379111 U CN210379111 U CN 210379111U
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- mounting groove
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Abstract
A miniaturized chip type ceramic Hall integrated circuit packaging structure comprises a ceramic shell with a mounting groove, a Hall circuit chip packaged in the mounting groove and a gold-plated cover plate covering the outer edge of the mounting groove and used for hermetically packaging the mounting groove, wherein the Hall circuit chip is connected with the ceramic shell through a silicon-aluminum wire, the ceramic shell adopts a ceramic shell with more than three electric connection channels, and three bonding regions in the ceramic shell are respectively connected with three pressure welding points of the Hall circuit chip; the ceramic shell of the electric connection channel is characterized in that three bonding pads distributed on the surface of the ceramic shell outside are respectively and electrically connected with three bonding areas inside the ceramic shell.
Description
Technical Field
The utility model relates to a miniaturized piece formula pottery hall integrated circuit packaging structure belongs to magnetic sensor preparation technology and equips technical field.
Background
The hall ic works on the principle of hall effect, and detects and controls many non-electric and non-magnetic physical quantities such as force, moment, pressure, stress, position, displacement, speed, acceleration, angle, angular velocity, revolution number, revolution speed, etc. by converting them into electric quantities, and can also measure and control electric quantities such as current, voltage, power, etc. in full isolation.
The Hall integrated circuit is widely applied to the fields of petroleum exploration, sea area measurement, aviation and aerospace in China with a plurality of advantages, and with the promotion of localization, higher requirements are put forward on miniaturization and reliable packaging of the Hall integrated circuit for in-situ substitution. The Hall integrated circuit device comprises a Hall chip and an amplifying circuit, and when a miniaturized chip type ceramic Hall integrated circuit packaging structure is not adopted, the Hall integrated circuit device adopts a structure that epoxy or other insulating materials are added into an aluminum metal shell for filling, so that the size is large, and errors are easy to occur in the electric connection performance during application.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a miniaturized piece formula pottery hall integrated circuit packaging structure, not only compact structure, small and have better stability and reliability, satisfied high reliable hall piece formula integrated circuit's gas tightness packaging structure's needs moreover. A ceramic housing with electrical connection channels is especially chosen.
The technical scheme of the utility model is that: miniaturized piece formula pottery hall integrated circuit packaging structure, including a ceramic package that has the mounting groove, encapsulate in hall circuit chip and lid in the mounting groove are in the outward flange of mounting groove and be used for the gas tightness encapsulation the gilding apron of mounting groove, wherein hall circuit chip passes through the silica-alumina silk and is connected with ceramic package, and ceramic package adopts the ceramic package that has electric connection passageway more than three, the three pressure welding point of hall circuit chip is do not connected to the inside three bonding of ceramic package to in the three pad one-to-one of outside at ceramic package surface distribution. The ceramic shell of the electric connection channel is characterized in that three bonding pads distributed on the surface of the ceramic shell outside are respectively and electrically connected with three bonding areas inside the ceramic shell.
Has the advantages that: the utility model relates to a miniaturized piece formula pottery hall integrated circuit selects the ceramic package that has the electric connection passageway to satisfy hall integrated circuit's miniaturization and the higher requirement that the reliability encapsulation provided. The ceramic shell has the length of 4.0mm, the width of 3.2mm and the thickness of 1.4mm, and the electrical connection performance is reliable.
The ceramic shell is 4.0mm in length, 3.2mm in width and 1.4mm in thickness, and a two-stage stepped structure is arranged in the mounting groove, and the height of each layer of steps is 0.5 mm.
The Hall circuit chip is arranged in the mounting groove of the ceramic shell, the space of the chip mounting groove is 1.5mm multiplied by 2.0mm multiplied by 0.5mm, and the operability of the process is ensured on the basis of small volume.
And three pressure welding points of the Hall circuit chip are connected with three bonding areas inside the ceramic shell and three bonding pads on the surface of the ceramic shell. The design of the printed wire connection in the tube shell not only meets the requirement of mutual connection, but also ensures that the shell has small volume, compact structure and high installation reliability.
The gold plating cover plate is packaged on the tube shell through gold-tin solder, so the width of the packaging edge needs to ensure the air tightness and reliability of the packaging on the basis of considering the small volume. The packaging process adopts a gold-tin welding ring structure, the usage amount of gold-tin welding flux is controlled, and the height of the whole packaging structure is controlled.
The utility model discloses hall piece formula integrated circuit's packaging structure's compact structure, small (4.0mm 3.2mm 1.7mm), reduce to about 50% of traditional gas tightness packaging structure (4.5mm 6mm 1.7mm), and guaranteed the realization of hall piece formula integrated circuit gas tightness encapsulation.
The utility model discloses a miniaturized piece formula pottery hall integrated circuit packaging structure, compact structure, small not only has satisfied the sealing performance needs moreover, and the leak hunting qualification rate after the encapsulation is more than 95%.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic cross-sectional view of FIG. 1;
FIG. 3 is a schematic view of the internal structure of a ceramic shell of selected electrical connection channels of the present invention;
fig. 4 is a schematic diagram of the external structure of the ceramic shell of fig. 3 of an alternative electrical connection channel of the present invention.
Detailed Description
For a better understanding of the technical content of the present invention, specific embodiments are described below in conjunction with the accompanying drawings.
As shown in fig. 1, the miniaturized chip type ceramic hall ic package structure includes: 1. a ceramic housing having a mounting groove; 2. the Hall circuit chip is packaged in the mounting groove; 3. and a gold-plated cover plate covering the outer edge of the mounting groove and used for air-tight packaging. The miniaturized chip type ceramic Hall integrated circuit packaging structure comprises a ceramic shell with a mounting groove, a Hall circuit chip packaged in the mounting groove and a gold-plated cover plate covering the outer edge of the mounting groove and used for air-tight packaging, wherein the Hall circuit chip is connected with the ceramic shell through a silicon-aluminum wire, three bonding areas inside the ceramic shell are respectively connected with three pressure welding points of the Hall circuit chip, and three bonding pads are distributed on the surface of the ceramic shell in the external in a one-to-one correspondence manner. The utility model provides a packaging structure's compact structure, small (4.0mm 3.2mm 1.7mm) and for about 50% of traditional monolithic hall integrated circuit gas tightness encapsulation shell volume, guaranteed the realization of hall integrated circuit gas tightness encapsulation.
In this embodiment, the hall circuit chip is preferably a hall circuit chip made of a silicon single crystal material, and is bonded in the ceramic tube shell by silver paste, and the connection between the chip and the ceramic shell is completed by a silicon-aluminum wire ultrasonic pressure welding process. And a printed wire 5 used for connecting the Hall circuit and three soldering lugs 6 distributed on the outer surface of the ceramic shell are arranged in the ceramic shell. The design of the connection of the internal lead 4 ensures that the shell has small volume and compact structure.
Claims (2)
1. A miniaturized chip type ceramic Hall integrated circuit packaging structure is characterized by comprising a ceramic shell with a mounting groove, a Hall circuit chip packaged in the mounting groove and a gold-plated cover plate covering the outer edge of the mounting groove and used for hermetically packaging the mounting groove, wherein the Hall circuit chip is connected with the ceramic shell through a silicon-aluminum wire, the ceramic shell adopts a ceramic shell with more than three electric connection channels, three bonding areas in the ceramic shell are respectively connected with three pressure welding points of the Hall circuit chip, and three bonding pads are distributed on the surface of the ceramic shell in a one-to-one correspondence mode; the ceramic shell of the electric connection channel is characterized in that three bonding pads distributed on the surface of the ceramic shell outside are respectively and electrically connected with three bonding areas inside the ceramic shell.
2. The package structure of claim 1, wherein the ceramic package has a length of 4.0mm, a width of 3.2mm, a thickness of 1.4mm, and a two-step structure in the mounting groove, and the height of each step is 0.5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921560087.2U CN210379111U (en) | 2019-09-19 | 2019-09-19 | Miniaturized piece formula pottery hall integrated circuit packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921560087.2U CN210379111U (en) | 2019-09-19 | 2019-09-19 | Miniaturized piece formula pottery hall integrated circuit packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210379111U true CN210379111U (en) | 2020-04-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921560087.2U Active CN210379111U (en) | 2019-09-19 | 2019-09-19 | Miniaturized piece formula pottery hall integrated circuit packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210379111U (en) |
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2019
- 2019-09-19 CN CN201921560087.2U patent/CN210379111U/en active Active
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