CN210359667U - Automatic soldering tin machine of selectivity wave-soldering - Google Patents
Automatic soldering tin machine of selectivity wave-soldering Download PDFInfo
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- CN210359667U CN210359667U CN201920594101.4U CN201920594101U CN210359667U CN 210359667 U CN210359667 U CN 210359667U CN 201920594101 U CN201920594101 U CN 201920594101U CN 210359667 U CN210359667 U CN 210359667U
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- tin
- soldering
- scaling powder
- station
- powder coating
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Abstract
The utility model discloses an automatic soldering tin machine of selectivity wave-soldering, which comprises a bod, the part is equipped with unloading mechanism and soldering tin mechanism on the PCB board respectively about on the organism, soldering tin mechanism is including the carousel that is located the upper part and scribble scaling powder mechanism and be located the decollator and the tin stove of lower part, decollator, tin stove are fixed on the organism, the carousel is rotatory to be set up on the decollator, the equidistance is provided with four stations that are located same circumference on the carousel, and unloading mechanism is used for the material loading on the PCB board is close to first station, scribbles scaling powder mechanism and sets up in one side of second station, and the tin stove sets up in the bottom of third station, is equipped with the tin spraying mouth on the tin stove, and the bottom of each station all is equipped with the tin spraying. The utility model discloses can satisfy the high-quality welding of requirement high accuracy of small area, the tin point is even, and is of high quality and stable, full process automation, and the multistation goes on in step, and production is quick, efficient.
Description
Technical Field
The utility model relates to a soldering tin machine, concretely relates to automatic soldering tin machine of selectivity wave-soldering.
Background
The common wave soldering adopts furnace-passing type welding, the speed is slow, only large-area soldering tin has advantages, and the requirement of small area on high precision and high quality welding cannot be met. In order to meet the process requirements and improve the efficiency, a selective wave soldering automatic tin soldering machine is developed, and the selective wave soldering automatic tin soldering machine has the characteristics of rapidness, accuracy, excellence and stability aiming at point-to-point welding.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's is not enough, provides an automatic soldering tin machine of selectivity wave-soldering, and it is mainly applied to the point pair spot welding, has quick welding, welds firmly, the tin point is even, excellent quality and stable advantage.
The technical scheme of the utility model as follows:
the automatic selective wave soldering tin machine comprises a machine body, wherein a PCB (printed circuit board) feeding and discharging mechanism and a tin soldering mechanism are arranged on the left portion and the right portion of the machine body respectively, the tin soldering mechanism comprises a rotary disc positioned on the upper portion, a scaling powder coating mechanism, a divider and a tin furnace positioned on the lower portion, the divider and the tin furnace are fixed on the machine body, the rotary disc is rotatably arranged on the divider, four stations positioned on the same circumference are arranged on the rotary disc at equal intervals, the first station is close to the PCB feeding and discharging mechanism and used for feeding, the scaling powder coating mechanism is arranged on one side of the second station, the tin furnace is arranged at the bottom of the third station, tin spraying nozzles are arranged on the tin furnace, tin spraying openings corresponding to the tin spraying nozzles are formed in the bottom of each station, and the fourth station is used.
Further, PCB board feeding and discharging mechanism includes that PCB carries dish, robot arm and lift, PCB carries dish, lift to be fixed on the organism, the robot arm is located PCB carries the top of dish, the one end of robot arm is fixed the top of lift drives through the lift and goes up and down.
Further, the other end of the robot arm is provided with a lifting cylinder and a magnet, the magnet is located above the PCB carrying disc, the magnet is fixedly connected with the robot arm through the lifting cylinder, and the PCB is sucked through the magnet.
Furthermore, a first CCD positioning device is arranged on the lifting cylinder.
Further, the first CCD positioning device includes a CCD camera and a light source.
Furthermore, a second CCD positioning device is arranged on one side of the first station.
Further, the scaling powder coating mechanism comprises a scaling powder coating cylinder and a pressing block, the scaling powder coating cylinder and the pressing block are located above the second station, the bottom of the scaling powder coating cylinder is a discharging end, the pressing block is arranged on one side of the bottom of the scaling powder coating cylinder, the top of the scaling powder coating cylinder is a material conveying end, and the top of the scaling powder coating cylinder is connected with a scaling powder storage box.
Further, the tin stove includes the furnace shaft, sets up servo motor and tin spraying funnel on the furnace shaft, it is equipped with to insert in tin spraying funnel's the feed inlet the tin spraying mouth, be equipped with soldering tin in the furnace shaft and hold chamber, soldering tin feeding runner and soldering tin ejection of compact runner, tin spraying funnel with soldering tin holds the chamber intercommunication, soldering tin feeding runner's one end with soldering tin holds the chamber intercommunication, soldering tin feeding runner's the other end with soldering tin ejection of compact runner intercommunication, soldering tin feeding runner's one end is provided with the impeller, the impeller pass through the transmission shaft with servo motor connects, the transmission shaft overcoat is equipped with high temperature bearing, soldering tin feeding runner's the other end with tin spraying mouth intercommunication.
Furthermore, an opening cover plate is arranged between the turntable and the tin furnace.
Furthermore, the PCB feeding and discharging mechanism and the soldering tin mechanism are covered with protective covers, a smoke suction and exhaust mechanism is arranged above the soldering tin mechanism, and the smoke suction and exhaust mechanism is arranged on the protective covers.
Compared with the prior art, the beneficial effects of the utility model reside in that:
1. the utility model can realize full-automatic point-to-point welding, material is taken through the robot arm, the first CCD positioning device and the second CCD positioning device realize positioning, the tin soldering process is completed through four stations, and finally, automatic blanking is performed through the manipulator;
2. the four stations of the welding process are synchronously carried out, so that the production is rapid and the efficiency is high;
3. soldering tin is carried out after the soldering flux is coated in the welding process, so that the welding is firmer;
4. the utility model discloses can satisfy the high-quality welding of requirement high accuracy of small area, the tin point is even, excellent quality and stability.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a three-dimensional structure diagram of an automatic selective wave soldering machine provided by the present invention;
FIG. 2 is a schematic front view of an automatic selective wave soldering machine according to the present invention;
FIG. 3 is a schematic side view of an automatic selective wave soldering machine according to the present invention;
FIG. 4 is a schematic structural view of the tin furnace of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In order to explain the technical solution of the present invention, the following description is made by using specific examples.
Examples
Referring to fig. 1, 2 and 3, the present invention provides a selective wave soldering automatic tin soldering machine, including a machine body 1, a left part and a right part of the machine body 1 are respectively provided with a PCB board loading and unloading mechanism 2 and a tin soldering mechanism 3, the tin soldering mechanism 3 includes a turntable 31 and a flux coating mechanism 32 which are located on an upper part, and a divider 33 and a tin furnace 34 which are located on a lower part, the divider 33 and the tin furnace 34 are fixed on the machine body 1, the turntable 31 is rotatably arranged on the divider 33, the turntable 31 is equidistantly provided with four stations 35 which are located on the same circumference, a first station is close to the PCB board loading and unloading mechanism 2 for loading, the flux coating mechanism 32 is arranged on one side of a second station, the tin furnace 34 is arranged at the bottom of a third station, the tin soldering furnace 34 is provided with a tin spraying nozzle 344, the bottom of each station 35 is provided with a tin spraying opening corresponding to the tin spraying nozzle 344, the fourth station is used for blanking.
Wherein, PCB board unloading mechanism 2 includes that PCB carries a dish 21, robot arm 22 and lift 23, PCB carries a dish 21, lift 23 to be fixed on the organism 1, robot arm 22 is located PCB carries the top of dish 21, robot arm 22's one end is fixed lift 23's top is passed through lift 23 and is driven.
The other end of robot arm 22 is provided with lift cylinder 24 and magnet 25, magnet 25 is located the top of dish 21 is carried to the PCB, magnet 25 through lift cylinder 24 with robot arm 22 rigid coupling, through magnet 25 absorbs the PCB board, be provided with first CCD positioner 26 on the lift cylinder 24, first CCD positioner 26 includes CCD camera 261 and light source 262.
And a second CCD positioning device 4 is arranged on one side of the first station.
The scaling powder coating mechanism 32 comprises a scaling powder coating cylinder 321 and a pressing block 322 which are positioned above the second station, the bottom of the scaling powder coating cylinder 321 is a discharging end, the pressing block 322 is arranged on one side of the bottom of the scaling powder coating cylinder 321, the top of the scaling powder coating cylinder 321 is a material conveying end, and the top of the scaling powder coating cylinder 321 is connected with a scaling powder storage box.
As shown in fig. 4, the tin furnace 34 includes a furnace body 341, a servo motor 342 and a tin spraying funnel 343 which are arranged on the furnace body 341, the tin spraying nozzle 344 is inserted into a feed port of the tin spraying funnel 343, a solder receiving cavity 345, a solder receiving channel 346 and a solder discharging channel 347 are arranged in the furnace body 341, the tin spraying funnel 343 is communicated with the solder receiving cavity 345, one end of the solder receiving channel 346 is communicated with the solder receiving cavity 345, the other end of the solder receiving channel 346 is communicated with the solder discharging channel 347, an impeller 348 is arranged at one end of the solder receiving channel 346, the impeller 348 is connected with the servo motor 342 through a transmission shaft 349, a high temperature bearing 350 is sleeved outside the transmission shaft 349, and the other end of the solder receiving channel 346 is communicated with the tin spraying nozzle 344.
Further, an opening cover plate 5 is arranged between the turntable 31 and the tin furnace 34. The tin furnace can be charged in the tin spraying hopper 343 by opening the cover opening plate 5.
The working principle is as follows: the robot arm 22 is positioned by the first CCD positioning device 26 to realize grabbing of the PCB on the PCB carrying disc 21, then the PCB is placed on the first station on the rotary disc 31 through positioning of the second CCD positioning device 4, then the rotary disc 31 rotates clockwise by 90 degrees and arrives at the second station, the scaling powder coating cylinder 321 drives the pressing block 322 to press down the PCB, the scaling powder coating cylinder 321 coats the scaling powder on the PCB, the scaling powder coating cylinder 321 resets after finishing, then the rotary disc 31 rotates clockwise by 90 degrees and arrives at the third station, at the moment, the DC wire is inserted into the PCB, the DC wire is welded by automatic tin spraying of the tin furnace 34, then the rotary disc 31 rotates clockwise by 90 degrees and arrives at the fourth station, and automatic blanking of the manipulator is realized. The whole process is automatic, and in the tin soldering process, four stations are synchronously performed, so that the production efficiency can be greatly improved.
When the soldering tin furnace 34 is used, the soldering tin can be heated in advance, the soldering tin is heated to a molten state, when the temperature sensing of the soldering tin furnace 34 is greater than 280 degrees, the servo motor 342 can be driven, the optimal tin temperature and constant temperature (control heating plate) can be selected according to different products, the height and the duration of a wave crest (acceleration and delay control of the servo motor) are realized, in a standby state, the servo motor 342 is started, the soldering tin flows into the soldering tin feeding runner 346 from the soldering tin containing cavity 345, the soldering tin gushes out from the soldering tin nozzle 344 under the action of the impeller 348 through the soldering tin discharging runner 347, and then falls back into the soldering tin containing cavity 345 through the soldering tin hopper 343, so that the soldering tin circulates at a constant speed, and during.
Preferably, in order to protect safety, protective covers are arranged around the PCB loading and unloading mechanism 2 and the soldering tin mechanism 3 in a covering mode, a smoke suction and exhaust mechanism is arranged above the soldering tin mechanism 3, and the smoke suction and exhaust mechanism is arranged on the protective covers and can effectively remove smoke generated during soldering.
To sum up, the utility model discloses can satisfy the high-quality welding of requirement high accuracy of small area, the tin point is even, and is of high quality and stable, full process automation, and the multistation is gone on in step, and production is quick, efficient.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The utility model provides an automatic soldering tin machine of selectivity wave-soldering, includes the organism, its characterized in that: the machine body is provided with a PCB feeding and discharging mechanism and a soldering tin mechanism on the left and right parts, the soldering tin mechanism comprises a rotary disc positioned on the upper part, a scaling powder coating mechanism, a divider and a tin furnace positioned on the lower part, the divider and the tin furnace are fixed on the machine body, the rotary disc is rotatably arranged on the divider, four stations positioned on the same circumference are equidistantly arranged on the rotary disc, a first station is close to the PCB feeding and discharging mechanism and used for feeding, the scaling powder coating mechanism is arranged on one side of a second station, the tin furnace is arranged at the bottom of a third station, a tin spraying nozzle is arranged on the tin furnace, a tin spraying opening corresponding to the tin spraying nozzle is arranged at the bottom of each station, and a fourth station is used for discharging.
2. The automatic selective wave soldering machine according to claim 1, characterized in that: the PCB loading and unloading mechanism comprises a PCB carrying disc, a robot arm and a lifter, wherein the PCB carrying disc and the lifter are fixed on the machine body, the robot arm is located above the PCB carrying disc, and one end of the robot arm is fixed at the top of the lifter and is driven to lift through the lifter.
3. The automatic selective wave soldering machine according to claim 2, characterized in that: the other end of the robot arm is provided with a lifting cylinder and a magnet, the magnet is located above the PCB carrying disc, and the magnet is fixedly connected with the robot arm through the lifting cylinder and absorbs the PCB.
4. The automatic selective wave soldering machine according to claim 3, characterized in that: and a first CCD positioning device is arranged on the lifting cylinder.
5. The automatic selective wave soldering machine according to claim 4, characterized in that: the first CCD positioning device comprises a CCD camera and a light source.
6. The automatic selective wave soldering machine according to claim 1, characterized in that: and a second CCD positioning device is arranged on one side of the first station.
7. The automatic selective wave soldering machine according to claim 1, characterized in that: the scaling powder coating mechanism comprises a scaling powder coating cylinder and a pressing block, the scaling powder coating cylinder and the pressing block are located above the second station, the bottom of the scaling powder coating cylinder is a discharge end, the pressing block is arranged on one side of the bottom of the scaling powder coating cylinder, the top of the scaling powder coating cylinder is a conveying end, and the top of the scaling powder coating cylinder is connected with a scaling powder storage box.
8. The automatic selective wave soldering machine according to claim 1, characterized in that: the tin stove includes the furnace shaft, sets up servo motor and tin spraying funnel on the furnace shaft, it is equipped with to insert in tin spraying funnel's the feed inlet tin spraying nozzle, it holds chamber, soldering tin feeding runner and soldering tin ejection of compact runner to be equipped with soldering tin in the furnace shaft, tin spraying funnel with soldering tin holds the chamber intercommunication, soldering tin feeding runner's one end with soldering tin holds the chamber intercommunication, soldering tin feeding runner's the other end with soldering tin ejection of compact runner intercommunication, soldering tin feeding runner's one end is provided with the impeller, the impeller pass through the transmission shaft with servo motor connects, the transmission shaft overcoat is equipped with high temperature bearing, soldering tin feeding runner's the other end with tin spraying nozzle intercommunication.
9. A selective wave soldering machine according to claim 1 or 8, characterized in that: an opening cover plate is arranged between the turntable and the tin furnace.
10. The automatic selective wave soldering machine according to claim 1, characterized in that: the PCB feeding and discharging mechanism and the soldering tin mechanism are provided with protective covers around in a covering mode, a smoke suction and exhaust mechanism is arranged above the soldering tin mechanism, and the smoke suction and exhaust mechanism is arranged on the protective covers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920594101.4U CN210359667U (en) | 2019-04-26 | 2019-04-26 | Automatic soldering tin machine of selectivity wave-soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920594101.4U CN210359667U (en) | 2019-04-26 | 2019-04-26 | Automatic soldering tin machine of selectivity wave-soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210359667U true CN210359667U (en) | 2020-04-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920594101.4U Expired - Fee Related CN210359667U (en) | 2019-04-26 | 2019-04-26 | Automatic soldering tin machine of selectivity wave-soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210359667U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110202232A (en) * | 2019-04-26 | 2019-09-06 | 东莞市科立电子设备有限公司 | A kind of selectivity wave-soldering automatic tin welding machine |
-
2019
- 2019-04-26 CN CN201920594101.4U patent/CN210359667U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110202232A (en) * | 2019-04-26 | 2019-09-06 | 东莞市科立电子设备有限公司 | A kind of selectivity wave-soldering automatic tin welding machine |
| CN110202232B (en) * | 2019-04-26 | 2024-02-13 | 广东盛控达智能科技有限公司 | Automatic soldering tin machine of selectivity wave soldering |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200421 Termination date: 20210426 |
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| CF01 | Termination of patent right due to non-payment of annual fee |