CN210328442U - Component stacking type connection realization module and circuit of separation circuit - Google Patents

Abstract

The utility model provides a component stacking type connection realization module and a circuit of a separation circuit, wherein the separation circuit comprises at least two circuit components which are used for series connection and/or parallel connection; the circuit components directly weld corresponding pins of the components according to the connection structure of the circuit, so that the components form a combined module according to the connection mode required by the circuit, and a circuit board and a connecting wire are omitted; the circuit component is in a square shape, and a welding disc is arranged on a partial area of the surface of the square shape. The utility model discloses modular components and parts have been adopted to separation circuit's components and parts pile up formula and have been connected realization module and circuit to and the convenient welded welding dish that sets up on components and parts, thereby can carry out welded connection in order to take the mode of building blocks and form circuit unit, carry out the direct welding realization circuit between the components and parts in three-dimensional space, the circuit of PCB restriction in the circuit board plane than prior art has wideer design space.

Description

Component stacking type connection realization module and circuit of separation circuit

Technical Field

The utility model relates to a circuit hardware realizes module and relevant circuit, what especially relate to is a brand-new circuit realizes module and the circuit arrangement who forms from this.

Background

In the circuit arrangement mode in the prior art, except for the integrated circuit which adopts a highly integrated circuit mode, most of the traditional circuits and the peripheral circuits of the integrated circuit chip still need to adopt separate circuits, namely circuit components need to adopt separate circuit components to carry out circuit connection according to a circuit schematic diagram, thereby realizing the circuit function.

Common separating circuit components mainly comprise resistors, capacitors, diodes, triodes and the like, and the traditional circuit components are welded on a printed circuit board in a pin welding mode; of course, simple circuits may also be connected directly by wires, such as some experimental unit circuits.

With the progress of circuit processing technology, especially for facilitating automatic welding processing technology, the current separated circuit components do not use a mode of pin welding any more, but the components such as resistors, diodes, triodes and the like are designed into a mode of chip components, especially the chip components are universal with the chip processing technology of an integrated circuit chip, and all the chip components can be pasted on a printed circuit board through a chip automatic welding machine.

However, both the conventional pin soldering technique and the chip component mounting process are generally performed by soldering the components to a printed circuit board, which is a PCB board, and the PCB board is pre-processed by a PCB board processing factory after being pre-designed, so that most of the wires are pre-printed on a flat insulating material, and the wires are printed on the insulating material according to the pre-designed circuit structure.

This conventional circuit design is subject to the planar printing process of the circuit board, the entire circuit is limited by the size of the circuit board, and the circuit needs to be laid out and formed in the plane of the circuit board; and because a circuit board is needed, the space size of the circuit board cannot be flexibly designed, and the designed and realized circuit board size cannot be adapted to products with small sizes.

The circuit implementation shown in fig. 1 to 9 is a circuit module and a circuit structure that the applicant has already applied to, and please refer to the related art content described in the patent document cn201610259246. x. The prior art provides a three-dimensional circuit structure unit module and a circuit aiming at the defects of the prior art, which can realize the concept of three-dimensional architecture and stacked integration of the circuit. However, in the above circuit implementation manner in the prior art, the bonding pad area of each unit module is a strip-shaped structure arranged along the center of the module side, so that a cold joint is likely to occur during actual circuit bonding, and the stacking angle is often limited by the trend of the central strip-shaped structure, and finally a two-dimensional circuit board structure is still formed, which cannot completely break through the two-dimensional space limitation.

Accordingly, the prior art is yet to be improved and developed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a separation circuit's components and parts pile up formula and connect realization module and circuit can consider the implementation of its circuit in three-dimensional space to need not printed circuit board and wire, realize a simple but unrestricted free circuit and realize the module.

The technical scheme of the utility model as follows:

a modular circuit of a separation circuit comprises at least two circuit components which are connected in series and/or in parallel; the circuit component is in a square shape, and a welding disc is arranged on a partial area of the surface of the square shape; the circuit components are directly welded with the corresponding welding discs of the circuit components according to the connection structure of the circuit, so that the circuit components form a combined module according to the connection mode required by the circuit, and a circuit board and a connecting wire are omitted; wherein, the welding disk is arranged in a region arrangement mode of multiple times.

The modular circuit of any preceding claim, wherein the area of the bonding pad is configured to be recessed from a surface of the sidewall.

In the modular circuit, the length-width-height ratio of the square shape is set to be 3:2:1 or 3:1:1, and the same setting ratio in the unit of the minimum unit area is adopted for the area corresponding to the bonding pad.

A component stacking type connection realization module of a separation circuit is arranged for circuit components which are used for series connection and/or parallel connection in a circuit, the circuit components are arranged in a square shape, and welding discs are arranged on partial areas of the surface of the square shape; according to the connection structure of the circuit, the corresponding welding discs of the circuit components are directly welded, so that the circuit components form a combined module according to the connection mode required by the circuit, and a circuit board and a connecting lead are omitted; wherein, the welding disk is arranged in a region arrangement mode of multiple times.

The stacking connection of the components realizes the module, wherein, the region of the welding disc is formed by sinking from the surface of the side wall.

The component stacking type connection implementation module is characterized in that the length-width-height ratio of the square shape is set to be 3:2:1 or 3:1:1, and the same setting ratio with the minimum unit area as a unit is adopted for the area corresponding to the welding pad.

The component stacking type connection implementation module is characterized in that the circuit component comprises a resistor, and at least two end faces or at least one body side face of the resistor is provided with the welding discs.

The components and parts pile up formula and connect and realize the module, wherein, circuit components and parts still include the diode, set up the diode has two bonding pads of distinguishing different current direction, the bonding pad sets up on the side and/or the terminal surface of diode square body type form.

The device stacking type connection implementation module is characterized in that the circuit device further comprises a triode, and at least three different welding discs including a base electrode, a collector electrode and an emitting electrode are arranged in the square shape of the triode; the welding discs of the base electrode and the emitting electrode are respectively arranged on the end surfaces of two sides and the side surface part corresponding to the end surface, and the collector electrode welding disc is arranged at the middle position surrounding the square shape.

The utility model provides a disconnect circuit's components and parts pile up formula and connect realization module and circuit, owing to adopted the regional modularization circuit components and parts of multiple welding dish to can more make things convenient for design and automated processing, realize that the manufacturing of circuit board realizes in three-dimensional space completely, and breaks away from circuit board base plate and planar design's limitation, the three-dimensional modular circuit before comparing accords with the automated processing of computer more easily.

Drawings

Fig. 1 is a schematic circuit diagram of a first preferred embodiment of the present invention. 


Fig. 2 is a schematic diagram of a prior art circuit board corresponding to the circuit schematic diagram shown in fig. 1.


Fig. 3 is a schematic diagram of a prior art circuit block corresponding to the circuit schematic diagram of fig. 1.


Fig. 4 is a schematic diagram of a circuit module corresponding to the circuit diagram shown in fig. 3.


Fig. 5a is a schematic diagram of the most basic connection in a prior art circuit, i.e. a series-wise soldered connection. 


Fig. 5b is a schematic diagram of the most basic connection in a prior art circuit, i.e. a soldering connection in parallel. 


Fig. 6 is a schematic view of an alternative equivalent implementation of the stacking arrangement shown in fig. 5 a.

Fig. 7 is a schematic circuit diagram of a second preferred embodiment of the present invention.

Fig. 8 is a schematic diagram of a prior art circuit block corresponding to the circuit schematic diagram of fig. 7.


Fig. 9 is a schematic diagram of a prior art circuit modular product corresponding to the circuit schematic diagram of fig. 7.

Fig. 10a and 10b are schematic perspective views of different shapes that can be used for the triode of the circuit component module according to the present invention.

Fig. 10c and 10d are schematic perspective views of different shapes that can be used for the diodes of the circuit component module according to the present invention.

Fig. 11a and 11b are schematic diagrams of the bonding pad area of the diode in the circuit component module during circuit stacking and manufacturing according to the present invention.

Fig. 12a, 12b and 12c are schematic diagrams of the bonding pad area of the triode in the circuit component module when the triode is stacked to manufacture the circuit according to the present invention.

Detailed Description

The following describes in detail preferred embodiments of the present invention.

The utility model provides a component pile-up formula of separation circuit connects implementation method, it sets up to be used for two at least circuit components and parts of series connection and/or parallelly connected in the circuit, the utility model discloses method and circuit need not to utilize the circuit board, but set circuit components and parts to the shape of rule, carry out mutual grafting or welded mode and realize modularization pile-up formula circuit, follow the stable angle welding of circuit and be prior to the grafting. Due to the adoption of the modularized stacked circuit structure, the design of a free three-dimensional space can be carried out aiming at a simpler circuit, so that the thinking mode that the circuit is designed in a plane depending on a PCB (printed circuit board) in the existing circuit is broken through. Of course, to comparatively complicated circuit structure, need utilize the topological structure principle of mathematics to design to comparatively complicated circuit's core part can adopt the integrated circuit design, and designs into with integrated circuit chip and accord with the utility model discloses modular circuit's modular mode to make things convenient for the welding to form working circuit.

The utility model discloses each components and parts in the circuit can be according to the connection structure requirement of circuit schematic diagram, carry out suitable piling up with components and parts, and will correspond the connected mode that pin direct welding or grafting etc. made the electrical property switch on, make components and parts form the compound module and pile up the ization according to the connected mode that circuit schematic diagram needs, save circuit board and connecting wire, thereby can form the design that the volume is less and the volume is comparatively nimble, can form three-dimensional circuit module according to the circuit place space requirement of product, realize the circuit function.

Among components and parts pile up formula connection implementation method and the circuit structure, components and parts include resistance R10, R20, as shown in FIG. 1, resistance R1, R2, R3, as shown in FIG. 7, each resistance is except that the resistance is different, and its structure sets up similarly, mainly sets up resistance is square body form, for example the cuboid, and concrete size can set up according to actual needs, also can set up different size standards according to the requirement of dispelling the heat for example according to the electrical property. On each resistor, a bonding pad 110 is provided on at least both end faces. Thus the resistors are arranged in series so as to extend in an end-to-end welded connection.

Preferably, the resistor may be further provided as a pad extending from the end face to the body side face, i.e., an L-shaped pad, i.e., a pad electrically connected to a corresponding pad on the end face is provided on at least one body side face, and the length of the pad provided on the body side face of the resistor may be set to be more than half the length of the side face, as shown in fig. 3 and 4.

The specific connection principle is as shown in fig. 5a and 5b, and as shown in fig. 5a, the welding mode in series connection is to weld two components arranged side by side with a welding pad that is more than half of the length of the side surface, which is equivalent to connecting two resistors in series; as shown in fig. 5b, when connecting in parallel, the two side segment soldering pads of the two components can be respectively extended to the two side surfaces of the two sides, so that when the two components are arranged side by side, the soldering between the soldering pads at the two ends can be performed, thereby forming a parallel connection.

Fig. 5a and 5b show two basic connection unit ways of the present invention, and other various series-parallel circuit structures are realized by the combination of the above two basic connection ways, respectively, and aiming at different connection ways, the bonding pads on the components can be set to adopt different structural characteristics, such as the L-shaped bonding pad structure in fig. 5a is just a structure suitable for series connection, and the square C-shaped bonding pad structure in fig. 5b is just a structure suitable for parallel connection. The utility model discloses an among the components and parts welding disk structural configuration, can set up different structural standard with the series connection mode and the parallel mode of distinguishing resistance to and the structural mode of other components and parts, the polarity setting of diode especially etc. the standard of these structures is all waited for further development.

As shown in fig. 2, the schematic diagram of the circuit board of the PCB circuit implementation manner in the prior art, each component of the PCB circuit implementation manner needs to be soldered or soldered on a reserved position on a circuit board printed in advance, and the formed circuit product is obviously different from the product of the present invention.

In the component stacking type connection implementation method and the circuit module thereof, the component further includes a component having a polarity connection direction, such as a diode, as shown in fig. 3 and 4, the diode can be set to have the same shape as the resistor and also be set to be a square shape, and more preferably, the connection direction of the diode is set to be two welding discs distinguishing different current directions, such as a pattern or a bump which is positively increased with a mark, and the like, so that the design mode is more effective, and the asymmetric welding discs can be set, thereby ensuring the use of the polarity of the diode.

In components and parts pile up formula and connect implementation method and circuit thereof, components and parts still include the components and parts of more welding discs, for example triode and integrated circuit chip etc. the triode also sets up to the square body form to set up in the square body form and have including base, collecting electrode and the three different welding discs of projecting pole, like the enlarged stack circuit that fig. 8 and fig. 9 are shown, can use with inductive switch. The triode is provided with E, B, C three soldering pads, wherein the base module, i.e. the B module, is arranged at the middle position (under different soldering structure requirements, the soldering pads with three pins can also have other structure arrangements, for example, the base B module is arranged at one end side), and one side surface of the whole triode product is provided with an insulating surface, so as to be connected with other components such as a resistor or a diode at the corresponding other side surface, the specifically connected modular product is shown in fig. 9, but the specific product topology is not limited to the above combination mode, and the design soldering pad mode of the circuit components is not limited by the specific examples of each embodiment, as shown in fig. 6, the concatenation of fig. 5a can also be realized by adopting other stacking modes, because there is no plane and frame limitation of the circuit board, the possibility of realizing the circuit by the stacking mode of the present invention is far higher than the traditional PCB board mode, has more flexible design space.

The utility model discloses a modular circuit of separation circuit, the separation circuit comprises at least two circuit components used for series connection and/or parallel connection; the circuit components and parts are directly welded with corresponding pins of the components and parts according to the connection structure of the circuit, so that the components and parts form a combined module according to the connection mode required by the circuit, and a circuit board and a connecting wire are omitted. The components comprise resistors, diodes, triodes and the like, are all arranged in a square shape, and are provided with welding discs for welding. No matter in comparatively simple circuit and the separating circuit of a little complicacy, through the utility model discloses an above-mentioned modularization welded structure can realize the circuit module who need not circuit board and wire to conveniently realize the circuit product in the less space, and its design space is free, is favorable to producing brand-new circuit module.

The utility model discloses be applied to separation circuit's components and parts pile up formula and connect implementation module is for realizing above-mentioned circuit structure mode, and has carried out unique design's modular structure, and mainly to comparatively common circuit components and parts, for example resistance, electric capacity, diode, triode etc. it adopts external standardized modular structure, for example square body structure to can adopt comparatively unified modular size who conveniently connects, conveniently build the circuit with the mode of similar stacking blocks. On each circuit component, the structure in the body of the circuit component adopts the setting mode of respective circuit characteristics, for example, the resistor is still the resistor, the diode and the triode are respectively made of corresponding semiconductor silicon materials, and the square shape which is convenient to stack is adopted only in appearance. Use the utility model discloses the circuit design and the preparation mode of module and circuit, processing preparation that can be faster especially use in the automatic processing line that generates, owing to need not the course of working of wire and circuit board, processing technology is simpler, and flow and cycle from design to production will shorten greatly.

Pin quantity to different circuit components, what adopt in prior art is that the mode of participating in makes, and the utility model discloses a circuit components adopts is that the square body sets up the different welding dish region that is used for circuit connection on the surface, and pile up the formation circuit for conveniently forming the cordwood system, the gear of square body form sets up in unison, for example the length that circuit components of minimum basic unit adopted, it is wide, the high size is corresponding unit size, and can form the multiple relation each other, in order to make things convenient for the building block to pile up the size cooperation yardstick of formula, for example length is wide and high twice or triple, width and height equal or twice relation, when piling up the formation circuit laminating through welding dish region like this, just can conveniently form neat collocation, the circuit that forms will form more easily more neat space fit type form.

The circuit components applied to the separation circuit of the utility model not only comprise resistors, capacitors (ceramic capacitors, electrolytic capacitors), diodes, triodes and the like, but also can be applied to realize other components such as inductors, CMOS tubes and the like, even can be applied to the packaging structure of an integrated circuit chip to form a novel circuit component with a bonding pad structure on three dimensions, for example, for an existing component with more than three pins, such as an integrated circuit chip, the whole component can be arranged to form a long rectangular prism, the length may be N times, e.g., ten or twenty times, the width, each unit dimension in the length direction, the land area forming a node, therefore, the stacked separation circuit in the three-dimensional space can be conveniently and directly welded with the welding disc areas of other corresponding components in a three-dimensional mode without any conducting wires or PCB (printed circuit board).

As shown in fig. 10a and 10b, another embodiment of the circuit component module according to the present invention, for example, a triode, can adopt two types of size settings on a triode circuit component in a square shape, one of which is a ratio of length, width and height of 3:2:1, see fig. 10a, and another is a ratio of length to width to height of 3:1:1, although the actual arrangement is not limited to the two types described above, and more proportional size arrangements are possible. The different length, width and height dimensions arranged in a multiple manner facilitate the actual building block type circuit construction to form a relatively orderly circuit module three-dimensional structure. When the ratio of length to width to height is 3:2:1, two or three other circuit components can be conveniently matched in series or in parallel in the length and width directions, so that a three-dimensional circuit architecture can be really realized. When the length-width-height ratio is 3:1:1, three circuit components with other unit sizes can be connected in a matching way in the length direction, so that a building block type circuit structure is formed, and a three-dimensional circuit framework can be really realized.

Welding dish region on the circuit components and parts module is different from prior art's middle strip mode of setting, sets up on the tip and the side of module, sinks whole welding dish region from the lateral wall surface to convenient welding. The shape of the pad area may be different regular or irregular shapes, but preferably is square, and is also formed into a multiple region arrangement, for example, as shown in fig. 10b, the pad areas 310 and 320 are arranged as the minimum unit area, and are square, and the shape of the other side surface may be arranged as two or three times the minimum unit area, so as to form a region where two or three minimum unit area areas are combined side by side as the pad area. Therefore, in the process of designing a circuit by a computer, the region with the minimum unit area can be abstracted into a connection point by using a topological principle, and the region with two or three times of bonding pad regions can be abstracted into a line segment with two end points or a line segment with two end points and a middle point, so that the calculation processing of the computer in the process of designing the circuit is facilitated. The multiple arrangement of the welding disk areas facilitates the alignment of the welding areas between two modules welded together, facilitates the design and actual processing of the computer, such as welding of stacked disks, and reduces the error rate.

The triode is because the circuit components and parts of three pins, E (the projecting pole), B (the base), three pin electrode of C (the collecting electrode), consequently, form at least three types of welding dish regions that are used for circuit connection at the external surface of cube, the more convenient mode of setting is at two end lateral parts, form the terminal surface and adopt E electrode 310 and C electrode 320 near the side of terminal surface, and set up to B electrode 330 in the position of encircleing the centre, and for making things convenient for the collocation manufacturing circuit of cordwood system, each welding dish region sets into the region of multiple, and can form the welding dish from the side is recessed. The solder pad regions on different sides of the same electrode are not necessarily all used, for example, when the ratio of 3:2:1 or 3:1:1 is adopted for the diode or the triode shown in fig. 12a, 12b and 12c, the adopted solder pad regions are also correspondingly arranged in comparison with the minimum unit area region such as a square, and the solder pad regions can be arranged in a concave manner; the solder pad areas on different sides may be selected for series or parallel access to the circuit. In order to prevent unnecessary electrical conduction, the circuit component can be processed and manufactured in a mode of coating insulating glue or loading no conductive material during processing for the welding pad area which does not need to be connected with a circuit.

As shown in fig. 10c and 10d, also can be the diode cube sketch map of the circuit component module shown in the utility model, its setting is similar to the size proportion type form of fig. 10a and 10b, for distinguishing diode and triode, can adopt different colours, or print corresponding identification symbol and electrode symbol on the surface of circuit component, for realizing automated processing and assembly, can also set up corresponding breach structure etc. on the circuit component to realize the discernment of different components and parts, this is waited to further technical research and development. The soldering pan area 410 of the circuit component of the diode or the triode of the utility model adopts a multiple area setting mode, as shown in the proportion of 3:1:1 in fig. 11a and fig. 11b, the soldering pan area of the side surface and/or the end surface can be selected to realize corresponding circuit connection according to the requirements of series connection and parallel connection, soldering paste can be coated in the corresponding soldering pan area during soldering, and the soldering paste is heated and fused by a certain mode, such as infrared ray or high-frequency induction welding, and the like, so as to form firm soldering connection; because the corresponding contact welding of the welding disk area is adopted, the welding area is larger, the welding is easier to finish for a circuit, and the cold joint is not easy to form. To the soldering pan region that does not need to connect, if unsettled can not need the processing, perhaps, can use the insulating cement to coat isolated processing, through certain heat treatment, infrared ray for example, form insulating cement layer after the solidification, only leave the required soldering pan region of circuit connection, through the electric connection of soldering pan between the different components and parts in space, realized the circuit implementation structure that need not wire and circuit board carrier. Because the welding disk area is formed by recessing from the side surface or the end surface, the solder paste or the insulating glue can be accommodated in the recessed area, and the recessed arrangement mode is convenient for automatic processing of a machine.

In further improvement mode, circuit components and parts modular concept can also be applied to more integrated circuit chips and other components and parts etc. and these are more than the circuit components and parts or the set unit of three pin, can form on a plurality of bonding pad regions on chip components and parts square body surface with its pin to conveniently form three-dimensional circuit. The utility model discloses a modular design thinking further can use in integrated circuit layout design, owing to adopt be space three-dimensional circuit design thinking, can carry out the design of circuit in the space through computer and space topology principle, compares multilayer plane integrated circuit laying out design thinking before, and the space degree of freedom of its design is higher.

Compared with the smt (surface Mount technology) in the prior art, the three-dimensional circuit formed by the circuit components of the present invention can adopt bmt (block Mount technology) or dmp (direct Mount technology) technology, that is, the circuit assembly layout of the three-dimensional unit needs to be developed in the development of the future technology, so as to save the wires and the circuit board substrate, and the circuit components are directly designed and assembled to form the circuit, so as to directly perform the welding and manufacturing of the circuit. It must be noted that circuit components's square three-dimensional cylindricality itself forms through the encapsulation manufacturing, in fact is the encapsulation form of customs one-tenth like circuit components's such as the common resistance of prior art, diode and triode appearance, the utility model discloses a circuit components and parts identification mode also can form one set of different encapsulation forms to obtain standardized implementation and use.

It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are considered to be within the scope of the invention as defined by the following claims.

Claims (9)

1. A modular circuit of a separation circuit comprises at least two circuit components which are connected in series and/or in parallel; the circuit component is in a square shape, and a welding disc is arranged on a partial area of the surface of the square shape; the circuit components are directly welded with the corresponding welding discs of the circuit components according to the connection structure of the circuit, so that the circuit components form a combined module according to the connection mode required by the circuit, and a circuit board and a connecting wire are omitted; the welding disc is characterized in that the welding disc is arranged in a region arrangement mode which is multiple.

2. The modular circuit of claim 1, wherein the area of the bonding pad is configured to be recessed from a surface of the sidewall.

3. The modular circuit of claim 2, wherein the aspect ratio of the square shape is set to 3:2:1 or 3:1:1, and the same setting ratio in units of minimum unit area is adopted for the regions corresponding to the bonding pads.

4. A component stacking type connection realization module of a separation circuit is arranged for circuit components which are used for series connection and/or parallel connection in a circuit, the circuit components are arranged in a square shape, and welding discs are arranged on partial areas of the surface of the square shape; according to the connection structure of the circuit, the corresponding welding discs of the circuit components are directly welded, so that the circuit components form a combined module according to the connection mode required by the circuit, and a circuit board and a connecting lead are omitted; the welding disc is characterized in that the welding disc is arranged in a region arrangement mode which is multiple.

5. The stacked component connection module according to claim 4, wherein the solder pads are formed by recessing regions of the solder pads from the sidewall surface.

6. A component stacking type connection realization module as claimed in claim 5, wherein the length-width-height ratio of the square shape is set to 3:2:1 or 3:1:1, and the same setting ratio in units of minimum unit area is adopted for the regions corresponding to the bonding pads.

7. A component stacked connection implementation module as claimed in claim 6, wherein the circuit component includes a resistor, and the bonding pads are disposed on at least two end surfaces or at least one body side surface of the resistor.

8. A module for realizing stacked connection of components according to claim 6, wherein the circuit component further comprises a diode, and the diode is provided with two bonding pads for distinguishing different current directions, and the bonding pads are arranged on the side surface and/or the end surface of the square body shape of the diode.

9. A component stacking connection implementation module as claimed in claim 6, wherein the circuit component further comprises a triode, and at least three different bonding pads including a base, a collector and an emitter are disposed in the triode cube; the welding discs of the base electrode and the emitting electrode are respectively arranged on the end surfaces of two sides and the side surface part corresponding to the end surface, and the collector electrode welding disc is arranged at the middle position surrounding the square shape.

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