JP2023087886A - Electronic module, electronic device, intermediate connection unit, intermediate connection unit manufacturing method, and electronic module manufacturing method - Google Patents

Abstract

To realize further miniaturization of an electronic module.SOLUTION: An electronic module includes a first wiring board, a second wiring board arranged to face the first wiring board, an intermediate connection member disposed between the first wiring board and the second wiring board, and an electronic component, and the intermediate connection member includes an insulating substrate, first wiring disposed on the insulating substrate and electrically connected to the first wiring board, and second wiring electrically connected to the second wiring board, and the electronic component includes a first electrode joined to the first wiring and a second electrode joined to the second wiring.SELECTED DRAWING: Figure 4

Description

The present invention relates to a technique for laminating a first wiring board and a second wiring board.

An electronic device is known that includes an electronic module having a plurality of wiring boards. Due to the demand for miniaturization of electronic equipment, high-density mounting is required for electronic modules. A three-dimensional mounting structure configured by stacking a plurality of wiring boards in multiple stages is known as one structure for achieving high-density mounting. For the three-dimensional mounting structure, a method of connecting two wiring boards facing each other using solder balls and a method of connecting two wiring boards facing each other using an intermediate connection member having wiring are known. It is Patent Literature 1 discloses a three-dimensional mounting structure configured by connecting two mounting boards with an intermediate connection member.

Japanese Patent Application Laid-Open No. 2001-111232

In recent years, due to the demand for further miniaturization of electronic devices, electronic modules are also required to be further miniaturized.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to achieve further miniaturization of an electronic module.

The electronic module of the present invention comprises a first wiring board, a second wiring board arranged to face the first wiring board, and an intermediate wiring board arranged between the first wiring board and the second wiring board. a connection member; and an electronic component, wherein the intermediate connection member includes an insulating substrate; first wiring disposed on the insulating substrate and electrically connected to the first wiring board; and a second wiring electrically connected to two wiring boards, and the electronic component includes a first electrode joined to the first wiring and a second electrode joined to the second wiring. characterized by having

An intermediate connection unit of the present invention comprises an intermediate connection member having an insulating substrate and a plurality of wirings arranged on the insulating substrate, extending in a first direction, and arranged in a second direction intersecting the first direction. and an electronic component joined to two of the plurality of wires.

A method of manufacturing an intermediate connection unit according to the present invention comprises the steps of: preparing an intermediate body having an insulating base material; and a first conductive member disposed on the insulating base material and extending in a first direction; bonding a first electrode of an electronic component to the first conductive member of an intermediate body; and cutting the intermediate body in a second direction crossing the first direction. A method for manufacturing an intermediate connection unit.

A method of manufacturing an electronic module according to the present invention comprises: an insulating substrate; an intermediate connecting member disposed on the insulating substrate and having first wiring extending in a first direction; an electronic component having electrodes; and disposing the intermediate connection unit on a first wiring board to join the intermediate connection unit and the first wiring board. and placing a second wiring board on the intermediate connection unit and joining the intermediate connection unit and the second wiring board.

According to the present invention, further miniaturization of the electronic module can be achieved.

1 is an explanatory diagram of a digital camera that is an imaging device as an example of an electronic device according to a first embodiment; FIG. 1A is a plan view of an imaging module as an example of an electronic module according to a first embodiment; FIG. (b) is a cross-sectional view of the imaging module according to the first embodiment. 2 is an enlarged cross-sectional view of the essential parts of the imaging module according to the first embodiment; FIG. (a) is a perspective view of an intermediate connection member according to the first embodiment. (b) is a perspective view of an intermediate connection unit according to the first embodiment. (c) is a cross-sectional view of the intermediate connection unit according to the first embodiment. (a) to (g) are explanatory diagrams of a method for manufacturing the intermediate connection unit according to the first embodiment. (a) to (d) are explanatory diagrams of a method for manufacturing the imaging module according to the first embodiment. (a) to (c) are explanatory diagrams of a method for manufacturing the imaging module according to the first embodiment. (a) is a perspective view of an intermediate connection unit according to a second embodiment. (b) is a cross-sectional view of an intermediate connection unit according to the second embodiment. (c) is a cross-sectional view of an intermediate connection unit according to the second embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.

[First embodiment]
FIG. 1 is an explanatory diagram of a digital camera 600, which is an imaging device as an example of electronic equipment according to the first embodiment. A digital camera 600 is an interchangeable-lens digital camera and includes a camera body 601 . A lens unit 602 including lenses is detachable from the camera body 601 . A lens unit 602 is an interchangeable lens, that is, a lens barrel.

The camera body 601 includes a housing 611 and an imaging module 200 and an image processing module 400 arranged inside the housing 611 . The imaging module 200 and the image processing module 400 are electrically connected via a flexible printed wiring board 950 so as to be able to communicate with each other. Image data generated by the imaging module 200 is transmitted to the image processing module 400 via the flexible printed wiring board 950 .

The imaging module 200 is an example of an electronic module and has a three-dimensional mounting structure. The imaging module 200 has circuit units 201 and 202 and a plurality of intermediate connection units 300 that are an example of at least one intermediate connection unit. The circuit unit 201 is an example of a first circuit unit, and the circuit unit 202 is an example of a second circuit unit.

The image processing module 400 has a printed wiring board 401 and an image processing device 402 which is a semiconductor element mounted on the printed wiring board 401 . Image processing device 402 is, for example, a digital signal processor. The image processing device 402 is configured to apply image processing to image data acquired from the imaging module 200 .

2A is a plan view of the imaging module 200, and FIG. 2B is a cross-sectional view of the imaging module 200. FIG. In FIG. 2A, illustration of the circuit unit 201 is omitted for explanation. FIG. 2(b) is a cross-sectional view of the imaging module 200 along line IIB-IIB shown in FIG. 2(a).

The circuit unit 201 is a printed wiring board, a printed circuit board, or a semiconductor package, and is, for example, a printed circuit board in the first embodiment. The circuit unit 202 is a printed wiring board, a printed circuit board, or a semiconductor package, for example, a semiconductor package in the first embodiment.

The circuit unit 201 and the circuit unit 202 are arranged with an interval so as to face each other in the Z direction, which is the stacking direction. The Z direction is an example of a first direction. A plurality of intermediate connection units 300 are arranged between the circuit unit 201 and the circuit unit 202 as an example of at least one intermediate connection unit.

Each intermediate connection unit 300 has an intermediate connection member 310 . The intermediate connecting member 310 is arranged between the circuit unit 201 and the circuit unit 202 and used to electrically and mechanically connect the circuit unit 201 and the circuit unit 202 .

The circuit unit 202 has a wiring board 221 including two main surfaces 2211 and 2212 and an image sensor 222 arranged on the main surface 2211 of the wiring board 221 . The principal surface 2212 is the principal surface on the back side with respect to the principal surface 2211 . Wiring board 221 is an example of a second wiring board and is a package substrate. Moreover, the wiring board 221 is a rigid printed wiring board. The image sensor 222 is a semiconductor device such as a semiconductor chip. In addition, the circuit unit 202 includes a frame 223 arranged on the main surface 2211 of the wiring board 221 so as to surround the image sensor 222, and an LID 224 arranged on the frame 223 so as to face the image sensor 222 with a gap. and have A substrate made of glass, for example, is used for the LID 224 .

The wiring board 221 has a flat insulating substrate 220 . The material of the insulating substrate 220 is preferably resin with a low coefficient of thermal expansion. Main surfaces 2211 and 2212 of wiring board 221 are also main surfaces of insulating substrate 220 .

The image sensor 222 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor. The image sensor 222 has a function of converting light incident through the lens unit 602 into an electrical signal and generating image data based on the electrical signal. It is preferable that the image sensor 222 has a size corresponding to a large size such as an APSC size or a full size as the definition of an image becomes higher.

The circuit unit 201 includes a wiring board 211 including two main surfaces 2111 and 2112, a memory element 212 arranged on the main surface 2111 of the wiring board 211, and an electronic component arranged on the main surface 2111 of the wiring board 211. 213 and . Memory device 212 is an example of at least one semiconductor device. The principal surface 2112 is the principal surface on the back side with respect to the principal surface 2111 . Wiring board 211 is an example of a first wiring board, and is a rigid printed wiring board. The memory device 212 is, for example, a semiconductor chip, and can store image data in the first embodiment. The electronic component 213 is a chip component smaller in size than the memory device 212, and is, for example, a passive device such as a resistor, a capacitor, an inductor, or an active device such as a semiconductor component. That is, the memory element 212 is higher in the Z direction than the electronic component 213 . As described above, the memory element 212 and the electronic component 213 are mounted as at least one mounting component on the main surface 2111 of the wiring board 211 .

Wiring board 211 has flat insulating substrate 210 . The material of the insulating substrate 210 is preferably resin such as epoxy resin containing glass fiber. Main surfaces 2111 and 2112 of wiring board 211 are also main surfaces of insulating substrate 210 .

In the first embodiment, the main surface 2111 of the wiring board 211 is arranged to face the main surface 2212 of the wiring board 221 in the Z direction. Therefore, the memory element 212 and the electronic component 213 are arranged between the wiring board 211 and the wiring board 221 in the Z direction. The plurality of intermediate connection members 310 are arranged between the wiring boards 211 and 221 so as to maintain a gap between the wiring boards 211 and 221 so that the memory elements 212 and the electronic components 213 do not interfere with the wiring board 221 . are placed in That is, the plurality of intermediate connection members 310 also serve as spacers.

A plurality of intermediate connection units 300 are arranged to surround the memory device 212 and the electronic component 213 . In the first embodiment, the number of intermediate connection units 300 is four.

Wiring board 221 has a plurality of pads 225 arranged at positions corresponding to intermediate connection members 310 . A plurality of pads 225 are provided on main surface 2212 . Each pad 225 is made of a conductive material such as a metal such as copper. Each pad 225 is, for example, a signal pad, a power pad, a ground pad, or a dummy pad. Each intermediate connection member 310 is joined to a corresponding pad 225 among the plurality of pads 225 with a conductive joining member such as solder.

A solder resist film (not shown) may be provided on the main surface 2212 . At this time, it is preferable that openings are formed in the solder resist film at positions corresponding to the respective pads 225 . The shape of each pad 225 is not particularly limited, and may be, for example, circular or polygonal in plan view. Also, the relationship between the solder resist film and the pad may be SMD (Solder Mask Defined) or NSMD (Non Solder Mask Defined).

Wiring board 211 has a plurality of pads 215 arranged at positions corresponding to intermediate connection members 310 , a plurality of pads 216 arranged at positions corresponding to memory elements 212 , and a plurality of pads 216 arranged at positions corresponding to electronic components 213 . and a plurality of pads 217 . These pads 215 , 216 , 217 are provided on main surface 2111 . Each of the pads 215, 216, 217 is made of a conductive material such as a metal such as copper. Each pad 215, 216, 217 is, for example, a signal pad, a power pad, a ground pad, or a dummy pad. Each intermediate connecting member 310 is joined to a corresponding pad 215 among the plurality of pads 215 with a conductive joining member such as solder. The memory element 212 is bonded to a plurality of pads 216 with a conductive bonding member such as solder. Each electronic component 213 is joined to a corresponding pad 217 out of the plurality of pads 217 with a conductive joining member such as solder.

A solder resist film (not shown) may be provided on the main surface 2111 . At this time, it is preferable that openings are formed in the solder resist film at positions corresponding to the respective pads 215 , 216 and 217 . The shape of each pad 215, 216, 217 is not particularly limited, and may be circular or polygonal in plan view, for example. Also, the relationship between the solder resist film and the pads may be either SMD or NSMD.

Each intermediate connection unit 300 has the above-described intermediate connection member 310 and at least one electronic component, a plurality of, for example, eight electronic components 320 . Each electronic component 320 is mounted on the intermediate connection member 310 . Each electronic component 320 is a chip component smaller in size than the memory device 212, such as a passive device such as a resistor, capacitor, inductor, or an active device such as a semiconductor component. That is, each electronic component 320 has a lower height in the Z direction than the memory element 212 . Note that the size of the intermediate connection member 310 and the size of each electronic component 320 mounted on the intermediate connection member 310 are determined by the sizes of the wiring boards 211 and 221 and the sizes and arrangements of the pads on the wiring boards 211 and 221. It is designed according to the position.

The description below focuses on one intermediate connection unit 300 . FIG. 3 is an enlarged cross-sectional view of a main part of the imaging module 200 shown in FIG. 2(b). FIG. 4(a) is a perspective view of the intermediate connecting member 310 according to the first embodiment. FIG. 4(b) is a perspective view of the intermediate connection unit 300 according to the first embodiment. FIG. 4(c) is a cross-sectional view of the intermediate connection unit 300 taken along line IVC-IVC shown in FIG. 4(b).

Intermediate connection member 310 is a rectangular parallelepiped rigid wiring board. Here, the longitudinal direction of the intermediate connection member 310 is the X direction, and the width direction, that is, the thickness direction of the intermediate connection member 310 is the Y direction. The height direction of the intermediate connection member 310, that is, the lateral direction of the intermediate connection member 310 is the Z direction. The Z direction is the first direction, the X direction is the second direction, and the Y direction is the third direction. The X, Y and Z directions intersect each other. In this embodiment, the X, Y and Z directions are orthogonal to each other. The intermediate connection member 310 electrically and mechanically connects the two circuit units 201 and 202, that is, the two wiring boards 211 and 212, while maintaining the Z-direction spacing between the two main surfaces 2111 and 2212 facing each other. Therefore, it preferably has a rectangular parallelepiped shape that is long in the X direction.

The intermediate connecting member 310 has an end face 310L and an end face 310U in the Z direction. The end surface 310</b>L of the intermediate connection member 310 is an example of a first end surface, and serves as a lower end surface in some of the manufacturing processes of the imaging module 200 . The end surface 310U of the intermediate connection member 310 is an example of a second end surface, and serves as an upper end surface in some steps of the manufacturing process of the imaging module 200 . End surface 310L faces main surface 2111 of wiring board 211 in the Z direction. End surface 310U faces main surface 2212 of wiring board 221 in the Z direction.

The intermediate connection member 310 has a flat insulating substrate 311 and a plurality of, for example, 16 wirings 330 arranged on the insulating substrate 311 and extending in the Z direction.

The material of the insulating substrate 311 is preferably resin such as glass fiber-containing epoxy resin. In consideration of increasing the density of mounted components in the image pickup module 200 and securing a mounting area, etc., the thickness of the intermediate connection member 310 in the Y direction is preferably 5 mm or less. is preferably 2.5 mm or less.

Each wiring 330 extends from one end to the other end of the insulating substrate 311 in the Z direction. The end surface 330L of the two end surfaces 330L and 330U of each wiring 330 in the Z direction is included in the end surface 310L of the intermediate connection member 310. FIG. The end face 330</b>L is joined to the corresponding pad 215 among the plurality of pads 215 by the joining member 351 . Of the two end faces 330L and 330U of each wiring 330 in the Z direction, the end face 330U is included in the end face 310U of the intermediate connection member 310. FIG. The end face 330</b>U is joined to the corresponding pad 225 among the plurality of pads 225 by the joining member 352 .

Each of the joint members 351 and 352 includes a conductive member such as solder. The material of the joint member 352 is the same as the material of the joint member 351 . Although the bonding members 351 and 352 preferably contain solder, they are not limited to this, and may be a cured organic conductive adhesive.

Insulating substrate 311 includes two major surfaces 3111 and 3112 . The main surface 3111 is an example of a first main surface of the intermediate connection member 310 , and the main surface 3112 is an example of a second main surface of the intermediate connection member 310 . The principal surface 3112 is the principal surface on the back side with respect to the principal surface 3111 . Each main surface 3111, 3112 is a surface parallel to each other. Moreover, each of the main surfaces 3111 and 3112 is a surface that intersects the main surfaces 2111 and 2212 and is preferably a surface orthogonal to the main surfaces 2111 and 2212 . At least one of the plurality of wires 330 , eight wires 330 in this embodiment, are arranged on the main surface 3111 of the insulating substrate 311 . Of the plurality of wirings 330 , at least one wiring other than the at least one wiring, which is another eight wirings 330 in this embodiment, is arranged on the main surface 3112 of the insulating substrate 311 . The eight wirings 330 arranged on the main surface 3111 are spaced apart from each other in the X direction. The eight wirings 330 arranged on the main surface 3112 are spaced apart from each other in the X direction.

Each wiring 330 includes a conductive member, such as an inorganic material such as copper, silver, or aluminum, or an organic material such as conductive rubber. Each wiring 330 may be formed by crimping a metal foil, or may be formed by applying a conductive paste with a dispenser or the like and baking the paste.

Each electronic component 320 has two electrodes 321 and 322 spaced apart from each other. The electrode 321 is an example of a first electrode, and the electrode 322 arranged on the opposite side of the electrode 321 is an example of a second electrode. Each electronic component 320 is preferably a chip component such as a resistor, capacitor, inductor, or the like. Let A1 be the length in the X direction and B1 be the length in the Z direction of each electronic component 320 when mounted on the intermediate connection member 310 . The size of each electronic component 320, namely A1×B1, is 3.2 mm×1.6 mm, 1.6 mm×0.8 mm, 1.0 mm×0.5 mm, 0.8 mm×0.4 mm, 0.4 mm×0. 0.2 mm, and 0.2 mm by 0.1 mm.

At least one of the eight electronic components 320 , four electronic components 320 in this embodiment, are arranged on the main surface 3111 . Electronic component 320 arranged on main surface 3111 is an example of a first electronic component. In addition, among the eight electronic components 320 , at least one electronic component other than the at least one electronic component, which is another four electronic components 320 in this embodiment, is arranged on the main surface 3112 . Electronic component 320 arranged on main surface 3112 is an example of a second electronic component. Major surface 3111 is located between major surface 3112 and memory element 212 .

Since the connection structure of each electronic component 320 to the intermediate connection member 310 is the same, the connection structure of one electronic component 320 will be described.

Two electrodes 321 and 322 of the electronic component 320 are joined to two wirings 330 adjacent to each other. The two wirings 330 adjacent to each other are referred to as a wiring _330-1 and a wiring _330-2 . The wiring _330-1 is an example of a first wiring, and the wiring _330-2 is an example of a second wiring. The wiring _330-2 is spaced apart from the wiring _330-1 in the X direction.

The wiring _330-1 is electrically connected to the wiring board 211, and the wiring _330-2 is electrically connected to the wiring board 221. FIG. In this embodiment, the wiring _330-1 is electrically connected to the wiring boards 211 and 221, and the wiring _330-2 is electrically connected to the wiring boards 211 and 221. FIG. Specifically, wiring 330 ₁ is electrically connected to corresponding pad 215 on wiring board 211 and corresponding pad 225 on wiring board 221 . Also, the wiring ₃₃₀₂ is electrically connected to the corresponding pad 215 on the wiring board 211 and the corresponding pad 225 on the wiring board 221 . As described above, the pads 215 and 225 to which the wiring _330-1 is electrically connected and the pads 215 and 225 to which the wiring _330-2 is electrically connected are, for example, signal pads, power pads, ground pads, or dummy pads. is.

If one of the pads 215 and 225 electrically connected to the wiring ₃₃₀₁ is a dummy pad, the other of the pads 215 and 225 is a pad other than the dummy pad. Similarly, if one of the pads 215 and 225 electrically connected to the wiring ₃₃₀₂ is a dummy pad, the other of the pads 215 and 225 is a pad other than the dummy pad.

Further, when the end face 330L of the wiring _330-1 is bonded to a pad other than the dummy pad on the wiring board ₂₁₁ , the end face 330U of the wiring 330-1 may not be bonded to the pad on the wiring board 221. FIG. When the end face 330U of the wiring ₃₃₀₂ is bonded to a pad other than the dummy pad on the wiring board 221, the end face 330L of the wiring 3302 does not have to _be bonded to the wiring board 211. FIG.

The electrode 321 is joined to the wiring _330-1 and the electrode 322 is joined to the wiring _330-2 . As shown in FIG. 3, the electrodes 321 and the wirings ₃₃₀₁ are joined by corresponding joining members 351 . Also, the electrodes 322 and the wirings ₃₃₀₂ are joined by corresponding joining members 351 .

Of the end faces 310L and 310U of the intermediate connection member 310 in the Z direction, the electronic component 320 is arranged closer to the end face 310L than the end face 310U. In the first embodiment, the electronic component 320 is arranged closer to the end surface _330L than the end surface 330U of the end surface 330L and the end surface 330U of the wiring 3301 in the Z direction. That is, the distance D11 between the electronic component 320 and the wiring board 211 in the Z direction is smaller than the distance D12 between the electronic component 320 and the wiring board 221 in the Z direction. The distance D11 is an example of a first distance, and the distance D12 is an example of a second distance.

An end face 321L of the electrode 321 in the Z direction is arranged to face the corresponding pad 215 and is joined to the corresponding pad 215 by the corresponding joining member 351 . In some steps of the manufacturing process of the imaging module 200, the end surface 321L of the electrode 321 becomes the lower end surface. The electrodes 321 , the wirings 330 ₁ , and the corresponding pads 215 are integrally bonded with corresponding bonding members 351 . The electrodes 322 , the wirings 330 ₂ , and the corresponding pads 215 are likewise integrally joined with corresponding joining members 351 .

4(b) and 4(c) show the intermediate connection unit 300 before being joined to the wiring board 211 of the circuit unit 201. FIG. Therefore, the electrodes 321 and the wirings ₃₃₀₁ are joined by the corresponding joining members 361 . Similarly, the electrodes 321 and the wirings ₃₃₀₂ are joined with corresponding joining members 361 . The material of the joint member 361 is the same as the material of the joint member 351 .

The dimension H11 of the wiring _330-1 in the Z direction is larger than the dimension L11 of the wiring _330-1 in the X direction. Similarly, the dimension H12 of the wiring ₃₃₀₂ in the Z direction is larger than the dimension L12 of the wiring ₃₃₀₂ in the X direction.

A pitch P of the wiring _330-1 and the wiring _330-2 in the X direction is set to a pitch that allows the electrodes 321 and 322 of the electronic component 320 to be joined. Here, the pitch P is the distance between the X-direction center of the wiring 330 ₁ and the X-direction center of the wiring 330 ₂ in the two wirings 330 ₁ and 330 ₂ adjacent to each other in the X direction. The distance L0 between the end surface 310L of the intermediate connection member 310 and the end surface 321L of the electrode 321 in the Z direction is preferably narrower than the pitch P between the wiring _330-1 and the wiring _330-2 in the X direction. In the first embodiment, the distance between the end surface 330L of the wiring ₃₃₀₂ and the end surface 322L of the electrode 322 in the Z direction is the same as the distance L0.

That is, the difference |D12-D13| between the distance D13 and the distance D11 between the intermediate connection member 310 and the wiring board 211 in the Z direction is preferably narrower than the pitch P1. Distance D13 is an example of a third distance. The difference |D12-D13| is the same as the interval L0. Note that the distance D12 may be zero. Also, the distance D13 may be zero. Also, the difference |D12−D13| may be zero.

Intermediate connection member 310 may include ground wiring connected to grounds included in wiring boards 211 and 221 . That is, one of the wirings 330 may be the ground wiring. The ground wiring is required to have a lower resistance because a larger current flows through it than the signal wiring. Therefore, the ground wiring may be made of a conductive material with lower resistance or a wire with a large diameter.

The width in the X direction and the thickness in the Y direction of each wiring 330 may be considered depending on the application of the wiring and the application of the electronic component 320 to be connected, but is preferably 0.01 mm or more and 2 mm or less. In consideration of increasing the density of the plurality of wirings 330, the width in the X direction and the thickness in the Y direction of each wiring 330 are more preferably 0.5 mm or less.

The X-direction length of the intermediate connection member 310 , that is, the X-direction length L1 of the insulating substrate 311 is preferably shorter than the length of one side of each of the wiring boards 211 and 221 . Here, the X-direction length of the intermediate connection member 310 is the same as the X-direction length L1 of the insulating substrate 311 .

It is preferable that the Y-direction width of the intermediate connection member 310, ie, the Y-direction width W1 of the insulating substrate 311, be as thin as possible because the mounting area for mounting components on the wiring board 211 is increased. Here, the Y-direction width of the intermediate connection member 310 is the Y-direction width W1 of the insulating substrate 311, the Y-direction width of one wiring 330 arranged on the main surface 3111, and the Y-direction width of the wiring 330 arranged on the main surface 3112. It is the sum of the width of one wiring 330 in the Y direction.

It is preferable that the height of the intermediate connection member 310 in the Z direction, that is, the height H1 of the insulating substrate 311 in the Z direction, is higher than the highest mounted component such as the memory element 212 . Here, the height of the intermediate connection member 310 in the Z direction is the same as the height H1 of the insulating substrate 311 in the Z direction. For example, when a mounting component with a height of 1.6 mm is mounted on the wiring board 211, the height H1 in the Z direction of the intermediate connection member 310, that is, the insulating substrate 311 is preferably 1.6 mm or more. .

The number and pitch P of the wirings 330 of the intermediate connection member 310 depend on the number of pads and the pitch between the pads of the wiring boards 211 and 221 to be connected.

Since the electronic component 320 is mounted on the intermediate connection member 310 in this way, high-density mounting is possible in the imaging module 200, and further miniaturization of the imaging module 200 can be achieved.

A method of manufacturing the intermediate connection unit 300 will be described. 5(a) to 5(g) are explanatory diagrams of each step of the manufacturing method of the intermediate connection unit 300. FIG.

In the step shown in FIG. 5(a), an intermediate 500 is prepared. The intermediate 500 has a plate-shaped insulating base material 511 and a plurality of conductive members 530 arranged on the insulating base material 511 and extending in the Z direction. Among the plurality of conductive members 530, at least one conductive member, eight conductive members 530 in the example of FIG. are placed open. Further, among the plurality of conductive members 530, at least one conductive member other than at least one conductive member, eight conductive members 530 in the example of FIG. are spaced apart from each other in the X direction on the main surface 5112 of the . The principal surface 5112 is a surface on the back side with respect to the principal surface 5111 . Here, two conductive members 530 adjacent to each other are referred to as a conductive member _530-1 and a conductive member _530-2 . Conductive member _530-1 is an example of a first conductive member, and conductive member _530-2 is an example of a second conductive member. The conductive member _530-2 is spaced apart from the conductive member _530-1 in the X direction.

Next, in the step shown in FIG. 5B, a plurality of conductive pastes 561 are arranged on each conductive member 530 with intervals in the Z direction. The conductive paste 561 is a precursor of the joining member 361 . In the example shown in FIG. 5(b), four conductive pastes 561 are arranged on one conductive member 530 at intervals in the Z direction. The conductive paste 561 is applied onto the corresponding conductive member 530 by, for example, screen printing, a dispenser, or the like. Conductive paste 561 is preferably a conductive adhesive such as solder paste or silver paste. Also, the conductive paste 561 may be a sheet-like conductive adhesive. Thus, a plurality of conductive pastes 561 are arranged on each conductive member 530 on each main surface 5111 , 5112 of the intermediate body 500 . Thereby, a plurality of conductive pastes 561 are arranged in an array in the X direction and the Y direction on each of the main surfaces 5111 and 5112 .

Next, in the step shown in FIG. 5C, a plurality of electronic components 320 are arranged on the main surfaces 5111 and 5112 using a mounter (not shown). At that time, each of the electrodes 321 and 322 of the electronic component 320 is brought into contact with two conductive pastes 561 adjacent to each other in the X direction.

Next, each conductive paste 561 is heated to a temperature higher than the temperature at which the metal powder contained in each conductive paste 561 melts, and then the molten metal in which each conductive paste 561 is melted is cooled. Then, each joint member 361 shown in FIG. 5(d) is formed. The metal powder is, for example, solder powder. As the solder powder is melted by heating, the molten solder aggregates.

The step of heating and cooling each conductive paste 561 can be performed, for example, in a reflow oven. Each joining member 361 is formed by the step of heating and cooling each conductive paste 561 . The electrodes 321 of the electronic component 320 are joined to the conductive members _530-1 with corresponding joining members 361, and the electrodes 322 of the electronic component 320 are joined to the conductive members _530-2 with corresponding joining members 361. Thereby, the electrode 321 is electrically and mechanically connected to the conductive member _530-1 , and the electrode 322 is electrically and mechanically connected to the conductive member _530-2 .

Next, in the step shown in FIG. 5(e), the intermediate 500 is linearly cut along the X direction. Thereby, as shown in FIG. 5(f), a plurality of separated intermediate connection units 300 are formed. FIG. 5(g) illustrates one of a plurality of intermediate connection units 300 to be manufactured.

In the cutting step, the distance L0 (see FIG. 4C) between the cut end surface of the conductive member 530 in the Z direction and the end surface 321L of the electrode 321 in the Z direction is the distance between the conductive member 530 ₁ and the conductive member 530 ₂ . The intermediate 500 is cut so as to be narrower than the pitch P in the X direction. A cut end surface of the conductive member 530 is an end surface that becomes an end surface 330L of the wiring 330 . An end surface 321L of the electrode 321 in the Z direction faces the same direction as the cut end surface, and faces the cutting tool T during cutting of the intermediate 500 . A dicer device, a wire saw device, or the like can be used for cutting the intermediate 500 . The Z-direction interval for cutting the intermediate body 500 is the Z-direction height H1 of the intermediate connecting member 310 , that is, the insulating substrate 311 .

The end faces 330L and 330U of the wiring 330 are preferably parallel to the XY plane, but may be inclined with respect to the XY plane. Moreover, although it is preferable that the wirings 330 have the same height in the Z direction, the wirings 330 may have different heights in the Z direction.

Through the manufacturing process described above, the intermediate connection unit 300 can be manufactured easily.

Next, a method for manufacturing the imaging module 200 will be described. 6(a) to 7(c) are explanatory diagrams of each step of the manufacturing method of the imaging module 200. FIG.

In the process shown in FIG. 6A, a wiring board 211 is prepared. The wiring board 211 has a plurality of pads 215 , a plurality of pads 216 and a plurality of pads 217 .

Next, in the process shown in FIG. 6B, conductive paste 615 is placed on each pad 215, conductive paste 616 is placed on each pad 216, and conductive paste 617 is placed on each pad 217. do. Each of the conductive pastes 615-617 is preferably a conductive adhesive such as solder paste or silver paste. Also, each of the conductive pastes 615 to 617 may be a sheet-like conductive adhesive. Each of the conductive pastes 615 to 617 is preferably a solder paste containing solder powder and flux, and preferably made of the same material as the conductive paste 561 described above. Each conductive paste 615-617 can be applied by screen printing or dispenser, for example. Each conductive paste 615-617 may be applied to cover the entire exposed portion of each pad 215-217, or may be applied to cover a portion of the exposed portion of each pad 215-217 such as offset printing. You may

In the step shown in FIG. 6C, memory elements 212, electronic components 213, and intermediate connection units 300 to be mounted on wiring board 211 are prepared. Next, as shown in FIG. 6(d), the wiring board 211 is arranged at a predetermined position with the pads 215 to 217 on the wiring board 211 facing upward in the vertical direction G. Next, as shown in FIG. The vertical direction G is the direction of gravity. Then, the memory element 212 , the electronic component 213 and the intermediate connection unit 300 are placed on the main surface 2111 of the wiring board 211 . That is, the memory element 212 is placed on the pad 216 in contact with the conductive paste 616 , and the electronic component 213 is placed on the pad 217 in contact with the conductive paste 617 . The intermediate connection unit 300 is placed on the pads 215 by contacting each wire 330 with the corresponding conductive paste 615 . These memory element 212, electronic component 213, and intermediate connection unit 300 are placed on the wiring board 211 by a mounter (not shown).

Next, each of the conductive pastes 615 to 617 is heated to a temperature equal to or higher than the temperature at which the metal powder contained in each of the conductive pastes 615 to 617, such as solder powder, melts. This melts the solder powder and agglomerates the molten solder. After that, the molten solder solidifies through a step of cooling the molten solder. As a result, as shown in FIG. 7A, a bonding member 351 for bonding intermediate connection unit 300 and wiring board 211, a bonding member 355 for bonding memory element 212 and wiring board 211, and electronic component 213 are formed. A joining member 356 for joining the wiring board 211 is formed. The heating step of heating and melting the conductive pastes 615 to 617 and the cooling step of cooling and solidifying the molten metal shown in FIG. 6D can be performed in a reflow furnace, for example. Each joining member 351, 355, 356 is formed by the heating process and the cooling process. Thus, the intermediate connection unit 300 and the wiring board 211 of the circuit unit 201 are joined as shown in FIG. 7A by the heating process and the cooling process in FIG. 6D.

The electrodes 321 of the electronic component 320 , the wirings 330 ₁ , and the corresponding pads 215 are bonded together with corresponding bonding members 351 . Also, the electrodes 322 of the electronic component 320 , the wiring 330 ₂ , and the corresponding pads 215 are bonded together with corresponding bonding members 351 . In the joining member 351, the metal forming the joining member 361 shown in FIG. 5G and the metal forming the conductive paste 615 shown in FIG. By being integrated, it is configured as one. Thereby, the electrodes 321 , the wirings 330 ₁ , and the corresponding pads 215 are electrically and mechanically connected to each other by the corresponding bonding members 351 . Also, the electrodes 322 , the wirings 330 ₂ , and the corresponding pads 215 are electrically and mechanically connected to each other by the corresponding bonding members 351 .

Here, if the intermediate connection unit 300 does not have the electronic component 320 but only the intermediate connection member 310, the wiring board 211 may be damaged due to handling after being placed on the wiring board 211, vibration during reflow, or the like. There is a risk of slipping or falling. In particular, when the Y-direction width W1 of the insulating substrate 311 of the intermediate connection member 310 is 1 mm or less and the Z-direction height H1 of the insulating substrate 311 is 2 mm or more, the intermediate connection member 310 alone can be mounted on the wiring board 211. It is difficult to make it self-sufficient.

In the first embodiment, the electronic component 320 is arranged closer to the end surface 310L than the end surface 310U of the intermediate connection member 310 in the Z direction, as shown in FIGS. 4(b) and 4(c). Then, as shown in FIG. 6(d), the intermediate connection unit 300 is placed on the wiring board 211 with the end surface 310L of the intermediate connection member 310 located below the end surface 310U in the vertical direction G. That is, the intermediate connection unit 300 is placed on the wiring board 211 so that the end surface 310L of the intermediate connection member 310 faces the main surface 2111 of the wiring board 211 . In this state, the intermediate connection unit 300 and the wiring board 211 are joined through the heating process and the cooling process. Here, the posture in which the end face 310L is positioned below the end face 310U in the vertical direction G is a posture in which the end face 310L is the lower end face. This makes it easy for the intermediate connection unit 300 to stand on its own on the wiring board 211 , and prevents the intermediate connection unit 300 from slipping or falling with respect to the wiring board 211 before the intermediate connection unit 300 is joined to the wiring board 211 . can be prevented.

Further, the interval L0 shown in FIG. 4(c) is narrower than the pitch P shown in FIG. 4(a). Therefore, when the intermediate connection unit 300 is arranged on the wiring board 211, the end surfaces 321L of the electrodes 321 of the electronic component 320 face the corresponding pads 215 of the wiring board 211 with the conductive paste 615 interposed therebetween. . At this time, the end face 321L of the electrode 321 becomes the lower end face. As a result, when intermediate connection unit 300 is placed on wiring board 211 , intermediate connection unit 300 can stand on its own more stably on wiring board 211 . At this time, the Z direction, which is also the height direction of the intermediate connection member 310, is parallel to the vertical direction G. Then, through a heating process and a cooling process, intermediate connection unit 300 is joined to wiring board 211 in a self-supporting state, as shown in FIG. 7A. Therefore, intermediate connection unit 300 can be joined to wiring board 211 with high accuracy. Note that the spacing L0 shown in FIG. 4C corresponds to the arrangement position of each conductive paste 561 in FIG. 5B, the arrangement position of each electronic component 320 in FIG. Can be controlled by cutting position.

If the center of gravity of intermediate connection unit 300 is at the center of intermediate connection unit 300 in the Y direction, electronic components 320 are preferably arranged on both sides of intermediate connection member 310 in the Y direction. At that time, it is preferable that the electronic components 320 arranged on the main surface 3111 and the electronic components 320 arranged on the main surface 3112 are arranged at the same height in the Z direction.

Next, in the step shown in FIG. 7B, conductive paste 625 is placed on each pad 225 of wiring board 221 of circuit unit 202 . Each conductive paste 625 is preferably a conductive adhesive such as solder paste or silver paste. Also, each conductive paste 625 may be a sheet-like conductive adhesive. Each conductive paste 625 is preferably a solder paste containing solder powder and flux, and preferably made of the same material as the conductive paste 561 described above. Each conductive paste 625 can be applied by screen printing or dispenser, for example. Each conductive paste 625 may be supplied to cover the entire exposed portion of each pad 225, or may be supplied to partially cover the exposed portion of each pad 225 as in offset printing.

Then, the circuit unit 202 is placed on the end face 310U of the intermediate connection member 310 in such a posture that each pad 225 on the wiring board 221 faces downward in the vertical direction G. As shown in FIG. That is, the conductive paste 625 on the pad 225 is brought into contact with the end face 330U (FIG. 4(c)) of the corresponding wiring 330. Then, as shown in FIG. The circuit unit 202 is placed on the intermediate connection member 310 by a mounter (not shown).

Next, each conductive paste 625 is heated to a temperature equal to or higher than the temperature at which the metal powder contained in each conductive paste 625, such as solder powder, melts. This melts the solder powder and agglomerates the molten solder. After that, the melted solder is cooled through a process to solidify, forming a joint member 352 that joins the intermediate connection unit 300 and the wiring board 221 as shown in FIG. 7(c). Note that the step of heating and cooling each conductive paste 625 can be performed, for example, in a reflow furnace. By heating and cooling each conductive paste 625 , each joining member 352 is formed and the intermediate connection unit 300 and the wiring board 221 of the circuit unit 202 are joined.

The imaging module 200 can be manufactured through the steps described above. Since electronic components 320 such as resistors and capacitors can be mounted as chip components on the intermediate connection member 310 as well, high-density mounting in the imaging module 200 is possible. In addition, the impedance at the connection point between the laminated circuit units 201 and 202 and the intermediate connection unit 300 can be lowered, and impedance mismatch can be reduced. Moreover, it is possible to prevent the intermediate connection member 310 from collapsing or shifting with respect to the wiring board 211, thereby enabling the miniaturized imaging module 200 to be manufactured with high precision.

[Second embodiment]
Next, an intermediate connection unit according to the second embodiment will be described. FIG. 8(a) is a perspective view of an intermediate connection unit 300A according to the second embodiment. FIG. 8(b) is a cross-sectional view of the intermediate connection unit 300A along line VIIIB-VIIIB shown in FIG. 8(a). FIG. 8(c) is a cross-sectional view of the intermediate connection unit 300A along line VIIIC-VIIIC shown in FIG. 8(a). In the electronic module of the second embodiment, an intermediate connection unit 300A is substituted for the intermediate connection unit 300 shown in FIG. 2(a) and the like. In 2nd Embodiment, description is abbreviate|omitted by using the same code|symbol about the structure similar to 1st Embodiment.

An intermediate connection unit 300A of the second embodiment includes an intermediate connection member 310A, and electronic components 320A and 320B mounted on the intermediate connection member 310A. Electronic component 320A is larger in size than electronic component 320B.

The intermediate connection member 310A is a rectangular parallelepiped rigid wiring board. The intermediate connection member 310A electrically connects the two circuit units 201 and 202, that is, the two wiring boards 211 and 212, while maintaining the Z-direction spacing between the two main surfaces 2111 and 2212 shown in FIG. In order to connect mechanically, it is preferable to have a rectangular parallelepiped shape elongated in the X direction.

The intermediate connection member 310A has an end face 310AL and an end face 310AU in the Z direction. The end surface 310AL of the intermediate connection member 310A is an example of a first end surface, and serves as a lower end surface in some steps of the manufacturing process of the imaging module. The end surface 310AU of the intermediate connection member 310A is an example of a second end surface, and serves as an upper end surface in some steps of the manufacturing process of the imaging module.

The intermediate connection member 310A includes an insulating substrate 311, a plurality of wirings 330, 330A ₁ , 330A ₂ , 330B ₁ , 330B ₂ arranged respectively on the principal surfaces 3111 and 3112 of the insulating substrate 311, have. Each wiring 330, 330A ₁ , 330A ₂ , 330B ₁ , 330B ₂ is a wiring extending in the Z direction. Here, the wiring _330A1 is an example of the first wiring. The wiring _330A2 is an example of a second wiring. The wiring _330B1 is an example of a first wiring. The wiring _330B2 is an example of a second wiring. In some steps of the manufacturing process of the imaging module, when the Z direction is made parallel to the vertical direction, the wiring 330A ₁ is positioned vertically below the wiring 330A ₂ , and the wiring 330B ₁ It is located vertically below the wiring _330B2 .

The wiring 330A ₁ and the wiring 330A ₂ are arranged at the same position in the X direction and spaced apart in the Z direction. The wiring 330B ₁ and the wiring 330B ₂ are arranged at the same position in the X direction and spaced apart in the Z direction.

The wiring 330A- ₁ is electrically connected to the wiring board 211 (FIG. 2(b)), and the wiring 330A- ₂ is electrically connected to the wiring board 221 (FIG. 2(b)). Similarly, wiring 330B ₁ is electrically connected to wiring board 211 and wiring 330B ₂ is electrically connected to wiring board 221 .

Each of the wirings 330, 330A ₁ , 330A ₂ , 330B ₁ , 330B ₂ includes a conductive member, such as an inorganic material such as copper, silver, or aluminum, or an organic material such as conductive rubber. . Each of the wirings 330, 330A ₁ , 330A ₂ , 330B ₁ , 330B ₂ may be formed by crimping a metal foil, or may be formed by applying a conductive paste with a dispenser or the like and baking it. .

The electronic component 320A has two electrodes 321A and 322A spaced apart from each other. The electronic component 320B has two electrodes 321B and 322B spaced apart from each other. The electrode 321A is an example of a first electrode, and the electrode 322A arranged on the opposite side of the electrode 321A is an example of a second electrode. The electrode 321B is an example of a first electrode, and the electrode 322B arranged on the opposite side of the electrode 321B is an example of a second electrode. Each electronic component 320A, 320B is preferably a chip component such as a resistor, a capacitor, an inductor, etc., for example, a resistance chip that is a resistor.

Two electrodes 321A and 322A of the electronic component 320A are joined to two wirings 330A ₁ and 330A ₂ adjacent to each other, respectively. The wiring 330A ₂ is spaced apart from the wiring 330A ₁ in the Z direction. Two electrodes 321B and 322B of the electronic component 320B are joined to two wirings 330B ₁ and 330B ₂ adjacent to each other, respectively. Wire 330B ₂ is spaced apart from wire 330B ₁ in the Z direction.

Electrode 321A is joined to wire 330A- ₁ and electrode 322A is joined to wire 330A _-2 . As shown in FIG. 8(b), the electrode 321A and the wiring 330A- ₁ are joined by a corresponding joining member 351A- ₁ . Also, the electrode 322A and the wiring 330A ₂ are joined by a corresponding joining member 351A ₂ .

Electrode 321B is joined to wire _330B1 and electrode 322B is joined to wire _330B2 . As shown in FIG. 8(c), the electrode 321B and the wiring 330B- ₁ are joined by a corresponding joining member 351B- ₁ . Also, the electrode 322B and the wiring _330B2 are joined by a corresponding joining member _351B2 .

Since the electronic components 320A and 320B are mounted on the intermediate connection member 310A in this manner, high-density mounting is possible in the imaging module, and further miniaturization of the imaging module can be achieved.

Since the electronic component 320A is larger in size than the electronic component 320B, it is heavy. The size of the electronic component 320A is, for example, 0.6 mm×0.3 mm. The size of the electronic component 320B is, for example, 0.4 mm×0.2 mm. Of the end faces 310AL and 310AU of the intermediate connecting member 310A in the Z direction, the electronic component 320A is arranged closer to the end face 310AL than the end face 310AU. That is, the distance between the electronic component 320A and the wiring board 211 (FIG. 3) in the Z direction is smaller than the distance between the electronic component 320A and the wiring board 221 (FIG. 2B) in the Z direction. As a result, it is possible to prevent the intermediate connection member 310A from collapsing or shifting with respect to the wiring board 211 when manufacturing the image pickup module, and it is possible to manufacture a compact image pickup module with high accuracy. In this case, the interval L0 between the end surface 310AL of the intermediate connection member 310A and the end surface 321AL of the electrode 321A in the Z direction is preferably narrower than the pitch between the wiring _330A1 and the wiring 330 in the X direction.

Note that the method of manufacturing the intermediate connection unit 300A and the method of manufacturing the imaging module having the intermediate connection unit 300A in the second embodiment are the same as those in the first embodiment, so description thereof will be omitted.

If the center of gravity of the intermediate connection unit 300A is at the center of the intermediate connection unit 300A in the Y direction, it will not fall over easily. At that time, electronic component 320A arranged on main surface 3111 and electronic component 320A arranged on main surface 3112 are preferably arranged at the same height in the Z direction. Similarly, it is preferable that the electronic components 320B are arranged on both sides of the intermediate connection member 310A in the Y direction. At that time, electronic component 320B arranged on main surface 3111 and electronic component 320B arranged on main surface 3112 are preferably arranged at the same height in the Z direction.

(Example 1)
A specific example of a method for manufacturing the intermediate connection unit 300 described in the first embodiment will be described. As the electronic component 320, a capacitor chip component having a size of 0.4 mm×0.2 mm was used. An insulating flat plate with a low coefficient of thermal expansion was used for the insulating base material 511 shown in FIG. 5(a). The insulating base material 511 had a length of 41.0 mm in the X direction, a length of 50.0 mm in the Z direction, and a thickness of 1.0 mm in the Y direction. On each of the main surfaces 5111 and 5112 of the insulating base material 511, 70 conductive members 530 made of copper were arranged at a pitch P=0.4 mm. Each conductive member 530 had a thickness of 0.015 mm and a width of 0.2 mm.

Next, as shown in FIG. 5B, a conductive paste 561 was applied on each conductive member 530 by a printing method. The conductive paste 561 was a solder paste containing Sn--Ag--Cu solder powder and flux. The alloy composition of the solder powder contained in the solder paste was tin-balance silver-3 copper-3, and the melting point of the solder powder was 220.degree. The average particle size of the solder powder was 40 μm.

Next, as shown in FIG. 5C, a plurality of electronic components 320 were placed on each of the conductive members 530 on the main surfaces 5111 and 5112 using a mounter.

Next, as shown in FIG. 5D, the intermediate body 500 with the electronic component 320 mounted thereon was put into a reflow furnace, and the conductive paste 561 was heated to a temperature equal to or higher than the melting point of the solder powder. After the solder powder was melted and the molten solder was agglomerated, the molten solder was cooled to a temperature below the melting point of the solder and solidified to form the joining member 361 . With this bonding structure, the electrodes 321 of the electronic component 320 and the conductive member ₅₃₀₁ are electrically and mechanically connected, and the electrodes 322 of the electronic component 320 and the conductive member ₅₃₀₂ are electrically and mechanically connected. connected.

Next, as shown in FIG. 5(e), the intermediate body 500 was cut into strips using a dicer to obtain a plurality of intermediate connection units 300 as shown in FIG. 5(f). In the intermediate connection member 310 of each intermediate connection unit 300, the length L1 in the X direction of the insulating substrate 311 is 41.0 mm, the width W1 in the Y direction of the insulating substrate 311 is 1.0 mm, and the Z direction of the insulating substrate 311 is 1.0 mm. was 1.8 mm. Thirty-five electronic components 320 were mounted on each of the main surfaces 3111 and 3112 of the intermediate connection member 310, and an intermediate connection unit 300 having a total of 70 electronic components 320 was produced.

Next, a specific example of a method for manufacturing the imaging module 200 using the intermediate connection member 310 will be described.

A wiring board 211 shown in FIG. 6A was prepared. A solder resist (not shown) is formed on the main surface 2111 of the wiring board 211 to partially cover the pads 215 to 217 . Openings are formed in the solder resist at positions corresponding to the pads 215 to 217, and portions of the pads 215 to 217 are exposed.

FR-4 was used for the insulating substrate 210 of the wiring board 211 . The outer size of the wiring board 211 in plan view was 50.0 mm×50.0 mm. Electronic components such as capacitors and resistors (not shown) are mounted in advance on the main surface 2112 of the wiring board 211 . The material of each pad 215-217 of the wiring board 211 was copper. The pads 215 to which the intermediate connection units 300 are connected have a width of 0.2 mm and a length of 0.3 mm, and are arranged at a pitch of 0.4 mm.

As shown in FIG. 6B, conductive pastes 615 to 617 were screen-printed on pads 215 to 217 of wiring board 211 . A printing plate with a thickness of 0.02 mm was used for screen printing. Each of the conductive pastes 615-617 was a solder paste containing Sn--Ag--Cu solder powder and flux. The alloy composition of the solder powder contained in the solder paste was tin-balance silver-3 copper-3, and the melting point of the solder powder was 220.degree. The average particle size of the solder powder was 40 μm.

A memory element 212 having a back surface to which solder balls are connected in advance was prepared. Each pad 216 of wiring board 211 is arranged at a position corresponding to a solder ball of memory element 212 . The external size of the memory element 212 was 16.0 mm long, 16.0 mm wide, and 1.6 mm high. Also, four intermediate connection units 300 were prepared.

Next, as shown in FIG. 6D, the memory element 212, the electronic component 213, and the intermediate connection unit 300 are placed on the wiring board 211 to which the conductive pastes 615 to 617 are supplied using a mounter. placed. Four intermediate connection units 300 were placed on the wiring board 211 so as to surround the memory device 212 and the electronic component 213 .

In each of the four intermediate connection units 300 , the end surface 330 L of each wiring 330 and each pad 215 of the wiring board 211 were aligned, and each intermediate connection unit 300 was placed on the wiring board 211 . Also, the memory element 212 was placed on the wiring board 211 by aligning the solder balls (not shown) of the memory element 212 with the pads 216 of the wiring board 211 . Width W1 of insulating substrate 311 of intermediate connection unit 300 is 1.0 mm, and intermediate connection unit 300 is supported by electronic component 320 mounted on the side surface of intermediate connection member 310 and stands on wiring board 211 by itself. was

Next, the wiring board 211 with these components placed thereon was placed in a reflow furnace, and the conductive pastes 615 to 617 were heated to a temperature equal to or higher than the melting point of the solder powder. After the solder powder melted and the molten solder agglomerated, the molten solder was cooled to a temperature below the melting point of the solder to solidify. As a result, the memory element 212, the electronic component 213, and the intermediate connection unit 300 were bonded to the wiring board 211, as shown in FIG. 7(a).

Next, as shown in FIG. 7B, each conductive paste 625 was screen-printed on each pad 225 of the wiring board 221 . Each of the conductive pastes 615-617 was a solder paste containing Sn--Ag--Cu solder powder and flux. The alloy composition of the solder powder contained in the solder paste was tin-balance silver-3 copper-3, and the melting point of the solder powder was 220.degree. The average particle size of the solder powder was 40 μm.

Next, each pad 225 of the circuit unit 202 supplied with the conductive paste 625 is aligned with the end surface 330U of each wiring 330 of each intermediate connection unit 300, and the circuit unit 202 is placed on the four intermediate connection units 300. placed. A solder resist (not shown) partially covering each pad 225 is formed on the main surface 2212 of the wiring board 221 . Openings are formed in the solder resist at positions corresponding to the respective pads 225, and portions of the respective pads 225 are exposed.

An insulating substrate with a low coefficient of thermal expansion was used for the insulating substrate 220 of the wiring board 221 . The outer size of the wiring board 221 in plan view was 52.0 mm×52.0 mm. The material of each pad 225 of the wiring board 221 was copper. The pads 225 to which the intermediate connection units 300 are connected have a width of 0.2 mm and a length of 0.3 mm, and are arranged at a pitch of 0.4 mm.

Next, as shown in FIG. 7(c), the mounted product having the circuit unit 202 mounted on the intermediate connection unit 300 is put into a reflow furnace, and each conductive paste 625 is heated to a temperature equal to or higher than the melting point of the solder powder. bottom. After the solder powder melted and the molten solder agglomerated, the molten solder was cooled to a temperature below the melting point of the solder to solidify. As a result, the circuit unit 202 was joined to the intermediate connection unit 300 .

The imaging module 200 was manufactured through the steps described above. In the imaging module 200, the electronic component 320 mounted on the intermediate connection member 310 was not peeled off and there was no solder joint failure. In addition, the optical performance of the image sensor 222 can be sufficiently guaranteed.

(Example 2)
The intermediate connection unit 300A shown in FIGS. 8A to 8C described in the second embodiment is also manufactured in the same manner as in Example 1, and the imaging module using this intermediate connection unit 300A is also It was manufactured in the same manner as in Example 1. A chip resistor of 0.6 mm×0.3 mm was used for the electronic component 320A. A chip resistor of 0.4 mm×0.2 mm was used for the electronic component 320B. In the image pickup module, the electronic components 320A and 320B mounted on the intermediate connection member 310A did not come off and there was no solder joint failure. In addition, the optical performance of the image sensor can be fully guaranteed.

The present invention is not limited to the embodiments described above, and many modifications are possible within the technical concept of the present invention. Moreover, the effects described in the embodiments are merely enumerations of the most suitable effects produced by the present invention, and the effects of the present invention are not limited to those described in the embodiments.

In the above-described embodiments, the case where the electronic device is a digital camera has been described as an example, but it is not limited to this. For example, the electronic device may be a mobile communication device. For example, the electronic device may be an information device such as a smart phone or a personal computer, or a communication device such as a modem or router. Alternatively, electronic equipment includes office equipment such as printers and copiers, medical equipment such as radiation imaging equipment, magnetic imaging equipment, ultrasonic imaging equipment, and endoscopes, industrial equipment such as robots and semiconductor manufacturing equipment, vehicles and airplanes. , a transportation device such as a ship. If the intermediate connection unit 300 is used when wiring is provided in a limited space inside the housing of the electronic device, it is possible to reduce the size and increase the density of the electronic device. The electronic module of the present invention can be applied to any electronic device.

Further, electronic components different from the electronic components in the above-described embodiments may be mounted on the intermediate connection member. In this case, of two electrodes included in another electronic component, one electrode is bonded to one of wirings of an intermediate connection member, and the other electrode is bonded to a member other than the intermediate connection member, such as a pad of a wiring board. may be

DESCRIPTION OF SYMBOLS 211... Wiring board (1st wiring board) 221... Wiring board (2nd wiring board) 310... Intermediate connection member 311... Insulating substrate 320... Electronic component 321... Electrode (first electrode) 322... Electrode (second electrode), 330 ₁ .. Wiring (first wiring), 330 ₂ .. Wiring (second wiring)

Claims (20)

a first wiring board;
a second wiring board arranged to face the first wiring board;
an intermediate connecting member disposed between the first wiring board and the second wiring board;
an electronic component;
The intermediate connection member includes an insulating substrate, first wiring disposed on the insulating substrate and electrically connected to the first wiring board, and second wiring electrically connected to the second wiring board. having wiring and
The electronic component has a first electrode joined to the first wiring and a second electrode joined to the second wiring,
An electronic module characterized by: the second wiring board faces the first wiring board in a first direction;
the dimension of the first wiring in the first direction is larger than the dimension of the first wiring in a second direction intersecting the first direction;
The electronic module according to claim 1, characterized in that: The first wiring and the second wiring are spaced apart in the second direction,
3. The electronic module according to claim 2, characterized in that: The first wiring and the second wiring are spaced apart in the first direction,
3. The electronic module according to claim 2, characterized in that: the distance between the electronic component and the first wiring board is smaller than the distance between the electronic component and the second wiring board;
The electronic module according to any one of claims 1 to 4, characterized in that: The first wiring board has a pad that is bonded to the first wiring,
The first electrode is joined to the pad facing the pad,
6. The electronic module according to claim 5, characterized in that: a first distance between the electronic component and the first wiring board is smaller than a second distance between the electronic component and the second wiring board;
The first wiring board has a pad that is bonded to the first wiring,
the first electrode facing the pad and joined to the pad;
a difference between the third distance and the first distance between the intermediate connection member and the first wiring board is narrower than the pitch between the first wiring and the second wiring;
4. The electronic module according to claim 3, characterized in that: A plurality of electronic components including the electronic component are mounted on the intermediate connection member, and at least one semiconductor element is provided between the first wiring board and the second wiring board.
The electronic module according to any one of claims 1 to 7, characterized in that: at least a first electronic component among the plurality of electronic components is arranged on the first main surface of the intermediate connecting member;
The first main surface is located between the semiconductor element and a second main surface on the back side of the intermediate connection member with respect to the first main surface.
9. Electronic module according to claim 8, characterized in that: at least a first electronic component among the plurality of electronic components is arranged on the first main surface of the intermediate connecting member;
At least a second electronic component among the plurality of electronic components is arranged on a second main surface on the back side of the first main surface of the intermediate connection member,
9. Electronic module according to claim 8, characterized in that: a housing;
an electronic module according to any one of claims 1 to 10 arranged inside the housing,
An electronic device characterized by: an image sensor arranged on one of the first wiring board and the second wiring board;
12. The electronic device according to claim 11, characterized by: an intermediate connection member having an insulating substrate and a plurality of wirings arranged on the insulating substrate, extending in a first direction, and arranged in a second direction intersecting the first direction;
and an electronic component joined to two of the plurality of wires,
An intermediate connection unit characterized by: A method for manufacturing an intermediate connection unit, comprising:
providing an intermediate body having an insulating base material and a first conductive member disposed on the insulating base material and extending in a first direction;
joining a first electrode of an electronic component to the first conductive member of the intermediate;
and cutting the intermediate in a second direction that intersects with the first direction.
A method of manufacturing an intermediate connection unit, characterized by: The intermediate has a second conductive member disposed on the insulating base material with a gap from the first conductive member and extending in the first direction,
bonding a second electrode of the electronic component to the second conductive member in the bonding step;
15. The method of manufacturing an intermediate connection unit according to claim 14, characterized in that: The second conductive member is spaced apart from the first conductive member in the second direction,
16. The method of manufacturing an intermediate connection unit according to claim 15, wherein: In the step of cutting, the distance between the cut end surface of the first conductive member in the first direction and the end surface of the first electrode in the first direction is the distance between the first conductive member and the second conductive member. cutting the intermediate body so as to be narrower than the pitch in the second direction with the member;
17. The method of manufacturing an intermediate connection unit according to claim 16, wherein: An intermediate comprising an insulating substrate, an intermediate connecting member disposed on the insulating substrate and having first wiring extending in a first direction, and an electronic component having a first electrode joined to the first wiring providing a connection unit;
disposing the intermediate connection unit on the first wiring board and joining the intermediate connection unit and the first wiring board;
placing a second wiring board on the intermediate connection unit and joining the intermediate connection unit and the second wiring board;
An electronic module manufacturing method characterized by: the electronic component is arranged closer to the first end face than the second end face of the intermediate connection member in the first direction;
In the step of joining the intermediate connection unit to the first wiring board, the intermediate connection unit is arranged on the first wiring board in a posture in which the first end face is vertically lower than the second end face. to join the intermediate connection unit and the first wiring board;
19. The method of manufacturing an electronic module according to claim 18, characterized by: In the step of joining the intermediate connection unit to the first wiring board, the lower end surface of the first electrode of the electronic component is joined to face the pad of the first wiring board.
20. The method of manufacturing an electronic module according to claim 19, characterized by:

Images