JP2022082426A - Module and device - Google Patents

Abstract

To provide a technique that is advantageous in preventing noise generation on a module.SOLUTION: A module 300 includes a wiring board 1001, integrated circuit components 200, mounted on the wiring board 1001, a wiring board 1002, overlapping the wiring board 1001, integrated circuit components 50, mounted on the wiring board 1002, and connecting members 110, arranged between the wiring board 1001 and the wiring board 1002 to electrically connect the wiring board 1001 and the wiring board 1002. The integrated circuit components 50 overlap the wiring board 1001 and supply power to the integrated circuit components 200 via the connecting members 110.SELECTED DRAWING: Figure 2

Description

The present invention relates to a module including integrated circuit components and wiring boards.

In a module equipped with a wiring board on which integrated circuit components are mounted, it is required to achieve both high density of mounting and noise reduction.

Patent Document 1 discloses an image pickup device including an image pickup element mounted on one surface of a printed circuit board and an image pickup element drive circuit mounted on the other surface of the printed circuit board.

Japanese Unexamined Patent Publication No. 2007-295105

The technique of Patent Document 1 is insufficient to suppress the influence of heat on the image sensor. Therefore, the present invention provides an advantageous technique for suppressing the generation of noise in a module including a wiring board on which an integrated circuit component is mounted.

The means for solving the above problems are a first wiring board, a first integrated circuit component mounted on the first wiring board, and a second wiring board overlapping the first wiring board. The second integrated circuit component mounted on the second wiring board is arranged between the first wiring board and the second wiring board, and the first wiring board and the second wiring are arranged. A module including a connecting member for electrically connecting a plate, wherein the second integrated circuit component overlaps with the first wiring plate and is via the connecting member. It is characterized by supplying power to integrated circuit components.

According to the present invention, it is possible to provide an advantageous technique for suppressing the generation of noise in a module.

Schematic diagram illustrating a module. Schematic diagram illustrating a module. Schematic diagram illustrating a module. Schematic diagram illustrating a module. Schematic diagram illustrating a module. Schematic diagram illustrating a module. Schematic diagram illustrating a module. Schematic diagram illustrating a module. Schematic diagram illustrating a module. Schematic diagram illustrating the device.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the following description and drawings, common reference numerals are given to common configurations across a plurality of drawings. Therefore, a common configuration will be described with reference to each other with reference to a plurality of drawings, and the description of the configuration with a common reference numeral will be omitted as appropriate.

1 (a)-(f) are YY cross-sectional views of a module 300 according to some examples of embodiments for carrying out the invention. 1 (g) and 1 (h) are XY plan views of the module 300 according to some examples of embodiments for carrying out the invention.

As shown in FIGS. 1A to 1D, the module 300 may include a wiring board 1001, an integrated circuit component 200, a wiring board 1002, an integrated circuit component 50, and a connecting member 110. The integrated circuit component 200 is mounted on the wiring board 1001. The wiring board 1002 overlaps with the wiring board 1001. The direction in which the wiring plate 1001 and the wiring plate 1002 overlap is the Z direction, the direction orthogonal to the Z direction is the X direction, and the directions orthogonal to the X direction and the Z direction are the Y direction. The integrated circuit component 50 is mounted on the wiring board 1002. The connecting member 110 is arranged between the wiring board 1001 and the wiring board 1002. The connecting member 110 electrically connects the wiring board 1001 and the wiring board 1002. The integrated circuit component 50 overlaps the wiring board 1001. The integrated circuit component 50 supplies electric power to the integrated circuit component 200 via the connecting member 110. By overlapping the integrated circuit component 50 with the wiring board 1001, the module 300 can be downsized.

Since the integrated circuit component 200 and the integrated circuit component 50 are mounted on separate wiring boards 1001 and 1002, the influence of heat generated by the integrated circuit component 200 on the integrated circuit component 50 can be reduced. Therefore, it is possible to reduce the noise that may occur in the integrated circuit component 50 depending on the temperature of the integrated circuit component 50. Then, when the power is supplied from the integrated circuit component 50 to the integrated circuit component 200, the noise that may be superimposed on the power line can be reduced. As a result, the operation of the integrated circuit component 200 is stable. Such an effect is suitable for the module 300 in which the temperature of the integrated circuit component 200 becomes higher than the temperature of the integrated circuit component 50 when the electric power is supplied. The integrated circuit component 200 may be, for example, 60 ° C. or higher. Further, the influence of the heat generated on the integrated circuit component 50 on the integrated circuit component 200 can be reduced. Therefore, it is possible to reduce the noise that may occur in the integrated circuit component 200 due to the temperature of the integrated circuit component 200. As a result, the operation of the integrated circuit component 200 is stable. The integrated circuit component is a semiconductor component including at least one semiconductor substrate and having a plurality of semiconductor elements provided on the one semiconductor substrate. The semiconductor element provided on the semiconductor substrate can be a transistor or a diode.

As shown in FIGS. 1A to 1D, it is preferable that a gap 55 is provided between the integrated circuit component 200 and the integrated circuit component 50. The gap 55 can suppress heat conduction between the integrated circuit component 200 and the integrated circuit component 50.

The wiring board 1001 and the wiring board 1002 are typically printed wiring boards. The wiring board 1001 and the wiring board 1002 may be a wiring board in which a wiring pattern is formed by a method not based on a printing method, such as an interposer formed by a photolithography method. Further, the wiring board 1001 and the wiring board 1002 are typically rigid wiring boards, but the wiring board 1001 and the wiring board 1002 may be flexible wiring boards.

This embodiment is suitable when the integrated circuit component 200 includes an analog circuit. This is because analog circuits are more susceptible to noise than digital circuits, but according to this embodiment, noise can be reduced. The integrated circuit component 200 may be an image pickup device (image sensor) or a display device (display). The image quality (imaging quality or display quality) of the imaging device or the display device can be affected by noise, but according to the present embodiment, the noise can be reduced. The image pickup device may be a CCD image sensor, a CMOS image sensor, a TOF sensor, a SPAD sensor, or the like. The display device may be an EL display, a liquid crystal display, or a digital miller display.

The integrated circuit component 50 is a power supply device that supplies electric power as described above, and is, for example, a device including a linear regulator and a DC / DC converter. The integrated circuit component 50 may be a power supply IC having a single function, a power supply IC having a plurality of functions, or a power management IC (PMIC).

In the examples of FIGS. 1A and 1C, the wiring board 1002 is provided between the integrated circuit component 50 and the wiring board 1001. Further, in the examples of FIGS. 1A and 1C, a wiring board 1002 is provided between the integrated circuit component 50 and the integrated circuit component 50. In the example of FIGS. 1B and 1D, the integrated circuit component 50 is provided between the wiring board 1001 and the wiring board 1002. In the examples of FIGS. 1A and 1B, the wiring board 1001 is provided between the integrated circuit component 200 and the wiring board 1002. Further, in the examples of FIGS. 1A and 1B, a wiring board 1001 is provided between the integrated circuit component 200 and the integrated circuit component 50. In the examples of FIGS. 1 (c) and 1 (d), the integrated circuit component 200 is provided between the wiring board 1001 and the wiring board 1002. Further, in the examples of FIGS. 1 (c) and 1 (d), the integrated circuit component 200 is provided between the wiring board 1001 and the integrated circuit component 50.

As shown in FIGS. 1 (e) and 1 (f), the module 300 may include an integrated circuit component 51 mounted on the wiring board 1002. In the example of FIG. 1 (e), the integrated circuit component 51 is provided between the wiring board 1001 and the wiring board 1002. In the example of FIG. 1 (f), the wiring board 1002 is provided between the integrated circuit component 51 and the wiring board 1001. The integrated circuit component 50 may be configured to supply power to the integrated circuit component 51. The example shown in any one of FIGS. 1 (a) to 1 (d) and the example shown in any of FIGS. 1 (e) and 1 (f) can be combined.

The integrated circuit component 51 can be a storage device (memory). The storage device may be a non-volatile memory such as a flash memory or a volatile memory such as a DRAM or SRAM. The integrated circuit component 51 can be a processing device (processor). The integrated circuit component 51 as a processing device may be a device that processes a signal input to the integrated circuit component 200, or may be a device that processes a signal output from the integrated circuit component 200. The integrated circuit component 51 can be a control device (controller). The integrated circuit component 51 as a control device may be a device that controls the integrated circuit component 200 or other components. The integrated circuit component 51 can be a communication device. Communication devices perform wired communication and wireless communication. The communication device may perform communication in a frequency band of 3.5 to 5.0 GHz, or may perform communication in a frequency band of 24 to 53 GHz. The communication device is not limited to microwaves and millimeter waves, and may communicate using terahertz waves. The integrated circuit component 51 may include a semiconductor device manufactured by a process rule of 65 to 5 nm, or may include a semiconductor device manufactured by a process rule of 1 to 4 nm. In manufacturing these, an EUV exposure apparatus, an electron beam exposure apparatus, a nanoimprint lithography apparatus and the like can be used. A plurality of integrated circuit components 51 may be mounted on the wiring board 1002, and each of the plurality of integrated circuit components 51 may have different functions from each other. For example, the wiring board 1002 may be equipped with at least two devices, a storage device, a processing device, and a control device. The integrated circuit component 50 can also supply electric power to a plurality of integrated circuit components 51 mounted on the wiring board 1002.

In the example shown in FIG. 1 (g), the integrated circuit component 50 overlaps with the integrated circuit component 200. By overlapping the integrated circuit component 50 with the integrated circuit component 200, the module 300 can be miniaturized. In the example shown in FIG. 1 (h), the integrated circuit component 50 does not overlap with the integrated circuit component 200. Since the integrated circuit component 50 does not overlap with the integrated circuit component 200, the influence of the heat of the integrated circuit component 200 on the integrated circuit component 50 can be reduced. The example shown in any one of FIGS. 1 (a) to 1 (d) and the example shown in any of FIGS. 1 (g) and 1 (h) can be combined.

2 (a) is a sectional view of the module 300 according to the first embodiment, FIG. 2 (b) is a sectional view of the module 300 according to the second embodiment, and FIG. 2 (c) is a sectional view of the module 300 according to the third embodiment. It is a cross-sectional view of.

The module 300 includes an integrated circuit component 200, a wiring board 1001, a cover glass 201, a frame 202, a connecting member 110, a wiring board 1002, and an integrated circuit component 50. The integrated circuit component 200 has an analog circuit, and the electric power required for operation is supplied from the integrated circuit component 50 via wiring.

The connection member 110 includes a power supply wiring 971 that supplies a power supply potential from the integrated circuit component 50 to the integrated circuit component 200, and a ground wiring 972 that supplies a ground potential from the integrated circuit component 50 to the integrated circuit component 200.

The cover glass 201 that protects the integrated circuit component 200 is fixed to the wiring board 1001 via the frame 202. The frame 202 has a role as a spacer for preventing the integrated circuit component 200 and the cover glass 201 from coming into contact with each other, and a resin or ceramic is used as the material. The cover glass 201 and the frame 202 are fixed using an adhesive.

The wiring board 1001 has a conductor portion and an insulator portion. For the conductor portion, a conductive metal such as copper or gold is used. For the insulator portion, for example, glass epoxy resin or ceramic is used as a material having electrical insulation. In this example, the conductor portion is made of copper and the insulator portion is made of glass epoxy resin. The outer shape of the wiring board 1001 is substantially a quadrilateral, and the dimensions (long side, short side, diagonal length) of the wiring board 1001 are, for example, 10 to 100 mm. The thickness of the wiring board 1001 is, for example, 200 μm to 2 mm, and from the viewpoint of reducing the thickness of the module 300, the thickness of the wiring board 1001 is preferably less than 800 μm.

In the wiring board 1001, a plurality of conductor layers are arranged at intervals from each other in the Z direction, which is the thickness direction of the wiring board 1001. The conductor layer is at least two layers or more, and an insulator layer is arranged between the two conductor layers. In this example, the conductor layer is composed of four layers. The conductor layer 11, the conductor layer 12, the conductor layer 13, and the conductor layer 14 are stacked and arranged in this order from the side of the integrated circuit component 200. The conductor layer 11 and the conductor layer 14 are surface layers, and a solder resist (not shown) may be provided on the surface thereof. The conductor portion of the wiring board 1001 includes conductor layers 11, 12, 13, 14 and vias connecting these conductor layers, and is used as wiring or electrodes of the wiring board 1001.

The conductor layer 11 is provided with a power supply electrode 911 and a ground electrode 912 that are separated from each other. Further, the conductor layer 14 is provided with a power supply electrode 921 and a ground electrode 922 that are separated from each other. The power supply electrode 911 and the power supply electrode 921 are electrically connected by a power supply wiring 961 provided on the wiring board 1001. The ground electrode 912 and the ground electrode 922 are electrically connected by a ground wire 962 provided on the wiring board 1001. The power supply wiring 961 and the ground wiring 962 are formed by a conductor portion (conductor layer and / or via) of the wiring board 1001.

The integrated circuit component 200 is arranged on the conductor layer 11, and is connected to the power supply electrode 911 and the ground electrode 912 provided on the wiring board 1001 by using the conductive member 901 and the conductive member 902. The conductive member 901 is connected to the power supply electrode 911, and the conductive member 902 is connected to the ground electrode 912. The conductive members 901 and 902 are electrically connected by using a metal material such as gold or aluminum. In this example, the integrated circuit component 200 is mounted on the wiring board 1001 by wire bonding, and the conductive members 901 and 902 are bonding wires such as gold wire and copper wire. However, the present invention is not limited to this, and the integrated circuit component 200 may be mounted on the wiring board 1001 by flip chip bonding, and the conductive members 901 and 902 may be metal bumps such as solder and gold.

The wiring board 1002 has a conductor portion and an insulator portion. For the conductor portion, a conductive metal such as copper is used. For the insulator portion, for example, glass epoxy resin or ceramic is used as a material having electrical insulation. In this example, the conductor portion is made of copper and the insulator portion is made of glass epoxy resin. The outer shape of the wiring plate 1001 is substantially a quadrilateral, and the dimensions (long side, short side, diagonal length) of the wiring plate 1002 are, for example, 10 to 100 mm. The dimensions of the wiring plate 1002 may be larger or smaller than the dimensions of the wiring plate 1001, but from the viewpoint of miniaturization of the module 300, the dimensions of the wiring plate 1002 are 0. It is preferably 9 to 1.1 times. Here, the dimensions of the wiring board 1001 and the wiring board 1002 can be compared in a certain cross-sectional view when both are overlapped. The thickness of the wiring board 1002 is, for example, 200 μm to 2 mm, and from the viewpoint of reducing the thickness of the module 300, the thickness of the wiring board 1001 is preferably less than 800 μm.

In the wiring board 1002, a plurality of conductor layers are arranged at intervals from each other in the Z direction, which is the thickness direction of the wiring board. The conductor layer is at least two layers or more, and an insulator layer is arranged between the two conductor layers. In this example, it is composed of four conductor layers. The conductor layer 21, the conductor layer 22, the conductor layer 23, and the conductor layer 24 are stacked and arranged in this order from the side of the integrated circuit component 200. The conductor layer 21 and the conductor layer 24 are surface layers, and a solder resist (not shown) may be provided on the surface thereof. The conductor portion of the wiring board 1002 includes conductor layers 21, 22, 23, 24 and vias connecting these conductor layers, and is used as wiring or electrodes of the wiring board 1002.

The conductor layer 21 is provided with a power supply electrode 931 and a ground electrode 932 separated from each other. Further, the conductor layer 24 is provided with a power supply electrode 941 and a ground electrode 942 separated from each other. The power supply electrode 931 and the power supply electrode 941 are electrically connected by a power supply wiring 981 provided on the wiring board 1002. The ground electrode 932 and the ground electrode 942 are electrically connected by a ground wire 982 provided on the wiring board 1002. The power supply wiring 981 and the ground wiring 982 are formed by a conductor portion (conductor layer and / or via) of the wiring board 1001.

In addition to the integrated circuit component 50 and the integrated circuit component 51, the wiring board 1002 may include a passive component 52 such as a resistor or a capacitor. The passive component 52 may be a battery such as a lithium ion battery, an all-solid-state battery, or a fuel cell. The passive component 52 as a battery may supply power to the integrated circuit component 50. The integrated circuit component 50 is a power supply circuit for supplying electric power to an analog circuit or a digital circuit included in the integrated circuit component 200, and supplies electric power for operating the integrated circuit component 200.

In the first and third embodiments, as shown in FIGS. 2A and 2C, the integrated circuit component 50 is a conductive member 99 that is conductive to the power supply electrode 941 and the ground electrode 942 provided on the conductor layer 24. It is connected with. Solder or a conductive resin is used for the conductive member 99. Further, in the second embodiment, as shown in FIG. 2B, the integrated circuit component 50 is connected to the power supply electrode 941 and the ground electrode 942 provided in the conductor layer 21 by a conductive conductive member 99. There is. In each of the first to third embodiments, the integrated circuit component 50 overlaps the integrated circuit component 200. In the first and third embodiments, the integrated circuit component 50 may overlap the connecting member 110.

The connecting member 110 has a conductor portion 97 and an insulator portion 109. For the conductive portion 97 of the connecting member 110, a metal having conductivity, for example, copper is used. The conductor portion 97 of the connecting member 110 is used as wiring for connecting the wiring board 1001 and the wiring board 1002. 2 (a) to 2 (c) show the power supply wiring 971 and the ground wiring 972 as the conductor portion 97 of the connecting member 110. The power supply wiring 971 and the ground wiring 972 are supported by the insulator portion 109. For the insulator portion 109, for example, resin or ceramic is used as a material having electrical insulation. The resin used for the insulator portion 109 is a thermoplastic resin or a thermosetting resin, but it is preferable to use a thermosetting resin in order to secure heat resistance during production and use. The connecting member 110 of this example has an insulating portion 109 made of a glass epoxy resin. The connection member 110 of this example may be a member obtained by processing a printed wiring board produced by thermally curing a prepreg containing a thermosetting resin and patterning a conductor. In the connecting member 110 of another embodiment, the insulator portion 109 can also be manufactured by injection molding a thermoplastic resin. The connecting member 110 can also be manufactured by insert molding an insulator portion 109 made of a thermoplastic resin and a conductor portion 97 such as a metal pin.

If the power supply wiring 971 and the ground wiring 972 of the connection member 110 are located between the wiring plate 1001 and the wiring plate 1002, the wiring path between the wiring plate 1001 and the wiring plate 1002 can be made as small as possible. Therefore, it is desirable that the power supply wiring 971 and the ground wiring 972 do not extend outside the outer edges of the wiring board 1001 and the wiring board 1002. On the other hand, the insulator portion 109 of the connecting member 110 may have an extending portion extending from between the wiring plate 1001 and the wiring plate 1002 to the outside of the outer edge of the wiring plate 1001 and the wiring plate 1002. A through hole or the like may be provided in the extending portion for fixing or positioning the module.

Conductive portions are provided at positions corresponding to the upper and lower surfaces of the connecting member 110 in the Z direction, and the conductive portions on the upper and lower surfaces are electrically connected by the conductor portion 97. The conductive portion on the upper surface of the connecting member 110 is connected to the wiring board 1001 via the conductive member 99, and the conductive portion on the lower surface of the connecting member 110 is connected to the wiring board 1002 via the conductive member 99.

The conductor portion 97 formed on the connecting member 110 and the electrodes of the wiring boards 1001 and 1002 realize an electrical connection by using the conductive member 99. Of the plurality of conductor portions 97 provided on the connecting member 110, the power supply wiring 971 connects the power supply electrode 921 of the wiring board 1001 and the power supply electrode 931 of the wiring board 1002. That is, the integrated circuit component 50 supplies the power potential to the integrated circuit component 200 via the power supply wiring 971. Of the plurality of conductor portions 97 provided on the connecting member 110, the ground wiring 972 connects the ground electrode 922 of the wiring plate 1001 and the ground electrode 932 of the wiring plate 1002. That is, the integrated circuit component 50 supplies the ground potential to the integrated circuit component 200 via the power supply wiring 971.

The plurality of conductor portions 97 in the connecting member 110 can be arranged at substantially the same pitch (distance between centers), and the pitch of the two adjacent conductor portions 97 in this case is defined as the arrangement pitch P. The distance between the adjacent conductor portions 97 can be approximated to approximately half (P / 2) of the arrangement pitch P. When N (N ≧ 0) conductor portions 97 are located between the two conductor portions 97, the pitch (intercenter distance) of the two conductor portions 97 is (N + 1) × P, and the two conductor portions 97 are located. The distance of the conductor portion 97 can be approximated by (N + 0.5) × P. The sequence pitch P may be, for example, 10 μm or more, may be 50 μm or more, may be 100 μm or more, and may be 300 μm or more. The arrangement pitch P is, for example, 5 mm or less, may be 3 mm or less, and may be 1 mm or less. The electric power for operating the integrated circuit component 200 is supplied from the integrated circuit component 50 mounted on the wiring board 1002. The path reaches the power supply electrode 931 and the ground electrode 932 through the wiring of the wiring plate 1002 from the power supply electrode 941 and the ground electrode 942 to which the integrated circuit component 50 is connected in the wiring plate 1002. Next, the power supply electrode 921 and the ground electrode 922 are reached through the power supply wiring 971 and the ground wiring 972 extending in the Z direction in the connection member 110. Next, in the wiring plate 1001, the power supply electrode 911 and the ground electrode 912 are reached from the power supply electrode 921 through the power supply wiring 961 and the ground wiring 962 of the wiring plate 1001. Then, the power supply electrode 911 and the ground electrode 912 reach the integrated circuit component 200 through the conductive members 901 and 902.

A general SMT process can be used for manufacturing the module 300 shown in FIGS. 2 (a) to 2 (c). First, the solder paste is supplied on the electrodes provided on one surface of the surface layer of the wiring board 1002 by screen printing or a dispenser. As the next step, the conductive parts of the electronic parts (integrated circuit parts 50 and 51 and the passive parts 52) are mounted so as to be in contact with the supplied solder paste. Next, the conductive member 99 is heated to a temperature equal to or higher than the melting point to melt the conductive member 99, and then solidified by cooling to join the conductive portion of the electronic component and the connection land of the wiring board. The solder paste can be heated in a reflow oven.

Next, the electronic component and the connecting member 110 can be joined to the unmounted surface of the wiring board 1002 by carrying out the above-mentioned three steps of supplying the solder paste, mounting the component, and heating. Since the connecting member 110 can be joined in the same process as the electronic component, it can be joined to other electronic components at the same time.

The joining method between the wiring board 1002 with the connecting member manufactured by the above steps and the wiring board 1001 on which the integrated circuit component 200 and the cover glass 201 are mounted is shown below. First, the solder paste is supplied to the electrodes for the connecting member provided on the surface layer of the wiring board 1001 by screen printing or a dispenser. Next, the electrodes of the connecting member 110 integrated with the wiring board 1002 are aligned with the positions of the supplied solder paste and mounted. After that, it is heated to a melting point or higher to melt the conductive member 99, then cooled, and the conductive member 99 is solidified to perform bonding.

3A, 3B, and 3C are perspective views illustrating the form of the connecting member 110.

The connecting member 110 shown in FIG. 3A has a frame structure. A plurality of connecting portions are provided on the upper surface and the lower surface of the connecting member 110 for connecting the connecting member 110 to the wiring board 1001 and the wiring board 1002. Further, the conductive portions facing each other on the top and bottom are connected by a conductor portion 97 of the connecting member 110. For example, a through hole may be formed and upper and lower continuity may be obtained by copper plating, or a copper rod may be embedded instead of the plating.

The connecting member 110 shown in FIG. 3B has a rectangular parallelepiped shape, and a plurality of connecting members 110 may be used if necessary. The conductive portions connected to the wiring board are formed on the upper and lower surfaces as in FIG. 3A, and the conductive portions facing each other on the upper and lower surfaces are connected by the conductor portion 97 of the connecting member 110. For example, a through hole may be formed and upper and lower continuity may be obtained by copper plating, or a copper rod may be embedded instead of the plating.

The connecting member 110 shown in FIG. 3 (c) has a rectangular parallelepiped shape as in FIG. 3 (b). The conductive portion has a rectangular shape, and the upper and lower conductive portions are electrically connected by using the conductor portion 97 formed on the side surface of the connecting member 110. The conductor portion 97 of the connecting member 110 may be formed, for example, by etching a copper foil bonded to the surface of the insulator portion 109, or by plating.

The integrated circuit component 200 is mounted on the wiring board 1001, and the integrated circuit component 50 is mounted on the wiring board 1002. Further, the wiring board 1001 and the wiring board 1002 are connected via the connecting member 110. That is, most of the space between the wiring plate 1001 and the wiring plate 1002 is the gap 55, and the main heat transfer path between the wiring plate 1001 and the wiring plate 1002 is the connecting member 110.

Therefore, even if the integrated circuit component 200 generates heat, the thermal influence on the integrated circuit component 50 can be suppressed by interposing the void 55 having a high thermal resistance. By suppressing the temperature change of the integrated circuit component 50, Johnson noise can be reduced and the operation of the integrated circuit component 200 can be stabilized.

Next, the induced noise will be described in detail. The electric power for operating the integrated circuit component 200 is supplied from the integrated circuit component 50 joined on the wiring board. The route leads from the power supply electrode connecting the integrated circuit component 50 to the power supply electrode 931 through the wiring of the wiring board in the wiring board 1002. Next, the power electrode 921 is reached through the conductor portion 97 connecting the upper and lower electrodes of the connecting member 110. Next, in the wiring board 1001, the power supply electrode 921 reaches the power supply electrode 911 through the wiring of the wiring board and the first via conductor 96, and reaches the integrated circuit component 200 through the wire. At that time, a closed loop is formed by the wiring from the integrated circuit component 50 to the integrated circuit component 200. Assuming that the area of the closed loop is S, the magnetic flux density is B, and the magnetic flux interlinking the closed loop is Φ, it is expressed as Φ = B × S. That is, the magnetic flux Φ is proportional to the area S of the closed loop. When the magnetic flux Φ interlinks the closed loop, an induced electromotive force V corresponding to the time change of the magnetic flux Φ is generated in the closed loop of the wiring. This follows Faraday-Lenz's law. The relationship between the induced electromotive force V and the change ΔΦ of the magnetic flux Φ in the minute time Δt is expressed by V = −ΔΦ / Δt. Since ΔΦ is proportional to the area S of the closed loop, the induced electromotive force V generated in the closed loop is also proportional to the area S of the closed loop. According to Ohm's law, the relationship between the induced electromotive force V generated in the closed loop, the impedance R of the closed loop, and the induced current I flowing through the closed loop is expressed by I = V / R. Since the induced current I is inversely proportional to the impedance R, the smaller the impedance R, the easier it is for the induced current I to flow. When the magnetic flux Φ faces in the opposite direction by 180 degrees, the directions of the induced electromotive force V and the current I are in the opposite directions. Further, even when the magnetic flux Φ reaches the closed loop plane in the oblique direction, the induced electromotive force V is generated by the component of the magnetic flux Φ in the direction perpendicular to the loop surface.

The integrated circuit component 200 may have an analog circuit having low resistance to magnetic flux. Therefore, when the magnetic flux becomes large, inductive noise is generated in the analog circuit of the integrated circuit component 200, which causes a decrease in operational stability. Alternatively, noise may be superimposed on the signal handled in the analog circuit. If the integrated circuit component 200 is an image pickup device or a display device, the image quality may be deteriorated. In order to suppress the influence caused by this inductive noise, it can be said that the closed loop area should be reduced. By overlapping the integrated circuit component 50 with the wiring board 1001, the spread of the closed loop can be suppressed and the inductive noise can be reduced. Further, by arranging the integrated circuit component 50 at a position overlapping the wiring board 1001, the power supply path from the integrated circuit component 50 to the integrated circuit component 200 can be shortened, and more stable power supply can be realized. When the integrated circuit component 50 overlaps the connecting member 110, the closed loop area can be made smaller.

FIG. 4A shows a perspective view of the module 300. The outer shape of the integrated circuit component 200 may be a quadrilateral. Let Dw be the diagonal dimension of the integrated circuit component 200. Further, when the integrated circuit component 200 is viewed in a plan view, the dimension of the first side is Dx, and the dimension of the second side intersecting the first side is Dy. FIG. 4B shows a plan view of the wiring board 1001, and FIG. 4C shows a plan view of the wiring board 1002. The examples shown in FIGS. 4 (b) and 4 (c) show suitable arrangements of electrodes and wiring in reducing thermal noise and inductive noise in the module 300.

In order to reduce the influence of inductive noise, it is preferable that the distance Da between the power supply wiring 971 and the ground wiring 972 is smaller than the dimension Dw of the integrated circuit component 200 (Da <Dw). It is preferable that the distance Da between the power supply wiring 971 and the ground wiring 972 is smaller than the dimension Dx of the integrated circuit component 200 (Da <Dx). It is preferable that the distance Da between the power supply wiring 971 and the ground wiring 972 is smaller than the dimension Dy of the integrated circuit component 200 (Da <Dy).

As shown in FIG. 5A, the distance Da between the power supply wiring 971 and the ground wiring 972 is larger than the dimension Dv of the wiring plate 1001 (Dv is any of Dw, Dx, and Dy) (Dv>. Da), a large closed loop L1 is formed. Therefore, inductive noise may occur. On the other hand, as shown in FIGS. 5 (b) and 5 (c), the distance Da between the power supply wiring 971 and the ground wiring 972 is the dimension Dv of the integrated circuit component 200 (Dv is any of Dw, Dx, and Dy). If it is smaller than (Da <Dv), small closed loops L2 and L3 can be formed. When the integrated circuit component 50 is arranged between the wiring board 1001 and the wiring board 1002 as shown in FIG. 5C, the width of the closed loop L3 in the Z direction can be made smaller than that of the closed loop L1, so that inductive noise is reduced. It is advantageous to.

In order to effectively reduce the induced noise, the distance Da may be arranged so as to satisfy the following equation (1).

That is, it is preferable that the distance Da is 1/10 or less of the dimension Dw (Da ≦ Dw / 10). At least one of the dimensions Dw, Dx, and Dy is, for example, 1 mm or more, 5 mm or more, 10 mm or more, 25 mm or more, 100 mm or less, and 50 mm or less. You may. The distance Da may be, for example, 50 mm or less, 10 mm or less, 5 mm or less, 3 mm or less, or 1 mm or less. The distance Da may be, for example, 10 μm or more, 50 μm or more, 100 μm or more, or 200 μm or more.

For the arrangement pitch P of the conductor portions 97 in the connecting member 110, when N (N ≧ 0) conductor portions 97 are located between the power supply wiring 971 and the ground wiring 972, the distance Da is (N + 0.5) ×. It can be approximated by P. It is preferable that the number N of the conductor portions 97 located between the power supply wiring 971 and the ground wiring 972 satisfies 0 ≦ N ≦ 3. When one conductor portion 97 is located between the power supply wiring 971 and the ground wiring 972, the distance Da is approximately 1.5 × P.

Even if the structure of the connecting member 110 is different, the influence of inductive noise can be sufficiently suppressed by satisfying the above equation (1) with respect to the distance Da between the power supply wiring 971 and the ground wiring 972 and the size of the integrated circuit component 200. Further, it is preferable that the distance Da is at least 1/10 or less of any one of the dimensions Dx and Dy (Da ≦ Dx / 10, Da ≦ Dy / 10). It is preferable that the distance Da is 1/10 or less of the dimension Dx and at least 1/10 or less of the dimension Dy. It is also preferable that the distance Da between the power supply wiring 971 and the ground wiring 972 is smaller than the distance Db between the wiring board 1001 and the wiring board 1002 (Da <Db). The distance Da may be 1/2 or less of the distance Db (Da ≦ Db / 2), and the distance Da may be 1/4 or less of the distance Db. It may be Da ≦ Db / 4). As described above, it is advantageous to reduce the distance Da as much as possible in order to reduce the influence of the induced noise. The distance Db between the wiring board 1001 and the wiring board 1002 can be approximated to the thickness of the connecting member 110. In order to suppress heat conduction from the wiring board 1001 to the wiring board 1002, it is preferable that the distance Db is large. The thickness of the distance Db and the connecting member 110 may be larger than the thickness of the wiring board 1001 or may be larger than the thickness of the wiring board 1002. The distance Db is, for example, 500 μm or more, may be 1 mm or more, may be 3 mm or less, and may be 5 mm or less.

As shown in FIG. 4B, the distance between the power supply electrode 921 and the ground electrode 922 can be approximated to the distance Da between the power supply wiring 971 and the ground wiring 972. On the other hand, the distance Dc between the power supply electrode 911 and the ground electrode 912 can be set independently of the distance Da. In the present embodiment, the distance Dc may be larger than the distance Da (Dc> Da), and the distance Dc may be twice or more the distance Da (Dc ≧ 2 × Da). However, the distance Dc may be smaller than the distance Da (Dc <Da), and the distance Dc may be less than half of the distance Da (Dc ≦ Da / 2). The distance Dc may be greater than half the distance Da (Dc> Da / 2), and the distance Dc may be less than twice the distance Da (Dc> Da / 2).

As shown in FIG. 4C, the distance between the power supply electrode 931 and the ground electrode 932 may also be approximated to the distance Da between the power supply wiring 971 and the ground wiring 972. On the other hand, the distance Dd between the power supply electrode 941 and the ground electrode 942 can be set independently of the distance Da. In the present embodiment, the distance Dd may be larger than the distance Da (Dd> Da), and the distance Dd may be twice or more the distance Da (Dd ≧ 2 × Da). However, the distance Dd may be smaller than the distance Da (Dd <Da), and the distance Dd may be less than half of the distance Da (Dd ≦ Da / 2). The distance Dd may be greater than half the distance Dd (Dd> Da / 2), and the distance Dd may be less than twice the distance Da (Dd> Da / 2). In the present embodiment, the distance Dc is larger than the distance Dd (Dc> Dd), but the distance Dc may be smaller than the distance Dd (Dc <Dd).

The distance De between the power supply electrode 921 and the power supply electrode 911 is larger than the dimension Dx (De> Dx) in this example, but may be smaller than the dimension Dx (De <Dx). The distance De is smaller than the dimension Dw in this example (De <Dw), but may be larger than the dimension Dw (De> Dw). In this example, the distance De is larger than the distance Da (De> Da), but may be smaller than the distance Da (De <Da). The distance Df between the power supply electrode 931 and the power supply electrode 941 is larger than the distance Dd (Df> Dd) in this example, but may be smaller than the distance Dd (Df <Dd). The distance Df is larger than the distance Da (Df> Da) in this example, but may be smaller than the distance Da (Df <Da). The distance Dd is, for example, 100 μm or more, and may be 300 μm or more. The distance Dd may be, for example, 10 mm or less, may be 5 mm or less, may be 3 mm or less, and may be 1 mm or less.

The distance Dg between the ground electrode 922 and the ground electrode 912 is smaller than the dimension Dx (Dg <Dx) in this example, but may be larger than the dimension Dx (Dg> Dx). The distance Dg is smaller than the dimension Dw (Dg <Dw) in this example, but may be larger than the dimension Dw (Dg> Dw). The distance Dg is larger than the distance Da (Dg> Da) in this example, but may be smaller than the distance Da (Dg <Da). The distance Dh between the ground electrode 932 and the ground electrode 942 is larger than the distance Dd (Dh> Dd) in this example, but may be smaller than the distance Dd (Dh <Dd). The distance Dh is larger than the distance Da (Dh> Da) in this example, but may be smaller than the distance Da (Dh <Dh).

The closed loop area can also be reduced by reducing the distance Dc between the power supply electrode 911 and the ground electrode 912. In order to reduce the influence of inductive noise, it is preferable that the distance Dc between the power supply electrode 911 and the ground electrode 912 is smaller than the dimension Dw of the integrated circuit component 200 (Dc <Dw). It is also preferable that the distance Dc is smaller than the dimension Dx (Da <Dx). It is preferable that the distance Dc is smaller than the dimension Dy of the integrated circuit component 200 (Da <Dy). However, in this example, the distance Dc between the power supply electrode 911 and the ground electrode 912 is larger than the dimension Dx of the integrated circuit component 200 in order to supply the power supply potential and the ground potential to both sides of the integrated circuit component 200. It has a configuration (Dc> Dx).

In the above, it has been described that the distance (Da, Dc) between the supply path of the power supply potential and the supply path of the ground potential is reduced in order to reduce the closed loop area. Not limited to this, the closed loop area can also be reduced by reducing the length of the supply path of the power supply potential or reducing the length of the supply path of the ground potential. The length of the power supply potential supply path in the closed loop largely depends on the sum of the distance Df, the distance Db, and the distance De. The length of the ground potential supply path in the closed loop largely depends on the sum of the distance Dd, the distance Dh, and the distance Dg. Therefore, for example, reducing the distance De and the distance Df that occupy the supply path of the power supply potential is also effective in reducing noise. Further, reducing the distance Df and the distance Dh that occupy the supply path of the ground potential is also effective in reducing noise. Reducing the distance Db is also effective in reducing noise. The distance Db can be, for example, 1 to 5 mm, and the distance Db may be smaller than the dimension Dv (Db <Dv) or smaller than the distance Dd (Db <Dd).

In order to reduce at least one of the distance De and the distance Dg, at least one of the power supply electrode 911 and the ground electrode 912 may be arranged at a position overlapping the connecting member 110. In order to reduce at least one of the distance Dd and the distance Dh, at least one of the power supply electrode 941 and the ground electrode 942 may be arranged at a position overlapping the connecting member 110. As shown in FIGS. 1 (a), 2 (a), and (c), the form in which the wiring plate 1001 and the wiring plate 1002 are located between the integrated circuit component 200 and the integrated circuit component 50 is the connecting member 110. It is preferable that at least one of the power supply electrode 911 and the ground electrode 912 and at least one of the power supply electrode 941 and the ground electrode 942 can be arranged at a position overlapping the power supply electrode 911 and the ground electrode 912. While the distance De depends on the dimension Dv of the integrated circuit component 200, the distance Df is smaller than the distance De if the position of the integrated circuit component 50 on the wiring board 1001 can be appropriately set (Df). <De) is preferable. As a result, the supply path of the power supply potential can be shortened as much as possible. The heat generated in the integrated circuit component 200 can be transferred to the wiring board 1002 via the wiring board 1001 and the connecting member 110. Therefore, in order to suppress the heat generated in the integrated circuit component 200 from being transferred to the integrated circuit component 50, it is preferable that the integrated circuit component 50 is separated from the connecting member 110. Therefore, it is preferable that the distance Df is larger than the distance Dd (Df> Dd).

By reducing the distance Da between the power supply wiring 971 and the ground wiring 972, the closed loop area can be reduced. As described above, it satisfies at least one of Da <Dv, Da ≦ Dv / 10 (Dv is any of Dw, Dx, and Dy), Da <Db, Da ≦ Db / 2, and Da ≦ Db / 4. Therefore, the closed loop area can be reduced. It is also preferable to satisfy the relationship of (Da, Dd, Dg) <(Db, Df, Dh) <(Dc, De) <Dv with respect to the dimensions and distances shown in FIG. Here, "(A, B) <(C, D)" means that at least one of A and B is smaller than at least one of C and D, and A to D are described above. Corresponds to either distance or dimensions.

For example, in the rectangular parallelepiped connecting member 110 as shown in FIG. 6A, the power supply wiring 971 and the grounding wiring 972 for supplying power to the integrated circuit component 200 are the same so that the distance Da satisfies the above equation. It may be arranged on the connecting member 110. As shown in FIG. 6B, the power supply wiring 971 and the ground wiring 972 provided in the different connection members 110 may be used.

Further, in the case where the electrode as shown in FIG. 7A has a rectangular shape and the connecting member 110 has a rectangular parallelepiped shape, the power supply wiring 971 and the ground wiring 972 for supplying power to the integrated circuit component 200 have a distance Da of the above. It may be arranged in the same connecting member 110 so as to satisfy the formula of. Alternatively, as shown in FIG. 7B, the power supply wiring 971 and the ground wiring 972 provided on different connection members 110 may be used. Further, by using such a module 300, the heat generated by the integrated circuit component 200 is not transmitted to the integrated circuit component 50, Johnson noise of the integrated circuit component 50 is suppressed, and the operational stability of the integrated circuit component 200 is lowered. It can also be prevented.

In the description using FIGS. 2 to 7, the wiring path including the wiring 971 is described as the power supply potential supply path, and the wiring path including the wiring 972 is described as the ground potential supply path. However, the wiring path including the wiring 971 may be used as the ground potential supply path, and the wiring path including the wiring 972 may be used as the power supply potential supply path.

8A shows a connection portion between the connection member 110 and the wiring board 1001 and the wiring board 1002 in the first embodiment shown in FIG. 2A or the second embodiment shown in FIG. 2B. The enlarged view of is shown. FIG. 8B shows an enlarged view of a connection portion between the connection member 110 and the wiring board 1001 and the wiring board 1002 in the third embodiment shown in FIG. 2C.

Matters common to the first to third embodiments will be described. The wiring board 1001 has connection electrodes 923 and 924, and the wiring board 1002 has connection electrodes 933 and 934. The connecting member 110 has connection wirings 973 and 974 as a plurality of conductor portions 97, and an insulator portion 109 that supports the plurality of conductor portions 97 (connection wirings 973 and 974). The connection wiring 973 has a conductive portion 976, a conductive portion 977, and a conductive portion 978 between the conductive portion 976 and the conductive portion 977 along the Z direction in which the wiring plate 1001 and the wiring plate 1002 overlap. The conductive portion 976 is connected to the connection electrode 923 of the wiring board 1001 via the conductive member 991. The conductive member 991 is in contact with the conductive portion 976 and the connection electrode 923. The conductive portion 977 is connected to the connection electrode 933 of the wiring board 1002 via the conductive member 992. The conductive member 992 is in contact with the conductive portion 977 and the connection electrode 933. The conductive members 991 and 992 are examples of the conductive member 99 described above, and are, for example, solder bumps in the first and second embodiments, and solder fillets in the third embodiment. The conductive members 991 and 992 are separated from each other, and none of the conductive members 991 and 992 are in contact with the conductive portion 978. In the Z direction, the conductive member 991 is located between the connection electrode 923 and the conductive portion 976. In the Z direction, the conductive member 992 is located between the connection electrode 933 and the conductive portion 977. As described above, the connection electrode 923, the conductive member 991, the conductive portion 976, the conductive portion 978, the conductive portion 977, the conductive member 992, and the connection electrode 933 are arranged in the Z direction. Therefore, the wiring path between the wiring board 1001 and the wiring board 1002 can be shortened, and the mounting density of the connection wiring can be increased. Here, the connection wiring 973 has been described in detail, but the same applies to the connection wiring 974. The connection wiring 974 is connected to the connection electrode 924 of the wiring board 1001 via the conductive member 993, and is connected to the connection electrode 924 of the wiring board 1001 via the conductive member 994. It is connected to the connection electrode 934 of the wiring board 1002. The conductive members 993 and 994 are also examples of the conductive member 99 described above, and are, for example, solder bumps in the first and second embodiments, and solder fillets in the third embodiment.

The third embodiment shown in FIG. 8B differs from the first and second embodiments in that the conductive member 99 is in contact with the side surface of the connecting member 110. That is, the conductive portion 976 is located between the conductive member 991 and the insulator portion 109 in the X direction perpendicular to the Z direction. Further, in the X direction perpendicular to the Z direction, the conductive portion 977 is located between the conductive member 992 and the insulator portion 109. In the modified example of the third embodiment, the conductive member 991 does not have to be located between the connection electrode 923 and the conductive portion 976 in the Z direction, and the connection electrode 923 and the conductive portion 976 may be in contact with each other. good. Further, in the Z direction, the conductive member 992 may not be located between the connection electrode 933 and the conductive portion 977, and the connection electrode 933 and the conductive portion 977 may be in contact with each other.

9 (a) is a modification of the connecting member 110 shown in FIG. 3 (c), which is applicable to the third embodiment and the like. The connecting member 110 has a separating portion 120 on each of the plurality of conductor portions 97. Here, the continuous separation portions 120 cover the plurality of conductor portions 97. FIG. 9A shows Example A in which the conductor portion 97 is embedded in the recess provided in the insulator portion 109 and the side surface of the connecting member 110 is flattened. Further, FIG. 9A shows an example B in which a plurality of conductor portions 97 are arranged on the side surface of the flat insulator portion 109, and the side surface of the connecting member 110 has irregularities. In Example B, the concave portion is formed by the insulator portion 109 and the convex portion is formed by the conductor portion 97, and the separated portion 120 also has unevenness along the unevenness.

9 (b) shows an example in which the connecting member 110 shown in FIG. 9 (a) is applied to the module. The form different from the form shown in FIG. 8 (b) is that the separated parts 121 and 122 are provided as an example of the separated part 120, and the other points are the same as the form shown in FIG. 8 (b). Since it may be present, the explanation is omitted. The module 300 has a separation portion 121 located between the conductive member 991 and the conductive member 992 in the Z direction. The separation portion 121 facilitates the separation of the conductive member 991 and the conductive member 992. In the X direction perpendicular to the Z direction, the conductive portion 978 is located between the separation portion 121 and the insulator portion 109. By covering the conductive portion 978 with the separated portion 121, none of the conductive members 991 and 992 comes into contact with the conductive portion 978. In the example of FIG. 9B, the thickness of the separated portion 121 in the X direction is smaller than the thickness of the conductive portion 978 in the X direction, thereby suppressing an increase in the dimensions of the connecting member 110. Since the conductive portion 978 is covered with the separated portion 121, oxidation of the conductive portion 978 can be suppressed, and an increase in resistance of the connection wiring 973 can be suppressed. In that case, the separated portion 121 can also be referred to as a protective portion for protecting the connection wiring 973 (particularly the conductive portion 978). By making the thickness of the separated portion 121 in the X direction larger than the thickness of the conductive portion 978 in the X direction, the protective function can be enhanced.

The separation portion 120 is arranged so that the plurality of conductor portions 97 do not short-circuit. Therefore, the typical separation portion 120 is an insulator, and as the insulator, an organic insulating film such as solder resist or an inorganic insulating film such as silicon oxide can be used. If the separation portion 120 is formed only on the conductor portion 97, the separation portion 120 may be a conductor. In that case, the separated portion 121 can also be referred to as a conductive portion for improving the conductivity of the connection wiring 973. In FIG. 9B, if the wettability of the conductive member 99 with respect to the separated portion 121 of the conductor is low and the wettability of the conductive member 99 with respect to the conductive portions 976 and 977 is low, the conductive member 991 and the conductive member 992 are satisfactorily wetted. Can be separated. By making the separation portion 121 a conductor, the resistance of the connection wiring 973 can be reduced. By making the thickness of the separated portion 121 in the X direction larger than the thickness of the conductive portion 978 in the X direction, the resistance of the connection wiring 973 can be easily reduced. The same applies to the separated portion 122. The connection form between the wiring board 1001 and the wiring board 1002 via the connecting member 110 has been described with reference to FIGS. 8 and 9. With respect to such a connection form, the types and arrangements of the integrated circuit components mounted on the wiring boards 1001 and 1002 can be variously changed regardless of the relationship between the integrated circuit components 200, 50, and 51.

FIG. 10A is a schematic diagram of a device 600 provided with a module 300 as an example of the device according to the embodiment. A device 600 such as a digital camera, a digital video camera, or a smartphone with a built-in camera includes a module in which electronic components such as integrated circuit components 200, 50, and 51 are mounted on a printed wiring board. In order to reduce the size, high image quality, and high performance of the module 300 for imaging in which the integrated circuit component 200 is an imaging device, high-density mounting in which a large number of electronic components are arranged on a wiring board of a limited size is required. .. The electronic components include a relatively large integrated circuit component 51 such as a memory, an integrated circuit component 50 for operating the integrated circuit components 200 and 51, and a passive component 52 such as a resistor and a capacitor. On the other hand, the integrated circuit component 200 as an image pickup device is also required to be increased in size such as APSC size or full size as the definition becomes higher. Along with this, the amount of heat generated by the integrated circuit component 200 tends to increase. Further, as the usage of the module 300, it is increasingly used for continuous shooting and long-time moving image shooting, and the integrated circuit component 200 is more likely to generate heat. As a result, if the temperature of the integrated circuit component 50 that operates the integrated circuit component 200 is raised, Johnson noise is generated, which causes a problem of deterioration in image quality. However, when the integrated circuit component 50 and the integrated circuit component 200 are mounted on the same wiring board, the thermal resistance of the wiring board is constant, and heat transfer from the integrated circuit component 200 to the integrated circuit component 50 is likely to occur. In order to reduce the effect of heat while the amount of heat generated tends to increase, it is necessary to further increase the distance between the arrangements of the integrated circuit components. As a result, the area of the wiring board becomes large, and it becomes difficult to arrange the module in the limited space in the product, which is becoming smaller and smaller. It is desired to provide a structure that reduces the thermal influence from the integrated circuit component 200 to the integrated circuit component 50 and realizes high image quality without changing the size of the module 300.

FIG. 10A is a schematic diagram of a device 600 provided with a module 300 as an example of the device according to the embodiment. The device 600 may be a device in which a lens and a camera body are integrated, but in this example, it is a digital single-lens camera with interchangeable lenses, and includes a camera body 601 and a lens barrel 602. The camera body 601 includes a housing 500, a module 300 arranged in the housing 500, and a circuit board 400. The lens barrel 602 includes an optical system 210 that forms an optical image on the light incident surface 301 of the image pickup device when the lens barrel 602 is attached to the camera body 601. The optical system 210 has a lens 211 arranged on the light incident side and a lens 212 arranged on the light emitting side. The lenses 211 and 212 are held in the housing 220 of the lens barrel 602. The module 300 and the circuit board 400 are electrically connected by a connecting component 700. The module 300 (imaging module) is mounted with a wiring board 1001 on which an integrated circuit component 200 and a passive component 52 such as a resistor or a capacitor are mounted, and a tall component such as a memory or an integrated circuit component 50. It has a wiring board 1002 and a connecting member 110. The wiring board 1001 and the wiring board 1002 are electrically connected via the connecting member 110. The circuit board 400 includes an integrated circuit component 800, which is an example of an electronic component, and a wiring board 1003 on which the integrated circuit component 800 is mounted. Have. The integrated circuit component 800 may be a processing device (processor) that processes a signal output from the integrated circuit component 800. The connecting component 700 preferably has flexibility, and a cable, a flexible wiring board, or the like can be used for the connecting component 700. The signal path between the integrated circuit component 200 and the integrated circuit component 800 is, for example, from the integrated circuit component 200 to the integrated circuit component 800 via the wiring board 1001, the connecting member 110, the wiring plate 1002, and the connecting component 700. .. In that case, a passive component (connector) for connecting the connecting component 700 can be mounted on the wiring board 1002. However, the signal path between the integrated circuit component 200 and the integrated circuit component 800 does not have to go through the connecting member 110. For the signal path between the integrated circuit component 200 and the integrated circuit component 800, a passive component (connector) for connecting the connecting component 700 is mounted on the wiring board 1001, and the integrated circuit is connected from the integrated circuit component 200 to the integrated circuit component 700. It may be up to the component 800. In that case, since the signal path can be shortened, delay and the like can be suppressed. The device 600 includes a module 900 (display module) including a display device such as a liquid crystal display. The module 900 is connected to the wiring board 1003 via a connection component 710 such as a flexible wiring board.

The integrated circuit component 200 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) or a CCD (Charge Coupled Device). The integrated circuit component 200 has a function of converting light incident through the lens barrel 602 into an electric signal.

FIG. 10B is a schematic diagram of the device 600 including the module 300 according to the embodiment. The device 600 can be a camera such as a digital still camera, a digital video camera, a surveillance camera, a network camera, or a Web camera. The device 600 may be a camera in which a lens and a camera body are integrated, but is a digital single-lens camera, and includes a camera body 601 and a lens barrel 602 that can be attached to and detached from the camera body 601. The camera body 601 includes a housing 500. The housing 500 has a mount 111 to which the lens barrel 602 can be attached and detached. Inside the housing 500, a module 300 having a light incident surface 301 is arranged. The direction perpendicular to the light incident surface 301 is the Z direction. The module 300 is held by a metal frame 103. The module 300 includes a wiring plate 1001 on which an image pickup device is mounted, a wiring plate 1002 that overlaps the wiring plate 1001, and a connecting member 110 that connects the wiring plate 1001 and the wiring plate 1002. Inside the metal frame 103, a plurality of coils 104 that mechanically drive the module 300, which is an example of an inductor element, are arranged. Each coil 104 generates a Lorentz force to drive the module 300 in the direction opposite to the direction of camera shake. The image pickup device is a CMOS image sensor, a CCD image sensor, or the like, and the image pickup device is formed in a rectangular shape, specifically, a rectangular shape when viewed in the Z direction perpendicular to the light incident surface 301. The direction parallel to the light incident surface 301, the long side direction of the imaging device is the X direction, and the short side direction is the Y direction. For example, the Y direction is the first direction and the Z direction is the second direction. The image pickup device photoelectrically converts the light image formed on the light incident surface 301 and outputs the pixel signal to the wiring board 1001. The lens barrel 602 includes an optical system 210 that forms an optical image on the light incident surface 301 of the image pickup device when the lens barrel 602 is attached to the camera body 601. Further, the lens barrel 602 includes a coil 203 that mechanically drives the optical system 210, which is an example of an inductor element. The optical system 210 has a lens 211 arranged on the light incident side and a lens 212 arranged on the light emitting side. The lens barrel 602 is provided with a ring mount 204. The lens 212 is supported by the ring mount 204. The coil 203 is arranged so as not to block the optical path from the optical system 210 to the light incident surface 301 of the image pickup device, that is, to be located on the outer periphery of the image pickup device when viewed from the front as shown in FIG.

The coils 104 and 203 operate by supplying an alternating current having a frequency in the kHz band, that is, a frequency of 1 [kHz] or more and less than 1 [MHz]. The coils 104 and 203 generate magnetic flux around them when an alternating current is supplied. This magnetic flux causes inductive noise to the module 300. The direction of the magnetic flux is indicated by a broken arrow in FIG. 2, but since it is an alternating magnetic field generated by an alternating current, the direction of the broken arrow and the opposite direction are alternately switched.

The magnetic field generated from the inductor elements such as the coils 104 and 203 of FIG. 10B reaches the module 300. The closed loop in the module 300 has different resistance to inductive noise depending on the type of circuit to be connected. Specifically, in the module 300, the closed loop of the analog circuit is less resistant to inductive noise than the closed loop of the digital circuit. In particular, the wiring related to the pixel array has low resistance to magnetic field noise because it directly affects the pixel signal. In addition, the lower the impedance of the wiring, the easier it is for the induced current to flow, and the lower the resistance to magnetic field noise. When the voltage distribution occurs in the closed loop of the analog ground due to the induced electromotive force, the pixel signal, which is an analog signal, fluctuates depending on the distribution of the ground potential. In order to prevent pattern noise from occurring in the output image of the imaging device, that is, to increase the resistance of the module 300 to magnetic field noise, the closed loop area of the analog circuit may be reduced.

The device provided with the module 300 according to the present embodiment is not limited to an image pickup device such as a camera, but may be an electronic device such as a smartphone or a personal computer, or a display device such as a television or a display. It can be a transport device such as a vehicle, a ship, or an air vehicle. Alternatively, the equipment is medical equipment such as endoscopes and radiodiagnosis, measuring equipment such as distance measuring sensors, analysis equipment such as electronic microscopes, office equipment such as printers, scanners and copiers, and industries such as robots and manufacturing equipment. It may be a device. When the above-mentioned various devices include a coil that generates a magnetic field, the generation of dielectric noise can be suppressed by adopting the configuration of the module 300.

Here, an example in which the above-described embodiment of the module 300 is applied to the image pickup module has been described, but the above-mentioned embodiment of the module 300 may be applied to the display module.

In FIG. 2A, the wiring board 1001 uses FR-4, which is a glass epoxy resin. The external size is 43 mm × 50 mm, and the thickness is 0.5 mm. The conductor layer is made of copper foil and is composed of four layers. The first layer of the conductor layer is provided with a plurality of electrodes for connecting to the integrated circuit component 200. The electrodes include a power supply electrode 911 and a ground electrode 912 for supplying electric power for operating the integrated circuit component 200. Further, the fourth layer of the conductor layer is provided with an electrode for connecting to the connecting member 110. The diameter of the electrode to which the connecting member 110 is connected is 0.3 mm, and the adjacent pitch is 0.6 mm.

The size of the integrated circuit component 200 is about 30 × 40 mm, and the thickness is 0.7 mm. The integrated circuit component 200 is fixed to the wiring board 1001 by a die bond, and is connected to an electrode on the wiring board by a bonding wire.

The size of the cover glass 201 is 40 mm × 50 mm, and the thickness is 0.5 mm. The cover glass 201 is adhered to a resin frame having a height of 1 mm and a width of 1 mm so as not to come into contact with the integrated circuit component 200. The frame is adhered to the surface of the wiring board 1001.

The wiring board 1002 uses FR-4, which is a glass epoxy resin. The external size is 43 mm × 50 mm, and the thickness is 0.5 mm. The conductor layer is made of copper foil and is composed of four layers. The first layer of the conductor layer is provided with electrodes for connecting chip components such as a memory, a capacitor, and a resistor, which are integrated circuit components, and a connecting member 110. The diameter of the electrode to which the connecting member 110 is connected is 0.3 mm, and the adjacent pitch is 0.6 mm. The memory, which is the integrated circuit component 51, has a BGA (Ball Grid Array) structure, has a size of 14 mm × 14 mm, and has a thickness of 1.2 mm. A solder ball provided on the lower surface of the memory is joined to an electrode provided on the wiring board 1002.

Further, the fourth layer of the conductor layer is provided with a fourth electrode for connecting the integrated circuit component 50. The integrated circuit component 50 has a size of 3 mm × 3 mm and a thickness of 0.7 mm. A connection electrode is provided on the lower surface of the component, and is joined to a fourth electrode provided on the wiring board 1002 via a conductive member 99.

As shown in FIG. 3A, the connecting member 110 has a frame shape. The external size is 34 mm × 44 mm, the width of the frame is 1.6 mm, and the thickness is 2 mm. FR-4, which is a glass epoxy resin, is used as an insulator. A plurality of conductive portions are provided on the upper surface and the lower surface of the connecting member 110. Further, the conductive portions facing each other at the top and bottom are connected by a conductor portion 97 of the connecting member. Through-holes are formed, and upper and lower conduction is obtained by Cu plating. A lid is formed on the upper and lower ends of the through-hole by applying copper plating so as to fill the hole, and this is an electrode. The diameter of the electrode is 0.3 mm, and the adjacent pitch is 0.6 mm.

The electrodes formed on the upper surface of the connecting member 110 are joined to the wiring board 1001 by the conductive member 99. Further, the electrodes formed on the lower surface are joined to the wiring board 1002 by the conductive member 99.

By using such a module 300, the heat generated by the integrated circuit component 200 is not transmitted to the integrated circuit component 50, Johnson noise of the integrated circuit component 50 is suppressed, and deterioration of image quality can be prevented.

In FIG. 2A, the wiring board 1001 uses FR-4, which is a glass epoxy resin. The external size is 43 mm × 50 mm, and the thickness is 0.5 mm. The conductor layer is made of copper foil and is composed of four layers. The first layer of the conductor layer is provided with a plurality of electrodes for connecting to the integrated circuit component 200. The electrodes include a power supply electrode 911 and a ground electrode 912 for supplying electric power for operating the integrated circuit component 200. Further, the fourth layer of the conductor layer is provided with an electrode for connecting to the connecting member 110. The diameter of the electrode to which the connecting member 110 is connected is 0.3 mm, and the adjacent pitch is 0.6 mm.

The size of the integrated circuit component 200 is about 30 × 40 mm, and the thickness is 0.7 mm. The integrated circuit component 200 is fixed to the wiring board 1001 by a die bond, and is connected to an electrode on the wiring board by a bonding wire.

The size of the cover glass 201 is 40 mm × 50 mm, and the thickness is 0.5 mm. The cover glass 201 is adhered to a resin frame having a height of 1 mm and a width of 1 mm so as not to come into contact with the integrated circuit component 200. The frame is adhered to the surface of the wiring board 1001.

The wiring board 1002 uses FR-4, which is a glass epoxy resin. The external size is 43 mm × 50 mm, and the thickness is 0.5 mm. The conductor layer is made of copper foil and is composed of four layers. The first layer of the conductor layer is provided with electrodes for connecting chip components such as a memory, a capacitor, and a resistor, which are integrated circuit components, and a connecting member 110. The diameter of the electrode to which the connecting member 110 is connected is 0.3 mm, and the adjacent pitch is 0.6 mm. The memory, which is an integrated circuit component, has a BGA (Ball Grid Array) structure, has a size of 14 mm × 14 mm, and has a thickness of 1.2 mm. A solder ball provided on the lower surface of the memory is joined to an electrode provided on the wiring board 1002.

Further, an electrode for connecting the integrated circuit component 50 is provided on the fourth layer of the conductor layer. The integrated circuit component 50 has a size of 3 mm × 3 mm and a thickness of 0.7 mm. A connection electrode is provided on the lower surface of the component, and is joined to the electrode provided on the wiring board 1002 via the conductive member 99.

As shown in FIG. 3B, the connecting member 110 has a rectangular parallelepiped shape and uses two members having two dimensions. The dimensions are a member having a width of 1.6 mm, a length of 40 mm, and a height of 2 mm, and a member having a width of 1.6 mm, a length of 30 mm, and a height of 2 mm. As the material, FR-4, which is a glass epoxy resin, is used as an insulator. A plurality of conductive portions are provided on the upper surface and the lower surface of the connecting member 110. The conductive portions facing each other on the top and bottom are connected by the conductor portion 97 of the connecting member 110. A copper wire having a diameter of 0.3 mm is used as the conductor, and the adjacent pitch is 0.6 mm.

As shown in FIG. 3B, the wiring board 1001 and the wiring board 1002 are electrically connected by using four rectangular parallelepiped connecting members 110.

As the members other than the connecting member 110, the same members as in the first embodiment are used.

When the size of the frame-shaped connecting member 110 as shown in FIG. 3A is 20 mm × 20 mm or more, a warp of about 0.15 mm occurs during heating. Therefore, when joining with the wiring board, it is easy to cause a joining defect. On the other hand, the connecting member 110 shown in FIG. 3B is individualized, and the thermal deformation of each connecting member 110 can be suppressed to about 50%. Therefore, defects are less likely to occur when the wiring board and the connecting member 110 are joined.

Further, by using such a module 300, the heat generated by the integrated circuit component 200 is not transmitted to the integrated circuit component 50, Johnson noise of the integrated circuit component 50 is suppressed, and deterioration of image quality can be prevented.

In FIG. 2C, the wiring board 1001 uses FR-4, which is a glass epoxy resin. The external size is 43 mm × 50 mm, and the thickness is 0.5 mm. The conductor layer is made of copper foil and is composed of four layers. The first layer of the conductor layer is provided with a plurality of electrodes for connecting to the integrated circuit component 200. The electrodes include a power supply electrode 911 and a ground electrode 912 for supplying electric power for operating the integrated circuit component 200. Further, the fourth layer of the conductor layer is provided with an electrode for connecting to the connecting member 110. An electrode for connecting to the connecting member 110 is provided. The size of the electrode is 0.16 mm in width and 0.4 mm in length. The electrodes are arranged so that the position of the center of gravity of the electrodes of the wiring board and the position of the center of gravity of the conductive portion of the connecting member 110 are aligned.

The size of the integrated circuit component 200 is about 30 × 40 mm, and the thickness is 0.7 mm. The integrated circuit component 200 is fixed to the wiring board 1001 by a die bond, and is connected to an electrode on the wiring board by a bonding wire.

The size of the cover glass 201 is 40 mm × 50 mm, and the thickness is 0.5 mm. The cover glass 201 is adhered to a resin frame having a height of 1 mm and a width of 1 mm so as not to come into contact with the integrated circuit component 200. The frame is adhered to the surface of the wiring board 1001.

The wiring board 1002 uses FR-4, which is a glass epoxy resin. The external size is 43 mm × 50 mm, and the thickness is 0.5 mm. The conductor layer is made of copper foil and is composed of four layers. The first layer of the conductor layer is provided with electrodes for connecting chip components such as a memory, a capacitor, and a resistor, which are integrated circuit components, and a connecting member 110. The size of the electrode to which the connecting member 110 is connected is 0.16 mm in width and 0.4 mm in length. The electrodes are arranged so that the position of the center of gravity of the electrodes of the wiring board and the position of the center of gravity of the conductive portion of the connecting member 110 are aligned.

The memory, which is an integrated circuit component, has a BGA (Ball Grid Array) structure, has a size of 14 mm × 14 mm, and has a thickness of 1.2 mm. A solder ball provided on the lower surface of the memory is joined to an electrode provided on the wiring board 1002.

Further, an electrode for connecting the integrated circuit component 50 is provided on the fourth layer of the conductor layer. The integrated circuit component 50 has a size of 3 mm × 3 mm and a thickness of 0.7 mm. A connection electrode is provided on the lower surface of the component, and is joined to the electrode provided on the wiring board 1002 via the conductive member 99.

As shown in FIG. 3C, the connecting member 110 has a rectangular parallelepiped shape and uses two members having two dimensions. The dimensions are a member having a width of 1.6 mm, a length of 40 mm, and a height of 2 mm, and a member having a width of 1.6 mm, a length of 30 mm, and a height of 2 mm.

As the material, FR-4, which is a glass epoxy resin, is used as an insulator. The conductive portion has a rectangular shape, and the upper and lower conductive portions are electrically connected by using the conductive portion 97 of the connecting member 110.

As the conductor, a copper foil having a thickness of 0.05 mm is formed into an arbitrary size by etching. The width of the conductive portion provided on the upper and lower surfaces is 0.05 mm, which is the same as the thickness of the copper foil, and the length is 0.4 mm. The pitch of the adjacent conductive portions is 0.6 mm.

The connection between the electrode of the connecting member 110 and the electrode of the wiring board is connected by the conductive member 99.

The electrodes of the connecting member 110 of FIGS. 3A and 3B are joined only in the upper and lower surfaces, but in the structure shown in FIG. 3C, the conductor portion of the connecting member is added to the upper and lower surfaces. The conductive member 99 can be connected to 97. As shown in FIG. 2 (c), in order to form a fillet of the conductive member 99 with respect to the conductor portion 97 of the connecting member and the electrode of the wiring board, from the joint portion of the connecting member 110 shown in FIG. 2 (a). , High reliability can be obtained.

Further, by using such a module 300, the heat generated by the integrated circuit component 200 is not transmitted to the integrated circuit component 50, Johnson noise of the integrated circuit component 50 is suppressed, and deterioration of image quality can be prevented.

In FIG. 5B, the wiring board 1001 uses FR-4, which is a glass epoxy resin. The external size is 43 mm × 50 mm, and the thickness is 0.5 mm. The conductor layer is made of copper foil and is composed of four layers. The first layer of the conductor layer is provided with a plurality of electrodes for connecting to the integrated circuit component 200. The electrodes include a power supply electrode 911 and a ground electrode 912 for supplying electric power for operating the integrated circuit component 200. Further, the fourth layer of the conductor layer is provided with an electrode for connecting to the connecting member 110. The diameter of the electrode to which the connecting member 110 is connected is 0.3 mm, and the adjacent pitch is 0.6 mm. Among the electrodes to be connected to the connecting member 110, the most adjacent electrode pair is a power supply electrode 921 and a ground electrode 922. The power supply electrode 911 and the power supply electrode 921 are electrically connected by wiring and via provided on the wiring board 1001.

The size of the integrated circuit component 200 is about 30 × 40 mm, and the thickness is 0.7 mm. The integrated circuit component 200 is fixed to the wiring board 1001 by a die bond, and is connected to an electrode on the wiring board by a bonding wire.

The size of the cover glass 201 is 40 mm × 50 mm, and the thickness is 0.5 mm. The cover glass 201 is adhered to a resin frame having a height of 1 mm and a width of 1 mm so as not to come into contact with the integrated circuit component 200. The frame is adhered to the surface of the wiring board 1001.

The wiring board 1002 uses FR-4, which is a glass epoxy resin. The external size is 43 mm × 50 mm, and the thickness is 0.5 mm. The conductor layer is made of copper foil and is composed of four layers. The first layer of the conductor layer is provided with electrodes for connecting chip components such as a memory, a capacitor, and a resistor, which are integrated circuit components, and a connecting member 110. The diameter of the electrode to which the connecting member 110 is connected is 0.3 mm, and the adjacent pitch is 0.6 mm. The electrodes to be connected to the connecting member 110 are the power supply electrode 921 and the power supply electrode 931 of the wiring board 1001.

The memory, which is an integrated circuit component, has a BGA (Ball Grid Array) structure, has a size of 14 mm × 14 mm, and has a thickness of 1.2 mm. A solder ball provided on the lower surface of the memory is joined to an electrode provided on the wiring board 1002.

Further, an electrode for connecting the integrated circuit component 50 is provided on the fourth layer of the conductor layer.

The integrated circuit component 50 has a size of 3 mm × 3 mm and a thickness of 0.7 mm. A connection electrode is provided on the lower surface of the component, and is joined to the power supply electrode 941 provided on the wiring board 1002 via the conductive member 99. The power supply electrode 931 and the power supply electrode 941 are electrically connected by wiring and via provided on the wiring board 1002.

As shown in FIG. 3A, the connecting member 110 has a frame shape. The external size is 34 mm × 44 mm, the width of the frame is 1.6 mm, and the thickness is 2 mm. FR-4, which is a glass epoxy resin, is used as an insulator. A plurality of conductive portions are provided on the upper surface and the lower surface of the connecting member 110. Further, the conductive portions facing each other on the top and bottom are connected by a conductor portion 97 of the connecting member 110. Through-holes are formed, and upper and lower conduction is obtained by Cu plating. A lid is formed on the upper and lower ends of the through-hole by applying copper plating so as to fill the hole, and this is an electrode. The diameter of the electrode is 0.3 mm, and the adjacent pitch is 0.6 mm.

The electrodes formed on the upper surface of the connecting member 110 are joined to the wiring board 1001 by the conductive member 99. Further, the electrodes formed on the lower surface are joined to the wiring board 1002 by the conductive member 99.

In FIG. 5B, the electric power for operating the integrated circuit component 200 is supplied from the integrated circuit component 50 joined on the wiring board.

In the wiring board 1002, the path is from the electrode pair (power supply electrode 941 and ground electrode 942) connecting the integrated circuit component 50 to the power supply electrode 931 and the ground electrode 932 through the power supply wiring 981 and the ground wiring 982 of the wiring board 1002. It has reached. Next, it reaches the power supply electrode 921 and the ground electrode 922 through the conductor portion 97 (power supply wiring 971 and ground wiring 972) connecting the upper and lower electrodes of the connection member 110. Next, in the wiring plate 1001, the power supply electrode 921 and the ground electrode 922 reach the power supply electrode 911 and the ground electrode 912 through the power supply wiring 961 and the ground wiring 962 of the wiring plate 1002. Then, the power supply electrode 911 and the ground electrode 912 reach the integrated circuit component 200 through the conductive member 901 and the conductive member 902.

As shown in FIGS. 5B and 4, the separation distance Da between the power supply electrode 921 and the ground electrode 922 is 0.6 mm, which is the closest pitch, and the dimensions when the integrated circuit component 200 is viewed in a plan view are , 30 mm × 40 mm. In this structure, by satisfying the above equation (1), the closed loop area can be reduced and the image quality can be improved.

Further, by using such a module 300, the heat generated by the integrated circuit component 200 is not transmitted to the integrated circuit component 50, Johnson noise of the integrated circuit component 50 is suppressed, and deterioration of image quality can be prevented.

In FIG. 5C, the wiring board 1001 uses FR-4, which is a glass epoxy resin. The external size is 43 mm × 50 mm, and the thickness is 0.5 mm. The conductor layer is made of copper foil and is composed of four layers. The first layer of the conductor layer is provided with a plurality of electrodes for connecting to the integrated circuit component 200. The electrodes include a power supply electrode 911 and a ground electrode 912 for supplying electric power for operating the integrated circuit component 200. Further, the fourth layer of the conductor layer is provided with an electrode for connecting to the connecting member 110. The diameter of the electrode to which the connecting member 110 is connected is 0.3 mm, and the adjacent pitch is 0.6 mm. Among the electrodes to be connected to the connecting member 110, the most adjacent electrode pair is a power supply electrode 921 and a ground electrode 922. The power supply electrode 911 and the ground electrode 912 are electrically connected to the power supply electrode 921 and the ground electrode 922 by the power supply wiring 961 and the ground wiring 962 provided on the wiring plate 1001.

The size of the integrated circuit component 200 is about 30 × 40 mm, and the thickness is 0.7 mm. The integrated circuit component 200 is fixed to the wiring board 1001 by a die bond, and is connected to an electrode on the wiring board by a bonding wire.

The size of the cover glass 201 is 40 mm × 50 mm, and the thickness is 0.5 mm. The cover glass 201 is adhered to a resin frame having a height of 1 mm and a width of 1 mm so as not to come into contact with the integrated circuit component 200. The frame is adhered to the surface of the wiring board 1001.

The wiring board 1002 uses FR-4, which is a glass epoxy resin. The external size is 43 mm × 50 mm, and the thickness is 0.5 mm. The conductor layer is made of copper foil and is composed of four layers. The first layer of the conductor layer is provided with electrodes for connecting chip components such as a memory, a capacitor, and a resistor, which are integrated circuit components, and a connecting member 110. The diameter of the electrode to which the connecting member 110 is connected is 0.3 mm, and the adjacent pitch is 0.6 mm. Among the electrodes to be connected to the connecting member 110, the pair of electrodes facing the power supply electrode 921 of the wiring board 1001 is referred to as a power supply electrode 931.

Further, a power supply electrode 941 for connecting the integrated circuit component 50 is provided in the same plane, and is electrically connected to the power supply electrode 931 by wiring.

The integrated circuit component 50 has a size of 3 mm × 3 mm and a thickness of 0.7 mm. A connection electrode is provided on the lower surface of the component, and is joined to the power supply electrode 941 via the conductive member 99.

The memory, which is an integrated circuit component, has a BGA (Ball Grid Array) structure, has a size of 14 mm × 14 mm, and has a thickness of 1.2 mm. A solder ball provided on the lower surface of the memory is joined to an electrode provided on the wiring board 1002.

As shown in FIG. 3A, the connecting member 110 has a frame shape. The external size is 34 mm × 44 mm, the width of the frame is 1.6 mm, and the thickness is 2 mm. FR-4, which is a glass epoxy resin, is used as an insulator. A plurality of conductive portions are provided on the upper surface and the lower surface of the connecting member 110. Further, the conductive portions facing each other on the top and bottom are connected by a conductor portion 97 of the connecting member 110. Through-holes are formed, and upper and lower conduction is obtained by Cu plating. A lid is formed on the upper and lower ends of the through-hole by applying copper plating so as to fill the hole, and this is an electrode. The diameter of the electrode is 0.3 mm, and the adjacent pitch is 0.6 mm.

The electrodes formed on the upper surface of the connecting member 110 are joined to the wiring board 1001 by the conductive member 99. Further, the electrodes formed on the lower surface are joined to the wiring board 1002 by the conductive member 99.

In FIG. 5C, the electric power for operating the integrated circuit component 200 is supplied from the integrated circuit component 50 joined on the wiring board.

The route leads from the pair of fourth power supply wirings connecting the integrated circuit component 50 to the power supply electrode 931 through the wiring of the wiring board in the wiring board 1002. Next, the power electrode 921 is reached through the conductor portion 97 connecting the upper and lower electrodes of the connecting member 110. Next, in the wiring board 1001, the power supply electrode 921 reaches the power supply electrode 911 through the wiring of the wiring board and the first via conductor 96, and reaches the integrated circuit component 200 through the bonding wire.

As shown in FIGS. 5C and 4, the separation distance Da between the power supply electrode 921 and the ground electrode 922 is 0.6 mm, which is the closest pitch, and the dimensions when the integrated circuit component 200 is viewed in a plan view are , 30 mm × 40 mm. In this structure, by satisfying the above equation (1), the closed loop area can be reduced and the image quality can be improved.

In this embodiment, as shown in ", the integrated circuit component 50 mounted on the wiring board 1002 is arranged on the same surface as the connecting member 110, so that the closed loop area is larger than that of the structure shown in FIG. 5 (b). Can be made smaller.

Further, by using such a module 300, the heat generated by the integrated circuit component 200 is not transmitted to the integrated circuit component 50, Johnson noise of the integrated circuit component 50 is suppressed, and deterioration of image quality can be prevented.

In the sixth embodiment, the insulating separation portion 120 is formed on the conductor portion 97 of the connection member 110 of FIG. 3C in the third embodiment, and the connection member 110 as shown in FIG. 9A is used. ing. In this embodiment, the separated portion 120 is a solder resist having a thickness of 15 μm and a width of 0.2 mm in the Z direction. Solder was used as the conductive member 99. The position of the separation portion 120 is above the central portion of the side surface of the connecting member 110. In the module 300 using the connecting member 110, as shown in FIG. 9B, the conductive member 99 can be connected to the conductive portion 97 of the connecting member 110 in addition to the upper and lower surfaces of the connecting member 110. The conductive member 99 separated by the separation portion 120 with respect to the conductor portion 97 of the connection member and the electrodes of the wiring boards 1001 and 1002 becomes a solder fillet having a good shape and draws a smooth concave curve. For example, since the conductive member 99 is surely separated at the center in the vertical plane direction by the separation portion 121, the upper and lower solder fillets (conductive member 991 and conductive member 992) are uniformly formed. Further, for example, the upper and lower solder fillets (conductive member 993 and conductive member 994) are uniformly formed by the separated portion 122.

By changing the position and width of the separated portion 120 of the conductive member in the vertical direction (Z direction), the length of the solder fillet can also be controlled independently in the vertical direction. Therefore, higher reliability can be obtained from the connection portion of the connection member 110 shown in FIG. 2 (c). Further, by using such a module 300, the heat generated by the integrated circuit component 200 is not transmitted to the integrated circuit component 50, Johnson noise of the integrated circuit component 50 can be suppressed, and deterioration of image quality can be prevented.

The embodiments described above can be appropriately changed as long as they do not deviate from the technical idea. It should be noted that the disclosure content of this specification includes not only what is described in this specification but also all matters that can be grasped from this specification and the drawings attached to this specification.

Regarding the specific numerical range exemplified, the description e to f (e and f are numbers) means e or more and / or f or less. In addition, when the range i to j and the range m to n are written together (i, j, m, n are numbers) for the specific numerical range illustrated, the set of the lower limit and the upper limit is It is not limited to the pair of i and j or the pair of m and n. For example, the lower limit and the upper limit of a plurality of sets may be combined and examined. That is, when the range of i to j and the range of m to n are described together, the examination may be conducted in the range of i to n, or the examination may be conducted in the range of m to j. be.

The disclosure of this specification also includes a complement of the individual concepts described herein. That is, if there is a description in the present specification that "A is larger than B", for example, even if the description that "A is not larger than B" is omitted, the present specification states that "A is not larger than B". It can be said that it is not larger than B. " This is because when it is stated that "A is larger than B", it is premised that "A is not larger than B" is taken into consideration.

1001 Wiring board 1002 Wiring board 110 Connection member 200 Integrated circuit component 50 Second integrated circuit component 300 Module 600 Equipment

Claims (25)

The first wiring board and
The first integrated circuit component mounted on the first wiring board and
A second wiring board that overlaps with the first wiring board,
The second integrated circuit component mounted on the second wiring board, and
A module provided between the first wiring board and the second wiring board, and comprising a connecting member for electrically connecting the first wiring board and the second wiring board. ,
The second integrated circuit component is a module that overlaps with the first wiring board and supplies electric power to the first integrated circuit component via the connecting member. The module according to claim 1, wherein the second integrated circuit component overlaps with the first integrated circuit component. The connection member includes a first wiring that supplies a power supply potential from the second integrated circuit component to the first integrated circuit component, and a ground potential from the second integrated circuit component to the first integrated circuit component. The module according to claim 1 or 2, comprising a second wiring for supplying the above. The module according to claim 3, wherein the distance between the first wiring and the second wiring is smaller than the dimensions of the first integrated circuit component. The module according to claim 4, wherein the distance is 1/10 or less of the dimension. Any one of claims 3 to 5, wherein the distance between the first wiring and the second wiring is smaller than the distance between the first wiring board and the second wiring board. The module described in. The module according to any one of claims 1 to 6, wherein a gap is provided between the second integrated circuit component and the first wiring board. The module according to any one of claims 1 to 7, wherein the second integrated circuit component is provided between the first wiring board and the second wiring board. The module according to any one of claims 1 to 8, wherein the second wiring board is provided between the second integrated circuit component and the first wiring board. The module according to any one of claims 1 to 9, wherein the temperature of the first integrated circuit component is higher than the temperature of the second integrated circuit component when the electric power is supplied. The module according to any one of claims 1 to 10, wherein the first integrated circuit component includes an analog circuit. The module according to any one of claims 1 to 11, wherein the first integrated circuit component is an image pickup device or a display device. The first integrated circuit component and the first wiring board are connected by a bonding wire.
The second integrated circuit component and the second wiring board are connected by solder, the connection member and the first wiring board are connected by solder, and the connection member and the second wiring board are connected. Is the module according to any one of claims 1 to 12, which is connected by soldering. The module according to any one of claims 1 to 13, comprising a third integrated circuit component mounted on the second wiring board. The module according to claim 14, wherein the third integrated circuit component is a storage device. The module according to claim 14 or 15, wherein the second integrated circuit component supplies electric power to the third integrated circuit component. The module according to any one of claims 1 to 16, wherein a passive component is mounted on the second wiring board. The module according to any one of claims 1 to 17, wherein the connecting member has a portion made of a glass epoxy resin. The module according to any one of claims 1 to 18, wherein the connecting member has a portion made of a thermosetting resin. The connecting member has a conductor portion and an insulator portion that supports the conductor portion.
The conductor portion includes a first conductive portion, a second conductive portion, and the first conductive portion along a first direction in which the first wiring board and the second wiring board overlap. A third conductive portion between the second conductive portion and the second conductive portion.
The first conductive portion is connected to the first wiring board via the first conductive member, and the second conductive portion is connected to the first wiring board via the second conductive member. Being done
In the second direction perpendicular to the first direction, the first conductive portion is located between the first conductive member and the insulator portion, and the second conductive member and the insulator are insulated. The module according to any one of claims 1 to 19, wherein the second conductive portion is located between the body portion and the body portion. It has a separation portion located between the first conductive member and the second conductive member in the first direction, and between the separation portion and the insulator portion in the second direction. The module according to claim 20, wherein the third conductive portion is located. The module according to claim 21, wherein each of the first conductive member and the second conductive member is a solder fillet, and the separated portion is a solder resist. The module according to any one of claims 1 to 22 and
With the third wiring board,
A connection component for electrically connecting the module and the third wiring board is provided.
A device in which the connecting parts have flexibility. The module according to any one of claims 1 to 22 and
A device equipped with a coil. The module according to any one of claims 1 to 22 and
Semiconductor devices manufactured according to process rules of 1 to 4 nm,
Communication devices that communicate using terahertz waves,
A device with at least one of an all-solid-state battery.

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