JP2024037400A - Package, electronic component, and apparatus - Google Patents

Abstract

To provide a technique advantageous in mounting an electronic device on a package.SOLUTION: A package comprises a mounting surface for mounting an electronic device. The mounting surface has a plurality of recesses arranged therein each arranged with an electrode. In orthogonal projection on the mounting surface, the total occupation ratio of the plurality of recesses to the mounting surface is 10% or more and 50% or less.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD The present invention relates to packages, electronic components and equipment.

Patent Document 1 discloses that dark current is suppressed by electrically connecting an electrode provided on a surface of a package on which an electronic device is mounted and a back surface of the electronic device that faces the package via a conductive member. ing. Further, Patent Document 1 discloses that in order to suppress the effect of heat generation due to the flow of current through the conductive member, the conductive member is arranged so as not to overlap the sensor section in which the sensor of the electronic device is arranged. .

Japanese Patent Application Publication No. 2021-136396

As packages become smaller and chip sizes of electronic devices become smaller, it becomes difficult to arrange the electrodes of the package, which are connected to the electronic device via a conductive member, at a position that does not overlap with the sensor section.

An object of the present invention is to provide an advantageous technique for mounting an electronic device in a package.

In view of the above problems, a package according to an embodiment of the present invention is a package that includes a mounting surface for mounting an electronic device, and the mounting surface has a plurality of recesses each having an electrode arranged thereon. In an orthogonal projection onto the mounting surface, the total proportion of each of the plurality of recesses relative to the mounting surface is 10% or more and 50% or less.

According to the present invention, it is possible to provide an advantageous technique for mounting an electronic device on a package.

FIG. 3 is a diagram showing an example of the configuration of a package according to the present embodiment. 2 is a diagram showing an example of the configuration of an electronic component including the package of FIG. 1. FIG. FIG. 2 is a diagram showing an example of the configuration of a recessed portion of the package in FIG. 1; FIG. 2 is a diagram showing an example of the configuration of a recessed portion of the package in FIG. 1; FIG. 2 is a diagram showing a modification of the package shown in FIG. 1; 6 is a diagram showing an example of the configuration of an electronic component including the package of FIG. 5. FIG. An example of the configuration of the recessed portion of the package in FIG. 5 is shown. FIG. 1 is a diagram illustrating an example of the configuration of a device in which an electronic component of the present embodiment is incorporated.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the claimed invention. Although a plurality of features are described in the embodiments, not all of these features are essential to the invention, and the plurality of features may be arbitrarily combined. Furthermore, in the accompanying drawings, the same or similar components are designated by the same reference numerals, and redundant description will be omitted.

A package and an electronic component according to an embodiment of the present disclosure will be described with reference to FIGS. 1(a), 1(b) to FIG. 7. FIG. 1A is a plan view showing an example of the configuration of a package 100 of this embodiment, and FIG. 1B is a cross-sectional view showing an example of the configuration of the package 100. FIG. 1(b) is a cross-sectional view of the package 100 along line A-a shown in the plan view of FIG. 1(a). FIG. 2A is a plan view showing an example of the configuration of an electronic component 400 including the package 100, and FIG. 2B is a cross-sectional view showing an example of the configuration of the electronic component 400. 3(a) to 3(d) are enlarged views of the vicinity of the recess 20 of the package 100. 3(a) is a plan view of the vicinity of the recess 20, and FIG. 3(b) is a sectional view of the vicinity of the recess 20. 3(c) and 3(d) are a plan view and a sectional view of the vicinity of the recess 20 in the electronic component 400 in which the electronic device 200 is mounted on the package 100. The package 100 can be made using, for example, ceramic, a printed circuit board, plastic, or the like.

The package 100 includes a base 10 on which an electronic device 200 is mounted. The base 10 of the package 100 includes a mounting surface 101 for mounting an electronic device 200 thereon. A plurality of recesses 20 are arranged on the mounting surface 101, each having an electrode 30 arranged therein. The base body 10 of the package 100 includes a surface 102 opposite the mounting surface 101 . The surface 102 can also be said to be the back surface of the base 10. The surface 103, which is the bottom surface of the recess 20, may be a surface parallel to the mounting surface 101. Although details will be described later, the electrode 30 faces the electronic device 200 and is electrically connected to a facing surface 201 that faces the mounting surface 101 among the surfaces of the electronic device 200 via a conductive member 40.

The X direction and Y direction shown in each figure are directions parallel to the mounting surface 101 of the base 10 of the package 100. The Z direction is a direction intersecting the mounting surface 101. The X direction, the Y direction, and the Z direction may intersect perpendicularly. Hereinafter, the length in the Z direction may be referred to as "thickness" or "depth."

When mounting the electronic device 200 on the package 100 and forming the electronic component 400, the conductive member 40 is disposed (for example, coated) on the electrode 30 in the recess 20, and then the electronic device 200 is placed in the upper part. It is crimped from At this time, the conductive member 40 may be arranged so that the conductive member 40 fits within the recess 20.

As shown in FIG. 2B, the mounting surface 101 of the package 100 has external terminals (not shown) and electrical terminals disposed on a surface 202 of the electronic device 200 that is opposite to the facing surface 201. Terminals (not shown) for connection are provided. Further, for example, as shown in FIG. 2C, the mounting surface 101 may be recessed one step to accommodate the electronic device 200 to be mounted. In this case, terminals for electrical connection to external terminals of the electronic device 200 may be arranged on the surface 105 that is further away from the surface 102 than the mounting surface 101 .

Terminals on mounting surface 101 or surface 105 of package 100 and external terminals on surface 202 of electronic device 200 are electrically connected by wire 50 . The wire may be made of gold, silver, copper, aluminum, or an alloy thereof. The electrode 30 and the terminals arranged on the mounting surface 101 or the surface 105 are electrically connected to external terminals (not shown) of the package 100 arranged on the surface 102 of the base 10, and the package 100 (electronic component 400) Can be electrically connected to external circuits. The terminals disposed on the electrode 30, the mounting surface 101, or the surface 105 are made of a conductive material, such as a metal such as tungsten, molybdenum, nickel, or gold, and may be formed using a printing or plating method. . For the external terminals of the package 100, parts such as a land grid array (LGA), a pin grid array (PGA), a ball grid array (BGA), a leadless chip carrier (LCC), a lead frame, and a connector may be used.

A specific method for forming the recess 20 disposed on the mounting surface 101 and the electrode 30 disposed in the recess 20 will be described using a ceramic package as an example. Vias (holes) and recesses 20 that are electrically connected to the electrodes 30 and the terminals arranged on the mounting surface 101 or the surface 105 are formed in a green sheet made by kneading a ceramic material and a binder using a mold or the like. It is formed. The via is filled with a conductive member using a conductive material such as tungsten or molybdenum. Thereafter, by printing a wiring pattern (not shown) and laminating the layers, the terminals arranged on the electrode 30, mounting surface 101 or surface 105 can be electrically connected to external terminals via the conductive member filled in the via. connected to. After cutting and firing, the electrodes 30 and the terminals disposed on the mounting surface 101 or the surface 105 are plated using electrolytic plating, electroless plating, or the like. Through these steps, the package 100 is formed. In the case of a plastic package, the recess 20 can be formed by molding or cutting.

As shown in FIGS. 2(a) to 2(c), an electronic component 400 in which an electronic device 200 is mounted in a package 100 is exposed to mechanical impact or foreign matter such as dust into the package 100. A translucent lid 300 may be provided to prevent intrusion. The lid 300 is disposed above the surface 202 of the electronic device 200 and is fixed to the base 10 of the package 100 with a bonding member such as an adhesive. The package 100 is thereby sealed. When the mounting surface 101 side of the base 10 of the package 100 is flat, a frame-shaped member is arranged in the outer peripheral region of the mounting surface 101 than the region where the electronic device 200 is mounted, and the lid 300 is placed on top of the frame-shaped member. It is good also as a structure provided with. In this case, the mounting surface 101 refers to the area inside the frame-shaped member of the base body 10. The frame-shaped member may be made of the same material as the base 10, or may be made of a different material.

The type of electronic device 200 mounted on package 100 is not particularly limited. For example, electronic device 200 may be an optical device. In this embodiment, the electronic device 200 has a main region 210 and a sub-region 220. For example, main region 210 is located at the center of electronic device 200 in orthogonal projection onto surface 202 of electronic device 200, and sub-region 220 is located at its periphery. When the electronic device 200 is a photoelectric conversion device such as a CCD image sensor or a CMOS image sensor, the main area 210 is a pixel area where a plurality of pixels are arranged, and the sub area 220 is a peripheral area where a drive circuit etc. are arranged, for example. It is. The pixel area may also be called an imaging area. When the electronic device 200 is a display device such as a liquid crystal display or an EL display, the main area 210 is a pixel area in which a plurality of pixels are arranged, and the sub area 220 is a peripheral area in which, for example, a drive circuit is arranged. In this case, the pixel area may also be called a display area.

When the electronic device 200 is a photoelectric conversion device, the surface 202 of the electronic device 200 becomes the light incident surface. The light incident surface can be formed by the outermost layer of a multilayer film provided on a semiconductor substrate having a light receiving surface. Multilayer films include layers with optical functions such as color filter layers, microlens layers, antireflection layers, and light shielding layers, layers with mechanical functions such as flattening layers, and chemical functions such as passivation layers. It may include a layer having a The sub-region 220 may be provided with a drive circuit for driving the main region 210 and a signal processing circuit for processing signals from the main region 210 (or signals to the main region 210). When electronic device 200 is a semiconductor device, it is easy to form such a circuit monolithically. If the electronic device 200 is an electronic device in which two or more electronic devices are stacked, it may be configured such that an electronic device serving as the sub-region 220 is stacked below an electronic device serving as the main region 210 .

As described above, the electrode 30 is electrically connected to the opposing surface 201 of the electronic device 200 via the conductive member 40. The purpose of connecting the electronic device 200 and the electrode 30 of the package 100 is to release the electric charge accumulated in the electronic device 200 to the outside of the electronic component 400. Specifically, in order to suppress dark current in the main region 210, the substrate of the electronic device 200 and the electrode 30 are electrically connected, and a voltage is applied from an external terminal of the package 100 to reduce noise. Therefore, the substrate (semiconductor) of the opposing surface 201 of the electronic device 200 may be exposed. For example, if a conductive member 40 using a conductive adhesive such as silver paste is placed under the sub-region 220, the following disadvantages due to the placement of the conductive member 40 will not occur. hard. However, with the miniaturization of the package 100 and the chip size of the electronic device 200, the electrode 30 (conductive member 40) of the package connected to the electronic device 200 via the conductive member 40 has become smaller under the main region 210. There is a higher possibility of being assigned. When the conductive member 40 is disposed below the main region 210 of the electronic device 200, it is possible to suppress dark current and reduce noise in the same manner as described above. On the other hand, the temperature locally increases around the conductive member 40 due to the resistance of the conductive member 40, the contact resistance between the conductive member 40 and the electrode 30, and the contact resistance between the conductive member 40 and the facing surface 201 of the electronic device 200. It ends up. For example, if the electronic device 200 is a photoelectric conversion device, local noise may occur in an image obtained by the electronic device 200 due to a local temperature rise. As a countermeasure for this, by using the package 100 shown in this embodiment, it is possible to suppress local noise caused by a rise in temperature around the conductive member 40 to a stable amount.

Hereinafter, the recess 20 and the electrode 30 will be described in more detail. In this embodiment, in the orthogonal projection of the package 100 onto the mounting surface 101, the total proportion of each of the plurality of recesses 20 relative to the mounting surface 101 is 10% or more and 50% or less. When the area of the recess 20 becomes smaller, the electrode 30 disposed in the recess 20 becomes smaller, and the conductive member 40 connected to the electrode 30 becomes smaller. As a result, the resistance value of the conductive member 40 increases, making it difficult to obtain the effect of reducing noise. On the other hand, if the area of the recess 20 is too large, the volume of the conductive member 40 becomes large, and the surface precision of the electronic device 200 may deteriorate due to curing shrinkage when the conductive member 40 is thermally cured.

Further, as described above, a plurality of recesses 20 are arranged on the mounting surface 101. If there is only one recess 20 (electrode 30), the surface precision of the electronic device 200 will noticeably deteriorate due to curing and shrinkage of the conductive member 40. By providing a plurality of recesses 20, a mounting surface 101 that supports the electronic device 200 is arranged between the recesses 20, and the mounting surface 101 plays a role as a beam, stabilizing the surface accuracy of the electronic device 200 and supporting the conductive member 40. It becomes possible to achieve both resistance and stabilization of contact resistance.

The electrode 30 may be formed on a part of the surface 103 of the recess 20, as shown in FIGS. 1(a) to 3(d), but is not limited thereto. For example, as shown in FIG. 4, the electrode 30 may be arranged to cover the entire surface 103 of the recess 20. In this case, in the orthogonal projection onto the mounting surface 101, the area of one of the plurality of recesses 20 and the area of the electrode 30 arranged in one recess 20 are the same. Therefore, in the orthogonal projection onto the mounting surface 101, the total area of the electrodes 30 arranged in each of the plurality of recesses 20 may be 10% or more and 50% or less of the area of the mounting surface.

An example of the relationship between the size of the facing surface 201 of the electronic device 200 and the size of the plurality of recesses 20 (electrodes 30) will be shown. The opposing surface 201 of the electronic device 200 needs to be smaller than the mounting surface 101 of the package 100. However, as shown in FIG. 2C, there may be a case in which the facing surface 201 of the electronic device 200 and the mounting surface 101 of the package 100 are approximately the same in size. Therefore, in orthogonal projection onto the mounting surface 101 of the package 100, the total area of each of the plurality of recesses 20 (electrodes 30) may be, for example, 11% or more of the area of the opposing surface 201 of the electronic device 200. . Further, as described above, the mounting surface 101 arranged between the recesses 20 plays a role as a beam that supports the electronic device 200. Therefore, in consideration of stabilizing the surface accuracy of the electronic device 200, in the orthogonal projection onto the mounting surface 101 of the package 100, the total area of each of the plurality of recesses 20 (electrodes 30) is It may be 51% or less of the area of .

From the above, when the area of the mounting surface 101 of the package 100 is Amm ² and the number of recesses 20 (electrodes 30) is N, the area of each recess 20 (electrode 30) is 0.1A/ It may be in the range of N to 0.5 A/N. Further, when the area of the facing surface 201 of the electronic device 200 is Bmm ² and the number of recesses 20 (electrodes 30) is N, the area of each recess 20 (electrode 30) is 0.11 B/N to 0. It may be in the range of .51B/N. On the other hand, from the viewpoint of manufacturing the recess 20 and stabilizing the conductive member 40, the area of each electrode 30 may be equal to or larger than a circle of φ1 mm, that is, π/4 mm ² or larger. If the area of the recess 20 and the electrode 30 is too small, it will be difficult to stably arrange the conductive member 40 in the recess 20 in the process of disposing the conductive member 40 on the electrode 30 in the recess 20 using a dispensing method or the like. . As a result, it becomes difficult to stabilize the resistance and contact resistance of the conductive member 40. Further, when the recesses 20 and the electrodes 30 become smaller, the number of recesses 20 required to ensure the total area required for the electrodes 30 increases, which increases the process load for arranging the conductive member 40. Therefore, in orthogonal projection onto the mounting surface 101 of the package 100, by making the area of one electrode 30 π/4 mm ² or more, the yield of the electronic component 400 can be improved and the electronic device 200 placed on the electronic component 400 can be stabilized. will be promoted.

In order to suppress local noise caused by a rise in temperature around the conductive member 40 to a stable amount, each of the plurality of recesses 20 has the same shape and area when orthogonally projected onto the mounting surface 101 of the package 100. It's okay. Further, in the orthogonal projection onto the mounting surface 101 of the package 100, the shape and area of the electrode 30 may be the same in each of the plurality of recesses 20. Furthermore, in each of the plurality of recesses 20, the length between the virtual plane that is an extension of the mounting surface 101 and the surface of the electrode 30 may be the same. In other words, the depth of each of the plurality of recesses 20 may be the same. These shapes make it easier to control the volume of the conductive member 40 per location of the recess 20 and the contact area of the conductive member 40 to the electrode 30 and the electronic device 200 to a constant value, thereby reducing the resistance of the conductive member 40 and the contact resistance. It becomes possible to maintain constant control. Thereby, it is possible to stabilize the surface accuracy of the electronic device 200 and to stabilize the resistance of the conductive member 40 and the contact resistance.

The area of the surface 103 of the recess 20 and the area of the electrode 30 may be the same as shown in FIG. 4, or may be different as shown in FIGS. 1(a) to 3(d). good. When the area of the surface 103 of the recess 20 and the area of the electrode 30 are the same, even if the conductive member 40 is misaligned when the conductive member 40 does not contact the entire surface 103, the contact area with the electrode 30 is can be kept constant. That is, when the area of the surface 103 of the recess 20 and the area of the electrode 30 are the same, the process of disposing the conductive member 40 on the electrode 30 can be more easily managed.

In the orthogonal projection onto the mounting surface 101 of the package 100, the shape of the recess 20 may be rectangular, circular, or other shapes. However, when considering the number of steps in manufacturing the package 100 and the accuracy of molding the recess 20, the production yield of the package 100 can be improved with a simpler shape.

The shortest distance between the electrodes 30 adjacent to each other can be made to any desired distance within the range in which the base body 10 can be made. However, if the distance between the adjacent electrodes 30 is too short, the area between the adjacent conductive members 40 will be affected by heat generation when a voltage is applied to the conductive members 40 connected to the adjacent electrodes 30. Noise may also occur. Therefore, the distance between the electrodes 30 arranged in each of the plurality of recesses 20 that are closest to each other may be 1 mm or more.

Above, the package 100 has been described with a focus on the recess 20 and the electrode 30. Next, the electronic component 400 in which the electronic device 200 is mounted on the package 100 will be described.

As described above, the electrode 30 faces the electronic device 200 and is electrically connected to the opposing surface 201 that faces the mounting surface 101 among the surfaces of the electronic device 200 via the conductive member 40 . The area in which the conductive member 40 contacts the electrode 30 may be the same in each of the plurality of recesses 20 . Furthermore, the area in which the conductive member 40 contacts the facing surface 201 of the electronic device 200 may be the same in each of the plurality of recesses 20 . By arranging the conductive members 40 in this manner, the resistance value and contact resistance value of each conductive member 40 can be managed equally, and variations in the amount of noise can be suppressed.

Furthermore, the area where the conductive member 40 contacts the facing surface 201 of the electronic device 200 may be π/4 mm ² or more. In this case, in the orthogonal projection onto the mounting surface 101 of the package 100, the area of the electrode 30 placed in one of the plurality of recesses 20 is the same as that of the conductive member 40 placed in the one recess 20. It may be larger than the contact area. Further, for example, in an orthogonal projection onto the mounting surface 101 of the package 100, the area of the electrode 30 disposed in one of the plurality of concave portions 20 and the area of the conductive member 40 disposed in the one concave portion 20 are determined by the electrode 30. may be the same as the area in contact with. When the area where the conductive member 40 contacts the electrode 30 is the same as the area of the electrode 30, the conductive member 40 can cover the entire recess 20, as shown in FIG. Compared to the case where the conductive member 40 does not cover the entire area of the recess 20, by the conductive member 40 covering the entire area of the recess 20, it becomes easier to maintain a constant resistance value of the conductive member 40 and the contact resistance value, and noise is reduced. Amount variations can be effectively suppressed. Furthermore, in the case of the configuration shown in FIG. 4, the contact areas between the electrode 30 and the conductive member 40 and between the opposing surface 201 of the electronic device 200 and the conductive member 40 are large, so the resistance value and the contact resistance value are small. Therefore, the effect of suppressing dark current and reducing the amount of noise can be improved.

As shown in FIG. 2A, when orthogonally projected onto the mounting surface 101 of the package 100, the electronic device 200 (opposing surface 201) may have a rectangular shape. In this case, in the orthogonal projection onto the mounting surface 101 of the package 100, the plurality of recesses 20 are arranged line-symmetrically with respect to an imaginary line parallel to one side of the opposing surface 201 that bisects the opposing surface 201. It's okay. Further, in the orthogonal projection onto the mounting surface 101 of the package 100, the plurality of recesses 20 are parallel to the above-mentioned one side of the opposing surface 201 that bisects the opposing surface 201 and parallel to the other side. , may be arranged line-symmetrically. That is, as shown in FIG. 2(a), the plurality of recesses 20 may be arranged vertically symmetrically or horizontally symmetrically with respect to the center line of the facing surface 201 of the electronic device 200. Good too. Furthermore, the plurality of recesses 20 may be arranged vertically and horizontally symmetrically with respect to the center line of the facing surface 201 of the electronic device 200. Similarly, in the orthogonal projection onto the mounting surface 101 of the package 100, the electrodes 30 arranged in each of the plurality of recesses 20 are aligned with respect to an imaginary line parallel to one side of the opposing surface 201 that bisects the opposing surface 201. , may be arranged line-symmetrically. Furthermore, in the orthogonal projection onto the mounting surface 101 of the package 100, the electrodes 30 disposed in the plurality of recesses 20 are located on the other side that intersects the above-mentioned one side of the opposing surface 201 that divides the opposing surface 201 into two. They may be arranged line-symmetrically with respect to parallel imaginary lines. That is, as shown in FIG. 2(a), the electrodes 30 arranged in each of the plurality of recesses 20 may be arranged vertically symmetrically with respect to the center line of the facing surface 201 of the electronic device 200, or They may be arranged symmetrically. Furthermore, the plurality of recesses 20 may be arranged vertically and horizontally symmetrically with respect to the center line of the opposing surface 201 of the electronic device 200. Thereby, the influence of noise due to heat generated when a voltage is applied to the conductive member 40 can be made uniform within the plane of the electronic device 200.

Furthermore, as described above, in orthogonal projection onto the mounting surface 101 of the package 100, at least a portion of the plurality of recesses 20 is arranged to overlap the main region 210 (for example, pixel region) of the electronic device 200. . As shown in FIG. 2A, each of the plurality of recesses 20 may be arranged to overlap the main region 210 of the electronic device 200. Similarly, in orthogonal projection onto the mounting surface 101 of the package 100, at least a portion of the electrodes 30 arranged in each of the plurality of recesses 20 is arranged so as to overlap the main region 210 (for example, pixel region) of the electronic device 200. has been done. As shown in FIG. 2A, each of the electrodes 30 arranged in the plurality of recesses 20 may be arranged so as to overlap the main region 210 of the electronic device 200. On the other hand, in the orthogonal projection onto the mounting surface 101 of the package 100, the plurality of recesses 20 and the electrodes 30 arranged in each of the plurality of recesses 20 are connected to constant current sources arranged in the sub-region 220 (for example, the peripheral region). They may be arranged so as not to overlap. In the configuration shown in FIG. 2A, the plurality of recesses 20 and the electrodes 30 disposed in each of the plurality of recesses 20 do not overlap with the sub-region 220.

The constant current source has a large amount of current flowing when the electronic device 200 is driven, and is likely to generate heat. By arranging the recess 20 (electrode 30) so as not to overlap the constant current source, the influence of heat generated by the conductive member 40 and the influence of heat generated by the electronic device 200 itself can be dispersed, and the influence of the heat generated by the electronic device 200 itself can be dispersed. It is possible to suppress uneven heat generation. As a result, the influence of local noise caused by the conductive member 40 can be reduced.

The length in the Z direction between the electrode 30 and the facing surface 201 of the electronic device 200, that is, the thickness of the conductive member 40, may be 0.1 mm or more and 0.4 mm or less. If the length between the electrode 30 and the opposing surface 201 of the electronic device 200 is less than 0.1 mm, it is highly likely that it will be difficult to manufacture the recess 20 with stable accuracy if the base 10 is made of ceramic or the like. Even if manufacturing is possible with stable accuracy, the volume of the recess 20 is small, making it difficult to stably form the conductive member 40. Therefore, it becomes difficult to stabilize the contact area of the conductive member 40 with respect to the electrode 30 and the electronic device 200, and it becomes difficult to stabilize the resistance value and the contact resistance value. On the other hand, if the length between the electrode 30 and the facing surface 201 of the electronic device 200 is greater than 0.4 mm, it becomes difficult to form the conductive member 40. Further, in order to make the recess 20 deep, there is a possibility that a plurality of ceramic sheets are required to form the package 100, and it may become difficult to manufacture the package 100 with stable precision.

Based on the above content, a more specific example of the electronic component 400 will be shown below. The opposing surface 201 of the electronic device 200 is 10 mm x 10 mm, the area B = 100 mm ² , the number N of recesses 20 is 4, and the size of each recess 20 is 2.4 mm x 2.4 mm x depth 0.2 mm. shall be. In that case, the area of the surface 103 of the recess 20 is 5.76 mm ² ×4 locations=23.04 mm ² (an area of 23.04% of the area of the opposing surface 201 of the electronic device 200). Further, in the orthogonal projection onto the mounting surface 101 of the package 100, for example, the recesses 20 are arranged vertically and horizontally symmetrically with respect to the center line of the opposing surface 201 of the electronic device 200, and the shortest distance between adjacent recesses 20 is 1.6 mm. In that case, the distance between the recess 20 of the package 100 and the outer periphery of the facing surface 201 of the electronic device 200 is 1.8 mm, which allows for a well-balanced arrangement. Further, it is also possible to set the number N of recesses 20 to nine in this electronic component 400. In that case, for example, if the size of each recess 20 is 2 mm x 2 mm x depth 0.2 mm, the area of the surface 103 of the recess 20 is 4 mm ² x 9 locations = 36 mm ² (opposing the electronic device 200 36% of the area of the surface 201), which can result in a configuration that is more effective in suppressing dark current and noise. In this case, the shortest distance between adjacent recesses 20 is 1 mm. In order to arrange a larger number of recesses 20 than this, the size of each recess 20 must be made smaller, or the shortest distance between the recesses 20 must be reduced. The optimal configuration may be considered from multiple viewpoints, such as the effect of suppressing dark current, stabilization of the surface precision of the electronic device 200, and the cost of the conductive member 40.

The package 100 shown in FIGS. 5(a) and 5(b) and the electronic component 400 including the package 100 shown in FIGS. 6(a) and 6(b) are modified examples of the package 100 and electronic component 400 described above. be. More specifically, the structure of the recess 20 is different from the structure described above. The structure of the recess 20 may be the same as the package 100 and the electronic component 400 described above except for the structure of the recess 20, so the structure of the recess 20 will be described here.

As shown in FIGS. 5(a), 5(b), 6(a), and 6(b), a plurality of recesses 20 are arranged to surround the surface 103 and the surface 103 on which the electrode 30 is disposed. and a surface 104 deeper than the surface 103. It can also be said that the recessed portion 20 has a surface 104 in the outer peripheral region of the surface 103 that communicates with the surface 103 and is located below in the Z direction. Surface 104 is located between surface 103 and surface 102. If the recess 20 described above is a one-stage recess, the recess 20 shown in FIGS. 5(a), 5(b), 6(a), and 6(b) is a two-stage recess.

As shown in FIGS. 5(a) and 5(b), and FIGS. 6(a) and 6(b), the electrode 30 may be placed on a part of the surface 103. Further, as shown in FIG. 7, in the orthogonal projection onto the mounting surface 101 of the package 100, the area of the surface 103 and the area of the electrode 30 may be the same.

When configuring the electronic component 400 in such a two-stage concave portion 20, the conductive member 40 is , may be in contact with a part of the electrode 30. Further, the conductive member 40 may cover the entire electrode 30, as shown in FIG. 7, and may further cover a part or the entire surface 104. As shown in FIG. 7, the conductive member 40 may cover the entire area of the recess 20. Since the electrode 30 is not disposed on the surface 104, the size of the area of the conductive member 40 in contact with the surface 104 does not affect the contact resistance with the electrode 30, and does not affect the amount of noise caused by the conductive member 40 of the electronic component 400. has no effect.

If the amount of the conductive member 40 is larger than the space on the surface 103 when the conductive member 40 is placed on the electrode 30, the second stage concave portion formed by the surface 104 stores the surplus conductive member 40. It functions as a space for people to enter. By having this second-stage recess, the contact area between the electrode 30 and the conductive member 40 and the contact area between the facing surface 201 of the electronic device 200 and the conductive member 40 can be maximized, and the amount of the conductive member 40 can be maximized. It is possible to absorb variations in the resistance and precision of the recess 20 and to easily manage the resistance value and the contact resistance value to be constant. In other words, variations in the amount of noise caused by the conductive member 40 can be effectively suppressed.

Hereinafter, the device 1000 shown in FIG. 8 and including the electronic component 400 will be described in detail. Electronic device 200 is housed in package 100 and mounted on equipment 1000. In the configuration shown in FIG. 8, electronic device 200 is a photoelectric conversion device. The electronic component 400 can include a package 100 that includes a base 10 to which the electronic device 200 is fixed, and a lid 300 made of glass or the like that faces the main area 210 of the electronic device 200. As described above, the package 100 may include bonding members such as wires 50 and bumps that connect the terminals provided on the base 10 and external terminals such as pad electrodes provided on the electronic device 200.

The device 1000 can include at least one of an optical device 1040, a control device 1050, a processing device 1060, a display device 1070, a storage device 1080, and a mechanical device 1090. The optical device 1040 is, for example, a lens, a shutter, or a mirror. Control device 1050 controls electronic device 200 . The control device 1050 is, for example, a semiconductor device such as an ASIC.

Processing device 1060 processes the signal output from electronic device 200. The processing device 1060 is a semiconductor device such as a CPU or ASIC for configuring an AFE (analog front end) or a DFE (digital front end). The display device 1070 is an EL display device or a liquid crystal display device that displays information (image) obtained by the electronic device 200. The storage device 1080 is a magnetic device or a semiconductor device that stores information (images) obtained by the electronic device 200. The storage device 1080 is a volatile memory such as SRAM or DRAM, or a nonvolatile memory such as a flash memory or a hard disk drive.

Mechanical device 1090 has a movable part or a propulsion part such as a motor or an engine. In the device 1000, the signal output from the electronic device 200 is displayed on the display device 1070, or transmitted to the outside by a communication device (not shown) included in the device 1000. For this reason, it is preferable that the device 1000 further includes a storage device 1080 and a processing device 1060, in addition to the storage circuit and arithmetic circuit included in the electronic device 200. Mechanical device 1090 may be controlled based on signals output from electronic device 200.

Furthermore, the device 1000 is suitable for electronic devices such as information terminals (for example, smartphones and wearable terminals) and cameras (for example, interchangeable lens cameras, compact cameras, video cameras, and surveillance cameras) that have a photographing function. Mechanical device 1090 in the camera can drive parts of optical device 1040 for zooming, focusing, and shutter operation. Alternatively, the mechanical device 1090 in the camera can move the electronic device 200 for anti-vibration operation.

Furthermore, the device 1000 may be a transportation device such as a vehicle, a ship, or an aircraft. Mechanical device 1090 in a transportation device can be used as a moving device. The device 1000 as a transport device is suitable for transporting the electronic device 200 or for assisting and/or automating driving (maneuvering) using a photographing function. The processing device 1060 for assisting and/or automating driving (maneuvering) can perform processing for operating the mechanical device 1090 as a mobile device based on information obtained by the electronic device 200. Alternatively, the device 1000 may be a medical device such as an endoscope, a measuring device such as a distance sensor, an analytical device such as an electron microscope, an office device such as a copying machine, or an industrial device such as a robot.

The disclosure herein includes the following packages, electronic components, and equipment.

(Item 1)
A package comprising a mounting surface for mounting an electronic device,
A plurality of recesses each having an electrode arranged thereon are arranged on the mounting surface,
A package characterized in that, in orthogonal projection onto the mounting surface, a total proportion of each of the plurality of recesses relative to the mounting surface is 10% or more and 50% or less.

(Item 2)
The package according to item 1, wherein each of the plurality of recesses has the same shape and area when viewed orthogonally projected onto the mounting surface.

(Item 3)
3. The package according to item 1 or 2, wherein the shape and area of the electrode are the same in each of the plurality of recesses when viewed orthogonally projected onto the mounting surface.

(Item 4)
4. The package according to any one of items 1 to 3, wherein in each of the plurality of recesses, the length between a virtual plane that is an extension of the mounting surface and the surface of the electrode is the same.

(Item 5)
5. The package according to any one of items 1 to 4, wherein the area of the electrode is π/4 mm ² or more.

(Item 6)
Any one of items 1 to 5, wherein the area of one of the plurality of recesses and the area of the electrode disposed in the one recess are the same in orthogonal projection onto the mounting surface. Package as mentioned in the item.

(Item 7)
Items 1 to 1, wherein the plurality of recesses include a first surface on which the electrode is arranged, and a second surface that is arranged to surround the first surface and is deeper than the first surface. Packages listed in any one of item 5.

(Item 8)
8. The package according to item 7, wherein the area of the first surface and the area of the electrode are the same in orthogonal projection onto the mounting surface.

(Item 9)
9. The package according to any one of items 1 to 8, wherein the distance between the electrodes that are closest to each other among the electrodes arranged in each of the plurality of recesses is 1 mm or more.

(Item 10)
A package comprising a mounting surface for mounting an electronic device,
A plurality of recesses each having an electrode arranged thereon are arranged on the mounting surface,
A package characterized in that, in orthogonal projection onto the mounting surface, the total area of the electrodes arranged in each of the plurality of recesses is 10% or more and 50% or less of the area of the mounting surface.

(Item 11)
The package described in any one of items 1 to 10,
an electronic device mounted on the mounting surface;
A conductive member is arranged in each of the plurality of recesses,
An electronic component, wherein the electrode is electrically connected to an opposing surface of the electronic device that faces the mounting surface via the conductive member.

(Item 12)
12. The electronic component according to item 11, wherein in orthographic projection onto the mounting surface, the total area of each of the plurality of recesses is 11% or more and 51% or less of the area of the opposing surface.

(Item 13)
13. The electronic component according to item 11 or 12, wherein the area in which the conductive member contacts the electrode is the same in each of the plurality of recesses.

(Item 14)
14. The electronic component according to any one of items 11 to 13, wherein the area in which the conductive member contacts the opposing surface is the same in each of the plurality of recesses.

(Item 15)
15. The electronic component according to any one of items 11 to 14, wherein the area in which the conductive member contacts the opposing surface is π/4 mm ² or more.

(Item 16)
In the orthogonal projection onto the mounting surface,
the opposing surface has a rectangular shape,
Any one of items 11 to 15, wherein the plurality of recesses are arranged symmetrically with respect to an imaginary line parallel to the first side of the opposing surface that bisects the opposing surface. Electronic components listed in the item.

(Item 17)
In orthogonal projection onto the mounting surface, the plurality of recesses are arranged in line symmetry with respect to an imaginary line parallel to a second side of the opposing surface that bisects the opposing surface and intersects with the first side of the opposing surface. The electronic component according to item 16, characterized in that:

(Item 18)
In the orthogonal projection onto the mounting surface,
the opposing surface has a rectangular shape,
An item characterized in that the electrodes arranged in each of the plurality of recesses are arranged symmetrically with respect to an imaginary line parallel to a first side of the opposing surface that bisects the opposing surface. The electronic component according to any one of items 11 to 17.

(Item 19)
In orthogonal projection onto the mounting surface, the electrodes arranged in each of the plurality of recesses are aligned with an imaginary line parallel to the second side of the opposing surface that intersects the first side that bisects the opposing surface. 19. The electronic component according to item 18, wherein the electronic component is arranged line-symmetrically.

(Item 20)
The electronic device includes a pixel region in which a plurality of pixels are arranged and a peripheral region,
20. The electronic component according to any one of items 11 to 19, wherein at least a portion of the plurality of recesses is arranged so as to overlap the pixel region in orthogonal projection onto the mounting surface.

(Item 21)
The electronic device includes a pixel region in which a plurality of pixels are arranged and a peripheral region,
Any one of items 11 to 20, wherein at least a part of the electrodes arranged in each of the plurality of recesses is arranged so as to overlap with the pixel region in orthographic projection onto the mounting surface. Electronic parts listed in item 1.

(Item 22)
A constant current source is arranged in the peripheral area,
22. The electronic component according to item 20 or 21, wherein the plurality of recesses and the electrodes arranged in each of the plurality of recesses do not overlap the constant current source in orthogonal projection onto the mounting surface.

(Item 23)
In orthogonal projection onto the mounting surface, the area of the electrode disposed in one of the plurality of concave portions is larger than the area of contact of the conductive member disposed in the one concave portion with the electrode. The electronic component according to any one of characteristic items 11 to 22.

(Item 24)
In orthogonal projection onto the mounting surface, the area of the electrode placed in one of the plurality of recesses is the same as the area of contact of the conductive member placed in the one recess with the electrode. The electronic component according to any one of items 11 to 22, characterized by:

(Item 25)
25. The electronic component according to any one of items 11 to 24, wherein the length between the electrode and the opposing surface is 0.1 mm or more and 0.4 mm or less.

(Item 26)
An electronic component comprising: a package including a mounting surface for mounting an electronic device; a pixel region in which a plurality of pixels are arranged; and a peripheral region; an electronic device mounted on the mounting surface;
A plurality of recesses each having an electrode and a conductive member arranged thereon are disposed on the mounting surface,
The electrode is electrically connected to an opposing surface opposite to the mounting surface of the electronic device via the conductive member,
The electronic component, wherein at least a portion of the plurality of recesses is arranged so as to overlap the pixel region in orthogonal projection onto the mounting surface.

(Item 27)
The electronic component described in any one of items 11 to 26,
a processing device that processes signals output from the electronic component;
A device characterized by comprising:

The invention is not limited to the embodiments described above, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the following claims are hereby appended to disclose the scope of the invention.

20: recess, 30: electrode, 100: package, 101: mounting surface, 200: electronic device

Claims (27)

A package comprising a mounting surface for mounting an electronic device,
A plurality of recesses each having an electrode arranged thereon are arranged on the mounting surface,
A package characterized in that, in orthogonal projection onto the mounting surface, a total proportion of each of the plurality of recesses relative to the mounting surface is 10% or more and 50% or less. The package according to claim 1, wherein each of the plurality of recesses has the same shape and area when viewed orthogonally projected onto the mounting surface. The package according to claim 1, wherein the shape and area of the electrode are the same in each of the plurality of recesses when viewed orthogonally projected onto the mounting surface. 2. The package according to claim 1, wherein in each of the plurality of recesses, a length between a virtual plane that is an extension of the mounting surface and a surface of the electrode is the same. The package according to claim 1, wherein the area of the electrode is π/4 mm ² or more. 2. The package according to claim 1, wherein in orthogonal projection onto the mounting surface, the area of one of the plurality of recesses is the same as the area of the electrode disposed in the one recess. Claim 1, wherein the plurality of recesses include a first surface on which the electrode is arranged, and a second surface that is arranged to surround the first surface and is deeper than the first surface. Packages listed in. 8. The package according to claim 7, wherein the area of the first surface and the area of the electrode are the same in orthogonal projection onto the mounting surface. The package according to claim 1, wherein the distance between the electrodes that are closest to each other among the electrodes arranged in each of the plurality of recesses is 1 mm or more. A package comprising a mounting surface for mounting an electronic device,
A plurality of recesses each having an electrode arranged thereon are arranged on the mounting surface,
A package characterized in that, in orthogonal projection onto the mounting surface, the total area of the electrodes arranged in each of the plurality of recesses is 10% or more and 50% or less of the area of the mounting surface. The package according to any one of claims 1 to 10,
an electronic device mounted on the mounting surface;
A conductive member is arranged in each of the plurality of recesses,
An electronic component, wherein the electrode is electrically connected to an opposing surface of the electronic device that faces the mounting surface via the conductive member. 12. The electronic component according to claim 11, wherein in orthogonal projection onto the mounting surface, the total area of each of the plurality of recesses is 11% or more and 51% or less of the area of the opposing surface. The electronic component according to claim 11, wherein the area in which the conductive member contacts the electrode is the same in each of the plurality of recesses. 12. The electronic component according to claim 11, wherein the area in which the conductive member contacts the opposing surface is the same in each of the plurality of recesses. The electronic component according to claim 11, wherein an area of the conductive member in contact with the opposing surface is π/4 mm ² or more. In the orthogonal projection onto the mounting surface,
the opposing surface has a rectangular shape,
The electronic component according to claim 11, wherein the plurality of recesses are arranged symmetrically with respect to an imaginary line parallel to a first side of the opposing surface that bisects the opposing surface. . In orthogonal projection onto the mounting surface, the plurality of recesses are arranged in line symmetry with respect to an imaginary line parallel to a second side of the opposing surface that bisects the opposing surface and intersects with the first side of the opposing surface. The electronic component according to claim 16, characterized in that: In the orthogonal projection onto the mounting surface,
the opposing surface has a rectangular shape,
A claim characterized in that the electrodes arranged in each of the plurality of recesses are arranged line-symmetrically with respect to an imaginary line parallel to a first side of the opposing surface that bisects the opposing surface. The electronic component according to item 11. In orthogonal projection onto the mounting surface, the electrodes arranged in each of the plurality of recesses are aligned with an imaginary line parallel to the second side of the opposing surface that intersects the first side that bisects the opposing surface. The electronic component according to claim 18, wherein the electronic component is arranged line-symmetrically. The electronic device includes a pixel region in which a plurality of pixels are arranged and a peripheral region,
12. The electronic component according to claim 11, wherein at least a portion of the plurality of recesses is arranged so as to overlap the pixel region in orthogonal projection onto the mounting surface. The electronic device includes a pixel region in which a plurality of pixels are arranged and a peripheral region,
12. The electronic device according to claim 11, wherein at least a part of the electrodes arranged in each of the plurality of recesses is arranged so as to overlap the pixel region in orthographic projection onto the mounting surface. parts. A constant current source is arranged in the peripheral area,
21. The electronic component according to claim 20, wherein in orthogonal projection onto the mounting surface, the plurality of recesses and the electrodes arranged in each of the plurality of recesses do not overlap the constant current source. In orthogonal projection onto the mounting surface, the area of the electrode disposed in one of the plurality of concave portions is larger than the area of contact of the conductive member disposed in the one concave portion with the electrode. The electronic component according to claim 11. In orthogonal projection onto the mounting surface, the area of the electrode placed in one of the plurality of recesses is the same as the area of contact of the conductive member placed in the one recess with the electrode. The electronic component according to claim 11, characterized by: The electronic component according to claim 11, wherein the length between the electrode and the opposing surface is 0.1 mm or more and 0.4 mm or less. An electronic component comprising: a package including a mounting surface for mounting an electronic device; a pixel region in which a plurality of pixels are arranged; and a peripheral region; an electronic device mounted on the mounting surface;
A plurality of recesses each having an electrode and a conductive member arranged thereon are disposed on the mounting surface,
The electrode is electrically connected to an opposing surface opposite to the mounting surface of the electronic device via the conductive member,
The electronic component, wherein at least a portion of the plurality of recesses is arranged so as to overlap the pixel region in orthogonal projection onto the mounting surface. The electronic component according to claim 11;
a processing device that processes signals output from the electronic component;
A device characterized by comprising:

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