CN210325685U - Ion etching system - Google Patents
Ion etching system Download PDFInfo
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- CN210325685U CN210325685U CN201921408647.2U CN201921408647U CN210325685U CN 210325685 U CN210325685 U CN 210325685U CN 201921408647 U CN201921408647 U CN 201921408647U CN 210325685 U CN210325685 U CN 210325685U
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- filter screen
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- vacuum pump
- side wall
- strong magnet
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Abstract
The utility model provides an ion etching system, which comprises a vacuum etching cavity and a vacuum pump, wherein the vacuum etching cavity is connected with an air suction port of the vacuum pump through a communication pipeline; the communicating pipeline is internally provided with a cylindrical filter piece and a strong magnet adsorption piece arranged in the cylindrical filter piece; the cylindrical filter element consists of a side wall filter screen and a bottom filter screen positioned at the lower end of the side wall filter screen; the lower end of the side wall filter screen faces the vacuum pump; the upper end of the side wall filter screen faces the vacuum etching cavity and is in sealing connection with the inner wall of the communicating pipeline. The utility model discloses a along with the metal particle that evacuation air current flows receives the absorption of strong magnet adsorption piece, and the air current then filters through the cartridge type and gets into inside the vacuum pump after further filtering. After the equipment process is operated for a period of time, the strong magnet adsorption piece and the cylinder type filter piece are cleaned or replaced. The utility model discloses effectively protected the vacuum pump, and maintained high-efficiently simple and convenient, the maintenance cost is low, has improved the maintenance cycle and the cost consumption of equipment.
Description
Technical Field
The utility model relates to a semiconductor sculpture field, concretely relates to ion etching system.
Background
In the manufacturing processes of semiconductor devices, chips, and the like, etching processes are most frequently used and occur among many processes, and used apparatuses include ion beam etching systems and plasma etchers.
In the ion beam etching system, during the operation of the ion beam etching system, the ion beam emitted from the ion source bombards the etching material or the baffle plate, and the deposition of particles is generated and spread all over the reaction chamber. In the process of using the vacuum pump to vacuumize the cavity, most metal particles can enter the vacuum pump along with the vacuumized airflow, the inside of the vacuum pump is blocked, the working efficiency of equipment is influenced, and the internal parts of the vacuum pump are damaged even, so that the vacuum pump cannot work. The vacuum pump of the ion beam etching system generally adopts a molecular pump, which is expensive and complex to repair, so that the occurrence of the problem causes the rise of the equipment cost and the high and complex maintenance frequency.
Similar to the above, the plasma formed from the space above the chamber reaches the surface of the wafer through the acceleration of the bias rf source, many particles are sputtered from the surface of the wafer and the surface of the parts inside the chamber, most of the metal particles are distributed inside the reaction chamber, and finally the metal particles are pumped away by the vacuum pump, and after a period of operation, the inside of the vacuum pump is blocked, thereby causing damage.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides an ion etching system filters the foreign particle in vacuum pump exhaust line for inside the foreign particle can not enter into the vacuum pump, does not influence the evacuation effect of vacuum pump simultaneously.
The technical scheme is as follows: the utility model provides an ion etching system, which comprises a vacuum etching cavity and a vacuum pump, wherein the vacuum etching cavity is connected with an air suction port of the vacuum pump through a communication pipeline; the communicating pipeline is internally provided with a cylindrical filter piece and a strong magnet adsorption piece arranged in the cylindrical filter piece; the cylindrical filter element consists of a side wall filter screen and a bottom filter screen positioned at the lower end of the side wall filter screen; the lower end of the side wall filter screen faces the vacuum pump; the upper end of the side wall filter screen faces the vacuum etching cavity and is in sealing connection with the inner wall of the communicating pipeline.
Further, the cylinder-shaped filter piece is in a circular truncated cone shape, and the sectional area of the upper end is larger than that of the lower end.
Further, the strong magnet adsorption piece is fixed on the bottom filter screen.
Further, the strong magnet adsorbs the piece for cylindric, and the cylinder axis that the strong magnet adsorbs the piece and the round platform axis of barrel-type filter piece is located same straight line.
Furthermore, the mesh shapes of the side wall filter screen and the bottom filter screen are round holes or slotted holes.
Further, the communication pipeline is provided with a flange interface; and the upper end of the side wall filter screen is provided with a sealing ring which is clamped in the flange interface in a sealing way.
Has the advantages that: the utility model discloses a set up cartridge filter piece and strong magnet absorption piece in the intercommunication pipeline between the induction port of vacuum etching cavity and vacuum pump, when metal particle along with the inside that evacuation air current reachd the intercommunication pipeline, receive the absorption of strong magnet absorption piece, the gathering is on the surface that the strong magnet absorbed the piece, and the air current that does not contain the granule then filters piece entering vacuum pump through the cartridge inside, has realized the high-efficient filtration of air current. After the equipment process runs for a period of time, the communicating pipeline is disassembled, and the strong magnet adsorption piece and the cylindrical filter piece fixed in the communicating pipeline are cleaned or replaced. The utility model discloses effectively protected the vacuum pump, and maintained high-efficiently simple and convenient, the maintenance cost is low, has improved the maintenance cycle and the cost consumption of equipment.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the cylindrical filter member and the strong magnet adsorbing member of the present invention;
FIG. 3 is a schematic diagram of one embodiment of the mesh shape of the cartridge filter of the present invention;
fig. 4 is a schematic diagram of another embodiment of the mesh shape of the cartridge filter of the present invention.
Detailed Description
Referring to fig. 1, an ion beam etching system includes a vacuum etching chamber 1 and a vacuum pump 2, wherein the vacuum etching chamber 1 is connected with an air suction port of the vacuum pump 2 through a communication pipe 3.
The communicating pipeline 3 is internally provided with a cylinder type filtering piece 12 and a strong magnet adsorption piece 11 arranged in the cylinder type filtering piece 12.
As shown in fig. 2, the cartridge type filter member 12 is composed of a sidewall filter 120 and a bottom filter 121 positioned at a lower end of the sidewall filter 120. The lower end of the sidewall screen 120 faces the vacuum pump 2. The upper end of the side wall filter screen 120 faces the vacuum etching chamber 1 and is connected with the inner wall of the communicating pipe 3 in a sealing manner. The communication pipeline is provided with a flange interface 101; the upper end of the side wall filter screen 120 is provided with a sealing ring 122 which is clamped in the flange joint 101 in a sealing manner. The sealing ring 122 is provided with bolt holes 123 corresponding to the flange joints 101, the upper end face and the lower end face of the sealing ring 122 are also provided with annular sealing grooves 123, sealing rings 124 are embedded into the annular sealing grooves 123, and the sealing rings 124 are tightly pressed between the flange joints 101 to play a role in sealing.
The cylindrical filter member 12 is in the shape of a circular truncated cone, and the sectional area of the upper end is larger than that of the lower end.
The strong magnet adsorption piece 11 is fixed on the bottom filter screen 121, and a through hole is formed in the strong magnet adsorption piece 11, and then a bolt is inserted into the through hole to be connected with the bottom filter screen 121. The strong magnet adsorption piece 11 is cylindrical, and the cylindrical axis of the strong magnet adsorption piece 11 and the circular truncated cone axis of the cylindrical filter piece 12 are located on the same straight line.
When metal particles reach the inside of communicating pipe 3 along with the evacuation air current, receive strong magnet adsorption 11's absorption, the gathering is on strong magnet adsorption 11's surface, and the air current that does not contain the granule then passes through cartridge type and filters piece 12 entering vacuum pump inside, has realized the high efficiency of air current and has filtered. After the equipment process runs for a period of time, the communicating pipeline 3 is disassembled, and the strong magnet adsorption piece 11 and the cylindrical filter piece 12 fixed in the communicating pipeline are cleaned or replaced. The utility model discloses effectively protected vacuum pump 2, and maintained high-efficiently simple and convenient, the maintenance cost is low, has improved the maintenance cycle and the cost consumption of equipment.
The metal particles flow from top to bottom, so the adsorption capacity of the upper end of the ferromagnetic adsorption member 11 is greater than that of the lower end, and the gap between the upper end of the ferromagnetic adsorption member 11 adsorbing the metal particles and the sidewall filter screen 120 is too small, which may cause airflow blockage. The strong magnet of this embodiment adsorbs piece 11 and lateral wall filter screen 120's clearance from top to bottom reduces gradually, when guaranteeing the adsorption effect, prevents that the strong magnet from adsorbing under the little condition of the lower extreme clearance variation of piece 11, and the upper end clearance has blockked up unable the use. Thereby make the upper end clearance and the lower extreme clearance of strong magnet adsorption member 11 reduce to unable the use in step, strong magnet adsorption member 11 obtains make full use of, prolongs the life cycle of strong magnet adsorption member 11, reduces the cleaning frequency.
The mesh shapes of the sidewall screen 120 and the bottom screen 121 may be circular holes as shown in fig. 2, or slotted holes as shown in fig. 3 or 4. The size and the quantity of mesh are decided by vacuum pump 2's pumping pipeline size, and the flow area of this mesh is guaranteed mainly to be greater than or equal to vacuum pump's pumping pipeline's area, guarantees that vacuum pump 2 can not appear the flow resistance of great degree at the in-process of bleeding, prevents to cause the pumping speed to reduce, reduces work efficiency.
Similarly, the plasma etching machine can be provided with a cylindrical filter element 12 with the same structure and a strong magnet adsorption element 11 arranged in the cylindrical filter element 12 at the air suction port of the vacuum pump.
Claims (6)
1. An ion etching system comprises a vacuum etching cavity and a vacuum pump, wherein the vacuum etching cavity is connected with an air suction port of the vacuum pump through a communication pipeline; the method is characterized in that: the communicating pipeline is internally provided with a cylindrical filter piece and a strong magnet adsorption piece arranged in the cylindrical filter piece; the cylindrical filter element consists of a side wall filter screen and a bottom filter screen positioned at the lower end of the side wall filter screen; the lower end of the side wall filter screen faces the vacuum pump; the upper end of the side wall filter screen faces the vacuum etching cavity and is in sealing connection with the inner wall of the communicating pipeline.
2. The ion etching system of claim 1, wherein: the cylinder type filter piece is in a round table shape, and the sectional area of the upper end is larger than that of the lower end.
3. The ion etching system of claim 2, wherein: the strong magnet adsorption piece is fixed on the bottom filter screen.
4. The ion etching system of claim 3, wherein: the strong magnet adsorbs the piece for cylindric, and the cylinder axis that the strong magnet adsorbs the piece is located the collinear with the round platform axis of barrel-type filter piece.
5. The ion etching system of claim 1, wherein: the meshes of the side wall filter screen and the bottom filter screen are round holes or slotted holes.
6. The ion etching system of claim 1, wherein: the communicating pipeline is provided with a flange interface; and the upper end of the side wall filter screen is provided with a sealing ring which is clamped in the flange interface in a sealing way.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921408647.2U CN210325685U (en) | 2019-08-28 | 2019-08-28 | Ion etching system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921408647.2U CN210325685U (en) | 2019-08-28 | 2019-08-28 | Ion etching system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210325685U true CN210325685U (en) | 2020-04-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921408647.2U Active CN210325685U (en) | 2019-08-28 | 2019-08-28 | Ion etching system |
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| CN (1) | CN210325685U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115518453A (en) * | 2021-06-25 | 2022-12-27 | 江苏鲁汶仪器有限公司 | Method for reducing aggregation of silver etching byproducts |
-
2019
- 2019-08-28 CN CN201921408647.2U patent/CN210325685U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115518453A (en) * | 2021-06-25 | 2022-12-27 | 江苏鲁汶仪器有限公司 | Method for reducing aggregation of silver etching byproducts |
| WO2022267372A1 (en) * | 2021-06-25 | 2022-12-29 | 江苏鲁汶仪器有限公司 | Method for reducing agglomeration of silver etching by-products |
| TWI811890B (en) * | 2021-06-25 | 2023-08-11 | 大陸商江蘇魯汶儀器有限公司 | Method for reducing aggregatioin of silver etching by-products |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 221300 No.8, Liaohe West Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee after: Jiangsu Luwen Instrument Co.,Ltd. Address before: 221300 No.8, Liaohe West Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee before: JIANGSU LEUVEN INSTRUMMENTS Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |