CN220249680U - Vacuumizing pipeline, vacuum adsorption device and wafer processing equipment - Google Patents
Vacuumizing pipeline, vacuum adsorption device and wafer processing equipment Download PDFInfo
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- CN220249680U CN220249680U CN202322291421.1U CN202322291421U CN220249680U CN 220249680 U CN220249680 U CN 220249680U CN 202322291421 U CN202322291421 U CN 202322291421U CN 220249680 U CN220249680 U CN 220249680U
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- liquid discharge
- vacuum generator
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- 238000001179 sorption measurement Methods 0.000 title claims abstract description 24
- 239000007788 liquid Substances 0.000 claims abstract description 59
- 238000000605 extraction Methods 0.000 claims abstract description 9
- 238000000926 separation method Methods 0.000 claims description 9
- 230000008901 benefit Effects 0.000 abstract description 5
- 230000009466 transformation Effects 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a vacuumizing pipeline, a vacuum adsorption device and wafer processing equipment, wherein the vacuumizing pipeline comprises a first vacuum generator used for connecting a vacuum adsorber, a first air inlet of the first vacuum generator is connected with an air source, a first air extraction opening of the first vacuum generator is used for connecting the vacuum adsorber, a first air outlet of the first vacuum generator is connected with a vacuum liquid discharge tank, and a liquid discharge opening of the vacuum liquid discharge tank is connected with the liquid discharge pipeline. The utility model adopts the vacuum generator to provide vacuum, and compared with a vacuum pump, the utility model has simpler equipment structure and better economic benefit. Simultaneously, make vacuum generator connect the vacuum drain pot, make vacuum drain pot connect the flowing back pipeline to can be with the interior absorptive liquid exhaust pipeline of pipeline in real time, can not influence the vacuum value, can effectively guarantee vacuum adsorption's stability.
Description
Technical Field
The utility model relates to the field of semiconductor device processing, in particular to a vacuumizing pipeline, a vacuum adsorption device and wafer processing equipment.
Background
In the process of cutting, thinning, cleaning, ring removing and the like of a semiconductor device, a vacuum adsorption table disclosed in Chinese patent publication No. CN218385167U can be adopted to adsorb and fix materials for further processing.
The vacuum adsorption stage is typically connected to a vacuum pump via a vacuum line to effect evacuation. However, in the cutting process, it is often necessary to spray liquid on the material on the vacuum adsorption table, and spraying liquid while vacuumizing easily causes liquid to enter the vacuumizing pipeline, so that the vacuum value is affected, and the unstable vacuum adsorption occurs.
Disclosure of Invention
The utility model aims to solve the problems in the prior art and provides a vacuumizing pipeline, a vacuum adsorption device and wafer processing equipment.
The aim of the utility model is achieved by the following technical scheme:
the vacuum pumping pipeline comprises a first vacuum generator which is used for being connected with a vacuum absorber, a first air inlet of the first vacuum generator is connected with an air source, a first air extraction opening of the first vacuum generator is used for being connected with the vacuum absorber, a first air outlet of the first vacuum generator is connected with a vacuum liquid discharge tank, and a liquid outlet of the vacuum liquid discharge tank is connected with a liquid discharge pipeline.
Preferably, in the vacuumizing pipeline, the vacuum liquid draining tank comprises a tank body, an upper air inlet and an upper air outlet are formed in the upper half area of the tank body, and a liquid draining port is formed in the bottom of the tank body.
Preferably, in the vacuumizing pipeline, a pipe fitting is arranged at the upper air inlet and/or the upper air outlet and/or the liquid outlet, and the outer wall of the pipe fitting is provided with an external thread and/or the inner wall of the pipe fitting is provided with an internal thread.
Preferably, in the vacuumizing pipeline, a quick-change connector is connected to the pipe fitting through threads.
Preferably, in the vacuumizing pipeline, a gas-liquid separation plate is arranged in the tank body.
Preferably, in the vacuumizing pipeline, the liquid draining pipeline comprises a second vacuum generator, a second air inlet of the second vacuum generator is connected with the air source, a second air extraction opening of the second vacuum generator is connected with a liquid draining opening of the vacuum liquid draining tank, and a second air outlet of the second vacuum generator is connected with the liquid draining pipe.
The vacuum adsorption device comprises a vacuum adsorption table and further comprises the vacuumizing pipeline.
Wafer processing apparatus comprising a vacuum adsorption device as described above.
The technical scheme of the utility model has the advantages that:
the utility model adopts the vacuum generator to provide vacuum, and compared with a vacuum pump, the utility model has simpler equipment structure and better economic benefit. Simultaneously, make vacuum generator connect the vacuum drain pot, make vacuum drain pot connect the flowing back pipeline to can be with the interior absorptive liquid exhaust pipeline of pipeline in real time, can not influence the vacuum value, can effectively guarantee vacuum adsorption's stability.
The pipeline structure of the utility model is completely composed of mechanical structures, no electrical software connection is needed, the mechanical structures are easy to install and change, the pipeline structure is convenient and quick, and the stability is high.
The vacuum water drain tank has the advantages of simple structure, easy realization, high strength and easy installation, and the tank body is completely made of metal materials. The gas-liquid separation plate is arranged in the tank body, so that the gas and the liquid can be effectively ensured to be in a separation state.
Drawings
FIG. 1 is a schematic diagram of an evacuation line of the present utility model;
FIG. 2 is a perspective view of a vacuum drainage tank of the present utility model;
fig. 3 is a schematic diagram of the operation of the evacuation line of the present utility model.
Detailed Description
The objects, advantages and features of the present utility model are illustrated and explained by the following non-limiting description of preferred embodiments. These embodiments are only typical examples of the technical scheme of the utility model, and all technical schemes formed by adopting equivalent substitution or equivalent transformation fall within the scope of the utility model.
In the description of the embodiments, it should be noted that the positional or positional relationship indicated by the terms such as "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Example 1
The evacuation line according to the present utility model is illustrated in the following description with reference to the accompanying drawings, as shown in fig. 1, and includes a first vacuum generator 200 for connecting to a vacuum adsorption stage 100, where the specific structure of the first vacuum generator 200 is known in the art, and will not be described herein. The first vacuum generator 200 includes a first air inlet 210, a first air outlet 220, and a first air extraction opening 230, the first air inlet 210 of the first vacuum generator 200 is connected to an air source through a pipeline, the first air extraction opening 230 of the first vacuum generator 200 is connected to the vacuum adsorption table 100 through a pipeline, the first air outlet of the first vacuum generator 200 is connected to the vacuum drainage tank 300, and a liquid outlet of the vacuum drainage tank 300 is connected to the liquid drainage pipeline 400. Of course, the vacuum adsorption table may be other vacuum adsorbers such as a vacuum nozzle and a vacuum chuck.
As shown in fig. 2, the vacuum drainage tank 300 includes a tank body 310, the specific shape of the tank body 310 may be designed according to needs, in this embodiment, the overall shape of the tank body 310 is a cuboid, and the tank body 310 may be a hollow structure formed by integral injection molding, or may be obtained by full welding of metal materials. More preferably, the tank 310 is formed by full-welding stainless steel metal plates. The upper half area of the tank 310 is provided with an upper air inlet 320 and an upper air outlet 330, the upper air inlet 320 and the upper air outlet 330 are specifically disposed on a top plate of the tank 310, and a liquid outlet 340 is disposed at the bottom of the tank 310.
As shown in fig. 2, a pipe fitting 350 is disposed at the upper air inlet 320 and/or the upper air outlet 330 and/or the liquid outlet, the pipe fitting 350 may be welded to the tank 310 in a full-welded manner, an outer wall of the pipe fitting 350 has an external thread and/or an inner wall of the pipe fitting 350 has an internal thread, and a quick-change connector 351 is screwed on the pipe fitting 350, so that a pipe can be conveniently connected.
As shown in fig. 2, a gas-liquid separation plate 360 is disposed in the tank 310, the gas-liquid separation plate 360 is an L-shaped plate, the gas-liquid separation plate 360 may also be connected in the tank 310 in a welded manner, and a riser 361 of the gas-liquid separation plate 360 is disposed between the upper air inlet 320 and the upper air outlet 330, a transverse plate 362 of the gas-liquid separation plate 360 is disposed below the upper air outlet 330, and the transverse plate 362 and a side plate of the tank 310 adjacent to the upper air outlet 330 maintain a gap.
As shown in fig. 2, for convenience of assembly, two external connection plates 370 are provided at the side of the can body 310, the external connection plates 370 are L-shaped, the external connection plates 370 may be connected to the can body 310 in a welded manner, and at least two connection holes 371 are provided at the connection portions of the external connection plates 370.
As shown in fig. 1, the liquid draining pipeline 400 includes a second vacuum generator 410, a second air inlet 411 of the second vacuum generator 410 is connected with the air source through a pipeline, a second air extraction opening 412 of the second vacuum generator 410 is connected with a liquid draining opening of the vacuum liquid draining tank 300 through a pipeline, a second air outlet 413 of the second vacuum generator 410 is connected with a liquid draining pipe, and a liquid outlet end of the liquid draining pipe can be connected with a recovery tank.
In operation, as shown in fig. 3, the gas supplied by the gas source enters the first gas inlet 210 of the first vacuum generator 200 and is discharged from the first gas outlet 220, at this time, the first gas extraction port 230 of the first vacuum generator 200 can realize the vacuum suction of the vacuum adsorption platform 100, when the liquid enters the pipeline, the liquid enters the vacuum liquid discharge tank 300 along with the gas flow, under the action of gravity, the liquid and the gas entering the vacuum liquid discharge tank 300 are separated, the liquid falls into the bottom of the vacuum liquid discharge tank 300, and the gas is discharged from the upper gas outlet 330. At the same time, the gas supplied from the gas source enters the second vacuum generator 410 through the second gas inlet 411 and is discharged through the second gas outlet 413 of the second vacuum generator 410, and at this time, the gas flow can suck the liquid at the bottom of the vacuum discharge tank 300 and discharge the sucked liquid from the second gas outlet 413 of the second vacuum generator 410 along with the gas flow.
Example 2
The embodiment discloses a vacuum adsorption device, which comprises a vacuum adsorption table 100 and a vacuum pumping pipeline.
Example 3
The embodiment discloses wafer processing equipment comprising the vacuum adsorption device.
The utility model has various embodiments, and all technical schemes formed by equivalent transformation or equivalent transformation fall within the protection scope of the utility model.
Claims (8)
1. Vacuumizing pipeline, its characterized in that: the vacuum adsorber comprises a first vacuum generator used for being connected with the vacuum adsorber, a first air inlet of the first vacuum generator is connected with an air source, a first air extraction opening of the first vacuum generator is used for being connected with the vacuum adsorber, a first air outlet of the first vacuum generator is connected with a vacuum liquid discharge tank, and a liquid outlet of the vacuum liquid discharge tank is connected with a liquid discharge pipeline.
2. The evacuation line of claim 1, wherein: the vacuum liquid draining tank comprises a tank body, an upper air inlet and an upper air outlet are formed in the upper half area of the tank body, and a liquid draining port is formed in the bottom of the tank body.
3. The evacuation line of claim 2, wherein: the upper air inlet and/or the upper air outlet and/or the liquid outlet are/is provided with a pipe fitting, and the outer wall of the pipe fitting is provided with external threads and/or the inner wall of the pipe fitting is provided with internal threads.
4. A vacuum line according to claim 3, wherein: and the pipe fitting is connected with a quick-change connector in a threaded manner.
5. The evacuation line of claim 2, wherein: a gas-liquid separation plate is arranged in the tank body.
6. The evacuation line of any one of claims 1-5, wherein: the liquid discharge pipeline comprises a second vacuum generator, a second air inlet of the second vacuum generator is connected with the air source, a second air extraction opening of the second vacuum generator is connected with a liquid discharge opening of the vacuum liquid discharge tank, and a second air outlet of the second vacuum generator is connected with the liquid discharge pipe.
7. Vacuum adsorption device, including vacuum adsorption platform, its characterized in that: further comprising an evacuation line according to any of claims 1-6.
8. Wafer processing equipment, its characterized in that: comprising a vacuum adsorption device according to claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322291421.1U CN220249680U (en) | 2023-08-25 | 2023-08-25 | Vacuumizing pipeline, vacuum adsorption device and wafer processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322291421.1U CN220249680U (en) | 2023-08-25 | 2023-08-25 | Vacuumizing pipeline, vacuum adsorption device and wafer processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220249680U true CN220249680U (en) | 2023-12-26 |
Family
ID=89263881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322291421.1U Active CN220249680U (en) | 2023-08-25 | 2023-08-25 | Vacuumizing pipeline, vacuum adsorption device and wafer processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220249680U (en) |
-
2023
- 2023-08-25 CN CN202322291421.1U patent/CN220249680U/en active Active
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