CN210274688U - Circuit structure of printed circuit board - Google Patents
Circuit structure of printed circuit board Download PDFInfo
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- CN210274688U CN210274688U CN201921093215.7U CN201921093215U CN210274688U CN 210274688 U CN210274688 U CN 210274688U CN 201921093215 U CN201921093215 U CN 201921093215U CN 210274688 U CN210274688 U CN 210274688U
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- bonding pad
- printed circuit
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Abstract
The application provides a circuit structure of printed circuit board, printed circuit board includes: the connecting conductor, the first metal sheet, the second metal sheet, and the first bonding pad and the second bonding pad which are not connected; the first bonding pad is connected with the first end of the first metal sheet; the second bonding pad is connected with the first end of the second metal sheet; a preset spacing distance is kept between the first metal sheet and the second metal sheet; when applied to the first stage, the connecting conductor is detachably connected with the first metal sheet and the second metal sheet respectively to form zero ohm resistance between the first bonding pad and the second bonding pad; when the metal sheet is applied to the second stage, the connecting conductor is removed, and when the connecting conductor is electrified, the first metal sheet and the second metal sheet are disconnected. The zero-ohm resistor is realized by the metal sheet and the soldering tin, a circuit board design engineer does not need to check and modify the design content of the multilayer circuit board again, the chance of error change is reduced, and the test time is saved.
Description
Technical Field
The application relates to the field of circuit boards, in particular to a combined structure of a printed circuit board.
Background
Printed circuit boards are used as carriers of various electronic devices such as chips, and are developing in the direction of environmental protection with high density, high speed, low power consumption and low cost. The method mainly comprises the following steps: first, the printed circuit board has increasingly thinner track widths. Secondly, with the increasing demand of people for information, the electronic products are promoted to develop at a high speed.
In the new product introduction stage, in order to conveniently test the functions of the electronic circuits, zero-ohm resistors need to be arranged in nodes of the electronic circuits so as to accelerate the testing speed of engineers.
During the system integration test phase, engineers need to replace the zero ohm resistors in the electronic circuit with short circuit type circuits. That is, the design engineer of the printed circuit board needs to modify the multilayer electronic circuit in the multilayer printed circuit board, thereby increasing the workload of the engineer.
Disclosure of Invention
The present application provides a circuit structure of a printed circuit board; the problem that changing zero ohm resistance of an electronic circuit in a printed circuit board is time-consuming and labor-consuming is solved.
In order to solve the above technical problem, an embodiment of the present application provides the following technical solutions:
the application provides a circuit structure of printed circuit board, printed circuit board includes: the connecting conductor, the first metal sheet, the second metal sheet, and the first bonding pad and the second bonding pad which are not connected; the first bonding pad is connected with the first end of the first metal sheet; the second bonding pad is connected with the first end of the second metal sheet; a preset spacing distance is kept between the first metal sheet and the second metal sheet; when applied to the first stage, the connecting conductor is detachably connected with the first metal sheet and the second metal sheet respectively to form zero ohm resistance between the first bonding pad and the second bonding pad; when the metal sheet is applied to the second stage, the connecting conductor is removed, and when the connecting conductor is electrified, the first metal sheet and the second metal sheet are disconnected.
Optionally, the first metal sheet is specifically a first metal belt; the second metal sheet is specifically a second metal strip.
Optionally, a preset separation distance is kept between the second end of the first metal strip and the second end of the second metal strip.
Optionally, the metal material of the first metal sheet or the second metal sheet is steel.
Optionally, the preset separation distance is controlled to be in a length range of 1-2 mils.
Optionally, the connection conductor is solder.
Based on the disclosure of the above embodiments, it can be known that the embodiments of the present application have the following beneficial effects:
the application provides a circuit structure of printed circuit board, printed circuit board includes: the connecting conductor, the first metal sheet, the second metal sheet, and the first bonding pad and the second bonding pad which are not connected; the first bonding pad is connected with the first end of the first metal sheet; the second bonding pad is connected with the first end of the second metal sheet; a preset spacing distance is kept between the first metal sheet and the second metal sheet; when applied to the first stage, the connecting conductor is detachably connected with the first metal sheet and the second metal sheet respectively to form zero ohm resistance between the first bonding pad and the second bonding pad; when the metal sheet is applied to the second stage, the connecting conductor is removed, and when the connecting conductor is electrified, the first metal sheet and the second metal sheet are disconnected.
The zero-ohm resistor is realized by the metal sheet and the soldering tin, a circuit board design engineer does not need to check and modify the design content of the multilayer circuit board again, the chance of error change is reduced, and the test time is saved.
Drawings
FIG. 1 is an electrical diagram of a new product introduction phase with zero ohm resistance provided by an embodiment of the present application;
FIG. 2 is an electrical diagram of a short circuit during a system integration test phase according to an embodiment of the present disclosure;
fig. 3 is a diagram of a printed circuit board with an open circuit between a first metal plate and a second metal plate according to an embodiment of the present application;
fig. 4 is a diagram of a printed circuit board with a short circuit between a first metal sheet and a second metal sheet according to an embodiment of the present disclosure;
description of the reference numerals
1-first pad, 2-second pad, 3-first metal sheet, 4-second metal sheet, 5-connecting conductor, 6-zero ohm resistance.
Detailed Description
Specific embodiments of the present application will be described in detail below with reference to the accompanying drawings, but the present application is not limited thereto.
It will be understood that various modifications may be made to the embodiments disclosed herein. Accordingly, the foregoing description should not be construed as limiting, but merely as exemplifications of embodiments. Those skilled in the art will envision other modifications within the scope and spirit of the application.
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with a general description of the application given above and the detailed description of the embodiments given below, serve to explain the principles of the application.
These and other characteristics of the present application will become apparent from the following description of preferred forms of embodiment, given as non-limiting examples, with reference to the attached drawings.
It should also be understood that, although the present application has been described with reference to some specific examples, a person of skill in the art shall certainly be able to achieve many other equivalent forms of application, having the characteristics as set forth in the claims and hence all coming within the field of protection defined thereby.
The above and other aspects, features and advantages of the present application will become more apparent in view of the following detailed description when taken in conjunction with the accompanying drawings.
Specific embodiments of the present application are described hereinafter with reference to the accompanying drawings; however, it is to be understood that the disclosed embodiments are merely examples of the application, which can be embodied in various forms. Well-known and/or repeated functions and constructions are not described in detail to avoid obscuring the application of unnecessary or unnecessary detail. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present application in virtually any appropriately detailed structure.
The specification may use the phrases "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," which may each refer to one or more of the same or different embodiments in accordance with the application.
The application provides a circuit structure of a printed circuit board. Details are described in the following examples one by one.
The present application provides embodiments of a circuit structure of a printed circuit board.
The printed circuit board of this embodiment includes: a connection conductor 5, a first metal sheet 3, a second metal sheet 4, and a first pad 1 and a second pad 2 which are not connected; the first bonding pad 1 is connected with a first end of a first metal sheet 3; the second bonding pad 2 is connected with a first end of a second metal sheet 4; a preset spacing distance is kept between the first metal sheet 3 and the second metal sheet 4.
When the printed circuit board is applied in the first stage, the connection conductor 5 is detachably connected to the first metal sheet 3 and the second metal sheet 4, respectively, forming a zero-ohm resistor 6 between the first pad 1 and the second pad 2. Please refer to fig. 4.
The zero ohm resistor 6, also known as a bridge resistor, is a special purpose resistor. The zero-ohm resistor 6 is not really zero in resistance, and the zero-ohm resistor 6 is actually a resistor with a very small resistance. Because of the resistance value, the resistance value has the same error precision index as the conventional chip resistor. In the design of the printed circuit board, two points can not be connected by a printing circuit, the front surface is often connected by overlines, which are often seen in a common board, and in order to ensure the normal work of an automatic chip mounter and an automatic component inserter, overlines are replaced by zero resistors. Please refer to fig. 1.
For example, the first phase is a new product import phase; the present embodiment utilizes the connection conductor 5, the first metal sheet 3 and the second metal sheet 4 to connect to form a zero ohm resistor 6 for testing at the new product introduction stage.
The zero-ohm resistor 6 has no function in the electronic circuit, but is provided on the printed circuit board for test convenience or for a compatible design. Usually modified in the final electronic circuit to be short-circuited between two points, as shown in fig. 2.
When the printed circuit board is applied in the second stage, the connecting conductor 5 is removed, and when the printed circuit board is electrified, the first metal sheet 3 and the second metal sheet 4 are disconnected. Please refer to fig. 3. By installing the connecting conductors 5 or removing the connecting conductors 5, engineers do not need to change the design drawings and re-manufacture the printed circuit board, saving time and manufacturing cost. For example, the second stage is a system integration test stage, and the present embodiment achieves the purpose of breaking the circuit between the first metal sheet 3 and the second metal sheet 4 by removing the connecting conductor 5.
Optionally, the first metal sheet 3 is specifically a first metal strip; the second metal sheet 4 is in particular a second metal strip.
Optionally, a preset separation distance is kept between the second end of the first metal strip and the second end of the second metal strip.
The steel has good conductivity and low resistance. Therefore, optionally, the metal material of the first metal sheet 3 or the second metal sheet 4 is steel. The metallic material of the first metal strip or the second metal strip is also steel.
Optionally, the preset separation distance is controlled to be in a length range of 1-2 mils.
Alternatively, the connection conductor 5 is solder.
For example, in the new product import phase, solder is dotted between the first metal sheet 3 (or the second end of the first metal strip) and the second metal sheet 4 (or the second end of the second metal strip) which keep a preset spacing distance, the first metal sheet 3 (or the second end of the first metal strip) and the second metal sheet 4 (or the second end of the second metal strip) are connected by utilizing the characteristic of inward diffusion of the solder, so that the first metal sheet 3 (or the first metal strip) and the second metal sheet 4 (or the second metal strip) and the solder form a zero-ohm resistor 6, thereby facilitating the test; in the system integration test stage, the soldering tin between the first metal sheet 3 (or the first metal belt) and the second metal sheet 4 (or the second metal belt) is removed, and when the system is electrified, the first metal sheet 3 (or the first metal belt) and the second metal sheet 4 (or the second metal belt) are disconnected, so that the test work in the stage can be completed. Please refer to fig. 3.
In the embodiment, the zero-ohm resistor 6 is realized by using the metal sheet and the soldering tin, so that a circuit board design engineer does not need to check and modify the design content of the multilayer circuit board again, the chance of error change is reduced, and the test time is saved.
The above embodiments are only exemplary embodiments of the present application, and are not intended to limit the present application, and the protection scope of the present application is defined by the claims. Various modifications and equivalents may be made by those skilled in the art within the spirit and scope of the present application and such modifications and equivalents should also be considered to be within the scope of the present application.
Claims (6)
1. A circuit structure of a printed circuit board, the printed circuit board comprising: the connecting conductor, the first metal sheet, the second metal sheet, and the first bonding pad and the second bonding pad which are not connected; the first bonding pad is connected with the first end of the first metal sheet; the second bonding pad is connected with the first end of the second metal sheet; a preset spacing distance is kept between the first metal sheet and the second metal sheet; when applied to the first stage, the connecting conductor is detachably connected with the first metal sheet and the second metal sheet respectively to form zero ohm resistance between the first bonding pad and the second bonding pad; when the metal sheet is applied to the second stage, the connecting conductor is removed, and when the connecting conductor is electrified, the first metal sheet and the second metal sheet are disconnected.
2. The circuit structure of a printed circuit board according to claim 1, wherein the first metal sheet is a first metal strip; the second metal sheet is specifically a second metal strip.
3. The circuit structure of the printed circuit board as claimed in claim 2, wherein a predetermined spacing distance is maintained between the second end of the first metal strip and the second end of the second metal strip.
4. A circuit structure of a printed circuit board according to any one of claims 1 to 3, wherein the metal material of the first metal sheet or the second metal sheet is steel.
5. A circuit structure of a printed circuit board according to any one of claims 1 to 3, wherein the predetermined separation distance is controlled to a length ranging from 1 to 2 mils.
6. A circuit arrangement of a printed circuit board according to any of claims 1-3, characterized in that the connection conductor is solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921093215.7U CN210274688U (en) | 2019-07-12 | 2019-07-12 | Circuit structure of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921093215.7U CN210274688U (en) | 2019-07-12 | 2019-07-12 | Circuit structure of printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN210274688U true CN210274688U (en) | 2020-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921093215.7U Active CN210274688U (en) | 2019-07-12 | 2019-07-12 | Circuit structure of printed circuit board |
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| CN (1) | CN210274688U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114938568A (en) * | 2022-06-15 | 2022-08-23 | 昆山国显光电有限公司 | Circuit board structure and circuit testing method |
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2019
- 2019-07-12 CN CN201921093215.7U patent/CN210274688U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114938568A (en) * | 2022-06-15 | 2022-08-23 | 昆山国显光电有限公司 | Circuit board structure and circuit testing method |
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