CN210272423U - Ultraviolet light emitting element - Google Patents
Ultraviolet light emitting element Download PDFInfo
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- CN210272423U CN210272423U CN202020254054.1U CN202020254054U CN210272423U CN 210272423 U CN210272423 U CN 210272423U CN 202020254054 U CN202020254054 U CN 202020254054U CN 210272423 U CN210272423 U CN 210272423U
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Abstract
The utility model provides an ultraviolet light-emitting component, ultraviolet light-emitting component including the copper-clad ceramic substrate that has the box dam, be fixed in UV-LED chip in the middle of the copper-clad ceramic substrate with unsettled in the lens of UV-LED chip top, lens have the through-hole that runs through, the through-hole intussuseption is filled with the alloy, lens lower surface connection the alloy is equipped with first metal coating. The ultraviolet light-emitting element has a large light-emitting angle, high reliability and long service life, and can greatly improve the service performance of the UV-LED and realize real all-inorganic packaging due to no use of any organic matter.
Description
Technical Field
The utility model relates to a semiconductor field, especially ultraviolet light emitting component.
Background
In year 8 and 16 in 2017, the water guarantee convention officially takes effect, and the convention mandates that the country of treaty forbids the production and import and export of mercury-containing products (fluorescent lamps for general lighting use with mercury content of more than 5 mg) since 1/1 in 2020. The endorsement of the Water good convention and the incentive to take off the UV-LED market in various places around the world by acceleration, including various markets such as Japan, China, European Union, and the like, whether domestic or industrial traditional tubes need to be replaced by UV-LEDs.
The traditional UV-LED, namely an ultraviolet light emitting diode, is packaged by organic glue, and ultraviolet radiation emitted by a UV-LED chip can cause the yellow colloid and reduce the service life of a UV-LED packaging device.
In recent years, a technique such as so-called all-inorganic packaging or semi-inorganic packaging is used to package the UV-LED chip. Wherein the semi-inorganic package uses silicone or epoxy to adhere the quartz lens to the ceramic substrate. The all-inorganic packaging is mainly characterized in that metal is evaporated at the bottom of a quartz lens, and the lens is adhered to a ceramic substrate through materials such as tin paste or nano silver adhesive. Therefore, the problem of organic yellowing failure of organic matter cannot be completely avoided by using organic glue for semi-inorganic packaging. The solder paste or the nano-silver adhesive and other materials used for full inorganic packaging are inorganic substances after being cured, but the solder paste or the nano-silver adhesive and other materials are made by adding solder beads or silver particles into soldering flux, and in the packaging and curing stage, the soldering flux in the solder paste or the nano-silver adhesive cannot be prevented from volatilizing into a UV-LED cavity, so that organic substances in the cavity can be yellowed and decayed after being used for a long time, and are adhered to a lens in the cavity, so that the light transmittance of the lens is seriously reduced, and the using effect of the UV-LED is influenced.
Therefore, research and development of an ultraviolet light emitting device having high luminous efficiency, long life and strong reliability are required.
Disclosure of Invention
In order to solve the problem, the utility model provides an ultraviolet light-emitting component, ultraviolet light-emitting component including have the box dam cover the copper ceramic substrate, be fixed in cover the middle UV-LED chip of copper ceramic substrate and unsettled in the lens of UV-LED chip top, lens have the through-hole that runs through, the through-hole intussuseption is filled with the alloy, lens lower surface connection the alloy is equipped with first metal coating.
Preferably, the through hole is cylindrical or semi-cylindrical, and the diameter of the cross section of the through hole is 1-2 mm.
Preferably, the distance between the axis of the through hole and the outer side wall of the lens is 0-4.5 mm, and the distance between the through holes is 2-5 mm.
Preferably, the lens upper surface is provided with a second metal plating layer, and the second metal plating layer covers the through hole.
Preferably, the width of the second metal plating layer is greater than or equal to the diameter of the cross section of the through hole.
Preferably, the alloy is a kovar alloy, an invar alloy or a super invar alloy.
Preferably, the first metal plating layer is a quadrangular frustum pyramid with an isosceles trapezoid cross section.
Has the advantages that:
the utility model provides an ultraviolet light-emitting component gas tightness is good, the reliability is high, high light efficiency, size reduce, is fit for all kinds of small-size lamp pearl products, but the wide application has in the high-accuracy instrument, the equipment of strict limitation to service environment.
Drawings
FIG. 1 is a sectional view of an ultraviolet light-emitting element in example 1;
FIG. 2 is a top view of the lens of example 1;
FIG. 3 is a sectional view of an ultraviolet light-emitting element in example 2;
FIG. 4 is a top view of the lens of example 2;
FIG. 5 is a sectional view of an ultraviolet light-emitting element in example 3;
FIG. 6 is a sectional view of an ultraviolet light-emitting element in example 4;
1-a substrate; 2-UV-LED chip; 3-a lens; 4-a through hole; 5-first metal plating; 6-second metal plating; 101-a box dam; 102-bonding pads.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work all belong to the protection scope of the present invention.
Example 1
An ultraviolet light-emitting element is shown in figure 1, and comprises a copper-clad ceramic substrate 1, a UV-LED chip 2 fixed in the middle of the substrate 1 and a lens 3 suspended above the UV-LED chip 2, wherein the copper-clad ceramic substrate 1 is provided with a dam 101 and a bonding pad 102, and the UV-LED chip 2 is fixed on the bonding pad 102. As shown in fig. 2, the lens 3 is made of sapphire and has a semi-cylindrical through hole 4 therethrough, and the axis of the through hole is located on the outer sidewall of the lens 3, i.e. the axis of the through hole is 0mm away from the outer sidewall of the lens. The through hole 4 is filled with an alloy, which is kovar alloy with the trade name of 4J 29. The periphery of the lower surface of the lens 3 is provided with a rectangular frame of a first metal plating layer 5, and the periphery of the upper surface of the lens is provided with a rectangular frame of a second metal plating layer 6. The first metal plating layer 5 and the second metal plating layer 6 are electrically connected through the kovar alloy in the through hole 4. The first metal plating layer 5 comprises a kovar alloy layer with the thickness of 5 mu m and the mark of 4J29, a nickel layer with the thickness of 5 mu m and a gold layer with the width of 5mm from top to bottom; the second metal plating layer 6 comprises a 1 μm thick gold layer, a 5 μm nickel layer and a 10 μm kovar alloy layer of brand 4J29 from top to bottom, and has a width of 3 mm. The diameter of the cross section of the semi-cylindrical through hole 4 is 2mm, and the distance between the through holes 4 is 2 mm.
Example 2
An ultraviolet light-emitting element is shown in figure 3, and the ultraviolet light-emitting element is composed of a copper-clad ceramic substrate 1, a UV-LED chip 2 fixed in the middle of the substrate 1 and a lens 3 suspended above the UV-LED chip 2, wherein the copper-clad ceramic substrate 1 is provided with a dam 101 and a bonding pad 102, and the UV-LED chip 2 is fixed on the bonding pad 102. As shown in fig. 4, the lens 3 is made of sapphire and has cylindrical through holes 4 penetrating therethrough, and the pitch of the through holes 4 is 5 mm. The diameter of the cross section of the through hole 4 is 1mm, and the axial line of the through hole is 4.5mm away from the outer side wall of the lens 3. The through hole 4 is filled with an alloy, which is kovar alloy with the trade name of 4J 34. The periphery of the lower surface of the lens 3 is provided with a rectangular frame of a first metal plating layer 5, and the periphery of the upper surface of the lens is provided with a rectangular frame of a second metal plating layer 6. The first metal plating layer 5 and the second metal plating layer 6 are electrically connected through the kovar alloy in the through hole 4. The first metal plating layer 5 comprises a kovar alloy layer with the thickness of 10 mu m and the mark of 4J34, a nickel layer with the thickness of 3 mu m and a gold layer with the thickness of 1 mu m from top to bottom, and the width of the kovar alloy layer is 5 mm; the second metal plating layer 6 comprises a gold layer with a thickness of 0.3 μm, a kovar alloy layer with a mark of 5 μm and 4J34, and a nickel layer with a thickness of 3 μm from top to bottom, and the width is 5 mm.
Example 3
An ultraviolet light-emitting element is shown in figure 5, and the ultraviolet light-emitting element is composed of a copper-clad ceramic substrate 1, a UV-LED chip 2 fixed in the middle of the substrate 1 and a lens 3 suspended above the UV-LED chip 2, wherein the copper-clad ceramic substrate 1 is provided with a dam 101 and a bonding pad 102, and the UV-LED chip 2 is fixed on the bonding pad 102. The lens 3 is made of quartz glass and has through cylindrical through holes 4, the distance between the through holes 4 being 4 mm. The diameter of the cross section of the through hole 4 is 1.8mm, and the axial line of the through hole is 4.1mm away from the outer side wall of the lens 3. The through-hole 4 is filled with an alloy, which is invar alloy having a designation of 4J 36. The lower surface of the lens 3 is provided with a first metal plating layer 5, the upper surface is provided with a second metal plating layer, and the first metal plating layer 5 and the second metal plating layer 6 are electrically connected through the invar alloy in the through hole 4. The first metal plating layer 5 comprises an invar alloy layer with the thickness of 8 mu m and the mark of 4J36, a nickel layer with the thickness of 5 mu m and a gold layer with the thickness of 1 mu m from top to bottom, the widths of the invar alloy layer, the nickel layer and the gold layer are all 1.4mm, and the invar alloy layer just covers the through hole. The second metal coating comprises a gold layer with the thickness of 3 mu m, an invar alloy layer with the mark of 5 mu m of 4J36 and a nickel layer with the width of 5 mu m from top to bottom.
Example 4
An ultraviolet light-emitting element is shown in fig. 6, and the ultraviolet light-emitting element is composed of a copper-clad ceramic substrate 1, a UV-LED chip 2 fixed in the middle of the substrate 1 and a lens 3 suspended above the UV-LED chip 2, wherein the copper-clad ceramic substrate 1 is provided with a dam 101 and a bonding pad 102, and the UV-LED chip 2 is fixed on the bonding pad 102. The lens 3 is made of quartz glass and has cylindrical through holes 4 extending therethrough, the pitch of the through holes 4 being 3 mm. The diameter of the cross section of the through hole 4 is 2mm, and the axial line of the through hole is 2.5mm away from the side wall of the lens 3. The through hole 4 is filled with alloy, the alloy is super invar alloy with the mark number of 4J32, the lower surface of the lens 3 is provided with a first metal coating, the upper surface of the lens is provided with a second metal coating, and the first metal coating and the second metal coating are electrically connected through the super invar alloy in the through hole. The first metal plating layer comprises a super invar alloy layer with the thickness of 10 mu m and the mark number of 4J32, a nickel layer with the thickness of 3 mu m and a gold layer with the thickness of 1 mu m from top to bottom, the first metal plating layer is a quadrangular frustum with an isosceles trapezoid cross section, and the top surface of the first metal plating layer just covers the through hole. The second metal coating comprises a gold layer with the thickness of 3 mu m, a super invar alloy layer with the mark of 5 mu m of 4J32 and a nickel layer with the width of 5 mu m from top to bottom, the width of the second metal coating is 2mm, and the second metal coating just covers the through hole.
Through ingenious design lens structure, do metal coating and the metal in the through-hole on the lens surface and realize electric connection, make the utility model discloses an ultraviolet light emitting component is applicable to resistance welding technology, has reduced the inseparable combination degree of difficulty of lens and base plate, and this ultraviolet light emitting component gas tightness is good, the reliability is high, but the wide application has in the high-accuracy instrument, the equipment of strict limit to service environment. Because this structure does not need additionally to use the metal frame, has simplified the combination problem between metal frame and the lens then, and ultraviolet component size reduces, is fit for all kinds of small and medium-sized lamp pearl products. Meanwhile, because a metal outer frame is not needed, the light emitting angle of the ultraviolet light emitting element is increased, and the light efficiency can be improved to a certain extent. No organic matter is used, the service performance and the service life of the ultraviolet light-emitting element are greatly improved, and the real all-inorganic packaging is realized.
The above-mentioned embodiments only express the embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (7)
1. The ultraviolet light-emitting element is characterized by comprising a copper-clad ceramic substrate with a box dam, a UV-LED chip fixed in the middle of the copper-clad ceramic substrate and a lens suspended above the UV-LED chip, wherein the lens is provided with a through hole, an alloy is filled in the through hole, and a first metal coating is arranged on the lower surface of the lens and connected with the alloy.
2. The UV light emitting element according to claim 1, wherein the through hole has a cylindrical or semi-cylindrical shape, and a cross-sectional diameter of the through hole is 1-2 mm.
3. The UV emitting device of claim 2, wherein the distance between the axis of the through holes and the outer sidewall of the lens is 0-4.5 mm, and the distance between the through holes is 2-5 mm.
4. The uv emitting element according to claim 1, wherein the lens upper surface is provided with a second metal plating layer, and the second metal plating layer covers the through hole.
5. The UV-LED element according to claim 4, wherein the width of the second metal plating layer is greater than or equal to the cross-sectional diameter of the through-hole.
6. The uv emitting element according to claim 1, wherein the alloy is kovar, invar or super invar.
7. The uv-luminescent element according to claim 1, wherein the first metal plating layer is a quadrangular frustum pyramid having an isosceles trapezoid cross section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020254054.1U CN210272423U (en) | 2020-03-05 | 2020-03-05 | Ultraviolet light emitting element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020254054.1U CN210272423U (en) | 2020-03-05 | 2020-03-05 | Ultraviolet light emitting element |
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| CN210272423U true CN210272423U (en) | 2020-04-07 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111162154A (en) * | 2020-03-05 | 2020-05-15 | 华引芯（武汉）科技有限公司 | Ultraviolet light-emitting element and all-inorganic packaging method |
| CN111477733A (en) * | 2020-04-26 | 2020-07-31 | 深圳市环基实业有限公司 | Chip packaging method |
-
2020
- 2020-03-05 CN CN202020254054.1U patent/CN210272423U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111162154A (en) * | 2020-03-05 | 2020-05-15 | 华引芯（武汉）科技有限公司 | Ultraviolet light-emitting element and all-inorganic packaging method |
| CN111162154B (en) * | 2020-03-05 | 2020-12-04 | 华引芯（武汉）科技有限公司 | Ultraviolet light-emitting element and all-inorganic packaging method |
| CN111477733A (en) * | 2020-04-26 | 2020-07-31 | 深圳市环基实业有限公司 | Chip packaging method |
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