CN210230372U - Automatic chip mounter - Google Patents

Automatic chip mounter Download PDF

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Publication number
CN210230372U
CN210230372U CN201920550342.9U CN201920550342U CN210230372U CN 210230372 U CN210230372 U CN 210230372U CN 201920550342 U CN201920550342 U CN 201920550342U CN 210230372 U CN210230372 U CN 210230372U
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China
Prior art keywords
unit
patch
glue
conveying
plate
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Application number
CN201920550342.9U
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Chinese (zh)
Inventor
Xinxin Ding
丁欣欣
Zecheng Ding
丁泽成
Wenguang Wang
王文广
Dongshan Zhou
周东珊
Zhendong Hong
洪振东
Cheng Zhong
钟诚
Xiaofeng Zheng
郑晓峰
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Zhejiang Yasha Decoration Co Ltd
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Zhejiang Yasha Decoration Co Ltd
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Priority to CN201920550342.9U priority Critical patent/CN210230372U/en
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Abstract

The utility model discloses an automatic chip mounter, which comprises a frame, and a glue spraying unit and a chip mounting unit which are arranged on the frame, wherein the frame is also provided with a conveying unit and a feeding unit; the conveying unit conveys the plates to the positions below the glue spraying unit and the patch unit in sequence; the feeding unit arranges the patch bases in order and conveys the patch bases to the patch unit; the glue spraying unit sprays glue at the patch position of the plate; the patch unit grabs the patch base and presses and pastes the patch base on the position of the patch sprayed with the glue. The conveying unit realizes automatic conveying of the plate, the feeding unit realizes automatic alignment and feeding of the patch base, the glue spraying unit and the patch unit spray glue and patches to the designated positions of the plate according to set working procedures, manual feeding and discharging are not needed, glue spraying positions are accurate, and automatic patch mounting in a flow line mode is achieved, and working efficiency is high.

Description

Automatic chip mounter
Technical Field
The utility model relates to a house ornamentation material technical field especially relates to an automatic chip mounter.
Background
In the field of home decoration, a ceiling board is arranged on a top plate through a keel, the board is connected with the keel through a mounting patch base, and the patch base is uniformly adhered to the board; therefore, before the plate is installed, the plate needs to be installed with the patch base.
The chip mounter of present mounting base belongs to semi-automatic chip mounter, adopts artifical unloading, glues at the bottom of paster base through the frock is automatic, fixes a position the paster base through adjustable stop device on panel, later absorbs the paster base with the location frock that has magnetism and places. The chip mounter needs manual feeding and discharging, the position of a chip is inaccurate, the material taking speed is too low, the requirement of the efficiency of the chip can not be met, the working efficiency is low, and the construction period is long and not beneficial to the construction of front and back processes.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the not enough of prior art, provide an automatic unloading, high just efficient automatic chip mounter of paster precision on the automation.
The technical scheme of the utility model provides an automatic chip mounter, which comprises a rack, and a glue spraying unit and a chip mounting unit which are arranged on the rack, wherein a conveying unit and a feeding unit are also arranged on the rack;
the conveying unit conveys the plates to the positions below the glue spraying unit and the patch unit in sequence;
the feeding unit arranges the patch bases in order and conveys the patch bases to the patch unit;
the glue spraying unit sprays glue at the patch position of the plate;
the patch unit grabs the patch base and presses and attaches the patch base to the position of the patch sprayed with the glue.
Further, the conveying unit comprises a conveying table and a positioning piece;
the conveying table is provided with rotating rollers which are sequentially arranged and used for conveying the plates;
the positioning piece is arranged at the entrance end of the conveying table and used for positioning the transverse position of the plate on the conveying table.
Furthermore, a positioning shaft is further arranged on the conveying table and used for positioning the first row of patch positions of the plate.
Further, the feeding unit comprises a vibration disc and a feeding groove;
one end of the feeding groove is connected with the vibration disc, and the other end of the feeding groove is arranged on one side of the conveying unit;
arranging the patch bases in the vibration disc to the feeding chute in the same direction along with the vibration of the vibration disc.
Furthermore, the paster base is rectangular, and the width of one end of the feeding groove connected with the vibration disc is larger than the shortest side of the paster base and smaller than the longest side of the paster base.
Furthermore, the chip mounting unit comprises a plurality of manipulators and a plurality of chip mounting pressing disks;
the manipulator drives the patch pressing disc to suck and press the patch base on the plate.
Furthermore, one manipulator is connected with at least one patch pressing disc;
the paster pressure disk pass through the connecting axle connect in manipulator below, the paster pressure disk can wind connecting axle horizontal rotation 90 degrees.
Furthermore, the patch unit further comprises a plurality of first guide rails, and one manipulator corresponds to one first guide rail;
the first guide rails are perpendicular to the conveying direction of the conveying unit, and the manipulator moves along the first guide rails.
Furthermore, a plurality of the mechanical arms are distributed on two sides of the conveying unit, and the distance between the adjacent mechanical arms is adjustable.
Further, the glue spraying unit comprises a glue melting machine, a glue spraying machine and a second guide rail;
the glue spraying machine sprays glue at the position of a patch on the plate, and the glue melting machine is used for storing the glue and supplying the glue to the glue spraying machine;
the second guide rail is perpendicular to the conveying direction of the conveying unit and used for guiding the glue sprayer.
Furthermore, the glue spraying unit comprises at least one glue spraying machine, one glue spraying machine corresponds to one second guide rail, and the distance between every two adjacent glue spraying machines is adjustable.
After adopting above-mentioned technical scheme, have following beneficial effect: the conveying unit of the automatic chip mounter realizes automatic conveying of plates, the feeding unit realizes automatic alignment and feeding of the chip mounting base, the glue spraying unit and the chip mounting unit spray glue and chips at specified positions of the plates according to set working procedures, manual feeding and discharging are not needed, glue spraying positions are accurate, and the automatic chip mounting is achieved in the form of a production line, and the work efficiency is high.
Drawings
The disclosure of the present invention will become more readily understood by reference to the drawings. It should be understood that: these drawings are for illustrative purposes only and are not intended to limit the scope of the present disclosure. In the figure:
fig. 1 is a top view of an automatic placement machine according to an embodiment of the present invention;
fig. 2 is a schematic view of a mounting unit of an automatic mounter according to an embodiment of the present invention;
fig. 3 is a schematic view of a base with a patch adhered to a sheet of material.
Reference symbol comparison table:
the glue spraying unit 01, the glue melting machine 11, the glue spraying machine 12, the second guide rail 13 and the guide pipe 14;
the device comprises a chip mounting unit 02, a manipulator 21, a chip mounting pressure plate 22, a first guide rail 23 and a connecting shaft 24;
a conveying unit 03, a conveying table 31, a rotating roller 311 and a positioning member 32;
the feeding unit 04, the vibration disc 41, the feeding groove 42, the first linear groove 421 and the second linear groove 422;
plate 05, patch base 06.
Detailed Description
The following describes the present invention with reference to the accompanying drawings.
It is easily understood that, according to the technical solution of the present invention, a plurality of structural modes and implementation modes that can be mutually replaced by those of ordinary skill in the art can be achieved without changing the spirit of the present invention. Therefore, the following detailed description and the accompanying drawings are only exemplary illustrations of the technical solutions of the present invention, and should not be construed as limiting or restricting the technical solutions of the present invention in its entirety or as a limitation of the present invention.
The terms of orientation of up, down, left, right, front, back, top, bottom, and the like referred to or may be referred to in this specification are defined relative to the configuration shown in the drawings, and are relative terms, and thus may be changed correspondingly according to the position and the use state of the device. Therefore, these and other directional terms should not be construed as limiting terms.
The automatic chip mounter in the embodiment is used for uniformly pasting the chip bases 06 on the board 05, as shown in fig. 3, the chip bases 06 on the board 05 are arranged in a row-column arrangement manner, a plurality of rows of chip rows H are pasted along the length direction of the board 05, the chip rows H are arranged along the width direction of the board 05, the row spacing d between each row of chip rows H is the same, 3 chip bases 06 are pasted on each row of chip rows H, and the distances between every two adjacent chip bases 06 are the same;
as shown in fig. 1, the automatic chip mounter includes a frame, and a glue spraying unit 01 and a chip mounting unit 02 which are arranged on the frame, and the frame is further provided with a conveying unit 03 and a feeding unit 04;
the conveying unit 03 conveys the plate 05 to the lower parts of the glue spraying unit 01 and the patch unit 02 in sequence;
the feeding unit 04 arranges the chip bases 06 in order and conveys the chip bases to the chip unit 02;
the glue spraying unit 01 sprays glue at the patch position of the plate 05;
the patch unit 02 picks the patch base 06 and presses the patch position on which the adhesive has been sprayed.
Specifically, the plate 05 is placed on the conveying unit 03 for conveying, the glue spraying unit 01 and the patch unit 02 are sequentially arranged above the conveying unit 03 along the conveying direction of the plate 05 (from left to right in fig. 1, namely the length direction of the plate 05), and the feeding units 04 are arranged on two sides of the patch unit 02, namely two sides of the conveying unit 03; under the conveying of conveying unit 03, panel 05 is in proper order through spouting gluey unit 01 and paster unit 02 below, spouts gluey unit 01 according to setting for the procedure, spouts gluey in the paster position, later when should spout gluey paster position conveying to paster unit 02 below, paster unit 02 absorbs paster base 06 on the feed unit 04 and accurately presses according to setting for the procedure and pastes on the paster position.
The conveying unit 03 firstly conveys the first area of the plate 05 to the position below the glue spraying unit 01 and then stops, the glue spraying unit 01 sprays glue to all the patch positions in the first area, then the conveying unit 03 continues to convey a certain distance (the distance is a multiple of the line spacing d and is twice in the embodiment), the conveying is stopped after the first area is conveyed to the position below the patch unit 02, the second area behind the first area is located below the glue spraying unit 01 at the moment, the glue spraying unit 01 sprays glue to the second area, meanwhile, the patch unit 02 carries out patch mounting on the first area, after the patch mounting of the first area and the glue spraying of the second area are finished, the conveying unit 03 continues to be started, the plate 05 continues to be conveyed forwards by the same distance, and the operation is sequentially circulated until the patch mounting of the whole plate 05 is finished. In this embodiment the first region and the second region of panel 05 are provided with two rows of paster rows, spout gluey unit 01 promptly and spout gluey to two rows of paster rows simultaneously, and paster unit 02 also carries out the paster to two rows of paster rows simultaneously.
Further, the conveying unit 03 includes a transfer table 31 and a positioning member 32;
the conveying table 31 is provided with rotating rollers 311 which are arranged in sequence and used for conveying the plate 05;
the positioning member 32 is disposed at an entrance end of the conveying table 31, and is used for positioning a transverse position of the plate 05 on the conveying table 31.
Specifically, the rollers 311 are arranged in parallel on the conveying table 31, and when the plate 05 is conveyed, all the rollers 311 rotate at the same rotation direction and rotation speed, so that the plate 05 is conveyed in a direction perpendicular to the rollers 311; in order to ensure the accurate position of the plate 05, the positioning part 32 is arranged at the entrance end (left side in fig. 1) of the conveying table 31, a notch (not shown in the figure) is formed in the positioning part 32, and after the plate 05 passes through the positioning part 32, the position of the plate 05 is adjusted through the notch, so that the central line in the length direction of the plate 05 coincides with the central axis L of the conveying table 31.
Furthermore, a positioning shaft (not shown, the positioning shaft is covered by a plate in fig. 1) is disposed on the conveying table 31, and the positioning shaft positions the first row of patches on the plate 05.
Specifically, the positioning shaft is arranged in parallel to the rotating roller 311, when the plate 05 does not enter the position below the glue spraying unit 01, the positioning shaft protrudes from the conveying table 31, when the plate 05 is conveyed to contact with the positioning shaft, the rotating roller 311 stops conveying, at the moment, the first row of patch rows is just positioned below the glue spraying unit 01, and meanwhile, the positioning shaft sinks below the conveying table 31; and after the glue spraying is finished, the conveying is continued, and the plate 05 is automatically stopped after the advancing distance is judged according to the rotating speed of the rotating roller 311.
Further, the feeding unit 04 comprises a vibration disc 41 and a feeding groove 42;
one end of the feeding groove 42 is connected with the vibration disc 41, and the other end of the feeding groove 42 is arranged on one side of the conveying unit 03;
the patch bases 06 in the vibration disc 41 are aligned in the same orientation to the feed chute 42 with the vibration of the vibration disc 41.
Specifically, vibrations dish 41 shakes in succession, make the random action of paster base 06 in vibrations dish 41, because paster base 06 is the rectangle, and the width that feed chute 42 connects vibrations dish 41 one end sets up to be greater than the minor face of paster base 06 and be less than the long limit of paster base 06, along with the motion of paster base 06 in vibrations dish 41, only the minor face of paster base 06 can get into in the feed chute 42, convey to the one side of conveying unit 03 along the feed chute 42, then accomplished the range to paster base 06.
Furthermore, the height of the vibration plate 41 is higher than that of the feed chute 42, and the height of the feed chute 42 is gradually reduced from the vibration plate 41 to the same height as the conveying table 31, so that the conveying of the chip base 06 is facilitated.
In this embodiment, the vibration plate 41 is circular, the feeding channel 42 includes a first linear channel 421 and a second linear channel 422 which are perpendicular to each other, wherein the first linear channel 421 is connected to the vibration plate 41, the second linear channel 422 is perpendicular to the conveying direction of the plate 05, the width of the second linear channel 422 is larger than the long side of the chip base 06, when the chip base 06 is conveyed to a right angle, the chip base 06 slides down into the second linear channel 422, and at this time, the long side of the chip base 06 is parallel to the conveying direction of the plate 05.
Further, referring to fig. 1 and 2, the patch unit 02 includes a plurality of manipulators 21 and a plurality of patch pressing disks 22, and the manipulators 21 drive the patch pressing disks 22 to suck and press the patch base 06 on the plate 05;
specifically, the second linear groove 422 of the feeding unit 04 and the patch row are located on the same straight line, the manipulator 21 moves in a direction parallel to the rotating roller 311, the patch base 06 is sucked from the second linear groove 422 and then moves onto the plate 05, the patch platen 22 is located above the patch position, then the patch platen 22 descends, the patch base 06 is attached to the plate 05 and is subjected to static pressure for 1-2 seconds, and then the patch platen 22 releases the patch base 06 and resets.
Further, a plurality of manipulators 21 are distributed on both sides of the conveying unit 03, and the distance between adjacent manipulators 21 is adjustable.
In the present embodiment, two pairs of four robots 21 are provided, each pair including two robots 21a and 21b, respectively located on both sides of the conveying unit 03, and the robot 21a and the robot 21b are disposed on the same line to perform the mounting on the mount base 06 on the same mounting row. Since 3 chip bases 06 are provided for each row of chip rows in this embodiment, the robot 21a is connected to two chip platens 22, and the robot 21b is connected to one chip platen 22, so that the robot 21a can simultaneously press and stick two chip bases 06. Accordingly, 4 feeding units 04 are required, and each manipulator 21 corresponds to one feeding unit 04.
It should be noted that the number of the patch pressing plates 22 on the manipulator 21 and the distance between the patch pressing plates 22 may be set according to the number of patches in the patch row and the distribution of the patches; in addition, the spacing between adjacent robots 21 can also be adjusted to accommodate the row spacing of the rows of patches on the sheet 05.
In this embodiment, the patch unit 02 further includes a plurality of first guide rails 23, and one manipulator 21 corresponds to one first guide rail 23, and the manipulator 21 moves along the first guide rail 23 to guide the manipulator 21; the first guide rails 23 are perpendicular to the conveying direction of the conveying unit 03, arranged above the conveying table 31 and extending above the feeding unit 04; when adjusting the distance between the manipulators 21, it is only necessary to adjust the distance between the first guide rails 23.
Further, the chip mounting platen 22 is connected below the robot 21 by a connecting shaft 24, and the chip mounting platen 22 can horizontally rotate by 90 degrees around the connecting shaft 24; because the installation of the part of the chip base 06 on the plate 05 needs to rotate 90 degrees during chip mounting, for the part of the chip base 06, the chip pressing disc 22 automatically rotates 90 degrees horizontally around the connecting shaft 24 after being sucked, and then is pressed and mounted.
Further, the glue spraying unit 01 comprises a glue melting machine 11, a glue spraying machine 12 and a second guide rail 13;
the glue spraying machine 12 sprays glue at the position of a patch on the plate 05, and the glue melting machine 11 is used for storing the glue and supplying the glue to the glue spraying machine 12;
the second guide rail 13 is perpendicular to the conveying direction of the conveying unit 03 and is used for guiding the glue sprayer 12.
Specifically, the glue sprayer 12 is connected with the glue melting machine 11 through a guide pipe 14, glue flows to the glue sprayer 12 through the guide pipe 14, the glue sprayer 12 moves along the second guide rail 13, and glue is sprayed to the positions of the patches on the patch rows below the glue sprayer in sequence according to a set program.
Furthermore, the glue spraying unit 01 comprises at least one glue spraying machine 12, one glue spraying machine 12 corresponds to one second guide rail 13, and the distance between the adjacent glue spraying machines 12 is adjustable.
In the embodiment, two glue spraying machines 12 are provided, one glue spraying machine 12 is installed on one second guide rail 13, and glue is sprayed to two rows of patch rows at the same time; and, similarly to the patch unit 02, the line pitch between the patch rows can be adjusted by adjusting the pitch of the second guide rail 13.
The automatic chip mounter of this embodiment has the automatic function of unloading, the automatic paster of assembly line of going up, and the location is accurate, and the paster is quick, can carry out the panel paster high-efficiently fast.
What has been described above is merely the principles and preferred embodiments of the present invention. It should be noted that, for those skilled in the art, on the basis of the principle of the present invention, several other modifications can be made, and the protection scope of the present invention should be considered.

Claims (11)

1. An automatic chip mounter comprises a rack, and a glue spraying unit and a chip mounting unit which are arranged on the rack, and is characterized in that a conveying unit and a feeding unit are further arranged on the rack;
the conveying unit conveys the plates to the positions below the glue spraying unit and the patch unit in sequence;
the feeding unit arranges the patch bases in order and conveys the patch bases to the patch unit;
the glue spraying unit sprays glue at the patch position of the plate;
the patch unit grabs the patch base and presses and attaches the patch base to the position of the patch sprayed with the glue.
2. The automatic placement machine according to claim 1, wherein the conveying unit includes a transfer table and a positioning member;
the conveying table is provided with rotating rollers which are sequentially arranged and used for conveying the plates;
the positioning piece is arranged at the entrance end of the conveying table and used for positioning the transverse position of the plate on the conveying table.
3. The automatic placement machine according to claim 2, wherein a positioning shaft is further disposed on the transport table, and the positioning shaft positions the first row of placement positions of the board.
4. The automatic placement machine according to claim 1, wherein the feeding unit includes a vibration plate and a feeding chute;
one end of the feeding groove is connected with the vibration disc, and the other end of the feeding groove is arranged on one side of the conveying unit;
arranging the patch bases in the vibration disc to the feeding chute in the same direction along with the vibration of the vibration disc.
5. The automatic placement machine according to claim 4, wherein said placement base is rectangular, and a width of an end of said feed chute connected to said vibration plate is larger than a shortest side of said placement base and smaller than a longest side of said placement base.
6. The automatic placement machine according to claim 1, wherein said placement unit comprises a plurality of robots and a plurality of placement platens;
the manipulator drives the patch pressing disc to suck and press the patch base on the plate.
7. The automatic placement machine according to claim 6, wherein one of said robots is connected to at least one of said placement platens;
the paster pressure disk pass through the connecting axle connect in manipulator below, the paster pressure disk can wind connecting axle horizontal rotation 90 degrees.
8. The automatic placement machine according to claim 6, wherein said placement unit further comprises a plurality of first guide rails, one said robot corresponding to one said first guide rail;
the first guide rails are perpendicular to the conveying direction of the conveying unit, and the manipulator moves along the first guide rails.
9. The automatic placement machine according to claim 6, wherein a plurality of said manipulators are distributed on both sides of said conveying unit, and a distance between adjacent said manipulators is adjustable.
10. The automatic placement machine according to claim 1, wherein the glue-spraying unit includes a glue melting machine, a glue spraying machine, and a second guide rail;
the glue spraying machine sprays glue at the position of a patch on the plate, and the glue melting machine is used for storing the glue and supplying the glue to the glue spraying machine;
the second guide rail is perpendicular to the conveying direction of the conveying unit and used for guiding the glue sprayer.
11. The automatic placement machine according to claim 10, wherein said glue-spraying unit includes at least one said glue-spraying machine, and one said glue-spraying machine corresponds to one said second guide rail, and a distance between adjacent said glue-spraying machines is adjustable.
CN201920550342.9U 2019-04-22 2019-04-22 Automatic chip mounter Active CN210230372U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920550342.9U CN210230372U (en) 2019-04-22 2019-04-22 Automatic chip mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920550342.9U CN210230372U (en) 2019-04-22 2019-04-22 Automatic chip mounter

Publications (1)

Publication Number Publication Date
CN210230372U true CN210230372U (en) 2020-04-03

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Application Number Title Priority Date Filing Date
CN201920550342.9U Active CN210230372U (en) 2019-04-22 2019-04-22 Automatic chip mounter

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110142167A (en) * 2019-04-22 2019-08-20 浙江亚厦装饰股份有限公司 Automatic placement machine and automatic chip mounting method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110142167A (en) * 2019-04-22 2019-08-20 浙江亚厦装饰股份有限公司 Automatic placement machine and automatic chip mounting method

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