CN210223931U - Fuse heat radiation structure and power electronic equipment - Google Patents

Abstract

The application discloses a fuse heat dissipation structure and power electronic equipment, wherein the fuse heat dissipation structure comprises a radiator, a conductive bar and a fuse; the conductive bar is disposed between the heat sink and the fuse; the fuse includes at least one mounting face; the radiator and the conductive bar are fixed on the mounting surface. The radiator is arranged on the conductive bar, and the conductive bar is fixed on the fuse; the heat dissipation of the fuse is realized, compared with the heat dissipation scheme of the existing fuse, the fuse does not need to be placed in an airtight air duct, the thickened conductive bar does not need to be increased, the heat dissipation effect is obvious, and the cost is low.

Description

Fuse heat radiation structure and power electronic equipment

Technical Field

The application relates to the technical field of power electronics, in particular to a fuse heat dissipation structure and power electronic equipment.

Background

With the rapid development of the industry, the application of large-scale power electronic equipment in various industries is more and more extensive, the power level is higher and higher, the requirement on the volume of the equipment is higher and higher, meanwhile, the equipment installation environment is also worse and worse, and higher requirements are provided for the environmental adaptability of the equipment.

The power electronic equipment generates a large amount of heat in the operation process, the temperature of a device is one of important factors limiting the service life of power electronics, and the higher the temperature of the device is, the shorter the service life is. Therefore, the design of the heat dissipation system of the electrical cabinet equipment becomes a bottleneck problem in the development of the power electronic equipment.

Power electronics semiconductor device heat capacity is little, must have the quick-change fuse protection under the fault condition, and quick-change fuse has the similar thermal property with semiconductor device, can produce certain loss in the course of the work itself, if this partial loss can not be dissipated away, the temperature that will lead to the fuse body constantly risees, the loss that produces until loss and fuse itself that the fuse derived reaches the equilibrium, along with fuse surface temperature's rising, fuse surface copper bar overlap joint can be by the oxidation, lead to contact resistance further rising, the loss further increases, form vicious circle, burn out until the fuse. The temperature of the fuse surface must be controlled within a suitable range.

The heat dissipation scheme of current fuse mainly has 3: the scheme is that the fuse protector is placed at an air outlet of a fan, and forced heat exchange is carried out on the fuse protector by airflow formed by driving the fan directly; the second scheme is that the conductive bar connected with the thickened fuse is increased so as to conduct away the heat of the fuse; scheme three is a combination of scheme one and scheme two.

The first problem of the scheme is that the whole fuse is required to be placed in a closed air duct to ensure the peripheral air quantity of the fuse, or a fan is required to be installed near the fuse. However, the fuse is used as a protection device of the circuit, the maintenance frequency is very high, and the peripheral space of the fuse is required to be large so as to ensure convenient and fast maintenance. If the fuse is placed in a closed air duct, maintenance work will be very difficult. If the fan is installed at the accessory of the fuse, not only the material cost of the fan and the newly added control logic are increased, but also part of the maintenance space of the fuse is occupied, and the maintenance difficulty is increased. Since the fan is a vulnerable device, the maintenance frequency is high, and the addition of the fan is undoubtedly a fault risk point and the maintenance workload of the system.

The second scheme has the problem that the second scheme is essentially to conduct and dissipate the heat of the fuse from the conductive bar, and is not ideal in practical application because of the following reasons: 1. the material price of the conductive bar is high, and the cost of the conductive bar is greatly increased by enlarging and thickening the conductive bar; 2. a plurality of fuses are generally arranged in parallel in a high-power cabinet, the mutual distance is not large, the safety rule can be reduced by increasing the conductive bars, and partial wind can be blocked from blowing from the surfaces of the fuses. 3. Although the safety regulation is not directly influenced by thickening the conductive bar, the increase of the heat dissipation surface area of the conductive bar is limited, so that the heat dissipation effect of the fuse is not obvious.

SUMMERY OF THE UTILITY MODEL

In view of this, an object of the present application is to provide a fuse heat dissipation structure and a power electronic device, so as to solve the problems of the existing fuse heat dissipation schemes.

The technical scheme adopted by the application for solving the technical problems is as follows:

according to an aspect of the present application, there is provided a fuse heat dissipation structure, including a heat sink, a conductive bar, and a fuse;

the conductive bar is disposed between the heat sink and the fuse;

the fuse includes at least one mounting face;

the radiator and the conductive bar are fixed on the mounting surface.

In one possible embodiment, the fuse heat dissipation structure further comprises a heat sink mounting plate;

the heat sink mounting plate is arranged between the heat sink and the conductive bar; the radiator is fixed on the radiator mounting plate; the radiator mounting plate and the conductive bar are fixed on the mounting surface of the fuse.

In one possible embodiment, the heat sink comprises a first heat sink and a second heat sink; the conductive bars comprise a first conductive bar and a second conductive bar; the fuse comprises a first mounting surface and a second mounting surface;

the first conductive bar is arranged between the first radiator and the first mounting surface;

the second conductive bar is arranged between the second radiator and the second mounting surface;

the first radiator and the first conductive bar are fixed on the first mounting surface, and the second radiator and the second conductive bar are fixed on the second mounting surface.

According to another aspect of the present application, there is provided a power electronic device including the fuse heat dissipation structure described above.

According to the fuse heat dissipation structure and the power electronic equipment, the radiator is arranged on the conductive bar, and the conductive bar is fixed on the fuse; the heat dissipation of the fuse is realized, compared with the heat dissipation scheme of the existing fuse, the fuse does not need to be placed in an airtight air duct, the thickened conductive bar does not need to be increased, the heat dissipation effect is obvious, and the cost is low.

Drawings

Fig. 1 is a schematic view of a heat dissipation structure of a fuse according to an embodiment of the present application;

FIG. 2 is an exploded view of the heat dissipation structure of the fuse shown in FIG. 1;

FIG. 3 is a schematic diagram of another heat dissipation structure of a fuse according to an embodiment of the present disclosure;

fig. 4 is an exploded view of the heat dissipation structure of the fuse shown in fig. 3.

The implementation, functional features and advantages of the objectives of the present application will be further explained with reference to the accompanying drawings.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer and clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

First embodiment

As shown in fig. 1 and 2, the first embodiment of the present application provides a fuse heat dissipation structure including a fuse 11, a conductive bar 121, a conductive bar 122, a heat sink 131, a heat sink 132, a mounting screw 141, and a mounting screw 142.

In the present embodiment, the fuse 11 includes a mounting surface a and a mounting surface B.

Wherein the conductive bar 121 is disposed between the heat sink 131 and a mounting surface B of the fuse 11; the conductive bar 122 is disposed between the heat sink 132 and the mounting surface a of the fuse 11;

the heat sink 131 and the conductive bar 121 are fixed on the mounting surface B by the mounting screw 141; the heat sink 132 and the conductive bar 122 are fixed on the mounting surface a by the mounting screws 142.

When the fuse heat dissipation structure is removed, the mounting screws 141 and 142 are removed, and then the heat sink 131, the heat sink 132, the conductive bar 121, the conductive bar 122, and the fuse 11 are removed.

In other embodiments, it is also possible to provide the fuse with only the mounting surface a or the mounting surface B. Correspondingly, when only the mounting surface a is provided, the heat sink 132 and the conductive bar 122 are fixed on the mounting surface a by the mounting screws 142; alternatively, when only the mounting surface B is provided, the heat sink 131 and the conductive bar 121 are fixed to the mounting surface B by the mounting screws 141.

According to the fuse heat dissipation structure, the heat radiator is arranged on the conductive bar, and the conductive bar is fixed on the fuse; the heat dissipation of the fuse is realized, compared with the heat dissipation scheme of the existing fuse, the fuse does not need to be placed in an airtight air duct, the thickened conductive bar does not need to be increased, the heat dissipation effect is obvious, and the cost is low.

Second embodiment

As shown in fig. 3 and 4, the second embodiment of the present application provides another fuse heat dissipation structure, which includes a fuse 11, a conductive bar 121, a conductive bar 122, a heat sink mounting plate 211, a heat sink mounting plate 212, a heat sink 131, a heat sink 132, first fuse mounting screws (not shown in the drawings), second fuse mounting screws 222, and mounting screws 231, 232.

In the present embodiment, the fuse 11 also includes a mounting surface a and a mounting surface B.

Wherein the conductive bar 121 is disposed between the heat sink mounting plate 211 and the mounting surface B of the fuse 11; the conductive bar 122 is disposed between the heat sink mounting plate 212 and the mounting surface a of the fuse 11;

the heat sink 131 is fixed on the heat sink mounting plate 211 by mounting screws 231, and the heat sink 132 is fixed on the heat sink mounting plate 212 by mounting screws 232;

the heat sink mounting plate 211 and the conductive bar 121 are fixed on the mounting surface B by a first fuse mounting screw; the heat sink mounting plate 212 and the conductive bar 122 are fixed to the mounting surface a by second fuse mounting screws 222.

When the fuse heat dissipation structure is removed, the mounting screws 231 and 232 are removed, then the heat sink 131 and the heat sink 132 are removed, then the first fuse mounting screws and the second fuse mounting screws 222 are removed, and finally the heat sink mounting plate 211, the heat sink mounting plate 212, the conductive bar 121, the conductive bar 122 and the fuse 11 are removed.

Similar to the previous embodiment, in other embodiments, it is also possible to provide the fuse with only the mounting surface a or the mounting surface B.

According to the fuse heat dissipation structure, the heat radiator is arranged on the conductive bar, and the conductive bar is fixed on the fuse; the heat dissipation of the fuse is realized, compared with the heat dissipation scheme of the existing fuse, the fuse does not need to be placed in an airtight air duct, the thickened conductive bar does not need to be increased, the heat dissipation effect is obvious, and the cost is low.

Third embodiment

A third embodiment of the present application provides a power electronic device including the fuse heat dissipation structure according to the first embodiment or the second embodiment. The foregoing description of the heat dissipation structure of the fuse is omitted here for brevity.

According to the power electronic equipment provided by the embodiment of the application, the radiator is arranged on the conductive bar, and the conductive bar is fixed on the fuse protector; the heat dissipation of the fuse is realized, compared with the heat dissipation scheme of the existing fuse, the fuse does not need to be placed in an airtight air duct, the thickened conductive bar does not need to be increased, the heat dissipation effect is obvious, and the cost is low.

The preferred embodiments of the present application have been described above with reference to the accompanying drawings, and are not intended to limit the scope of the claims of the application accordingly. Any modifications, equivalents and improvements which may occur to those skilled in the art without departing from the scope and spirit of the present application are intended to be within the scope of the claims of the present application.

Claims (4)

1. A fuse heat radiation structure is characterized by comprising a radiator, a conductive bar and a fuse;

the conductive bar is disposed between the heat sink and the fuse;

the fuse includes at least one mounting face;

the radiator and the conductive bar are fixed on the mounting surface.

2. A fuse heat dissipation structure in accordance with claim 1, further comprising a heat sink mounting plate;

the heat sink mounting plate is arranged between the heat sink and the conductive bar; the radiator is fixed on the radiator mounting plate; the radiator mounting plate and the conductive bar are fixed on the mounting surface of the fuse.

3. A fuse heat dissipation structure as defined in claim 1, wherein the heat sink comprises a first heat sink and a second heat sink; the conductive bars comprise a first conductive bar and a second conductive bar; the fuse comprises a first mounting surface and a second mounting surface;

the first conductive bar is arranged between the first radiator and the first mounting surface;

the second conductive bar is arranged between the second radiator and the second mounting surface;

the first radiator and the first conductive bar are fixed on the first mounting surface, and the second radiator and the second conductive bar are fixed on the second mounting surface.

4. A power electronic device characterized in that it comprises the fuse heat dissipation structure of any one of claims 1 to 3.

Images