CN211906216U

CN211906216U - Computing power equipment operation system

Info

Publication number: CN211906216U
Application number: CN202020836172.3U
Authority: CN
Inventors: 徐伟峰; 沈志文
Original assignee: Shenzhen Jiemicrochip Technology Co ltd
Current assignee: Shenzhen Jiemicrochip Technology Co ltd
Priority date: 2020-05-19
Filing date: 2020-05-19
Publication date: 2020-11-10
Anticipated expiration: 2030-05-19

Abstract

The utility model discloses a calculation power equipment operating system, including control terminal, cloud ware, switch, calculation power module, heat dissipation module, power supply and auxiliary power supply, control terminal with cloud ware communication connection, cloud ware passes through the switch and calculates power module communication connection, calculation power module includes 2 at least calculation power equipment series connection is a plurality of between power supply and the earthing terminal calculation power equipment, each calculation power equipment is connected with heat dissipation module, the heat dissipation module electricity is connected with auxiliary power supply. The utility model discloses a power supply is to calculating power equipment independent power supply and adopt auxiliary power supply to connect heat radiation module to distinguish both supplies power, realize stable to the power supply of operation chip, and discharge fast the heat that power equipment produced, protect operation chip's life, further improve system operation efficiency.

Description

Computing power equipment operation system

Technical Field

The utility model relates to a system especially relates to a power of calculating equipment operating system.

Background

1. Along with the continuous iteration updating of scientific technology, more and more devices are intelligentized in installation and operation, and for devices embedded with high-computation-power intensive chips, the devices can generate a large amount of heat in a short time when being electrified and operated, and if the heat is not discharged in time, the chips are easy to burn out; and the power is supplied to all equipment, including lighting lamps, so that the phenomenon of unstable power supply to equipment with high computational power and dense chips exists, and the chips are easily burnt out.

SUMMERY OF THE UTILITY MODEL

The utility model provides a calculate power equipment operation system solves current a plurality of and calculates power equipment operation and produce a large amount of heats and to calculating power equipment power supply unstability, leads to the problem that the chip burns out easily.

In order to achieve the above object, the utility model provides a following technical scheme:

a computing power equipment operation system comprises a control terminal, a cloud server, a switch, a computing power module, a heat dissipation module, a power supply and an auxiliary power supply, wherein the control terminal is in communication connection with the cloud server, the cloud server is in communication connection with the computing power module through the switch, the computing power module comprises at least 2 computing power equipment, a plurality of computing power equipment are connected in series between the power supply and a grounding end, each computing power equipment is connected with the heat dissipation module, and the heat dissipation module is electrically connected with the auxiliary power supply;

the power calculation equipment comprises a PCB, a network interface, an electric connection serial port and an operation chip, wherein the PCB is arranged in the power calculation equipment, the network interface is arranged at one end of the PCB, the electric connection serial port is arranged at one side of the network interface, the operation chip is integrated on the PCB and is connected in series between every two adjacent operation chips, and the operation chip is connected with the network interface and the electric connection serial port.

Preferably, the heat dissipation module is an air-cooled heat sink disposed at least one end of the force computing device, and the air-cooled heat sink is connected to each corresponding force computing device for heat dissipation.

Preferably, the control terminal comprises a PC terminal or a mobile terminal, and the mobile terminal and the PC terminal are switched with each other.

Preferably, the heat dissipation module is a liquid cooling radiator and a liquid cooling plate arranged on the back of each PCB, and the liquid cooling radiator and each liquid cooling plate are communicated to convey cooling liquid to supply the power calculation equipment for heat dissipation.

Compared with the prior art, the utility model following beneficial effect has:

the utility model provides a power calculation equipment operation system supplies power alone and adopts auxiliary power supply to connect heat radiation module to power calculation equipment through the power supply to distinguish both supplies power, realize stable to the power supply of operation chip, and discharge fast the heat that power calculation equipment produced, protect the life of operation chip, further improve system operation efficiency.

To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

Drawings

FIG. 1 is a schematic structural diagram of a power calculating equipment operating system of the present invention;

FIG. 2 is a schematic diagram of the force computing apparatus of FIG. 1;

fig. 3 is a schematic structural diagram of the heat dissipation module in fig. 1;

FIG. 4 is a schematic structural diagram of the control terminal in FIG. 1;

fig. 5 is another structural schematic diagram of the heat dissipation module in fig. 1;

reference numerals: 1. a control terminal; 101. a PC terminal; 102. a mobile terminal; 2. a cloud server; 3. a switch; 4. a force calculation module; 5. a heat dissipation module; 501. an air-cooled radiator; 502. a liquid-cooled radiator; 503. a liquid-cooled plate; 6. a power supply; 7. an auxiliary power supply; 8. a force calculation device; 801. a PCB board; 802. a network interface; 803. connecting a power serial port; 804. and an operation chip.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and claims of this application or in the above-described drawings are used for distinguishing between different objects and not for describing a particular order.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The embodiment of the utility model provides a calculation power equipment operating system, refer to fig. 1 and fig. 2 and show, including control terminal 1, cloud server 2, switch 3, calculation power module 4, heat dissipation module 5, power supply 6 and auxiliary power supply 7, control terminal 1 with 2 communication connection of cloud server, cloud server 2 is through switch 3 and 4 communication connection of calculation power module, calculation power module 4 includes 2 at least calculation power equipment 8, a plurality of calculation power equipment 8 of series connection between power supply 6 and earthing terminal, each calculation power equipment 8 is connected with heat dissipation module 5, heat dissipation module 5 electricity is connected with auxiliary power supply 7;

the computing power equipment 8 comprises a PCB 801, a network interface 802, an electric connection serial port 803 and an operation chip 804, the PCB 801 is arranged in the computing power equipment 8, the network interface 802 is arranged at one end of the PCB 801, the electric connection serial port 803 is arranged at one side of the network interface 802, a plurality of operation chips 804 are integrated on the PCB 801, two adjacent operation chips 804 are connected in series, and the operation chips 804 are connected with the network interface 802 and the electric connection serial port 803.

The cloud server 2 (ECS) is a simple, efficient, secure, reliable computing Service with elastically scalable processing capability.

The power supply 6 is a main power supply and is used for supplying only the power of the power calculation equipment 8, and the power of other electronic equipment does not occupy part of the power calculation equipment 8, so that the power calculation equipment 8 is ensured to be stable and efficient in the process of high-speed calculation by the calculation chip 804.

And the auxiliary power supply 7 is used for connecting a heat dissipation module 5 required by the force computing equipment 8, such as a heat sink, a lighting, a fan and the like.

In this embodiment, a plurality of computing power devices 8 connected in series are disposed between the power supply 6 and the ground terminal, a PCB 801 is disposed in each computing power device 8, a network interface 802 and an electrical connection serial port 803 are disposed at one end of the PCB 801, a plurality of computing chips 804 connected in series with each other are further integrated on the PCB 801, the electrical connection serial port 803 is used for connecting the power supply 6 in series with each computing power device 8, and the network interface 802 is used for connecting with the switch 3 in a network to realize communication transmission of the computing chips 804.

Specifically, the control terminal 1 is connected with the switch 3 through the cloud server 2 in a network manner to realize that the control terminal 1 remotely controls the operation condition of the computing power device 8, and of course, the connection between the cloud server 2 and the switch 3 may be a wireless connection, such as WiFi, a local area network or a local area network.

Further, referring to fig. 3, the heat dissipation module 5 is an air-cooled heat sink 501 disposed at least one end of the force calculating device 8, and the air-cooled heat sink 501 is connected to each corresponding force calculating device 8 for heat dissipation.

In this embodiment, the computing power device 8 generates a large amount of heat during operation and needs to be discharged in time, and the air-cooled heat sink 501 (e.g., a fan) is disposed at one end or both ends of the computing power device 8, so that the heat can be rapidly discharged by one-out or one-in one-out conveying exhaust air, thereby reducing the temperature in the computing power device 8 and protecting the computing power chip.

Further, referring to fig. 4, the control terminal 1 includes a PC terminal 101 or a mobile terminal 102, and the mobile terminal 102 and the PC terminal 101 are switched with each other.

In this embodiment, the control terminal 1 connected to the cloud server 2 may be a PC terminal 101 (desktop computer or notebook computer) or a mobile terminal 102 (for example, control APP, smart phone or tablet), and the two terminals may be switched to log in for use.

Further, referring to fig. 5, the heat dissipation module 5 includes a liquid cooling heat sink 502 and liquid cooling plates 503 disposed on the back of each PCB, and the liquid cooling heat sink 502 and each liquid cooling plate 503 are communicated to deliver cooling liquid for the computing device 8 to dissipate heat.

In this embodiment, in order to quickly and sufficiently reduce the high-speed calculation of the operation chip 804 to generate high temperature and dissipate heat in a short time, on the premise that the calculation power device 8 is provided with the air-cooled radiator 501, a liquid-cooled radiator 502 and a liquid-cooled plate 503 arranged on the back of each PCB may be added, the liquid-cooled radiator 502 is communicated with each liquid-cooled plate 503 to convey cooling liquid to the calculation power device 8 for heat dissipation and cooling, and the liquid-cooled radiator 502 in this embodiment, for example, a water-cooled radiator, rapidly takes away the heat generated by the operation chip 804 in the process of circulating flow with water.

The technical principle of the present invention has been described above with reference to specific embodiments, which are merely preferred embodiments of the present invention. The utility model discloses a scope of protection not only limits in above-mentioned embodiment, and the all belongings the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. Those skilled in the art will appreciate that other embodiments of the invention can be devised which do not require inventive effort and which fall within the scope of the present invention.

Claims

1. The computing power equipment operation system is characterized by comprising a control terminal, a cloud server, a switch, a computing power module, a heat dissipation module, a power supply and an auxiliary power supply, wherein the control terminal is in communication connection with the cloud server, the cloud server is in communication connection with the computing power module through the switch, the computing power module comprises at least 2 computing power equipment, a plurality of computing power equipment are connected in series between the power supply and a grounding end, each computing power equipment is connected with the heat dissipation module, and the heat dissipation module is electrically connected with the auxiliary power supply;

2. The power computation equipment operating system of claim 1, wherein the heat dissipation module is an air-cooled heat sink disposed at least one end of the power computation equipment, and the air-cooled heat sink is connected to each corresponding power computation equipment for dissipating heat.

3. The computing power equipment operating system according to claim 1, wherein the control terminal comprises a PC terminal or a mobile terminal, and the mobile terminal and the PC terminal are switched with each other.

4. The power calculation equipment operation system according to claim 1 or 2, wherein the heat dissipation module is a liquid-cooled heat sink and a liquid-cooled plate disposed on the back of each PCB, and the liquid-cooled heat sink is communicated with each liquid-cooled plate to convey a cooling liquid for the power calculation equipment to dissipate heat.