CN110494015B - Charging heat dissipation device, electronic equipment and charging heat dissipation system - Google Patents

Charging heat dissipation device, electronic equipment and charging heat dissipation system Download PDF

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Publication number
CN110494015B
CN110494015B CN201910711191.5A CN201910711191A CN110494015B CN 110494015 B CN110494015 B CN 110494015B CN 201910711191 A CN201910711191 A CN 201910711191A CN 110494015 B CN110494015 B CN 110494015B
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heat
charging
heat dissipation
electronic equipment
temperature
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CN110494015A (en
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孙平
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Oppo Chongqing Intelligent Technology Co Ltd
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Oppo Chongqing Intelligent Technology Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209Heat transfer by conduction from internal heat source to heat radiating structure

Abstract

The application provides a charging and heat dissipating device which comprises an adapter, a charging wire and a heat dissipating assembly, wherein the heat dissipating assembly comprises a heat dissipating box body and a first joint arranged on the heat dissipating box body; the first connector is connected with the electronic equipment so as to charge the electronic equipment and lead out heat of the electronic equipment; the heat dissipation box body dissipates the heat conducted out by the first joint. The application provides a heat abstractor charges through the first joint that has charge and heat conduction function when charging for electronic equipment, derives the heat that the inside components and parts of electronic equipment produced, and then gives out the heat through the heat dissipation box body, and the reinforcing electronic equipment standby charges or the heat-sinking capability of bright screen charging in-process complete machine.

Description

Charging heat dissipation device, electronic equipment and charging heat dissipation system
Technical Field
The application relates to the technical field of electronic equipment, in particular to a charging and heat-dissipating device, electronic equipment and a charging and heat-dissipating system.
Background
The configuration of electronic equipment (for example, intelligent terminals such as mobile phones and tablet computers) is increasing, and the power consumption is increasing due to the application of 5G, super fast charging, high frame rate display and the like, and meanwhile, the heat dissipation technology of the electronic equipment is diversified, so that the problem of increasingly prominent heat dissipation is solved.
Generally, the heat dissipation methods applied to electronic devices at present are mainly classified into active heat dissipation and passive heat dissipation. Active heat dissipation is to take away the heat emitted by the heat sink forcibly through a heat dissipation device, for example, a built-in fan is used for heat dissipation; the passive heat dissipation is to dissipate the heat of a heat source to the air naturally through a heat sink, for example, heat dissipation is conducted through a heat pipe, graphene, and other heat sinks.
However, active heat dissipation methods such as a built-in fan generally occupy a large amount of space, and increase power consumption and noise; the passive heat dissipation method cannot actively dissipate heat outwards to transfer heat away, and if the heat dissipation capacity of the surface of the whole machine is poor, the effect is greatly reduced.
Disclosure of Invention
The technical problem to be solved in the present application is to provide a charging and heat dissipating device, an electronic device, and a charging and heat dissipating system, so as to solve the defect that the heat dissipating effect of the current heat dissipating method applied to the electronic device is poor.
The embodiment of the application provides a charging heat dissipation device, which is applied to rechargeable electronic equipment and comprises an adapter, a heat sink and a heat sink, wherein the adapter is used for connecting an external power supply; a charging wire; the heat dissipation assembly comprises a heat dissipation box body and a first joint arranged on the heat dissipation box body; the first connector is connected with the electronic equipment so as to charge the electronic equipment and lead out heat of the electronic equipment; the heat dissipation box body dissipates the heat led out by the first joint; one end of the charging wire is connected with the adapter, and the other end of the charging wire is connected with the heat dissipation assembly, so that the external power supply supplies power to the heat dissipation assembly.
The embodiment of the application also provides electronic equipment which comprises a shell, a battery and a CPU, wherein the battery and the CPU are arranged in the shell; the temperature equalizing plate is in contact connection with at least one surface of the battery and the CPU so as to conduct heat emitted by the battery and the CPU during working; the temperature equalization plate extends to the end portion of the shell provided with the charging interface so as to conduct heat to the outside of the electronic equipment.
The embodiment of the application also provides a charging and heat-dissipating system, which comprises a charging and heat-dissipating device and electronic equipment; the charging and heat dissipation device comprises an adapter, a charging wire and a heat dissipation assembly, wherein the adapter is used for connecting an external power supply; one end of the charging wire is connected with the adapter, and the other end of the charging wire is connected with the heat dissipation assembly, so that the external power supply supplies power to the heat dissipation assembly; the heat dissipation assembly comprises a heat dissipation box body and a first joint arranged on the heat dissipation box body;
the electronic equipment comprises a shell, a temperature-equalizing plate, a battery and a CPU (central processing unit) which are arranged in the shell, wherein the temperature-equalizing plate is in contact connection with at least one surface of the battery and the CPU so as to conduct heat emitted by the battery and the CPU during working, and the temperature-equalizing plate extends to the end part of the shell, which is provided with a charging interface, so as to conduct the heat to the outside of the electronic equipment;
the first joint is connected with the electronic equipment so as to charge the electronic equipment and lead out heat of the electronic equipment; the heat dissipation box body dissipates the heat conducted out by the first joint.
The heat abstractor that charges that this application embodiment provided through the first joint that has charge and heat conduction function when charging for electronic equipment, exports the heat that the inside components and parts of electronic equipment produced, and then distributes away the heat through the heat dissipation box body, strengthens the heat-sinking capability of electronic equipment standby charging or bright screen charging in-process complete machine.
The electronic equipment that this application embodiment provided conducts the tip or the outside of electronic equipment through the heat that the samming board produced battery, CPU and the inside components and parts of electronic equipment, improves the radiating efficiency.
The cooling system that charges that this application embodiment provided, the heat that the inside components and parts of electronic equipment produced is derived through the temperature-uniforming plate that sets up in the electronic equipment to first joint derives the heat to the heat abstractor that charges, so that the heat dissipation box body can be with the quick giving out of heat, promotes the radiating effect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a charging and heat dissipating device according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present application;
FIG. 3 is a schematic view of a first connector according to an embodiment of the present application;
FIG. 4 is a schematic view of a first connector according to an embodiment of the present application;
FIG. 5 is a schematic view of a first connector according to an embodiment of the present application;
FIG. 6 is a schematic structural diagram of a heat dissipation case according to an embodiment of the present application;
FIG. 7 is a schematic structural diagram of a heat dissipation case according to an embodiment of the present application;
FIG. 8 is a schematic structural diagram of a heat dissipation case according to an embodiment of the present application;
FIG. 9 is a schematic structural diagram of a heat dissipation case according to an embodiment of the present application;
FIG. 10 is a schematic structural diagram of a heat sink assembly according to an embodiment of the present application;
FIG. 11 is a schematic structural diagram of a heat sink assembly according to an embodiment of the present application;
FIG. 12 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
FIG. 13 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
FIG. 14 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
fig. 15 is a schematic structural diagram of a charging and heat dissipating system according to an embodiment of the present application;
fig. 16 is a schematic structural diagram of a charging and heat dissipating system according to an embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The embodiment of the application provides a charging heat dissipation device, which is applied to rechargeable electronic equipment, wherein the electronic equipment can be mobile phones, tablet computers, MP3, MP4 and other electronic equipment. The charging and heat dissipating device provided by the embodiment of the application has the advantages that the heat dissipating function is added during charging, the heat dissipating capacity of the whole device in the standby charging or bright screen charging use process of the mobile phone can be greatly enhanced, the temperature of the mobile phone in a charging scene is effectively reduced, and the charging rate of the standby or bright screen charging is further improved.
Further, the heat abstractor that charges that this application embodiment provided includes adapter, charging wire and radiator unit to make this heat abstractor that charges have simultaneously and charge and the heat dissipation function. Obviously, the adapter is used for connecting external power source and for this heat abstractor power supply that charges, and adapter and radiator unit are connected respectively in order to carry out electric power conduction to the charging wire, and radiator unit has the joint and the heat radiation structure that charge in order to possess and charge and the heat dissipation function.
Specifically, referring to fig. 1, an embodiment of the present invention provides a charging and heat dissipating device 100, and the charging and heat dissipating device 100 is applied to a rechargeable electronic device. The charging and heat dissipating device 100 includes an adapter 10, a charging wire 20, and a heat dissipating assembly 30. The adapter 10 is used for connecting an external power supply to supply power to the charging and heat dissipating device 100, and one end of the charging wire 20 is connected to the adapter 10, and the other end is connected to the heat dissipating assembly 30, so that the external power supply supplies power to the heat dissipating assembly 30. It is understood that the heat dissipation assembly 30 may have a charging connector and a heat dissipation structure to provide charging and heat dissipation functions.
It is to be understood that the terms "first", "second" and "third" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature.
Further, referring to fig. 2, the heat dissipation assembly 30 includes a heat dissipation box 31 and a first connector 32 disposed on the heat dissipation box 31, the first connector 32 is connected to the electronic device to charge the electronic device and to conduct heat of the electronic device, and the heat dissipation box 31 dissipates the heat conducted by the first connector 32. The heat dissipation case 31 can be made of a heat conductive material, for example, one of heat conductive materials such as copper sheet, aluminum sheet, graphite sheet, and graphene.
Obviously, in the process of connecting the first connector 32 with the electronic device, the electronic device can be charged, and at the same time, heat generated by components inside the electronic device can be conducted out, that is, the first connector 32 has dual functions of charging and heat conducting. It is understood that the structure of the first connector 32 with the heat conducting function can be made of a heat conducting material, for example, one of copper sheets, aluminum sheets, graphite sheets, graphene, and other heat conducting materials; the structure of the first connector 32 with the charging function is electrically connected to the electronic device and the charging wire 20, respectively, to achieve current conduction. The first connector 32 may have a structure similar to that of a charging interface of a charger, such as one of a USB interface, a Type-c interface, a 30-pin interface, a lightning interface, and the like.
The embodiment of the application provides a heat abstractor 100 that charges, through first joint 32 that has charge and heat conduction function when charging for electronic equipment, derive the heat that electronic equipment internal components produced, and then distribute away the heat through heat dissipation box body 31, dispel the heat when charging, can strengthen the heat-sinking capability of electronic equipment standby charging or bright screen charging in-process complete machine greatly, electronic equipment temperature when effectively reducing the scene of charging, and then improve the charge rate that standby or bright screen charge.
In some embodiments of the present application, the first connector includes a charging portion for connecting to a charging interface of an external electronic device, and a heat conduction portion for conducting heat of the electronic device away. Charging portion and heat-conducting portion are insulating to be set up to guarantee the security of first joint when charging, further, charging portion and heat-conducting portion also can insulate against heat and set up, in order to avoid first joint to conduct the heat to charging portion when the heat conduction, cause the portion of charging heat too big and conduct this heat to electronic equipment inside once more, make the radiating effect relatively poor.
Specifically, referring to fig. 3, the first connector 32 includes a charging portion 321 and a heat conduction portion 322, the charging portion 321 is used for connecting to a charging interface of an external electronic device to charge the external electronic device, and the heat conduction portion 322 is used for conducting heat of the electronic device out. Further, the charging portion 321 and the heat conduction portion 322 are disposed at an interval, so that the charging portion 321 and the heat conduction portion 322 are insulated from each other, and the safety of the first connector 32 during charging is ensured.
In some embodiments of the present application, referring to fig. 4, the charging portion 321 and the heat conducting portion 322 are connected in contact and arranged side by side in the connection direction of the first connector 32 and the electronic device, so that the first connector 32 has a smaller structure. At this time, in order to ensure the insulating arrangement between the charging portion 321 and the heat conduction portion 322, an insulating material may be disposed on the contact surface between the charging portion 321 and the heat conduction portion 322 to insulate between the charging portion 321 and the heat conduction portion 322, so as to ensure the safety of the first contact 32 during charging.
In some embodiments of the present application, referring to fig. 5, the charging portion 321 and the heat conducting portion 322 are disposed at an interval, and meanwhile, in order to ensure thermal insulation between the charging portion 321 and the heat conducting portion 322, a layer of thermal insulation portion 323 may be disposed between the charging portion 321 and the heat conducting portion 322 to prevent the first connector 32 from conducting heat into the charging portion 321 during heat conduction, which may cause excessive heat of the charging portion 321 and conduct the heat into the electronic device again, resulting in poor heat dissipation effect. It can be understood that the heat insulation portion 323 can also be made of an insulating material, so as to avoid waste caused by disposing a layer of insulating material between the charging portion 321 and the heat conduction portion 322, and save cost.
The embodiment of the application provides a heat abstractor 100 charges, makes first joint 32 have simultaneously to charge and heat conduction function through portion 321 that charges and heat conduction portion 322 to insulating thermal-insulated setting carries out between portion 321 that charges and the heat conduction portion 322, the security of guaranteeing first joint 32 when charging and promotion radiating effect.
In some embodiments of this application, the heat dissipation box body is provided with miniature fan and first air outlet, and miniature fan is connected in order to obtain power supply with the charging wire electricity, and miniature fan is used for distributing away the heat that first joint was derived. It can be understood that when the first joint derived the heat that the inside components and parts of electronic equipment produced to the heat dissipation box body in, miniature fan can be with the inside quick the giving off of heat dissipation box body to this improves the radiating efficiency.
Specifically, referring to fig. 6, the heat dissipation case 31 is provided with a micro fan 311 and a first air outlet 312, the micro fan 311 is electrically connected to a charging wire to obtain power supply, so that the micro fan 311 works to guide the first connector out of the heat dissipation case to dissipate the heat. Referring to fig. 7, one or more micro fans 311 may be disposed, and may be disposed according to specific requirements of the electronic device, so as to ensure a better heat dissipation effect; similarly, the first air outlet 312 may also be provided with one or more than one air outlet, so as to achieve a better heat dissipation effect by setting the number of the first air outlets 312.
In some embodiments of this application, in order to make the interior heat of heat dissipation box body can be quick distribute away, can set up the fin in heat dissipation box body, the fin can set up a plurality ofly, and specific quantity can be according to the nimble setting of radiating effect. It can be understood that a part of the plurality of heat dissipation fins can be connected to the first joint, and further, a part of the heat dissipation fins is connected to the heat conduction portion of the first joint, so that heat generated by the element inside the electronic device can be more rapidly conducted out.
Specifically, referring to fig. 8, a plurality of heat dissipation fins 313 are disposed in the heat dissipation box 31, the first air outlet 312 is disposed at a side of the heat dissipation box 31 far from the micro-fan 311, and the plurality of heat dissipation fins 313 are disposed between the first air outlet 312 and the micro-fan 311, so that the heat dissipation efficiency can be improved to the maximum. Further, some of the plurality of heat dissipation fins 313 may be connected to the first connector 32 to rapidly conduct the heat conducted from the first connector 32 to the inside of the heat dissipation case 31. Furthermore, the plurality of heat dissipation fins 313 may be uniformly distributed in the heat dissipation box 31, or may be regularly arranged in the heat dissipation box 31. For example, the heat sink 313 is rectangular and symmetrically distributed along the center lines of the first air outlet 312 and the micro fan 311, so that the heat conducted by the first connector 32 can be quickly dissipated from the first air outlet 312 by the micro fan 311 when the heat sink 313 guides the heat into the heat dissipation box 31.
In some embodiments of the present application, in order to improve the heat conduction and heat transfer efficiency of the heat sink, the regular rectangular heat sink may be adjusted to increase the heat dissipation surface. Specifically, referring to fig. 9, the heat sink 313 is crescent-shaped, which has a larger heat dissipation area than a regular rectangle, and the crescent-shaped heat sink 313 is symmetrically distributed along the center lines of the first air outlet 312 and the micro-fan 311, so that when the heat sink 313 guides the heat conducted by the first connector 32 into the heat dissipation case 31, the heat can be quickly dissipated from the first air outlet 312 by the micro-fan 311. It is understood that the heat sink 313 can be made of a heat conductive material, such as one of copper sheet, aluminum sheet, graphite sheet, graphene, and the like.
In some embodiments of the present application, in order to rapidly lead out heat generated by components inside the electronic device, the heat dissipation box further includes a second connector, and the second connector is connected to the electronic device to lead out heat of the electronic device.
Specifically, referring to fig. 10, the heat dissipation box 31 is provided with a second connector 33, the second connector 33 is connected to the electronic device to guide out heat of the electronic device, and the heat dissipation box 31 dissipates the heat guided out by the second connector 33. The second joint 33 may be a sheet-shaped structure made of a heat conductive material, for example, the second joint 33 may be a copper sheet, an aluminum sheet, a graphite sheet, graphene, or the like. It can be understood that the second connector 33 and the first connector 32 are disposed on the same side of the heat dissipation box 31, so as to conduct heat generated by components inside the electronic device while charging the electronic device. Meanwhile, the second connector 33 and the first connector 32 are arranged on the same side of the heat dissipation box body 31, so that the size of the charging and heat dissipation device 100 can be smaller, the use is lighter, and the user experience is improved.
The embodiment of the application provides a heat abstractor 100 charges, the heat that produces the inside components and parts of electronic equipment through second joint 33 is derived, and then gives out the heat through heat dissipation box body 31, can strengthen electronic equipment's heat-sinking capability greatly.
In some application scenarios, the micro fan is not needed to be used for rapid heat dissipation, for example, when the electronic device is just charged, the internal components of the electronic device do not generate too much heat, and at this time, the purpose of heat dissipation can be completely achieved by normal heat conduction. And when electronic equipment was when charging and was used, the inside components and parts of its electronic equipment can be quick the more heat of production, at this moment, need miniature fan work in order to dispel the heat fast.
In some embodiments of this application, be provided with temperature sensor and control circuit board in the heat dissipation box to detect the temperature of first joint heat-conducting part and second joint through temperature sensor, and then realize controlling micro-fan with the control circuit board cooperation, realize that micro-fan works as required, save the power. Obviously, the temperature sensor can be arranged close to the first joint heat conducting part and the second joint so as to better detect the heat conducting temperature. Furthermore, the adapter and the temperature sensor are respectively electrically connected with the control circuit board, and the adapter is electrically connected with the control circuit board to provide power for the control circuit board to work; the temperature sensor is electrically connected with the control circuit board to output the detected temperature to the control circuit board so that the control circuit board controls the micro fan to work.
Specifically, referring to fig. 11, a temperature sensor 315 and a control circuit board 316 are disposed in the heat dissipation box, and the temperature sensor 315 is disposed adjacent to the first connector 32 or the second connector 31 to detect the temperature of the first connector heat conduction portion or the second connector. The control circuit board 316 is electrically connected to the temperature sensor 315 to receive the temperature signal fed back by the temperature sensor 315 and control the micro fan 311 according to the temperature signal. The control circuit board 316 is electrically connected to the adapter 10 to obtain power required for operation.
The charging and heat-dissipating device provided by the embodiment of the application is characterized in that the temperature sensor and the control circuit board are arranged in the heat-dissipating box body, the temperature sensor detects the temperature of the first joint heat-conducting part or the second joint, the detected temperature signal is transmitted to the control circuit board, and the control circuit board can be preset with a temperature threshold value. When the temperature signal fed back by the temperature sensor received by the control circuit board exceeds the temperature threshold, the control circuit board controls the micro fan to work so as to improve the heat dissipation effect of the charging heat dissipation device. Meanwhile, the micro fan can be prevented from being in a working state all the time, and a power supply is saved.
The applicant finds that active heat dissipation of a built-in fan of the electronic device occupies a large amount of space, power consumption of a processor is increased, generation of heat inside the electronic device is increased, and the heat dissipation effect is poor. It can be understood that the electronic device may be a mobile phone, a tablet computer, an MP3, an MP4, and the like, and the main devices generating heat inside the electronic device are a battery and a CPU (Central Processing Unit).
The embodiment of the application provides an electronic device 200, and the electronic device 200 can achieve a good heat dissipation effect without a built-in fan. Further, the electronic device 200 includes a housing, and a battery, a CPU, and a temperature-uniforming plate disposed inside the housing. The temperature equalizing plate has good temperature equalizing effect, the heat generated by a CPU heat source or a battery heat source can be equalized to the whole temperature equalizing plate, and the temperature difference between the head and the tail can be within 3-5 ℃.
It should be noted that the vapor chamber can also be used as a vapor chamber, and the specific working principle is as follows: after absorbing heat, the liquid at the bottom of the vacuum cavity is evaporated and diffused into the vacuum cavity, the heat is conducted to the radiating fins, and then the liquid is condensed into liquid to return to the bottom. The evaporation and condensation process of the air conditioner similar to a refrigerator is quickly circulated in the vacuum cavity, and high heat dissipation efficiency is realized. Further, the base of the temperature-uniforming plate is contacted with a heat source to be heated, the heat source heats the copper mesh micro-evaporator of the base of the temperature-uniforming plate, cooling liquid (such as purified water) in the temperature-uniforming plate is heated and quickly evaporated into hot air under a vacuum ultralow pressure environment, the hot air circulates in the copper mesh micro-environment, the hot air is heated and rises, and the cooling liquid is condensed into liquid again to flow back to the bottom of the temperature-uniforming plate when meeting the radiating fins to radiate heat.
Specifically, referring to fig. 12, the electronic device 200 includes a housing 50, and a battery 501, a CPU502 and a temperature-equalizing plate 60 disposed inside the housing 50, wherein the temperature-equalizing plate 60 is in contact connection with at least one surface of the battery 501 and the CPU502 to conduct heat dissipated by the battery 501 and the CPU502 during operation. Further, the temperature equalization plate 60 extends to the end of the housing 50 where the charging interface 503 is disposed, so as to conduct heat to the outside of the electronic device 200 and facilitate heat dissipation of the external heat dissipation device. It can be understood that the temperature-equalizing plate 60 may be in contact with at least one of the surfaces of the battery 501 and the CPU502, and the temperature-equalizing plate 60 may be disposed on the same side of the battery 501 and the CPU502, so as to facilitate the temperature-equalizing plate 60 to absorb heat and conduct heat. The temperature equalizing plate 60 may be curved to increase the heat conducting distance and improve the heat dissipation effect.
In some embodiments of the application, the casing has been seted up air intake and second air outlet, and the air intake sets up in the tip that the casing is provided with the interface that charges, and the second air outlet sets up in the side that closes on the tip at air intake place. The air inlet and the second air outlet form a heat dissipation channel, air is blown from the air inlet by using an external heat dissipation device, and blown air flows out from the second air outlet so as to take away heat of the electronic equipment, so that the effect of rapid heat dissipation is achieved.
Specifically, referring to fig. 13, the housing 50 is provided with an air inlet 504 and a second air outlet 505, the air inlet 504 is disposed at an end portion of the housing 50 where the charging interface 503 is disposed, and the second air outlet 505 is disposed at a side edge close to the end portion where the air inlet 504 is located, so that the second air outlet 505 and the air inlet 504 form a heat dissipation channel, and further, cold air can be blown from the air inlet by using an external heat dissipation device, and the cold air flows out from the second air outlet through the inside of the electronic device, so as to take away heat of components inside the electronic device, and achieve a heat. It can be understood that the air inlet 504 is disposed near the end of the temperature-uniforming plate 60, or the temperature-uniforming plate 60 abuts against the air inlet 504, so that the cold air blown from the air inlet 504 directly contacts the temperature-uniforming plate 60 and takes away heat from the temperature-uniforming plate 60, thereby improving heat dissipation efficiency.
In some embodiments of this application, the heat conduction mouth has been seted up to the casing, and the heat conduction mouth is used for exporting the heat that the temperature-uniforming plate conducts to electronic equipment's outside, perhaps the heat conduction mouth is used for setting up the fin of connecting the temperature-uniforming plate to do benefit to the quick outside of exporting the heat of temperature-uniforming plate to electronic equipment, promote the radiating efficiency.
Specifically, referring to fig. 14, the housing 50 is provided with a heat conducting port 506, and the heat conducting port 506 can be used for conducting heat conducted by the temperature equalizing plate 60 to the outside of the electronic device. The heat conduction port 506 is disposed adjacent to the end of the temperature equalizing plate 60 or the temperature equalizing plate 60 abuts against the heat conduction port 506, so that the heat of the temperature equalizing plate 60 can be quickly conducted from the heat conduction port 506 to the outside of the electronic device. The heat conduction port 506 can also be used for arranging a heat dissipation sheet connected with the temperature equalization plate 60, the heat dissipation sheet penetrates through the heat conduction port 506 and is in contact connection with the temperature equalization plate 60, heat of the temperature equalization plate 60 can be quickly conducted out to the outside of the electronic equipment, and heat dissipation efficiency is improved.
The electronic equipment that this application embodiment provided conducts the heat that battery, CPU and the inside components and parts of electronic equipment produced to electronic equipment's tip or outside through the temperature-uniforming plate to through advancing, air outlet or heat conduction mouth, the quick outside of deriving the heat to electronic equipment has improved the radiating efficiency greatly.
It should be noted that, regardless of whether the electronic device is used or not, the temperature of the electronic device in the charging scenario is generally high, and therefore, the applicant has studied and proposed some improvements on the heat dissipation manner of the electronic device in the charging scenario.
The embodiment of the application provides a cooling system charges, under the electronic equipment scene of charging, derives the inside heat of electronic equipment through the samming board, and then distributes away the heat through charging heat abstractor is quick, can strengthen the heat-sinking capability of electronic equipment standby charging or bright screen charging use in-process complete machine greatly, electronic equipment temperature when effectively reducing the scene of charging, and then improves the charge rate that standby or bright screen charges. It can be understood that the electronic device may be a mobile phone, a tablet computer, an MP3, an MP4, and the like, and the main devices generating heat inside the electronic device are a battery and a CPU (central processing Unit).
Specifically, referring to fig. 15, an embodiment of the present application provides a charging and heat dissipating system 1000, which includes a charging and heat dissipating device 100 and an electronic device 200, where the charging and heat dissipating device 100 includes an adapter 10, a charging wire 20 and a heat dissipating assembly 30, and the electronic device 200 includes a housing 50, a temperature equalization plate 60, and a battery 501 and a CPU502 disposed inside the housing.
Further, the adapter 10 is used for connecting an external power supply; one end of the charging wire 20 is connected with the adapter 10, and the other end is connected with the heat dissipation assembly 30, so that an external power supply supplies power to the heat dissipation assembly; the heat sink assembly 30 includes a heat sink case 31 and a first connector 32 disposed on the heat sink case. The temperature equalization plate 60 is in contact connection with at least one surface of the battery 501 and the CPU502 to conduct heat emitted by the battery 501 and the CPU502 during operation, and the temperature equalization plate 60 extends to the end of the housing 50 provided with the charging interface 503 to conduct heat to the outside of the electronic device.
It is understood that the charging and heat dissipating device 100 of the charging and heat dissipating system 1000 according to the embodiment of the present application may be the charging and heat dissipating device 100 in the foregoing embodiment, and the electronic device 200 of the charging and heat dissipating system 1000 according to the embodiment of the present application may be the electronic device in the foregoing embodiment. The specific structures of the charging and heat dissipating device 100 and the electronic device 200 in the foregoing embodiments can be understood as being suitable for the charging and heat dissipating system 1000 in the embodiments of the present application, so that the specific structures and the operation manners of the charging and heat dissipating device 100 and the electronic device 200 in the embodiments of the present application will not be further described.
Further, the first connector 32 is connected to the electronic device 200 to charge the electronic device 200 and to conduct heat of the electronic device 200; the heat dissipation box 31 dissipates the heat conducted from the first connector 32. Further, the heat conduction portion 322 of the first connector 32 is in contact with the temperature-uniforming plate 60 disposed in the electronic device 200, so as to conduct heat away from the temperature-uniforming plate 60.
The embodiment of the application comprises heat abstractor 100 and electronic equipment 200 charging, and the heat generated by the components inside electronic equipment 200 is led out through the temperature-uniforming plate 60 arranged in electronic equipment 200, and the heat is led out to heat abstractor 100 charging through the first joint 32 connected with the temperature-uniforming plate 60 in a contact manner, so that the heat can be quickly dissipated out through the heat dissipation box body 31, and the heat dissipation effect is improved. Further, a plurality of radiating fins are arranged in the radiating box body 31, so that the radiating area can be effectively enlarged, and the wind direction of the micro fan is opposite to the radiating fins, so that heat can be quickly blown away.
The charging and heat-dissipating system 1000 according to the embodiment of the application can dissipate heat during charging, the charging interface 503 for connecting the charging portion 321 of the first joint 32 with the electronic device 200 charges the electronic device, and the heat generated by the internal components of the electronic device 200 is conducted to the charging box 31 through the heat conduction portion 322 of the first joint 32 during charging, the heat is actively blown away by the heat dissipation fins and the micro fan, so that the heat dissipation capacity of the whole machine during the standby charging or bright screen charging process of the electronic device 200 can be greatly enhanced, the temperature of the electronic device 200 during the charging scene is effectively reduced, and the charging rate of the standby or bright screen charging is further improved.
In the charging and heat dissipating system 1000 according to the embodiment of the present application, the charging and heat dissipating device 100 is disposed outside the electronic device 200, and only the charging portion 321 and the heat conducting portion 322 of the first connector 31 are required to be connected to the charging interface 503 and the temperature equalizing plate 60 disposed on the electronic device 200, respectively, so that heat dissipation can be achieved in time during charging, and compared with a heat dissipation method with a built-in fan, the space utilization rate and the weight of the whole device can be greatly reduced; in addition, the power supply of the micro fan can be provided by the adapter 10, the driving power can be flexibly applied according to the requirement, and the electric quantity of a mobile phone battery is not consumed.
In some embodiments of the present application, please refer to fig. 16, an embodiment of the present application provides a charging and heat dissipating system 1000, which includes a charging and heat dissipating device 100 and an electronic device 200, wherein the charging and heat dissipating device 100 includes an adapter 10, a charging wire 20 and a heat dissipating assembly 30, and the electronic device 200 includes a housing 50, a temperature equalizing plate 60, and a battery 501 and a CPU502 disposed inside the housing.
Further, the adapter 10 is used for connecting an external power supply; one end of the charging wire 20 is connected with the adapter 10, and the other end is connected with the heat dissipation assembly 30, so that an external power supply supplies power to the heat dissipation assembly; the heat dissipation assembly 30 comprises a heat dissipation box body 31 and a first joint 32 arranged on the heat dissipation box body; the heat dissipation box 31 is provided with a micro fan 311 and a first air outlet 312. The temperature equalization plate 60 is in contact connection with at least one surface of the battery 501 and the CPU502 to conduct heat emitted by the battery 501 and the CPU502 during operation, and the temperature equalization plate 60 extends to the end of the housing 50 provided with the charging interface 503 to conduct heat to the end of the electronic device or the outside.
Furthermore, the housing 50 is provided with an air inlet 504 and a second air outlet 505, the second air outlet 505 and the air inlet 504 form a heat dissipation channel, the micro fan 311 blows cold air through the first air outlet 312 to enter the air inlet 504, and the cold air flows out from the second air outlet 505 through the inside of the electronic device 200, so as to take away heat of components inside the electronic device, thereby achieving a heat dissipation effect. It can be understood that the air inlet 504 is disposed near the end of the temperature-uniforming plate 60, or the temperature-uniforming plate 60 abuts against the air inlet 504, so that the cold air blown from the air inlet 504 directly contacts the temperature-uniforming plate 60 and takes away heat from the temperature-uniforming plate 60, thereby improving heat dissipation efficiency.
The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (8)

1. A charging heat sink device applied to a chargeable electronic device, comprising:
an adapter for connecting an external power supply;
a charging wire;
the heat dissipation assembly comprises a heat dissipation box body and a first joint arranged on the heat dissipation box body; the first connector is connected with the electronic equipment so as to charge the electronic equipment and lead out heat of the electronic equipment; the heat dissipation box body dissipates the heat led out by the first joint;
one end of the charging wire is connected with the adapter, and the other end of the charging wire is connected with the heat dissipation assembly, so that the external power supply supplies power to the heat dissipation assembly;
the first joint comprises a charging part and a heat conducting part, the charging part is used for connecting a charging interface of the electronic equipment, the heat conducting part is used for conducting out heat of the electronic equipment, the charging part is in contact connection with the heat conducting part, and a layer of insulating material is arranged on the contact surface of the charging part and the heat conducting part so as to insulate the charging part and the heat conducting part;
the heat dissipation box body is provided with at least one micro fan and at least one first air outlet, the micro fan is electrically connected with the charging wire, and the micro fan is used for dissipating heat conducted out by the first connector;
the heat dissipation box body is internally provided with a plurality of heat dissipation fins, the heat dissipation fins are arranged between the first air outlet and the micro fan, and part of the heat dissipation fins are connected with the first joint.
2. The charging and heat-dissipating device according to claim 1, wherein the heat-dissipating case further has a second connector, and the second connector is connected to the electronic device to conduct heat away from the electronic device.
3. The charging and heat dissipating device according to claim 2, wherein the second connector is one of a copper sheet, an aluminum sheet, a graphite sheet, and graphene.
4. The charging and heat-dissipating device according to claim 1, wherein a temperature sensor and a control circuit board are disposed in the heat-dissipating box, the adapter and the temperature sensor are electrically connected to the control circuit board, respectively, and the temperature sensor is configured to detect the temperature of the heat-conducting portion and output the temperature to the control circuit board, so that the control circuit board controls the micro fan to operate.
5. An electronic device, comprising:
the battery and the CPU are arranged in the shell;
the temperature equalizing plate is in contact connection with at least one surface of the battery and the CPU so as to conduct heat emitted by the battery and the CPU during working;
the temperature equalizing plate extends to the end part of the shell provided with a charging interface so as to conduct heat to the outside of the electronic equipment;
the charging interface is used for being matched with a charging heat dissipation device to conduct heat to the outside of the electronic equipment while charging the electronic equipment, and the charging heat dissipation device is the charging heat dissipation device as claimed in any one of claims 1 to 4.
6. The electronic device of claim 5, wherein the housing defines an air inlet and a second air outlet, the air inlet is disposed at an end of the housing where the charging interface is disposed, and the air outlet is disposed at a side edge of the end near the air inlet.
7. The electronic device according to claim 6, wherein the housing further defines a heat conducting opening, the heat conducting opening is configured to conduct heat conducted by the temperature equalization plate to an outside of the electronic device, or the heat conducting opening is configured to provide a heat sink connected to the temperature equalization plate.
8. A charging and heat dissipating system, comprising:
a charging and heat dissipating device according to any one of claims 1 to 4;
the electronic equipment comprises a shell, a temperature-equalizing plate, a battery and a CPU, wherein the battery and the CPU are arranged in the shell, the temperature-equalizing plate is in contact connection with at least one surface of the battery and the CPU so as to conduct heat emitted by the battery and the CPU during working, and the temperature-equalizing plate extends to the end part of the shell, which is provided with a charging interface, so as to conduct the heat to the outside of the electronic equipment;
the first joint is connected with the electronic equipment so as to charge the electronic equipment and lead out heat of the electronic equipment; the heat dissipation box body dissipates the heat conducted out by the first joint.
CN201910711191.5A 2019-08-02 2019-08-02 Charging heat dissipation device, electronic equipment and charging heat dissipation system Active CN110494015B (en)

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