CN213457942U

CN213457942U - Server power supply board, server power supply module and server

Info

Publication number: CN213457942U
Application number: CN202022382949.6U
Authority: CN
Inventors: 范敬柱; 邓建廷; 胡远明; 秦晓宁; 路云飞; 孙寰宇
Original assignee: Nettrix Information Industry Beijing Co Ltd
Current assignee: Nettrix Information Industry Beijing Co Ltd
Priority date: 2020-10-23
Filing date: 2020-10-23
Publication date: 2021-06-15
Anticipated expiration: 2030-10-23

Abstract

The application provides a server power supply board, a server power supply module and a server. The server power supply board includes: power supply circuit board and liquid cooling radiator. The first end of the power supply circuit board is used for being electrically connected with a power supply bus. And the second end of the power supply circuit board is electrically connected with the server mainboard. The liquid cooling radiator and the power supply circuit board are arranged adjacently. And a medium in the liquid cooling environment flows through the liquid cooling radiator and radiates heat for the power supply circuit board. This application through with the liquid cooling radiator with power supply circuit board adjacent setting, and will server mainboard submergence is in the liquid cooling environment, simultaneously the coolant medium flows through in the liquid cooling radiator in the liquid cooling environment. When the power supply circuit board supplies power to the server mainboard, the liquid cooling radiator dissipates heat for the power supply circuit board, and therefore the heat dissipation effect is improved.

Description

Server power supply board, server power supply module and server

Technical Field

The application relates to the technical field of servers, in particular to a server power supply board, a server power supply module and a server.

Background

The blade server as an important form in the server field has wide application in the fields of high-performance computing, internet, cloud computing and the like. The appearance of liquid-cooled servers greatly improves the power level of the servers and alleviates the need for high power by the servers. However, the increase in blade density and performance is severely limited by the power supply capability and power supply heat dissipation capability of the system power supply as the power level of the server increases. In the communication industry, a 240V high-voltage direct-current Power supply System for communication has greater advantages in reliability, conversion efficiency and the like than a traditional alternating-current UPS (Uninterruptible Power System) System, and has significant economic and social benefits. No back-end IT equipment manufacturer declares to support the input of the high-voltage direct-current power supply in the construction and deployment of the current data center, and many manufacturers support the 48V direct-current input.

At present, the power supply scheme of the mainstream whole cabinet server is still 12V bus input, if the 12V scheme is adopted, 32 computing nodes (16 liquid cooling blades, 2 nodes per blade and about 2500W of single-chip node power) are required to be deployed in a 10U (U refers to the size, 1U is 4.45 cm) space, the total power is as high as 80KW, and the current size is 6667A, which is not imaginable. Even if the transmission impedance of the 12V copper bar is 0.1mR, 4.4KW loss can be caused. If the bus voltage is increased to 48V, the voltage is increased by 4 times, the current is reduced by 4 times, and the transmission loss is reduced to 1/16 which is about 275W. As such, the adoption of 48V power supply scheme is a future development trend.

At present, the power supply part in the power supply scheme of the mainstream whole cabinet server still radiates heat through air cooling, the power density is high due to the improvement of the power level of the server, and the cooling effect of radiating heat through air cooling is not ideal.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a server power supply board, a server power supply module and a server, aiming at the problem that the cooling effect is not ideal because the power supply part dissipates heat through air cooling in the existing server power supply scheme.

A server power board, the server motherboard submerged in a liquid-cooled environment, comprising:

the first end of the power supply circuit board is used for being electrically connected with a power supply bus, and the second end of the power supply circuit board is used for being electrically connected with the server mainboard; and

and the liquid cooling radiator is arranged adjacent to the power supply circuit board, and a medium in the liquid cooling environment flows through the liquid cooling radiator and radiates heat for the power supply circuit board.

In this embodiment, the liquid cooling radiator and the power supply circuit board are arranged adjacently, the server motherboard is immersed in a liquid cooling environment, and a medium in the liquid cooling environment flows through the liquid cooling radiator. When the power supply circuit board supplies power to the server mainboard, the liquid cooling radiator dissipates heat for the power supply circuit board, and therefore the heat dissipation effect is improved.

In one embodiment, the number of the power supply circuit boards is two, and the two power supply circuit boards are arranged in mirror symmetry with respect to the liquid-cooled heat sink.

In this embodiment, the number of the power supply circuit boards is two, and the two power supply circuit boards are arranged in mirror symmetry with respect to the liquid cooling heat sink, so that the total output power of the server power supply board can be further improved on the basis of heat dissipation.

In one embodiment, the power supply circuit board includes:

the first end of the hot plug circuit is electrically connected with the power supply bus; and

the power daughter card, the first end of power daughter card with the second end electricity of hot plug circuit is connected, the second end of power daughter card be used for with server mainboard electricity is connected, the third end of power daughter card with the third end electricity of hot plug circuit is connected, the power daughter card is used for server mainboard provides default voltage.

In this embodiment, by setting the hot plug circuit, when the power supply circuit board and the power supply bus perform hot plug action, the power supply circuit board is slowly powered on, so that the instantaneous impact current is reduced, and the rear-stage power daughter card is prevented from being damaged. Meanwhile, the power supply voltage provided by the power supply bus can be converted into the preset voltage required by the server mainboard through the power supply daughter card, and the reliability of power supply is improved.

In one embodiment, the hot plug circuit comprises:

the first end of the resistor is electrically connected with the power supply bus, and the second end of the resistor is electrically connected with the first end of the power supply daughter card;

a first end of the switch circuit is electrically connected with a first end of the resistor, and a second end of the switch circuit is electrically connected with a first end of the power daughter card; and

and the first end of the controller is electrically connected with the control end of the switch circuit, and the second end of the controller is electrically connected with the third end of the power daughter card.

In this embodiment, the resistor, the switch circuit and the controller cooperate to form a hot plug circuit, so that the instantaneous impact current is reduced when the power supply circuit board and the power supply bus perform hot plug action, thereby avoiding damaging the rear-stage input circuit.

In one embodiment, the power supply circuit board further includes:

and the first end of the capacitor is connected with the second end of the resistor and the first end of the power daughter card in a common mode, and the second end of the capacitor is electrically connected with the fourth end of the power daughter card.

In this embodiment, the capacitor is used to filter the power supply voltage provided by the power supply bus, so as to improve the anti-interference capability of the power supply voltage.

In one embodiment, the power supply circuit board further includes:

and the first end of the backflow prevention protection circuit is electrically connected with the second end of the power daughter card, and the second end of the backflow prevention protection circuit is used for being electrically connected with the server mainboard.

In this embodiment, the backflow prevention protection circuit is arranged at the second end of the power daughter card, so that the power supply circuit board is prevented from affecting the normal operation of the whole power supply module after being damaged, and the reliability of the system is improved.

In one embodiment, the server power board further includes:

the first connector is fixed on one side of the liquid cooling radiator, the first end of the first connector is used for being electrically connected with the power supply bus, and the second end of the first connector is electrically connected with the first end of the power supply circuit board; and

the second connector is fixed on one side of the liquid cooling radiator, the first end of the second connector is electrically connected with the second end of the power supply circuit board, and the second end of the second connector is used for being electrically connected with the server mainboard.

In this embodiment, through setting up first connector with the second connector, can be convenient for server power supply board fast with power supply bus with plug between the server mainboard, improve the installation effectiveness.

In one embodiment, the server power board further includes:

the positioning column is fixed on one side, close to the first connector, of the liquid cooling radiator; and

and the handle is fixed on one side, far away from the first connector, of the liquid cooling radiator.

In this embodiment, through setting up the reference column has guaranteed the interface location of server power supply board and power rack improves the security of plug. Through setting up the handle, can be convenient for with server power supply board inserts and extracts power rack.

A server power supply module is characterized by comprising a plurality of server power supply boards in any one of the above embodiments, and output ends of the plurality of server power supply boards are connected in parallel with each other.

In this embodiment, the liquid cooling radiator and the power supply circuit board are arranged adjacently, the server motherboard is immersed in a liquid cooling environment, and a medium in the liquid cooling environment flows through the liquid cooling radiator. When the server power supply module supplies power to the server mainboard, the liquid cooling radiator dissipates heat for the power supply circuit board, so that the heat dissipation effect of the server power supply module is improved.

A server, comprising:

the server power supply module of any of the above embodiments; and

the server mainboard is electrically connected with the server power supply module, the server mainboard is immersed in the liquid cooling environment, and a medium in the liquid cooling environment flows through the liquid cooling radiator and dissipates heat for the power supply circuit board.

In this embodiment, the liquid cooling radiator in the server power supply module is arranged adjacent to the power supply circuit board, the server motherboard is immersed in a liquid cooling environment, and a medium in the liquid cooling environment flows through the liquid cooling radiator. When the server power supply module supplies power to the server mainboard, the liquid cooling radiator dissipates heat for the power supply circuit board, so that the heat dissipation effect of the server power supply module is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a server power board according to an embodiment of the present application;

FIG. 2 is a block diagram of a circuit connection of a server power board according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a server power board according to another embodiment of the present application;

fig. 4 is a schematic structural diagram of a server power board according to yet another embodiment of the present application;

FIG. 5 is a schematic circuit diagram of a portion of a server power board according to an embodiment of the present application;

fig. 6 is a circuit block diagram of a server power supply module according to an embodiment of the present application;

fig. 7 is a circuit block diagram of a server according to an embodiment of the present application.

Description of reference numerals:

10. a server power supply board; 101. a server motherboard; 102. a power supply bus; 100. a power supply circuit board; 110. a hot plug circuit; 111. a resistance; 112. a switching circuit; 113. a controller; 120. a power daughter card; 130. a capacitor; 140. a backflow prevention protection circuit; 20. a server power supply module; 200. a liquid-cooled radiator; 210. a liquid inlet; 220. a liquid outlet; 30. a server; 300. a first connector; 310. a positioning column; 320. a handle; 400. a second connector.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and those skilled in the art will be able to make similar modifications without departing from the spirit of the application and it is therefore not intended to be limited to the embodiments disclosed below.

The numbering of the components as such, e.g., "first", "second", etc., is used herein for the purpose of describing the objects only, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be considered as limiting the present application.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 and fig. 2, an embodiment of the present application provides a server power board 10 applied to a server motherboard 101. The server motherboard 101 is immersed in a liquid-cooled environment. The server power supply board 10 includes: power supply circuit board 100 and liquid-cooled heat sink 200. The first end of the power supply circuit board 100 is used for electrically connecting with a power supply bus bar 102. The second end of the power supply circuit board 100 is used for electrically connecting with the server motherboard 101. The liquid cooling heat sink 200 is disposed adjacent to the power supply circuit board 100. The coolant medium in the liquid-cooled environment flows through the liquid-cooled heat sink 200 and dissipates heat to the power supply circuit board 100.

In one embodiment, the supply voltage provided by the supply bus 102 may be 380V dc voltage. Thus, the power supply voltage obtained by the first end of the power supply circuit board 100 is 380V dc voltage. In one embodiment, the first end of the power supply circuit board 100 may be electrically connected to the power supply bus bar 102 through a bus bar. Similarly, the second end of the power supply circuit board 100 may also be electrically connected to the server motherboard 101 through a bus bar.

It is understood that the specific circuit topology of the power supply circuit board 100 is not limited as long as the power supply circuit board has a function of converting the 380V dc voltage into the 48V dc voltage and outputting the 48V dc voltage to the server motherboard 101. In one embodiment, the power supply circuit board 100 may include a fuse, a hot swap circuit, a power conversion module, and a connector. The power supply circuit board 100 converts the power supply voltage provided by the power supply bus 102 into a 48V dc voltage and outputs the dc voltage to the server motherboard 101. The server mainboard 101 is powered by 48V direct-current voltage, so that transmission loss can be reduced, and the energy efficiency utilization rate is improved.

It is to be understood that the shape of the liquid-cooled heat sink 200 is not limited as long as it has a function of dissipating heat from the power supply circuit board 100. In one embodiment, the liquid-cooled heat sink 200 may be shaped as a rectangular parallelepiped. In one embodiment, the liquid-cooled heat sink 200 may be shaped in other plate configurations. In one embodiment, the disposing of the liquid-cooled heat sink 200 adjacent to the power supply circuit board 100 means: the liquid cooling heat sink 200 may be attached to the power supply circuit board 100. In one embodiment, the liquid-cooled heat sink 200 and the power supply circuit board 100 may be thermally conducted in other manners, as long as the liquid-cooled heat sink 200 can dissipate heat of the power supply circuit board 100. In one embodiment, the power supply circuit board 100 may be fixed to the liquid-cooled heat sink 200 by screws.

In one embodiment, the flowing of the coolant medium through the liquid-cooled heat sink 200 and dissipating heat to the power circuit board 100 in the liquid-cooled environment is: the coolant medium flowing through the liquid-cooled heat sink 200 flows out of the liquid-cooled environment. Specifically, the coolant medium in the liquid-cooled environment may flow in along the liquid inlet 210 of the liquid-cooled heat sink 200 and flow out along the liquid outlet 220 of the liquid-cooled heat sink 200. Wherein the coolant medium flowing out of the liquid outlet 220 can flow into the liquid cooling environment along a pipeline.

Meanwhile, a circulation pump may be provided, and the coolant medium may circulate between the liquid-cooled radiator 200 and the liquid-cooled environment through the circulation pump. Therefore, the refrigerant medium in the liquid cooling radiator 200 can be directly obtained from the liquid cooling environment, and meanwhile, the cooling circulation can be established by arranging the circulating pump, so that the heat dissipation effect can be improved, and the cooling cost can be reduced. In one embodiment, the cold medium may be a fluorinated liquid.

In this embodiment, the liquid cooling heat sink 200 and the power supply circuit board 100 are disposed adjacent to each other, and the server motherboard 101 is immersed in the liquid cooling environment, so that the cold medium in the liquid cooling environment flows through the liquid cooling heat sink 200. When the power supply circuit board 100 supplies power to the server motherboard 101, the power supply circuit board 100 is cooled by the liquid cooling radiator 200, so that the cooling effect is improved.

Referring to fig. 3, in an embodiment, the number of the power supply circuit boards 100 is two, and the two power supply circuit boards 100 are arranged in mirror symmetry with respect to the liquid-cooled heat sink 200. Specifically, the first surface of the liquid-cooled heat sink 200 is provided with one of the power supply circuit boards 100. The second surface of the liquid cooling heat sink 200 is provided with one of the power supply circuit boards 100. Wherein the first surface and the second surface are oppositely disposed.

In this embodiment, the number of the power supply circuit boards 100 is two, and the two power supply circuit boards 100 are arranged in mirror symmetry with respect to the liquid cooling heat sink 200, so that the two power supply circuit boards 100 can be cooled by one liquid cooling heat sink 200. Namely, the server power supply board 10 adopts the above structure, so that the total output power of the server power supply board 10 can be further improved on the basis of heat dissipation.

In one embodiment, the power supply module may include a plurality of the server power supply boards 10. For example, if the power of a single power supply circuit board 100 is 6KW, the structure of two power supply circuit boards 100 is adopted, so that the peak value of the total power of the server power supply board 10 can reach 12KW, thereby ensuring that the total output power of the server power supply board 10 is further increased on the basis of heat dissipation, and further increasing the overall output power of the power supply module.

In one embodiment, the server power board 10 further includes: a first connector 300 and a second connector 400. The first connector 300 is fixed to one side of the liquid-cooled heat sink 200. A first end of the first connector 300 is used for electrical connection with the power supply bus bar 102. The second end of the first connector 300 is electrically connected to the first end of the power supply circuit board 100. The second connector 400 is fixed to one side of the liquid-cooled heat sink 200. A first end of the second connector 400 is electrically connected to a second end of the power supply circuit board 100. A second end of the second connector 400 is used for electrically connecting with the server motherboard 101.

In one embodiment, the first connector 300 may be electrically connected to the power bus 102 through a bus bar. That is, the power supply circuit board 100 may be electrically connected to the corresponding bus bar of the power supply bus bar 102 through the first connector 300. Wherein, the first connector can be a quick plug connector. Similarly, the second connector 400 may be electrically connected to the server motherboard 101 through a bus bar. That is, the power supply circuit board 100 may be electrically connected to the corresponding bus bar of the server motherboard 101 through the second connector 400. In this embodiment, by providing the first connector 300 and the second connector 400, the server power supply board 100 can be conveniently plugged into and pulled out from the power supply bus 102 and the server motherboard 101, so as to improve the installation efficiency.

Referring to fig. 3 and 4, in an embodiment, the server power supply board 10 further includes: positioning post 310 and handle 320. The positioning post 310 is fixed on a side of the liquid-cooled heat sink 200 close to the first connector 300. The handle 320 is fixed to the liquid-cooled heat sink 200 at a side away from the first connector 300. In an embodiment, the positioning column 310 is disposed on a side of the liquid cooling heat sink 200 close to the first connector 300, so that the positioning of the interface between the server power supply board and the power cabinet can be ensured, and the plugging safety can be improved.

In one embodiment, the handle 320 is disposed on a side of the liquid-cooled heat sink 200 away from the first connector 300, so that the server power board 10 can be easily inserted into and pulled out of a power cabinet when the server power board 10 is plugged and pulled out.

Referring to fig. 5, in one embodiment, the power supply circuit board 100 includes: a hot plug circuit 110 and a power daughter card 120. The first end of the hot swap circuit 110 is used for electrically connecting with the power supply bus 102. The first end of the power daughter card 120 is electrically connected to the second end of the hot plug circuit 110. The second end of the power daughter card 120 is used for electrically connecting with the server motherboard 101. The third terminal of the power daughter card 120 is electrically connected to the third terminal of the hot plug circuit 110. The power daughter card 120 is configured to provide a preset voltage for the server motherboard 101.

It can be understood that the specific circuit topology of the hot-plug circuit 110 is not limited, as long as the function of reducing the transient impact current and avoiding damaging the subsequent input circuit is provided during the hot-plug process. In one embodiment, the hot plug circuit 110 may include a connector, a switch tube, a self-healing protection wire, and a controller. In one embodiment, the hot plug circuit 110 may also include: a resistor 111, a switching circuit 112, and a controller 113. Specifically, a first end of the resistor 111 is electrically connected to the power supply bus 102. The second end of the resistor 111 is electrically connected to the first end of the power daughter card 120. A first terminal of the switch circuit 112 is electrically connected to a first terminal of the resistor 111. The second end of the switch circuit 112 is electrically connected to the first end of the power daughter card 120. A first terminal of the controller 113 is electrically connected to a control terminal of the switch circuit 112. The second terminal of the controller 113 is electrically connected to the third terminal of the power daughter card 120.

In one embodiment, the number of the resistors 111 may be plural, and the plural resistors 111 may be connected in series and/or in parallel with each other. The instantaneously generated surge current can be limited by the resistor 111. It is understood that the specific structure of the switch circuit 112 is not limited as long as the controller 113 can control the on and off of the switch circuit 112. In one embodiment, the switch circuit 112 may be an IGBT (Insulated Gate Bipolar Transistor). In one embodiment, the switch circuit 112 may also be a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET).

In one embodiment, the controller 113 may be an MCU (micro control unit), and the controller 113 may also be an integrated control chip. In this embodiment, the resistor 111, the switch circuit 112, and the controller 113 cooperate to form the hot plug circuit 110, so that when the hot plug action is performed between the power supply circuit board 100 and the power supply bus 102, the transient impulse current is reduced, thereby avoiding damage to the rear-stage input circuit.

In one embodiment, the number of the power daughter cards 120 may be plural, and a plurality of the power daughter cards 120 are connected in parallel. The output power of the power source sub-cards 120 connected in parallel may be expanded, and the specific output power may be set according to the output power of each power source sub-card 120. If the output power of each power daughter card 120 is 600W, the total output power of 5 power daughter cards 120 is 3 KW. In addition, the power daughter cards 120 support parallel applications, and several other power daughter cards 120 may operate normally when a single power daughter card 120 fails, so that power supply reliability may be improved.

In one embodiment, the power supply voltage provided by the power supply bus 102 is converted into the preset voltage required by the server motherboard 101 through the power daughter card 120, so that the reliability of power supply can be improved. In one embodiment, the preset voltage may be 48V dc voltage.

In one embodiment, the power supply circuit board 100 further includes: a capacitor 130. The first terminal of the capacitor 130 is connected to the second terminal of the resistor 111 and the first terminal of the power daughter card 120. The second terminal of the capacitor 130 is electrically connected to the fourth terminal of the daughter power card 120. In this embodiment, the capacitor 130 may be used to filter the power supply voltage provided by the power supply bus 102, so as to improve the anti-interference capability of the audience rating power supply voltage.

In one embodiment, the power supply circuit board 100 further includes: the backflow prevention protection circuit 140. The first end of the backflow prevention protection circuit 140 is electrically connected to the second end of the power daughter card 120. The second end of the backflow prevention protection circuit 140 is used for electrically connecting with the server motherboard 101. In one embodiment, the anti-backflow protection circuit 140 may be a backward diode. In this embodiment, the backflow prevention protection circuit 140 is disposed at the second end of the power daughter card 120, so that the power supply circuit board 100 is prevented from affecting the normal operation of the whole power supply module after being damaged, and the reliability of the system is improved.

Referring to fig. 6, another embodiment of the present application provides a server power supply module 20. The server power supply module 20 includes a plurality of server power supply boards 10 as described in any of the above embodiments, and output ends of the plurality of server power supply boards are connected in parallel with each other.

In one embodiment, the server power supply module 20 may include 10 server power supply boards 10. In one embodiment, if the number of the power supply circuit boards 100 in the server power supply board 10 is two, and the power of each power supply circuit board 100 is 6KW, the peak value of the total power of each server power supply board 10 is 12 KW. Whereas the power required for the server motherboard 101 is 80 KW. In this way, the server power supply module 20 makes redundancy for the entire power supply while fully meeting the power requirement of the blade server (the blade server includes the server motherboard 101), so as to improve the stability and reliability of the system operation.

In the server power supply module 20 of this embodiment, the liquid cooling heat sink 200 and the power supply circuit board 100 are disposed adjacent to each other, and the server motherboard 101 is immersed in the liquid cooling environment, so that the cold medium in the liquid cooling environment flows through the liquid cooling heat sink 200. When the power supply circuit board 100 supplies power to the server motherboard 101, the liquid cooling radiator 200 radiates heat to the power supply circuit board 100, so that the heat radiation effect of the server power supply module 20 is improved.

Referring to fig. 7, another embodiment of the present application provides a server 30. The server 30 includes: the server power supply module 20 and the server motherboard 101 described in any of the above embodiments. The server mainboard 101 is electrically connected with the server power supply module. The server motherboard 101 is immersed in a liquid-cooled environment, and a coolant medium in the liquid-cooled environment flows through the liquid-cooled heat sink 200 and dissipates heat to the power supply circuit board 100. In one embodiment, the server 30 may be a blade server.

In the server 30 of this embodiment, the liquid-cooled heat sink 200 in the server power supply module 20 is disposed adjacent to the power supply circuit board 100, and the server motherboard 101 is immersed in a liquid-cooled environment, and a refrigerant medium in the liquid-cooled environment flows through the liquid-cooled heat sink 200. When the server power supply module 20 supplies power to the server motherboard 101, the liquid cooling heat sink 200 dissipates heat to the power supply circuit board 100, so that the heat dissipation effect of the server 30 is improved.

To sum up, this application will liquid cooling radiator 200 with power supply circuit board 100 is adjacent to be set up, and will server mainboard 101 submergence is in the liquid cooling environment, simultaneously the coolant medium flows through in the liquid cooling environment in the liquid cooling radiator 200. When the power supply circuit board 100 supplies power to the server motherboard 101, the power supply circuit board 100 is cooled by the liquid cooling radiator 200, so that the cooling effect is improved.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a server power supply board, server mainboard submergence in the liquid cooling environment which characterized in that includes:

2. The server power board of claim 1, wherein the number of power supply circuit boards is two, and two of the power supply circuit boards are arranged mirror-symmetrically with respect to the liquid-cooled heat sink.

3. The server power board of claim 1, wherein the power supply circuit board comprises:

4. The server power board of claim 3, wherein the hot-plug circuit comprises:

5. The server power board of claim 4, wherein the power circuit board further comprises:

6. The server power board of claim 3, wherein the power circuit board further comprises:

7. The server power board of claim 1, further comprising:

8. The server power supply board of claim 7, further comprising:

9. A server power supply module comprising a plurality of server power supply boards according to any one of claims 1 to 8, wherein the output terminals of the plurality of server power supply boards are connected in parallel with each other.

10. A server, comprising:

the server power module of claim 9; and