CN210167379U - Deep ultraviolet LED encapsulation support - Google Patents
Deep ultraviolet LED encapsulation support Download PDFInfo
- Publication number
- CN210167379U CN210167379U CN201921534851.9U CN201921534851U CN210167379U CN 210167379 U CN210167379 U CN 210167379U CN 201921534851 U CN201921534851 U CN 201921534851U CN 210167379 U CN210167379 U CN 210167379U
- Authority
- CN
- China
- Prior art keywords
- base
- box dam
- boss
- ultraviolet led
- deep ultraviolet
- Prior art date
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 6
- 239000011230 binding agent Substances 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- -1 polytetrafluoroethylene Polymers 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 4
- 238000004659 sterilization and disinfection Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model provides a deep ultraviolet LED encapsulation support, belongs to deep ultraviolet LED technical field, solves current deep ultraviolet LED electro-optic conversion inefficiency, chip performance easily receive heat to gather technical problem such as influence, luminous power low. The utility model adopts the technical proposal that: the utility model provides a dark ultraviolet LED encapsulates support, includes base, box dam and establishes the binder between base and box dam, wherein: a boss is arranged in the middle of the top surface of the base; the middle part of the box dam is of a hollow structure, the lower part of the hollow structure is provided with a through hole matched with the boss, and the periphery of the upper part of the hollow structure is an inclined plane; the box dam is arranged above the base, and the top of the boss is arranged in the through hole of the box dam. The utility model has the advantages of high electro-optic conversion efficiency, good heat-conducting property, stable structure and the like.
Description
Technical Field
The utility model belongs to the technical field of dark ultraviolet LED, concretely relates to dark ultraviolet LED encapsulation support.
Background
Deep ultraviolet LEDs are used in a wide variety of applications, such as sterilization, disinfection, water purification, medical care, and the like. The high-power deep ultraviolet LED lamp bead can meet better use requirements. However, the deep ultraviolet LED has low electro-optic conversion efficiency, the performance of the chip is affected by heat accumulation, and ultraviolet light emitted by the deep ultraviolet LED is easily absorbed or blocked, which greatly affects the optical power, so that a support with high thermal conductivity and good reflection function is required.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's shortcoming, provide a dark ultraviolet LED encapsulation support, solve current dark ultraviolet LED electro-optic conversion inefficiency, chip performance easily receive heat to gather technical problem such as influence, luminous power hang down.
In order to solve the technical problem, the utility model discloses a technical scheme does:
the utility model provides a dark ultraviolet LED encapsulates support, includes base, box dam and establishes the binder between base and box dam, wherein:
a boss is arranged in the middle of the top surface of the base, and bonding table surfaces are arranged on the top surface of the base and around the boss;
the middle part of the box dam is of a hollow structure, the lower part of the hollow structure is provided with a through hole matched with the boss, the periphery of the upper part of the hollow structure is provided with an inclined surface, and the size of the upper part of the hollow structure is larger than that of the lower part of the hollow structure;
the box dam is arranged above the base, the top of the boss is arranged in the through hole of the box dam, and the adhesive is arranged between the bottom surface of the box dam and the adhesive table surface of the base; the outer edge of the box dam is flush with the outer edge of the base;
the boundary surface of the dam and the adhesive is lower than the top surface of the boss.
Further, the manufacturing material of the box dam is polytetrafluoroethylene; the base is made of aluminum nitride ceramics.
Further, the boss is made into a round shape or a square shape according to the size of the deep ultraviolet LED chip.
The interface of the combination of the intermediate box dam and the binder is lower than the top surface of the boss, so that the deep ultraviolet can not irradiate on the binder, the binder can not be yellowed and cracked due to the action of ultraviolet, and the combination strength of the box dam and the base can be ensured; the box dam is made of a novel polytetrafluoroethylene material, has a good reflection effect on deep ultraviolet light, does not absorb ultraviolet light, and ensures light emission of the deep ultraviolet chip to a great extent; the light emitted from the side surface of the deep ultraviolet chip is totally reflected by the inclined surface, so that a higher light emitting effect is achieved; the base is made of aluminum nitride ceramics and has high heat conduction characteristic. Compared with the prior art, the utility model has the advantages of the electro-optic conversion efficiency is high, heat conductivility is good, stable in structure.
Drawings
Fig. 1 is a top view of the present invention;
fig. 2 is a schematic sectional structure of the present invention;
fig. 3 is a schematic view of the exploded state of the present invention.
Detailed Description
The present invention will be further explained with reference to the drawings and examples.
As shown in fig. 1 to 3, a deep ultraviolet LED package support in this embodiment includes a base 1, a dam 2, and an adhesive 3 disposed between the base 1 and the dam 2, wherein:
a boss 1-1 is arranged in the middle of the top surface of the base 1, and a bonding table surface 1-2 is arranged on the top surface of the base 1 and around the boss 1-1;
the middle part of the box dam 2 is of a hollow structure, the lower part of the hollow structure is provided with a through hole 2-1 matched with the boss 1-1, the periphery of the upper part of the hollow structure is provided with an inclined surface 2-2, and the size of the upper part of the hollow structure is larger than that of the lower part of the hollow structure;
the box dam 2 is arranged above the base 1, the top of the boss 1-1 is arranged in the through hole 2-1 of the box dam 2, the adhesive 3 is arranged between the bottom surface of the box dam 2 and the adhesive table top 1-2 of the base 1, and the outer edge of the box dam 2 is flush with the outer edge of the base 1;
the combination interface of the dam 2 and the adhesive 3 is lower than the top surface of the boss 1-1.
Further, the manufacturing material of the box dam 2 is polytetrafluoroethylene; the base 1 is made of aluminum nitride ceramics.
Further, the boss 1-1 is made into a round shape or a square shape according to the size of the deep ultraviolet LED chip.
The utility model discloses a use:
when the device is used, the deep ultraviolet chip is placed on the top surface of the boss 1-1 in the middle of the box dam 2, and as the combined interface of the box dam 2 and the adhesive 3 is lower than the top surface of the boss 1-1, the deep ultraviolet cannot irradiate the adhesive 3, the adhesive 3 cannot be damaged, and the adhesive strength between the box dam 2 and the base 1 is ensured; the box dam 2 is made of a novel polytetrafluoroethylene material, has a good reflection effect on deep ultraviolet light, does not absorb ultraviolet light, and ensures light emission of the deep ultraviolet chip to a great extent, so that all light emitted by the deep ultraviolet chip is reflected by the inclined plane 2-2, and a higher light emission effect is achieved; the base 1 is made of aluminum nitride ceramics and has high heat conduction characteristic.
Claims (3)
1. The utility model provides a dark ultraviolet LED encapsulation support, includes base (1), box dam (2) and establishes binder (3) between base (1) and box dam (2), its characterized in that:
a boss (1-1) is arranged in the middle of the top surface of the base (1), and bonding table tops (1-2) are arranged on the top surface of the base (1) and the periphery of the boss (1-1);
the middle part of the box dam (2) is of a hollow structure, the lower part of the hollow structure is provided with a through hole (2-1) matched with the boss (1-1), the periphery of the upper part of the hollow structure is provided with an inclined plane (2-2), and the size of the upper part of the hollow structure is larger than that of the lower part of the hollow structure;
the box dam (2) is arranged above the base (1), the top of the boss (1-1) is arranged in a through hole (2-1) of the box dam (2), and the binder (3) is arranged between the bottom surface of the box dam (2) and the binding table top (1-2) of the base (1); the outer edge of the dam (2) is flush with the outer edge of the base (1);
the bonding interface of the box dam (2) and the adhesive (3) is lower than the top surface of the boss (1-1).
2. The deep ultraviolet LED package support of claim 1, wherein: the manufacturing material of the box dam (2) is polytetrafluoroethylene; the base (1) is made of aluminum nitride ceramics.
3. The deep ultraviolet LED package support of claim 1, wherein: the boss (1-1) is made into a round shape or a square shape according to the size of the deep ultraviolet LED chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921534851.9U CN210167379U (en) | 2019-09-16 | 2019-09-16 | Deep ultraviolet LED encapsulation support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921534851.9U CN210167379U (en) | 2019-09-16 | 2019-09-16 | Deep ultraviolet LED encapsulation support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210167379U true CN210167379U (en) | 2020-03-20 |
Family
ID=69796534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921534851.9U Active CN210167379U (en) | 2019-09-16 | 2019-09-16 | Deep ultraviolet LED encapsulation support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210167379U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110504347A (en) * | 2019-09-16 | 2019-11-26 | 北京中科优唯科技有限公司 | A kind of deep ultraviolet LED package support |
-
2019
- 2019-09-16 CN CN201921534851.9U patent/CN210167379U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110504347A (en) * | 2019-09-16 | 2019-11-26 | 北京中科优唯科技有限公司 | A kind of deep ultraviolet LED package support |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240612 Address after: 046000 Zhangze New Industrial Park, Changzhi High-tech Zone, Shanxi Province Patentee after: SHANXI ZHONGKE ADVANCED ULTRAVIOLET OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Country or region after: China Address before: No.1, Lingang Second Road, Shunyi Park, Zhongguancun Science and Technology Park, Shunyi District, Beijing Patentee before: BEIJING ZHONGKE YOUWILL TECHNOLOGY Co.,Ltd. Country or region before: China |