CN210167332U - Silicon chip washs driping device and washs drying device - Google Patents
Silicon chip washs driping device and washs drying device Download PDFInfo
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- CN210167332U CN210167332U CN201921171074.6U CN201921171074U CN210167332U CN 210167332 U CN210167332 U CN 210167332U CN 201921171074 U CN201921171074 U CN 201921171074U CN 210167332 U CN210167332 U CN 210167332U
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Abstract
The utility model discloses a silicon wafer cleaning and draining device and a cleaning and drying device, which comprises a basket tool, a draining bracket, a lifting mechanism and a drying bracket; the draining support is provided with a draining inclined plane, and the drying support is provided with a drying inclined plane; the drying bracket is arranged at the bottom of the drying groove, and the draining bracket is arranged in the cleaning groove and can lift relative to the cleaning groove; the bottom of the flower basket tool can be obliquely placed on the draining inclined plane or the drying inclined plane, and the flower basket tool is used for arranging silicon wafers. Through the change of the shape during and after the transportation, the water residue moves among the silicon wafers, the water body tension is damaged, and the water residue is reduced. This application enables abluent silicon chip, before the stoving, carries out the waterlogging caused by excessive residual water fast, and the dry time is saved to the waterlogging caused by excessive droing of driping, is guaranteeing to dry under the prerequisite of quality, improves the productivity. Meanwhile, before drying, no water remains at the bottom of the silicon wafer, so that the drying time is further saved, and the drying effect is improved.
Description
Technical Field
The utility model relates to a silicon chip washs technical field, especially a silicon chip washs drain device and washs drying device.
Background
With the continuous development of world economy, the demand of modern construction for high-efficiency energy is continuously increased. Photovoltaic power generation is increasingly valued by countries in the world and is vigorously developed as a green energy source and one of the main energy sources for sustainable development of human beings. The monocrystalline silicon wafer is used as a basic material for photovoltaic power generation and has wide market demand.
At present, silicon wafer cleaning is used as the last production process before silicon wafer process detection, and high decontamination and drying capabilities are key indexes of silicon wafer cleaning capability. When the existing silicon wafer is cleaned in the cleaning tank, the silicon wafer is transferred among a plurality of cleaning tanks and/or drying boxes by means of a basket tool. After the silicon wafer is cleaned in the cleaning tank, the flower basket tool is lifted upwards from the cleaning tank, and large-area water residues are left at the bottom of the silicon wafer. When the silicon wafer with large-area water residues is transferred into a drying box to be dried, the drying time is prolonged, and the drying efficiency is reduced. In addition, under the pressure of the productivity, the decontamination and drying conditions are more severe, the beat time of the productivity given to the stage is shorter and shorter, the cleaning capability is inevitably reduced, and the drying capability is also reduced.
Therefore, the beat and the action are fully utilized in the process, and the original cleaning quality is ensured while the production energy is released, which is very important.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is not enough to above-mentioned prior art, and provide a silicon chip washs drain device, this silicon chip washs drain device and enables abluent silicon chip, carries out the waterlogging caused by excessive water logging fast, and the unnecessary residual water is removed in the waterlogging caused by excessive rainfall, improves the productivity. Meanwhile, after the silicon wafer leaves the cleaning medium, the water body residue at the bottom of the silicon wafer can be further reduced.
In order to solve the technical problem, the utility model discloses a technical scheme is:
a silicon wafer cleaning and draining device comprises a cleaning tank, a draining bracket and at least one basket fixture; the cleaning tank is filled with a cleaning medium, the draining support and at least one basket fixture are positioned in the cleaning tank, the basket fixture is used for arranging a silicon wafer, the draining support is provided with at least one draining inclined plane forming a first included angle with the liquid level of the cleaning medium, and the basket fixture is matched with the draining inclined plane; the draining support can lift relative to the cleaning tank, and drives the supported basket fixture to lift, so that a second included angle is formed between at least one edge, close to the bottom of the cleaning tank, of the silicon wafer of the basket fixture and the liquid level of the cleaning medium; the first included angle and the second included angle are both larger than 0 degree and smaller than 90 degrees.
The first included angle and the second included angle are both 1-30 degrees.
The first included angle and the second included angle are both 3-10 degrees.
The draining support comprises two draining rods which are oppositely arranged, the draining inclined plane is located on one side, away from the bottom of the cleaning tank, of the draining rod, the draining inclined planes of the two draining rods are corresponding, and the flower basket tool is supported between the two draining rods and matched with the draining inclined planes of the two draining rods.
Every drips and all has a plurality of driping inclined planes, and a plurality of driping inclined planes are laid along the length direction parallel of driping pole, and the quantity of basket of flowers frock is less than or equal to the quantity on the driping inclined plane of every driping pole.
The draining support also comprises at least one connecting side rod which is connected between the two draining rods.
The silicon wafer cleaning and draining device also comprises two parallel air shower pipes, the two air shower pipes are oppositely arranged at the top of the cleaning tank, and one side of each air shower pipe, which faces the flower basket tool, is provided with a plurality of air outlets; every wind drenches the high homoenergetic of pipe and goes up and down relative washing tank, and every wind drenches the pipe homoenergetic and rotates and make self location around self axis in the vertical plane that corresponds.
The silicon wafer cleaning and draining device further comprises a lifting mechanism, the lifting mechanism can lift and transfer the flower basket tool on the draining inclined plane relative to the cleaning tank.
The lifting mechanism comprises two hook plates and a lifting moving device.
The lifting and moving device can enable the two hook plates to realize transverse, longitudinal and vertical three-dimensional movement.
Each hook plate is provided with at least one hook groove.
The flower basket tool comprises two parallel mounting side plates, and each mounting side plate is provided with at least one convex hook; the convex hook on the mounting side plate can be mutually hooked with the hook groove on the corresponding side hook plate.
The bottom of each hook plate is provided with a plurality of hook grooves which are positioned at the same height.
When a flower basket tool is placed on each draining inclined plane, the hook grooves on the hook plates can be hooked with all the convex hooks on the side plates mounted on the same side.
The lifting moving device comprises a transverse slide rail, a linear lifting motor, a lifting support frame and a cylinder.
A linear motor shaft of the linear lifting motor can realize vertical height lifting, and can realize transverse sliding along the transverse sliding rail under the action of the driving device; the lifting support frame is horizontally arranged on a linear motor shaft, the air cylinder is arranged on the lifting support frame, and the hook plate is connected with the corresponding air cylinder and driven by the air cylinder to realize longitudinal sliding.
The utility model also provides a silicon chip washs drying device, this silicon chip washs drying device enables abluent silicon chip, before drying, carries out the waterlogging caused by excessive residual water of waterlogging caused by excessive rainfall fast, and the waterlogging caused by excessive rainfall of waterlogging caused by excessive rainfall is removed to the waterlogging caused by excessive rainfall, saves the stoving time, is guaranteeing under the prerequisite of drying quality, improves the productivity. Meanwhile, before drying, no water remains at the bottom of the silicon wafer, so that the drying time is further saved, and the drying effect is improved.
The utility model provides a silicon chip washs drying device, includes drying tank and silicon chip washing drain device, has the stoving support in the drying tank, and the stoving support has the stoving inclined plane that becomes the third contained angle with cleaning medium liquid level in the washing tank, and the slope direction that stoving inclined plane and drain inclined plane compare in the cleaning medium liquid level is the same/opposite.
The utility model discloses following beneficial effect has:
1. the setting of above-mentioned basket of flowers frock enables abluent silicon chip, before the stoving, carries out the waterlogging caused by excessive residual water of waterlogging caused by excessive drippage fast, and the stoving time is saved, is guaranteeing under the prerequisite of stoving quality, improves the productivity.
2. Above-mentioned drying support and the setting of driping the pole enable the silicon chip that is arranged in the basket of flowers frock, before breaking away from the surface of water, break away from the surface of water after, when the transport and the transport after placing the in-process, the state of silicon chip is: the water body at the bottom of the silicon chip is damaged by the tension of the water body, and the water residue is reduced. Therefore, before drying, no water remains at the bottom of the silicon wafer, so that the drying time is further saved, and the drying effect is improved.
3. The inclination direction of the slope surface in the drying support is opposite to the inclination direction of the slope surface in the draining rod, and in the processes of being separated from the water surface, being carried and being placed, the silicon wafer has large state change amplitude and large water body tension damage amplitude, so that the water body residue at the bottom of the silicon wafer is further effectively reduced, the drying time is saved, and the drying effect is improved.
4. The air shower pipe is arranged, so that the silicon wafer in the flower basket tool can be air-dried when being separated from the water surface, the drying time is saved, and the drying effect is improved.
5. The silicon chip drying machine has the advantages that the silicon chip can be dried through cleaning and draining, automatic operation is achieved, manual participation is not needed, the automation degree is high, the productivity takt time is kept up, and the productivity is improved.
Drawings
Fig. 1 shows the overall structure schematic diagram of the silicon wafer cleaning and drying device of the present invention.
FIG. 2 shows a schematic structural diagram of a silicon wafer and a flower basket tool.
Fig. 3 shows a schematic structure of two drying bars.
Figure 4 shows a schematic view of a first embodiment of a draining rack.
Figure 5 shows a schematic view of a second embodiment of a draining rack.
Fig. 6 shows a schematic structure of two air shower pipes.
Fig. 7 shows a schematic view of the structure of two hanger plates.
FIG. 8 shows a schematic diagram of water residue at the bottom of a silicon wafer during a transportation process after the silicon wafer is cleaned in the prior art.
FIG. 9 shows the residual water in the bottom of the silicon wafer during the transportation process after the cleaning of the silicon wafer.
FIG. 10 shows another embodiment of a silicon wafer disposed in a lift basket.
Among them are:
11. a drying box; 12. a box cover; 13. drying the bracket;
20. a cleaning tank;
30. draining the scaffold; 31. draining the rod; 311. draining the inclined surface; 32. connecting side rods; 33. a vertical support frame; 34. connecting the cross bars; 35. a reinforcing cross bar;
40. a flower basket tool; 41. installing a side plate; 411. a convex hook is hung; 42. a draining side plate;
50. a silicon wafer; 51. inserting and connecting mounting points;
60. a lifting mechanism; 61. a linear lifting motor; 62. lifting the support frame; 63. an inverted T-shaped hook; 631. a hook groove; 64. a cylinder;
70. a wind showering pipe; 71. and (7) air outlet.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific preferred embodiments.
In the description of the present invention, it should be understood that the terms "left side", "right side", "upper part", "lower part" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for convenience of description and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, "first", "second" and the like do not indicate the degree of importance of the component parts, and thus, are not to be construed as limiting the present invention. The specific dimensions used in the present embodiment are only for illustrating the technical solution, and do not limit the protection scope of the present invention.
As shown in fig. 1, a silicon wafer cleaning and draining device includes a cleaning tank 20, a draining support 30, a basket fixture 40, a lifting mechanism 60 and a wind showering pipe 70.
The silicon wafer cleaning and draining device mainly drains silicon wafers 50 cleaned from a cleaning tank 20 before the silicon wafers enter a drying tank for drying.
The cleaning tank 20 contains a cleaning medium, and the draining support 30 and the at least one flower basket fixture 40 are located in the cleaning tank 20.
The draining bracket 30 includes draining rods 31, and the number of the draining rods 31 is preferably two parallel to each other and oppositely disposed, but may be one or more. And the two draining rods 31 are preferably parallel to the bottom edge of the silicon wafer inserted in the basket fixture 40.
Each of the draining bars 31 can be elevated in the height direction of the wash bowl 20.
Each draining rod 31 has at least one draining inclined plane 311 forming a first angle with the surface of the washing medium, the draining inclined plane 311 preferably being arranged on the side of each draining rod 31 remote from the bottom of the washing tub 20.
The draining inclined surfaces 311 of the two draining rods 31 correspond to each other, and the basket fixture 40 is supported between the two draining rods 31 and matched with the draining inclined surfaces 311 of the two draining rods 31.
The number of the draining inclined surfaces 311 is set as needed. That is, each of the draining bars 31 may have a plurality of draining inclined planes 311, and the plurality of draining inclined planes 311 are arranged in parallel along the length direction of the draining bar 31 to form a step shape like a bottom surface level. In the cleaning tank 20, the number of the basket fixture 40 is less than or equal to the number of the draining inclined surfaces 311 of each draining rod 31.
The specific structure of the draining rack 30 is various, and three application examples are described below.
Application example 1
As shown in fig. 4, the draining bracket 30 includes two draining rods 31 and two connecting side rods 32. The two draining rods 31 are oppositely arranged, and the draining inclined surfaces 311 on the two draining rods 31 are inclined in the same direction. The two side connecting rods 32 are oppositely arranged and connected between the two draining rods 31. Alternatively, the number of the connecting-side rods 32 may be one, and one connecting-side rod 32 is connected between the two draining rods 31.
The high lift of draining support 30 is ripe prior art, like setting up in the stoving case 11 outside with draining support 30 matched with electromagnetic absorption circle, the glass that the absorption principle can refer to market purchase wipes. A lifting rod or the like may be disposed below the draining support 30, all of which are within the scope of the present application.
Application example 2
As shown in fig. 5, the draining bracket 30 includes two draining rods 31, two connecting side rods 32, a vertical supporting frame 33, a connecting cross rod 34 and a reinforcing cross rod 35.
Two driping pole 31, two side connection pole 32 splice each other and form the underframe, and vertical support frame 33 bottom is connected with one of them driping pole 31 top, and vertical support frame 33 top is connected with enhancement horizontal pole 35, and it is connected with vertical drive arrangement that slides to strengthen horizontal pole 35 through connecting horizontal pole 34, and vertical drive arrangement that slides is ripe prior art, can be motor, cylinder etc..
Application example 3
Each draining support 30 is driven by a lifting driving device which is arranged at the bottom, the side wall or the top of the cleaning tank 20, and the two lifting driving devices can be synchronously lifted.
As shown in fig. 1 and 2, the bottom of the basket fixture 40 can be obliquely placed on each draining inclined surface 311, the basket fixture 40 is used for arranging silicon wafers 50, and at least one basket fixture 40 is provided.
The silicon wafer 50 is inserted into the basket fixture 40, and two sides of the silicon wafer 50 and the draining side plate 42 are provided with inserting mounting points 511.
The arrangement mode of the silicon wafer 50 in the basket tool 40 mainly comprises the following two modes:
1. the edge of the silicon wafer 50 close to the bottom of the cleaning tank 20, referred to as the bottom edge of the silicon wafer, is parallel to the draining bottom plate of the basket fixture 40, and if the silicon wafer 50 is quadrilateral as shown in fig. 2, when the basket fixture 40 is placed on the draining inclined plane 311, the bottom edge of the silicon wafer is parallel to the draining inclined plane 311, and a second included angle formed between the edge of the silicon wafer 50 close to the bottom of the cleaning tank 20 and the liquid level of the cleaning medium is equal to the first included angle.
2. As shown in FIG. 10, a sharp corner of the pentagonal silicon wafer is opposite to the draining bottom plate of the basket fixture 40. at this time, the silicon wafer 50 has two bottom edges close to the cleaning tank 20, and the two bottom edges have a certain angle with the draining bottom plate itself. when the basket fixture 40 is placed on the draining inclined surface 311, the included angles formed between the two bottom edges close to the cleaning tank 20 and the liquid level of the cleaning medium are β and γ (one of the two included angles is the second included angle), respectively, as can be seen from FIG. 10, β and γ are not equal to the first included angle α, that is, the second included angle is not equal to the first included angle.
Wherein, the first included angle and the second included angle are both larger than 0 degree and smaller than 90 degrees, and are both preferably 1-30 degrees, and are further both preferably 3-10 degrees. The first included angle is too small, and the moisture at the bottom of the silicon wafer 50 is much remained; the first angle is large, which is likely to cause the silicon wafer 50 to be dirty and water to remain. To find the appropriate angle for the first included angle, the applicant performed multiple trial and error verifications.
The specific verification method comprises the following steps: and (3) detecting the water residue and the pollutant residue on the surface of the cleaned silicon wafer 50 by adopting image recognition equipment according to the first included angles at different angles, wherein if the water residue and the pollutant residue can be observed in the collected images by the image recognition equipment, the silicon wafer 50 is judged to be a defective product. Thus, the applicant determined the following data for the detection of more than 500 silicon wafers 50:
| first included angle (°) | 0 | 3 | 5 | 8 | 10 | 15 |
| Fraction defective | 0.7% | 0.2% | 0.07% | 0.15% | 0.15% | 0.47% |
As can be seen from the above table, the reject ratio is the smallest and not more than 0.2% when the first included angle is 3-10 deg.
The flower basket fixture 40 is mainly formed by enclosing two mounting side plates 41, two draining side plates 42 and a draining bottom plate (not shown in the figure).
The two side mounting plates 41 are preferably parallel to the silicon wafer 50, and each side mounting plate 41 is provided with at least one, preferably two, male hooks 411, which are preferably located at the same height.
The two draining side plates 42 and the draining base plate are preferably integrally formed. Both draining side plates 42 are preferably parallel to the length direction of the flower basket fixture 40. The draining side plate 42 is opposite to the hot air outlet of the drying box 11.
Above-mentioned hoist mechanism 60 can set up according to on-the-spot actual conditions needs, and is not high to requiring, if experimental requirement or condition do not possess the circumstances, hoist mechanism 60 can not add, adopts the manual work to carry out the transfer of basket of flowers frock 40, also belongs to within the scope of protection of this application.
The lifting mechanism 60 preferably includes two hanger plates and a lifting movement device.
The lifting and moving device can enable the two hook plates to realize three-dimensional movement in the X direction (transverse direction), the Y direction (longitudinal direction) and the Z direction (vertical direction).
In the present application, the drying box 11 and the cleaning tank 20 are preferably disposed on the same axis, and only the linear movement in the X direction, the Y direction, and the Z direction is required. When the drying compartment 11 and the washing tub 20 have an angular arrangement, the lifting and moving means may adopt a robot structure.
Each hook plate is provided with at least one hook groove 631, and the convex hook 411 on the installation side plate 41 can be mutually hooked with the hook groove 631 on the corresponding side hook plate.
In the present application, as shown in fig. 7, each hook plate is preferably an inverted T-shaped hook plate 63, and the bottom of the inverted T-shaped hook plate is provided with a plurality of hook grooves 631 located at the same height. The width of the vertical edge of the inverted T-shaped hook plate is preferably smaller than the distance between the two male hooks 411 on the installation side plate 41. Alternatively, the inverted T-shaped hook plate may have other shapes such as an L-shape or a U-shape, and the like, and is within the protection scope of the present application.
When a basket fixture 40 is placed on each draining inclined surface 311, the hook grooves 631 on the inverted-T-shaped hook plate can be hooked with all the convex hook hooks 411 on the installation side plate 41 on the same side.
The number of the hook grooves 631 is determined according to the number of the slope surfaces and the male hook 411. Assuming that the top of the drain bar 31 has n drain inclined surfaces 311, the number of the male hooks 411 on each mounting side plate 41 is a, when the distance between two adjacent male hooks 411 is relatively short, only one hook groove 631 is needed, and thus, the number of the hook grooves 631 is less than or equal to (a × n).
The lift moving means preferably includes a lateral slide rail, a linear lift motor 61, a lift support frame 62 and a cylinder 64.
A linear motor shaft of the linear lifting motor 61 can realize vertical height lifting, can realize transverse sliding along a transverse sliding rail under the action of a driving device, and is preferably a motor or a cylinder and the like; the lifting support frame 62 is horizontally arranged on a linear motor shaft, the air cylinder is arranged on the lifting support frame 62, and the hook plate is connected with the corresponding air cylinder and is driven by the air cylinder to realize longitudinal sliding.
Further, this application still preferably includes two wind shower pipes 70 that are parallel to each other as shown in fig. 6, and two wind shower pipes 70 all set up at the top of washing tank 20, and every wind shower pipe 70 all is provided with a plurality of air outlets 71 towards one side of basket frock 40. The height of each air shower pipe 70 can preferably be lifted relative to the cleaning tank 20, and each air shower pipe 70 can preferably rotate around the axis of the air shower pipe and position the air shower pipe per se in the corresponding vertical plane.
A silicon wafer cleaning and draining method comprises the following steps:
1) a silicon wafer 50 and a silicon wafer cleaning and draining apparatus as described above are provided.
2) The silicon wafer 50 is set in the cleaning bath 20 using the basket fixture 40.
3) The basket fixture 40 is matched with the draining inclined plane 311 of the draining bracket 30, and the silicon wafer 50 is arranged in the basket fixture 40 in the two setting modes. The edge of the silicon wafer 50 near the bottom of the cleaning tank 20 and the liquid level of the cleaning medium form a second included angle, and the second included angle may be equal to or different from the first included angle.
4) Preferably, the draining support 30 is driven to ascend and descend by the ascending and descending driving device, the draining support 30 drives the supported basket fixture 40 to ascend until the silicon wafer 50 is separated from the liquid level of the cleaning medium, and a second included angle is formed between at least one edge of the silicon wafer 50 close to the bottom of the cleaning tank 20 and the liquid level of the cleaning medium. The height of the draining rack 30 is preferably adjusted by air-drying the silicon wafer 50 passing through the top of the cleaning bath 20 using the air shower pipe 70. That is, during the process of lifting the draining support 30, the air shower pipe 70 is simultaneously started, and the water mass formed between the silicon wafer 50 and the silicon wafer 50 is destroyed by the wind force, and the water volatilization speed is increased.
As described above, when the silicon wafer 50 is disposed in the basket fixture 40 according to the first manner, the second included angle is equal to the first included angle. Such as "before water surface removal" and "after water surface removal" in fig. 9.
When the silicon wafer 50 is disposed in the basket fixture 40 according to the second manner, the second included angle is not equal to the first included angle.
5) When the lifting mechanism 60 is used to lift the basket fixture 40 upwards, the basket fixture 40 is changed from the inclined state of the first included angle to the horizontal state, and the inclined state of the edge of the silicon wafer 50, which is close to the bottom of the cleaning tank 20 and forms a second included angle with the liquid level of the cleaning medium, is changed.
When the silicon wafer 50 is disposed in the basket assembly 40 according to the first manner, and the basket assembly 40 is changed from the inclined state of the first included angle to the horizontal state, the bottom edge of the silicon wafer is changed from the inclined state of the first included angle or the second included angle to the horizontal state, as shown in fig. 9, i.e., "after being separated from the water surface" and "during transportation". Therefore, the moisture remaining at the bottom of the silicon wafer can be reduced.
When the silicon wafer 50 is disposed in the basket fixture 40 according to the second manner, and the basket fixture 40 is changed from the inclined state of the first included angle to the horizontal state, the edge of the silicon wafer 50, which is close to the bottom of the cleaning tank 20 and forms a second included angle with the liquid level of the cleaning medium, is only changed in the inclined state and is not necessarily in the horizontal state, however, due to the change of the inclined state, water can be remained between the silicon wafers 50 to move, further the water body tension is damaged, and the residue of water on the silicon wafer 50 is reduced.
A silicon wafer cleaning and drying device comprises a drying groove and the silicon wafer cleaning and draining device.
The drying groove is ripe prior art, and in this application, the drying groove preferably adopts application number 201820800199.X the drying box, including drying box 11 and case lid 12.
The drying tank is provided with a drying bracket 13, and the drying bracket 13 is provided with a drying inclined plane forming a third included angle with the liquid level of the cleaning medium in the cleaning tank 20. The drying bath dries the silicon wafer 50 placed on the drying inclined surface.
The drying rack 13 preferably comprises two drying bars parallel to each other, but may also be one or more. Further, the two drying bars are preferably parallel to the silicon wafer 50.
As shown in fig. 3, each drying rod has at least one drying inclined surface, preferably three drying inclined surfaces in the present application, but may be one drying inclined surface, two drying inclined surfaces or more drying inclined surfaces. The drying inclined planes are preferably arranged on one side of the drying rod away from the bottom of the drying groove, such as the top surface.
When the drying inclined planes at the top of each drying rod are more than two, all the drying inclined planes are parallel to each other and preferably have a step shape positioned on the same straight line.
Furthermore, the draining inclined plane and the edge of the silicon wafer have the same inclination direction compared with the liquid level of the cleaning medium, and the drying inclined plane and the edge of the silicon wafer have the opposite inclination direction compared with the liquid level of the cleaning medium. I.e. the first angle and the third angle are equal in size, preferably 3-10 deg., but opposite in direction, as in fig. 9 "after handling". The benefits of this arrangement are: before the silicon wafer 50 is separated from the water surface, after the silicon wafer is separated from the water surface, during transportation and after the silicon wafer is placed during transportation, the state change amplitude of the silicon wafer 50 is large, the water body tension damage amplitude is large, the water body residue at the bottom of the silicon wafer 50 is further effectively reduced, the drying time is saved, and the drying effect is improved.
A silicon wafer cleaning and drying method comprises the following steps:
1) a silicon wafer 50 and a silicon wafer cleaning and draining apparatus as described above are provided.
2) The silicon wafer 50 is set in the cleaning bath 20 using the basket fixture 40.
3) The flower basket tool 40 is matched with the draining inclined plane 311 of the draining support 30; the silicon wafer 50 is arranged in the basket fixture 40 in the above two ways. The edge of the silicon wafer 50 near the bottom of the cleaning tank 20 and the liquid level of the cleaning medium form a second included angle, and the second included angle may be equal to or different from the first included angle.
4) Preferably, the draining support 30 is driven to ascend and descend by the ascending and descending driving device, the draining support 30 drives the supported basket fixture 40 to ascend until the silicon wafer 50 is separated from the liquid level of the cleaning medium, and a second included angle is formed between at least one edge of the silicon wafer 50 close to the bottom of the cleaning tank 20 and the liquid level of the cleaning medium. In the process of draining the height of the support 30, the air shower pipe 70 is started, and the air drying principle of the silicon wafer 50 is as described in the silicon wafer cleaning and draining method. The second included angle may be equal to or different from the first included angle, as described in the method for cleaning and draining the silicon wafer.
5) When the lifting mechanism 60 is used to lift the basket fixture 40 upwards, the basket fixture 40 is changed from the inclined state of the first included angle to the horizontal state, and the inclined state of the edge of the silicon wafer 50, which is close to the bottom of the cleaning tank 20 and forms a second included angle with the liquid level of the cleaning medium, is changed. Wherein, the change process of the inclined state is as described in the silicon wafer cleaning and draining method.
6) And transferring and placing the lifted basket tool 40 on the drying inclined plane by using the lifting mechanism 60 again, so that the included angle formed by the bottom edge of the silicon wafer and the liquid level of the cleaning medium in the cleaning tank 20 is changed again.
The specific change process is as follows:
1. when the silicon wafer 50 is arranged in the basket tool 40 according to the first manner, and the basket tool 40 is placed on the drying inclined plane from the horizontal state, the bottom edge of the silicon wafer is changed from the horizontal state to the inclined state along the third included angle.
2. When the silicon wafer 50 is set in the basket tool 40 according to the second manner, and the basket tool 40 is placed on the drying inclined plane from the horizontal state, the inclination angle of the bottom edge of the silicon wafer changes again. Therefore, the water tension at the bottom edge of the silicon wafer is further destroyed, and the water residue is reduced.
7) The drying bath dries the silicon wafer 50 placed on the drying inclined surface.
The utility model discloses use first contained angle and second contained angle to equal as the example, to the draining principle before 50 stoving of silicon chip, explain as follows:
as shown in FIG. 8, the conventional silicon wafer 50 is lifted up horizontally when it is lifted up from the cleaning bath 20 after cleaning. When the tool is separated from the water surface, an area of water residue is formed at the bottom of the tool due to the surface tension of water.
As shown in fig. 9, when the flower basket device 40 is lifted up by using the draining device of the present invention, the shape is changed, so that the influence of the water surface tension on the residual water is reduced, and the residual water is reduced. By changing the shape during and after the transportation, water is left between the silicon wafers 50 and moves, thereby further breaking the water tension and reducing the water residue. The method specifically comprises the following steps: when the silicon wafer 50 is dehydrated and pulled to rise, the linear pulling motor 61 is adopted to control the rising speed of the pulling support frame 62, so that when the silicon wafer 50 is separated from the water surface, the surface tension of water can slowly and uniformly act between the silicon wafer 50 and the water, and the formation of water clusters is reduced; the use of the draining rod 31 can further reduce the formation of water clusters during the lifting process; in the rising process, the air shower pipes 70 are started simultaneously, water clusters formed between the silicon wafers 50 and the silicon wafers 50 are destroyed by means of wind power, and meanwhile, the water volatilization speed is accelerated; the use of the inverted T-shaped hook 63 can increase the fault-tolerant space for hooking and placing the flower basket tool 40 and reduce the occurrence of faults; finally, the dried powder is placed on a drying bracket 13 in the drying box 11 for drying.
Furthermore, the inclined directions of the draining inclined plane and the edge of the silicon wafer are the same compared with the liquid level of the cleaning medium, and the inclined directions of the drying inclined plane and the edge of the silicon wafer are opposite compared with the liquid level of the cleaning medium. Namely, the first included angle and the second included angle have the same size and the same direction; the first included angle and the third included angle are equal in size but opposite in direction. Therefore, in the process of separating from the water surface, carrying and placing, the state change amplitude of the silicon wafer 50 is large, the water body tension damage amplitude is large, the water body residue at the bottom of the silicon wafer 50 is further effectively reduced, the drying time is saved, and the drying effect is improved.
Furthermore, the lifting mechanism 60 can be arranged to realize automatic operation from cleaning, draining to drying of the silicon wafer 50, without manual participation, and has high automation degree, so that the productivity can be improved by following the productivity takt time.
The above detailed description describes the preferred embodiments of the present invention, but the present invention is not limited to the details of the above embodiments, and the technical idea of the present invention can be within the scope of the present invention to perform various equivalent transformations, which all belong to the protection scope of the present invention.
Claims (11)
1. The utility model provides a silicon chip washs drain device which characterized in that: the flower basket cleaning device comprises a cleaning tank, a draining bracket and at least one flower basket tool; the cleaning tank is filled with a cleaning medium, the draining support and at least one basket fixture are located in the cleaning tank, the basket fixture is used for arranging a silicon wafer, the draining support is provided with at least one draining inclined plane forming a first included angle with the liquid level of the cleaning medium, and the basket fixture is matched with the draining inclined plane; the draining support can lift relative to the cleaning tank, and drives the supported basket fixture to lift, so that a second included angle is formed between at least one edge, close to the bottom of the cleaning tank, of the silicon wafer of the basket fixture and the liquid level of the cleaning medium; the first included angle and the second included angle are both larger than 0 degree and smaller than 90 degrees.
2. The silicon wafer cleaning and draining device according to claim 1, wherein: the first included angle and the second included angle are both 1-30 degrees.
3. The silicon wafer cleaning and draining device according to claim 2, wherein: the first included angle and the second included angle are equal and are both 3-10 degrees.
4. The silicon wafer cleaning and draining device according to claim 1, 2 or 3, characterized in that: the drop dry support includes the drop dry pole of two relative settings, and the drop dry inclined plane is located the drop dry pole is kept away from one side of purge tank bottom, the drop dry inclined plane of two drop dry poles is corresponding, basket of flowers frock bearing is in two just cooperate with the drop dry inclined plane of two drop dry poles between the drop dry pole.
5. The silicon wafer cleaning and draining device according to claim 4, wherein: each draining rod is provided with a plurality of draining inclined planes which are arranged in parallel along the length direction of the draining rod, and the number of the flower basket tools is less than or equal to that of the draining inclined planes of each draining rod.
6. The silicon wafer cleaning and draining device according to claim 5, wherein: the draining support also comprises at least one connecting side rod which is connected between the two draining rods.
7. The silicon wafer cleaning and draining device according to claim 6, wherein: the silicon wafer cleaning and draining device also comprises two parallel air shower pipes, the two air shower pipes are oppositely arranged at the top of the cleaning tank, and one side of each air shower pipe, which faces the flower basket tool, is provided with a plurality of air outlets; every wind drenches the high homoenergetic of pipe and goes up and down relative washing tank, and every wind drenches the pipe homoenergetic and rotates and make self location around self axis in the vertical plane that corresponds.
8. The silicon wafer cleaning and draining device according to claim 7, wherein: the silicon wafer cleaning and draining device further comprises a lifting mechanism, and the lifting mechanism can lift and transfer the basket of flowers on the draining inclined plane relative to the cleaning tank;
the lifting mechanism comprises two hook plates and a lifting moving device;
the lifting and moving device can enable the two hook plates to realize three-dimensional movement in the transverse direction, the longitudinal direction and the vertical direction;
each hook plate is provided with at least one hook groove;
the flower basket tool comprises two parallel mounting side plates, and each mounting side plate is provided with at least one convex hook; the convex hook on the mounting side plate can be mutually hooked with the hook groove on the corresponding side hook plate.
9. The silicon wafer cleaning and draining device according to claim 8, wherein: the bottom of each hook plate is provided with a plurality of hook grooves which are positioned at the same height;
when a flower basket tool is placed on each draining inclined plane, the hook grooves on the hook plates can be hooked with all the convex hooks on the side plates mounted on the same side.
10. The silicon wafer cleaning and draining device according to claim 9, wherein: the lifting moving device comprises a transverse slide rail, a linear lifting motor, a lifting support frame and a cylinder;
a linear motor shaft of the linear lifting motor can realize vertical height lifting, and can realize transverse sliding along the transverse sliding rail under the action of the driving device; the lifting support frame is horizontally arranged on a linear motor shaft, the air cylinder is arranged on the lifting support frame, and the hook plate is connected with the corresponding air cylinder and driven by the air cylinder to realize longitudinal sliding.
11. The utility model provides a silicon chip washs drying device which characterized in that: the silicon wafer cleaning and draining device comprises a drying tank and the silicon wafer cleaning and draining device as claimed in any one of claims 1 to 10, wherein the drying tank is provided with a drying bracket which is provided with a drying inclined plane forming a third included angle with the liquid level of a cleaning medium in a cleaning tank, and the drying inclined plane and the draining inclined plane are inclined in the same/opposite direction compared with the liquid level of the cleaning medium.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921171074.6U CN210167332U (en) | 2019-07-24 | 2019-07-24 | Silicon chip washs driping device and washs drying device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921171074.6U CN210167332U (en) | 2019-07-24 | 2019-07-24 | Silicon chip washs driping device and washs drying device |
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| CN210167332U true CN210167332U (en) | 2020-03-20 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110429021A (en) * | 2019-07-24 | 2019-11-08 | 无锡隆基硅材料有限公司 | A kind of Wafer Cleaning draining device and method, cleaning drying device and method |
| CN116968047A (en) * | 2023-08-11 | 2023-10-31 | 无锡亚电智能装备有限公司 | Photovoltaic cleaning tank type mechanical arm |
-
2019
- 2019-07-24 CN CN201921171074.6U patent/CN210167332U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110429021A (en) * | 2019-07-24 | 2019-11-08 | 无锡隆基硅材料有限公司 | A kind of Wafer Cleaning draining device and method, cleaning drying device and method |
| CN116968047A (en) * | 2023-08-11 | 2023-10-31 | 无锡亚电智能装备有限公司 | Photovoltaic cleaning tank type mechanical arm |
| CN116968047B (en) * | 2023-08-11 | 2024-04-30 | 无锡亚电智能装备有限公司 | Photovoltaic cleaning tank type mechanical arm |
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Effective date of registration: 20210922 Address after: 651200 No. 1 Jurassic street, Jinshan Town, Lufeng County, Chuxiong Yi Autonomous Prefecture, Yunnan Province Patentee after: Lufeng Longji silicon material Co.,Ltd. Address before: 214013 No. 102, Ximei Road, Xinwu District, Wuxi City, Jiangsu Province Patentee before: WUXI LONGI SILICON MATERIALS Corp. |