CN205452243U - Wafer vibration cleaning machine - Google Patents
Wafer vibration cleaning machine Download PDFInfo
- Publication number
- CN205452243U CN205452243U CN201521111124.3U CN201521111124U CN205452243U CN 205452243 U CN205452243 U CN 205452243U CN 201521111124 U CN201521111124 U CN 201521111124U CN 205452243 U CN205452243 U CN 205452243U
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- CN
- China
- Prior art keywords
- plate
- wafer
- chip plate
- clamping device
- cleaning machine
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
The utility model discloses a wafer vibration cleaning machine, including the frame, be provided with wafer board supply frame in the frame, wafer board supply frame below is provided with the guide rail, and the terminal setting of guide rail has the wafer board fixture of through -hole, and wafer board fixture connects tilting mechanism, and wafer fixture top clearance is provided with the vibrator that can reciprocate, and wafer fixture's below is provided with dust extraction, and the mechanism is retrieved rather than the wafer board that matches to other being provided with of wafer fixture. The utility model discloses a vibration makes dust, particle and wafer break away from, aspirates dust, particle etc. Through dust collecting device to avoid dust and particle to descend once more to abluent wafer or on treating abluent wafer, guaranteed cleaning quality, and can not produce the damage to the wafer, entire system can autoloading, automatic unloading, and degree of automation is higher, and clean efficiency is higher.
Description
Technical field
This utility model relates to a kind of wafer cleaning machine, especially a kind of wafer vibration cleaning machine.
Background technology
Semiconductor wafer and miscellaneous part typically require the most high level cleannes, particularly during the manufacture of semiconductor circuit, see under the microscope, some small particles remain on the surface of chip architecture, some particles of advantage are referred to as " defect of being scattered ", if not removing, can cause circuit maloperation or cannot operate at all, it is scattered defect accordingly, it would be desirable to go out as much as possible these from semiconductor surface.
Existing a kind of wafer cleaning method is the rod driven near ultrasonic energy by wafer and mover bar wafer below, and rod makes the particle lifting in wafer surface separate with wafer；
But this clean method, complex operation, automaticity is the highest, and the particle departed from wafer has part still can drop on wafer, and cleaning quality has much room for improvement.
Summary of the invention
The purpose of this utility model is contemplated to solve the above-mentioned problems in the prior art, it is provided that a kind of wafer vibration cleaning machine.
The purpose of this utility model is achieved through the following technical solutions:
A kind of wafer vibration cleaning machine, including frame, described frame is provided with chip plate supply stand, is provided with guide rail below described chip plate supply stand, and the side of described chip plate supply stand is provided with the delivery device promoting chip plate at described slide on rails；The end of described guide rail is provided with the chip plate clamping device of through hole, described chip plate clamping device connects switching mechanism, above described chip plate clamping device, gap is provided with vibrator moving up and down, the lower section of described chip plate clamping device is provided with dust exhaust apparatus, is provided with matched chip plate recovering mechanism by described chip plate clamping device.
Preferably, described wafer vibration cleaning machine, wherein: described chip plate supply stand includes the chip plate placing frame that four L-shaped bars enclose, at the bottom opening of described chip plate placing frame, it is provided with the Telescopic pneumatic fork cooperatively forming position limiting structure.
Preferably, described wafer vibration cleaning machine, wherein: described chip plate clamping device includes the first plate with through hole, described first plate is connected to place the second plate of chip plate by telescopically Pneumatic extension post, described first plate is also by limited post connecting bottom board, and the periphery of described limited post is arranged with the upset cylinder in the spring between described second plate and base plate, described second plate and the affixed described switching mechanism of base plate.
Preferably, described wafer vibration cleaning machine, wherein: described dust exhaust apparatus includes some sweep-up pipes being connected to suction power plant.
Preferably, described wafer vibration cleaning machine, wherein: described chip plate recovering mechanism includes and the jaw of described chip plate clamping device location matches, described jaw connects X-direction motion, described X-direction motion is provided above chip plate and reclaims frame, is provided with and reclaims, with described chip plate, the Shang Ding mechanism that the bottom opening of frame mates below described X-direction motion.
The advantage of technical solutions of the utility model is mainly reflected in:
This utility model deft design, simple to operate, made the dust on wafer, particle depart from wafer by the vibration of vibrator, by dust collection equipment, the dust separated with wafer, particle etc. are aspirated simultaneously, thus avoid and depart from the dust of wafer and particle drops on the wafer that cleaned or wafer to be cleaned again, thus ensure that cleaning quality, and wafer will not be produced damage；Further, whole system is except can be in addition to automated cleaning, it is possible to self-feeding, automatic blanking, automaticity is higher, and cleaning efficiency is higher.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the enlarged drawing of a-quadrant in Fig. 1.
Detailed description of the invention
The purpose of this utility model, advantage and feature, by for illustration and explanation by the non-limitative illustration of preferred embodiment below.These embodiments are only the prominent examples of application technical solutions of the utility model, all technical schemes taking equivalent or equivalent transformation and formed, all fall within this utility model claimed within the scope of.
A kind of wafer vibration cleaning machine that this utility model discloses, as shown in Figure 1, including frame 1, the chip plate supply stand 2 of bottom opening it is provided with in described frame 1, the bracing frame 20 that described chip plate supply stand 2 is arranged by two gaps is fixed in described frame 1, concrete, described chip plate supply stand 2 includes the chip plate accepting groove 21 that four L-shaped bars enclose, the Telescopic pneumatic fork 22 cooperatively forming position limiting structure it is provided with at the bottom opening of described chip plate accepting groove 21, thus pitch by shrinking and stretch out described startup, chip plate 10 in chip plate accepting groove 21 can be placed on the guide rail 3 below described chip plate accepting groove 21 one by one.
It is provided with guide rail 3 below the bottom opening of described chip plate supply stand 2, described guide rail extends along X-direction, and the side of described chip plate supply stand 2 is provided with the delivery device 4 promoting chip plate to slide on described guide rail 3, described delivery device 4 is positioned at the gap location of two support frames as described above 20；The end of described guide rail 3 is provided with the chip plate clamping device 5 of through hole 511, and described chip plate clamping device 5 connects switching mechanism 6.
Concrete, as shown in Figure 2, described chip plate clamping device 5 includes the first plate 51 with through hole 511, described first plate 51 be connected to place the second plate 53 of chip plate by telescopically Pneumatic extension post 52, wherein, described through hole 511, for after upset, allows the impurity such as dust and particle drop out from the grasping part formed between described first plate 51 and the second plate 53.
Described first plate 51 is also by limited post 54 connecting bottom board 55, and the periphery of described limited post 54 is arranged with the spring 56 between described second plate 53 and base plate 55, described second plate 53 and the affixed described switching mechanism 6 of base plate 55 overturn the output shaft of cylinder 61, described upset cylinder 61 is fixed in described frame 1, it drives described second plate 53 and base plate 55 to rotate, and rotational angle is 180 °.
Above described chip plate clamping device 5, gap is provided with vibrator 7 moving up and down, concrete, two root posts 71 it are provided with in described frame 1, an affixed fixed plate 72 on described column 71, it is provided with telescopic cylinder 73 or motor in described fixed plate 72, described telescopic cylinder 73 or the affixed installing plate 74 of motor, described installing plate 74 is provided with vibrator 7.
The lower section of described chip plate clamping device 5 is provided with dust exhaust apparatus 8, and described dust exhaust apparatus 8 includes some sweep-up pipes 81 being connected to suction power plant, and described sweep-up pipe 81 is positioned at the lower section of described chip plate clamping device 5.
Described chip plate clamping device 5 is other is provided with the chip plate recovering mechanism 9 coordinated with it, described chip plate recovering mechanism 9 includes and the jaw 91 of described chip plate clamping device 5 location matches, described jaw 91 connects X-direction motion, described X-direction motion is provided above chip plate and reclaims frame 92, it is identical with the structure of described chip plate accepting groove 21 that described chip plate reclaims frame 92, is provided with and reclaims, with described chip plate, the Shang Ding mechanism that the bottom opening of frame 92 mates below described X-direction motion.
Wafer vibration cleaning machine of the present utility model, during its work, process is as follows:
First the chip plate with wafer of machine to be cleaned is placed in described chip plate supply stand 2, subsequently, makes described pneumatic fork shrink, make one piece of chip plate 10 fall on described guide rail 3 from described wafer storage groove 21.
Then, chip plate 10 on described guide rail 3 is pushed by the cylinder that drives starting described delivery device 4 to the end of described guide rail 3, and described chip plate 10 is pushed on described second plate 53, described telescopic mast 52 is now made to shrink, thus the distance between the first plate 51 and the second plate 53 is furthered, simultaneously because the restriction of described limited post 54, distance between described first plate 51 and the second plate 53 cannot continue after reaching the ultimate range of limited post 54 to reduce, and now the first plate 51 and the second plate 53 coordinate the chip plate 10 that will be located on the second plate 53 to clamp.
And then, start described upset cylinder 61 by after overall to described second plate 53 and the first plate 51 upset 180 °, described vibrator 7 is moved to described base plate 55 and starts, start described dust exhaust apparatus 8 simultaneously, now, vibrator 7 applies vibration force to described base plate 55, effect due to described spring, described second plate 53 constantly vibrates under the effect of the push-pull effort repeatedly of spring, so that the dust on wafer, particles etc. get loose with wafer, and the through hole 511 from described first plate 52 drops out, the most described sweep-up pipe 81 is by dust, particles etc. are pumped to the dust collecting installations such as dust deposited case.
Stop after vibration, dust suction one end time, described chip plate clamping device 5 is overturn 180 ° by described upset cylinder 61 again, the most described jaw 51 moves to described chip plate clamping device 5 direction, and will clean after chip plate 10 clamp, the most described telescopic mast 52 is stretched out, so that the spacing of described first plate 51 and the second plate 53 becomes big, unclamp the chip plate after cleaning 10.
Drive described jaw 51 opposite direction to move again and move to the bottom opening of described chip plate recovery frame 92, then chip plate 10 being headed in described chip plate recovery frame 92 by described Shang Ding mechanism.
This utility model still has numerous embodiments, all employing equivalents or equivalent transformation and all technical schemes of being formed, within all falling within protection domain of the present utility model.
Claims (5)
1. a wafer vibration cleaning machine, including frame (1), it is characterized in that: in described frame (1), be provided with chip plate supply stand (2), described chip plate supply stand (2) lower section is provided with guide rail (3), and the side of described chip plate supply stand (2) is provided with and promotes chip plate (10) at the upper delivery device (4) slided of described guide rail (3)；The end of described guide rail (3) is provided with the chip plate clamping device (5) of through hole, described chip plate clamping device (5) connects switching mechanism (6), gap, described chip plate clamping device (5) top is provided with vibrator moving up and down (7), the lower section of described chip plate clamping device (5) is provided with dust exhaust apparatus (8), and described chip plate clamping device (5) is other is provided with matched chip plate recovering mechanism (9).
Wafer vibration cleaning machine the most according to claim 1, it is characterized in that: described chip plate supply stand (2) includes the chip plate accepting groove (21) that four L-shaped bars (23) enclose, at the bottom opening of described chip plate accepting groove (21), be provided with Telescopic pneumatic fork (22) cooperatively forming position limiting structure.
Wafer vibration cleaning machine the most according to claim 1, it is characterized in that: described chip plate clamping device (5) includes the first plate (51) with through hole (511), described first plate (51) is connected to place second plate (53) of chip plate by telescopically Pneumatic extension post (52), described first plate (51) is also by limited post (54) connecting bottom board (55), and the periphery of described limited post (54) is arranged with the spring (56) being positioned between described second plate (53) and base plate (55), upset cylinder (61) in described second plate (53) and the affixed described switching mechanism of base plate (55) (6).
Wafer vibration cleaning machine the most according to claim 1, it is characterised in that: described dust exhaust apparatus (8) includes some sweep-up pipes (81) being connected to suction power plant.
Wafer vibration cleaning machine the most according to claim 1, it is characterized in that: described chip plate recovering mechanism (9) includes and the jaw (91) of described chip plate clamping device (5) location matches, described jaw (91) connects X-direction motion, described X-direction motion is provided above chip plate and reclaims frame (92), is provided with and reclaims, with described chip plate, the Shang Ding mechanism that the bottom opening of frame (92) mates below described X-direction motion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521111124.3U CN205452243U (en) | 2015-12-29 | 2015-12-29 | Wafer vibration cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521111124.3U CN205452243U (en) | 2015-12-29 | 2015-12-29 | Wafer vibration cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205452243U true CN205452243U (en) | 2016-08-10 |
Family
ID=56572919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521111124.3U Expired - Fee Related CN205452243U (en) | 2015-12-29 | 2015-12-29 | Wafer vibration cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205452243U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783683A (en) * | 2016-12-19 | 2017-05-31 | 安徽天裕汽车零部件制造有限公司 | A kind of wafer-scanning cleans swinging arm device |
| CN107877830A (en) * | 2017-12-13 | 2018-04-06 | 山东吉威医疗制品有限公司 | A kind of multi-mould closing device of balloon forming machine |
| CN111604325A (en) * | 2019-06-06 | 2020-09-01 | 北京危安宝科技有限公司 | Pole piece cleaning and purifying device and method |
| CN118635185A (en) * | 2024-07-30 | 2024-09-13 | 安徽富乐德长江半导体材料股份有限公司 | A spray cleaning machine for wafer cleaning |
-
2015
- 2015-12-29 CN CN201521111124.3U patent/CN205452243U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783683A (en) * | 2016-12-19 | 2017-05-31 | 安徽天裕汽车零部件制造有限公司 | A kind of wafer-scanning cleans swinging arm device |
| CN106783683B (en) * | 2016-12-19 | 2019-08-09 | 安徽天裕汽车零部件制造有限公司 | Wafer scanning cleaning swing arm device |
| CN107877830A (en) * | 2017-12-13 | 2018-04-06 | 山东吉威医疗制品有限公司 | A kind of multi-mould closing device of balloon forming machine |
| CN107877830B (en) * | 2017-12-13 | 2024-04-26 | 山东吉威医疗制品有限公司 | Multimode utensil switching device that sacculus make-up machine was used |
| CN111604325A (en) * | 2019-06-06 | 2020-09-01 | 北京危安宝科技有限公司 | Pole piece cleaning and purifying device and method |
| CN118635185A (en) * | 2024-07-30 | 2024-09-13 | 安徽富乐德长江半导体材料股份有限公司 | A spray cleaning machine for wafer cleaning |
| CN118635185B (en) * | 2024-07-30 | 2025-11-25 | 安徽富乐德长江半导体材料股份有限公司 | A spray cleaning machine for wafer cleaning |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160810 Termination date: 20161229 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |