CN210132169U - Material feeding unit and semiconductor laser robot processing equipment who constitutes thereof - Google Patents

Material feeding unit and semiconductor laser robot processing equipment who constitutes thereof Download PDF

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Publication number
CN210132169U
CN210132169U CN201920151080.9U CN201920151080U CN210132169U CN 210132169 U CN210132169 U CN 210132169U CN 201920151080 U CN201920151080 U CN 201920151080U CN 210132169 U CN210132169 U CN 210132169U
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Prior art keywords
material pipe
shell
track
feeding device
laser
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CN201920151080.9U
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陈开伟
曹泽华
余根海
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CHANGSHA XINGSHA MACHINE TOOL Co Ltd
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CHANGSHA XINGSHA MACHINE TOOL Co Ltd
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Abstract

The utility model discloses a feeding device, feeding device include casing, shower nozzle, material pipe, shower nozzle preheating device, ultrasonic probe device and material control device, and the casing is the tubaeform shell that the centre is provided with the through-hole, and the shower nozzle sets up inside the casing with material union coupling, and shower nozzle preheating device sets up around material pipe in the casing, and ultrasonic probe device sets up on the casing top, and material control device is on the material pipe of being connected with the material storehouse. The bottom end of the shell is also provided with a protective cover, and the protective cover is also provided with an infrared heating device. The spray heads are more than two spray heads with different diameters. The material pipe comprises a material pipe and an auxiliary material pipe. The device is characterized by further comprising a main controller, wherein the spray head preheating device, the material control device and the ultrasonic probe device are respectively connected with the main controller. The utility model discloses highly integrated, automatic, convenient operation, labour saving and time saving can realize carrying out the processing operation of high precision such as laser hardening, alloying, cladding to spare part.

Description

Material feeding unit and semiconductor laser robot processing equipment who constitutes thereof
Technical Field
The utility model relates to a laser technical field, more specifically say, especially be applied to the semiconductor laser robot processing equipment of material feeding unit and constitution that carries out laser hardening, alloying and laser cladding to pipe form spare part.
Background
After referring to the existing patent of a laser processing machine (patent number: 201420084299.9), the company improves the existing semiconductor laser robot processing device shown in fig. 1 and 2, changes the original column assembly into a robot arm and a laser generator and powder feeding support assembly, and fully utilizes the use flexibility of the robot arm. However, as the requirements for the processing quality of products are increased and the processing procedures are improved in a perfecting manner, real-time monitoring may be required in the processing process, the processing procedures need to be increased or decreased, or the requirements for the universality and diversification of the use of a laser processing machine tool are required, so that the laser processing machine tool needs to be further improved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to the problem that above-mentioned prior art exists, provide a highly integrated, automatic, and convenient operation, labour saving and time saving can realize carrying out the material feeding unit of high precision processing such as laser hardening, alloying, cladding to spare part and the semiconductor laser robot processing equipment of constituteing thereof.
The utility model discloses mainly through material feeding unit that following technical scheme can solve, including casing, shower nozzle, material pipe, shower nozzle preheating device, ultrasonic probe device, material control device and material storehouse, the casing is the tubaeform shell that the centre is provided with the through-hole, and the shower nozzle sets up inside the casing with material union coupling, and shower nozzle preheating device sets up around material pipe in the casing, and ultrasonic probe device sets up on the casing top, and material control device is on the material pipe of being connected with the material storehouse.
The bottom end of the shell is also provided with a protective cover, and the protective cover is also provided with an infrared heating device.
The spray heads are more than two spray heads with different diameters.
The material pipe comprises a material pipe and an auxiliary material pipe.
The device also comprises a main controller and a matched host thereof, and the spray head preheating device, the material control device and the ultrasonic probe device are respectively connected with the main controller.
The spray head preheating device comprises a heating device and a temperature sensor.
The material control device comprises a supercharger and a control valve.
A semiconductor laser robot processing device comprises a lathe bed assembly, an object stage assembly and a laser robot assembly: the lathe bed assembly comprises an object stage area and a laser robot area, wherein the object stage area is provided with an XA track, the laser robot area is provided with an XB track, and the XA track is parallel to the XB track; the object stage assembly is arranged in the object stage area and comprises a supporting platform, a top tip and a cutting pick pneumatic chuck, the top tip and the cutting pick pneumatic chuck are driven by a motor to be arranged at two ends of an XA track, and the supporting platform is arranged between the top tip and the cutting pick pneumatic chuck through the XA track; the laser robot assembly is arranged in a laser robot area of the lathe bed assembly through the XB track and comprises a robot arm, a laser generator and a feeding device, wherein the laser generator is arranged in the middle of the feeding device and is arranged at the front end of the laser robot arm together with the feeding device. The beneficial effects of the utility model reside in that: the utility model discloses a to the improvement of material shower nozzle, carry out the injection of branch time quantum in batches through the shower nozzle that the diameter is unequal in the course of working, can play the effect of accurate cladding and material saving.
The beneficial effects of the utility model reside in that: the utility model discloses a to the improvement of material shower nozzle, adopt the diameter to vary and the different shower nozzle of material kind, can guarantee to carry out in turn, divide the preface at the course of working to spray, thereby play the effect of accurate processing and material saving. Through the arrangement of the different spray heads of the material types, the precision control of the machining process is further enhanced, and the machining quality and the machining efficiency are improved.
The utility model discloses an add ultrasonic probe device, can monitor the course of working such as laser hardening, alloying, cladding in real time, can carry out on-line measuring to last processing result quality simultaneously.
The utility model discloses an add shower nozzle preheating device in shower nozzle part and can treat the material that sprays and preheat, and add an infrared heating device on the protective housing below the shower nozzle again, can also treat the position that needs processing on the processing work piece and carry out the infrared ray and preheat to further shorten process time, improve processingquality.
To sum up, the utility model discloses highly integrated, automatic, convenient operation, labour saving and time saving can realize carrying out the processing operation of high precision such as laser hardening, alloying, cladding to spare part.
Drawings
The present invention will be described in further detail with reference to the following examples, which are not intended to limit the invention.
Fig. 1 is a schematic view of a semiconductor laser robot processing apparatus.
Fig. 2 is a plan view of the semiconductor laser robot processing apparatus.
Fig. 3 is a schematic structural view of the feeding device of the present invention.
In the figure: 1. the device comprises a tip, 2, a cutting pick air chuck, 3, a supporting platform, 4, a laser robot arm, 5, a carrying platform area, 6, a laser robot area, 7, XB tracks, 8, XA tracks, 9, a laser generator cable, 10, a laser generator, 11, a shell, 12, a spray head, 13, a protective cover, 14, a heating device, 15, a material pipe, 16, material powder, 17, a high-temperature insulating layer, 18 and an ultrasonic probe device.
Detailed Description
Referring to the drawings, the utility model discloses a material feeding unit includes casing 11, shower nozzle 12, material pipe 15, shower nozzle preheating device, ultrasonic probe device 18 and material control device (do not mark in the picture), casing 11 is the tubaeform shell that is provided with the through-hole in the middle of, shower nozzle 12 is connected with material pipe 15 and is set up inside casing 11, shower nozzle preheating device sets up around material pipe 15 in casing 11, ultrasonic probe device 18 sets up on 11 tops of casing, material control device (do not mark in the picture) on material pipe 15 be connected with material storehouse (do not mark in the picture).
The utility model discloses make further improvement to material feeding unit on original basis, laser generator 10 sets up in the middle through-hole of casing 11, sets up a plurality of shower nozzles 12 around it, still is provided with ultrasonic probe device 18 in casing 11 and laser generator 10's upper end simultaneously, still is provided with high temperature insulating layer 17 between ultrasonic probe device 18 and the casing 11, and ultrasonic probe device 18 can carry out real time monitoring to whole course of working, processes on one side and spouts material powder 16. Because of the plurality of spray heads 12, omnibearing spraying can be ensured in the processing process. Simultaneously, still because the setting of preheating to material powder 16 is inside casing 11, can spray immediately after the heating, also further played the effect of energy saving.
As a further improvement, the bottom end of the housing 11 is further provided with a protective cover 13, and the protective cover 13 is further provided with an infrared heating device 14 (not labeled in fig. 3). Usual laser beam machining device all adopts the function of preheating to material powder 16, the utility model discloses still treat the processing position of processing spare part on the basis of preheating to material powder 16 and preheat, further improvement processingquality and processing effect.
As a further improvement, the spray heads 12 are more than two spray heads 12 with different diameters. The utility model discloses a to the unequal setting of a plurality of shower nozzles 12 diameters, just can be directly through controlling what of opening of shower nozzle 12 and controlling and spraying material powder 16.
As a further improvement, the material pipe 15 comprises a material pipe and an auxiliary material pipe. The utility model discloses material pipe 15 of connecting shower nozzle 12 bears the powder of two kinds or two kinds of above materials and auxiliary material, has further improved processingquality and the processing effect to spare part processing position.
As a further improvement, the device further comprises a main controller and a host machine (not marked in the figure) matched with the main controller, and the spray head preheating device, the material control device and the ultrasonic probe device 18 are respectively connected with the main controller. The utility model discloses in through main control unit and supporting host computer, can monitor the course of working in real time, to material and supplementary material spray order and quality carry out programming control to and carry out programming control or real-time adjustment according to actual conditions to whole course of working.
The preheating device for the spray head comprises a heating device 14 and a temperature sensor (not labeled in the figure). The preheating of the spray head 12 in the housing 11 can solve the problems of early preheating and delayed spraying temperature reduction.
The material control device comprises a supercharger and a control valve. The accuracy of spraying the material powder 16 can be improved by the arrangement of a pressure booster (not shown). The supercharger and a control valve (not marked in the figure) for performing on-off control on the material pipe 15 are respectively arranged on the material pipe 15 outside the shell 11, and the material pipe 15 is finally connected with a material bin (not marked in the figure).
A semiconductor laser robot processing device comprises a lathe bed assembly, an object stage assembly and a laser robot assembly: the lathe bed assembly comprises an object stage area 5 and a laser robot area 6, wherein the object stage area 5 is provided with an XA track 8, the laser robot area 6 is provided with an XB track 7, and the XA track 8 is parallel to the XB track 7; the object stage assembly is arranged in an object stage area 5 and comprises a saddle 3, a tip 1 and a cutting tooth pneumatic chuck 2, the tip 1 and the cutting tooth pneumatic chuck 2 are driven by a motor to be arranged at two ends of an XA track 8, and the saddle 3 is arranged between the tip 1 and the cutting tooth pneumatic chuck 2 through the XA track 8; the laser robot assembly is arranged in a laser robot area 6 of the lathe bed assembly through an XB track 7 and comprises a laser robot arm 4, a laser generator 10 and a feeding device, and the laser generator 10 and the feeding device are arranged at the front end of the laser robot arm 4.
The beneficial effects of the utility model reside in that: the utility model discloses a to the improvement of material shower nozzle 12, adopt the diameter to vary and the different shower nozzle 12 of material kind, can guarantee to carry out in turn, divide the preface at the course of working to spray to play the effect of accurate processing and saving material. Through adopting the setting of the different shower nozzles 12 of material kind, further the accurate control to the course of working has been strengthened, has improved processingquality and machining efficiency.
The utility model discloses an add ultrasonic probe device 18, can monitor the course of working such as laser hardening, alloying, cladding in real time, can carry out on-line measuring to final machining result quality simultaneously.
The utility model discloses an add shower nozzle preheating device in shower nozzle 12 part and can treat the material that sprays and preheat, and add an infrared heating device 14 on protection casing 13 below shower nozzle 12 again, can also treat the position that needs processing on the processing work piece and carry out the infrared ray and preheat to further shorten process time, improve processingquality.
To sum up, the utility model discloses highly integrated, automatic, convenient operation, labour saving and time saving can realize carrying out the processing operation of high precision such as laser hardening, alloying, cladding to spare part.
The above embodiment is the preferred embodiment of the present invention, which is only used to facilitate the explanation of the present invention, it is not right to the present invention, which makes the restriction on any form, and any person who knows commonly in the technical field can use the present invention to make the equivalent embodiment of local change or modification without departing from the technical features of the present invention.

Claims (7)

1. A feeding device is characterized in that: the ultrasonic material spraying device comprises a shell, a spray head, a material pipe, a spray head preheating device, an ultrasonic probe device and a material control device, wherein the shell is a horn-shaped round shell with a through hole in the middle, the spray head is connected with the material pipe and arranged inside the shell, the spray head preheating device is arranged around the material pipe in the shell, the ultrasonic probe device is arranged at the top end of the shell, and the material control device is arranged on the material pipe connected with a material bin.
2. The feeding device as set forth in claim 1, wherein: the bottom end of the shell is also provided with a protective cover, and the protective cover is also provided with an infrared heating device.
3. The feeding device as set forth in claim 1, wherein: the spray heads are more than two spray heads with different diameters.
4. The feeding device as set forth in claim 1, wherein: the material pipe comprises a material pipe and an auxiliary material pipe.
5. The feeding device as set forth in claim 1, wherein: the material control device comprises a supercharger and a control valve.
6. The feeding device as set forth in claim 1, wherein: the device is characterized by further comprising a main controller and a matched host, wherein the spray head preheating device, the material control device and the ultrasonic probe device are respectively connected with the main controller.
7. A semiconductor laser robot processing apparatus characterized in that: including lathe bed subassembly, objective table subassembly and laser robot subassembly: the lathe bed assembly comprises an object stage area and a laser robot area, wherein the object stage area is provided with an XA track, the laser robot area is provided with an XB track, and the XA track is parallel to the XB track; the object stage assembly is arranged in the object stage area and comprises a supporting platform, a top tip and a cutting pick pneumatic chuck, the top tip and the cutting pick pneumatic chuck are driven by a motor to be arranged at two ends of an XA track, and the supporting platform is arranged between the top tip and the cutting pick pneumatic chuck through the XA track; the laser robot assembly is arranged in a laser robot area of the lathe bed assembly through an XB track and comprises a laser robot arm, a laser generator and the feeding device of any one of the claims 1 to 6, wherein the laser generator is arranged in the middle of the feeding device and is arranged at the front end of the robot arm together with the feeding device.
CN201920151080.9U 2019-01-29 2019-01-29 Material feeding unit and semiconductor laser robot processing equipment who constitutes thereof Active CN210132169U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920151080.9U CN210132169U (en) 2019-01-29 2019-01-29 Material feeding unit and semiconductor laser robot processing equipment who constitutes thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920151080.9U CN210132169U (en) 2019-01-29 2019-01-29 Material feeding unit and semiconductor laser robot processing equipment who constitutes thereof

Publications (1)

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CN210132169U true CN210132169U (en) 2020-03-10

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109551126A (en) * 2019-01-29 2019-04-02 长沙星沙机床有限公司 A kind of semiconductor laser processing of robots equipment of feed device and its composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109551126A (en) * 2019-01-29 2019-04-02 长沙星沙机床有限公司 A kind of semiconductor laser processing of robots equipment of feed device and its composition

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