CN210091010U - Computer mainboard suitable for harsh application environment - Google Patents

Abstract

A computer motherboard adapted for use in harsh application environments, comprising: the electronic component comprises a substrate and an electronic component arranged on the substrate, wherein a first heat dissipation layer, a heat preservation layer and a second heat dissipation layer are sequentially arranged on the upper surface and the lower surface of the substrate from inside to outside, the first heat dissipation layer is in plane contact with the substrate, the other surface of the first heat dissipation layer is in wave contact with the substrate, the other surface of the second heat dissipation layer is in plane contact with the heat preservation layer, the electronic component penetrates out of the surface of the second heat dissipation layer, a plurality of first through holes are formed in the positions, close to the position where the electronic component is arranged, of the substrate, an insulating heat-conducting silica gel rod is arranged in each first through hole, the diameters of the first heat dissipation layer, the heat preservation layer and the first through holes are equal, and the end portion of the insulating heat-conducting silica gel rod is. The utility model provides a computer mainboard suitable for harsh application environment, can dispel the heat fast, when external environment is lower, can play a fine heat preservation effect to guarantee that the mainboard can normally work.

Description

Computer mainboard suitable for harsh application environment

[ technical field ] A method for producing a semiconductor device

The utility model belongs to the electronic equipment field, concretely relates to computer motherboard suitable for harsh application environment.

[ background of the invention ]

The portable system maintenance terminal has a large body shape, is generally applied to high-end professional fields such as national defense, aerospace, navigation and the like, and is required to have stronger functions, and a main board adopted in the portable system maintenance terminal needs to work stably and without faults in an environment between 40 ℃ below zero and 80 ℃. The heat dissipation efficiency of the heat dissipation scheme of the structure is a serious test, however, the existing mainboard can hardly meet the requirement, so that a high temperature and high heat resistant mainboard is urgently needed to ensure that the mainboard can be normally used in a severe environment.

[ Utility model ] content

To the problem, the utility model provides a computer mainboard suitable for harsh application environment can dispel the heat fast, when external environment is lower, can play a fine heat preservation effect to guarantee that the mainboard can normally work.

The utility model discloses a realize through following technical scheme, provide a computer mainboard suitable for harsh application environment, it includes: the electronic component comprises a substrate and an electronic component arranged on the substrate, wherein a first heat dissipation layer, a heat preservation layer and a second heat dissipation layer are sequentially arranged on the upper surface and the lower surface of the substrate from inside to outside, the first heat dissipation layer is in plane contact with the substrate, the other surface of the first heat dissipation layer is in wave contact with the substrate, the other surface of the second heat dissipation layer is in plane contact with the heat preservation layer, the electronic component penetrates out of the surface of the second heat dissipation layer, a plurality of first through holes are formed in the positions, close to the position, where the electronic component is arranged, of the substrate, an insulating heat-conducting silica gel rod is arranged in each first through hole, a second through hole equal to the aperture of each first through hole is formed in each of the first heat dissipation layer and the heat preservation layer, and the end portion of each.

Particularly, the thickness of the first heat dissipation layer is 0.12mm, the thickness of the heat preservation layer is 0.1mm, and the thickness of the second heat dissipation layer is 0.05 mm.

In particular, the method also comprises the following steps: the heating plate is arranged on one side of the substrate, and the temperature detector, the temperature detector and the controller are arranged on one side of the most easily-generated electronic element.

Particularly, the second heat dissipation layer is made of insulating silica gel.

In particular, the method also comprises the following steps: the cooling tubes are sequentially communicated and then respectively connected with the cooling fins through a pipeline, and the cooling tubes and the pipelines are filled with conduction liquid for heat dissipation.

In particular, the side walls of the refrigeration pipe and the pipeline are uneven.

Particularly, the pipeline is connected with the radiating fins after encircling a circle at the edge of one side of the second radiating layer far away from the heat-insulating layer.

The utility model provides a pair of computer mainboard suitable for harsh application environment, first heat dissipation layer, the second heat dissipation layer can play a fine radiating action, combine insulating heat conduction silica gel stick, the very piece of heat that can make electronic component distribute reaches away, heat radiation fins and the design of refrigeration pipe simultaneously, further cool down the mainboard, thereby guarantee that the mainboard can normally work, and the design of heat preservation piece and hot plate, can guarantee that the mainboard is when external ambient temperature is lower, can provide the temperature that is fit for the mainboard work, thereby guarantee that the mainboard can normally work under low temperature environment, consequently this mainboard can be under the environment of-40 ℃ -8 ℃ steady operation, and first heat dissipation layer, the heat preservation, the second heat dissipation layer can play a buffering antidetonation under the mobile condition.

[ description of the drawings ]

FIG. 1 is a side view of a computer motherboard suitable for use in harsh applications;

fig. 2 is a sectional view a-a of fig. 1.

[ detailed description ] embodiments

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings.

Referring to fig. 1-2, the present invention provides a computer motherboard suitable for harsh application environment, which includes: a substrate 1 and an electronic element 2 arranged on the substrate 1, characterized in that the upper and lower surfaces of the substrate 1 are provided with a first heat dissipation layer 3, a heat preservation layer 4 and a second heat dissipation layer 5 in sequence from inside to outside, one surface of the first heat dissipation layer 3, which is in contact with the substrate 1, is a plane, the other surface is wave-shaped, the heat insulation layer 4 is wave-shaped, one surface of the second heat dissipation layer 5, which is in contact with the heat insulation layer 4, is wavy, the other surface is flat, the electronic element 2 penetrates out of the surface of the second heat dissipation layer 5, a plurality of first through holes 6 are formed near the electronic element 2 on the substrate 1, the first through hole 6 is internally provided with an insulating heat-conducting silica gel rod 7, the first heat dissipation layer 3 and the heat preservation layer 4 are provided with a second through hole 8 with the same aperture as the first through hole 6, the end part of the insulating heat-conducting silica gel rod 7 is positioned below one side of the second heat dissipation layer 5 close to the heat insulation layer; in the utility model, the first heat dissipation layer, the heat preservation layer and the second heat dissipation layer can not only play a good role in heat dissipation, but also play a role in heat preservation in a low-temperature environment, and can play a role in shock absorption and buffering for the electronic element and the substrate under a maneuvering condition, thereby ensuring the normal operation of the mainboard; simultaneously insulating heat conduction silica gel stick can make the quick second heat dissipation layer that transmits of temperature around the electronic component to quick reduction mainboard temperature.

Particularly, the thickness of the first heat dissipation layer 3 is 0.12mm, the thickness of the heat insulation layer 4 is 0.1mm, and the thickness of the second heat dissipation layer 5 is 0.05 mm; because base plate surface temperature is higher, with the effect that first heat dissipation layer design can play a rapid cooling for 0.12mm, and design the heat preservation for 0.1mm and for the wave, surface area has been increased, so can be favorable to giving off of first heat dissipation in-situ temperature, can be when the temperature is lower simultaneously, play fine heat preservation effect, and second heat dissipation layer design is 0.05mm, can make the base plate, first heat dissipation layer, the intraformational temperature of heat preservation distributes out fast, play rapid cooling's effect, further guarantee that the mainboard can rapid cooling, thereby can work under normal temperature.

In particular, the method also comprises the following steps: the heating plate 9 is arranged on one side of the substrate 1, the temperature detector 10 and the controller 11 are arranged on the other side of the substrate, and the heating plate 9 is connected with the insulating heat-conducting silica gel rod 7 through a heat-conducting wire; thermodetector is in the open mode, when detecting that ambient temperature is less than mainboard operating temperature, signals gives the controller, controller signals gives the hot plate, the hot plate begins to work, heat the mainboard, after reaching the mainboard operating temperature that the controller set for, mainboard start to work this moment generates heat, thermodetector real-time detection mainboard temperature simultaneously, after the temperature stabilization, the hot plate stop work, when the temperature crosses lowly, repeat above-mentioned heating work, it is required to explain, this thermodetector not only can detect the low temperature, can detect high temperature equally.

Particularly, the second heat dissipation layer 5 is made of insulating silica gel; so that the second heat dissipation layer 5 can rapidly and stably transfer the temperature of the heat preservation layer out, and the purpose of rapidly reducing the temperature of the main board is achieved.

In particular, the method also comprises the following steps: the heat dissipation fins 12 are arranged at the two ends of the substrate 1 and are not provided with the electronic element 2, the outer side of the electronic element 2 is provided with an annular refrigeration pipe 13, the refrigeration pipes 13 are sequentially communicated and then respectively connected with the heat dissipation fins 12 through a pipeline 14, and the refrigeration pipes 13 and the pipeline 14 are filled with heat conduction liquid for heat dissipation; so design, when external temperature is higher, be unfavorable for giving off of mainboard temperature, so when mainboard high temperature, the heat radiation fins is dispelled the heat with high temperature transmission that conduction liquid in the refrigeration pipe can be quick, so circulate to guarantee that the mainboard normally works in normal temperature.

In particular, the side walls of the cooling pipe 13 and the pipeline 14 are uneven; therefore, the transmission area can be increased, the content of the conduction liquid can be increased, and the heat dissipation efficiency is further improved.

Particularly, the pipeline 1 is connected with the radiating fins 12 after the edge of one side of the second radiating layer 5 far away from the insulating layer 4 is encircled for a circle; thus, the content of the conductive liquid is further increased, and the heat dissipation efficiency is further improved.

The utility model provides a mainboard can be applied to inside national defense, space flight, computer for navigation, has the fast advantage of heat dissipation, and can heat the mainboard when external ambient temperature is lower to can guarantee that the mainboard can normally work under-40 ℃ -80 ℃ of temperature, very be applicable to harsh operational environment.

Claims (6)

1. A computer motherboard adapted for use in harsh application environments, comprising: the heat-insulating and heat-conducting electronic component comprises a substrate (1) and an electronic component (2) arranged on the substrate (1), and is characterized in that a first heat-radiating layer (3), a heat-insulating layer (4) and a second heat-radiating layer (5) are sequentially arranged on the upper surface and the lower surface of the substrate (1) from inside to outside, one surface of the first heat-radiating layer (3) contacting with the substrate (1) is a plane, the other surface of the first heat-radiating layer is a wave, the heat-insulating layer (4) is a wave, one surface of the second heat-radiating layer (5) contacting with the heat-insulating layer (4) is a wave, the other surface of the second heat-radiating layer is a plane, the electronic component (2) penetrates out of the surface of the second heat-radiating layer (5), a plurality of first through holes (6) are formed near the substrate (1) provided with the electronic component (2), insulating and heat-conducting silica gel rods (7) are arranged in the first through holes (6), the tip of insulating heat conduction silica gel stick (7) is located one side below that second heat dissipation layer (5) are close to heat preservation (4), still includes: locate hot plate (9), thermodetector (10) of base plate (1) one side controller (11), hot plate (9) are connected through the heat conduction line with insulating heat conduction silica gel stick (7).

2. The computer motherboard suitable for harsh application environment of claim 1, wherein the thickness of said first heat dissipation layer (3) is 0.12mm, the thickness of said insulation layer (4) is 0.1mm, and the thickness of said second heat dissipation layer (5) is 0.05 mm.

3. The computer motherboard suitable for harsh application environments of claim 1, wherein the second heat dissipation layer (5) is made of insulating silica gel.

4. The computer motherboard adapted for use in harsh environments as recited in claim 1, further comprising: the heat dissipation device is characterized in that the heat dissipation fins (12) which are not provided with the electronic elements (2) are arranged at two ends of the substrate (1), annular refrigeration pipes (13) are arranged on the outer sides of the electronic elements (2), the refrigeration pipes (13) are sequentially communicated and then respectively connected with the heat dissipation fins (12) through pipelines (14), and heat conduction liquid for heat dissipation is filled in the refrigeration pipes (13) and the pipelines (14).

5. Computer motherboard adapted for harsh use environments according to claim 4, characterized in that the side walls of said cooling tubes (13) and ducts (14) are uneven.

6. The computer motherboard suitable for harsh application environment of claim 5, wherein said pipeline (14) is connected with the heat dissipating fins (12) after the second heat dissipating layer (5) is looped around one side edge away from the insulating layer (4).

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