CN210006727U - high-voltage-resistant lead frame - Google Patents
high-voltage-resistant lead frame Download PDFInfo
- Publication number
- CN210006727U CN210006727U CN201920918335.XU CN201920918335U CN210006727U CN 210006727 U CN210006727 U CN 210006727U CN 201920918335 U CN201920918335 U CN 201920918335U CN 210006727 U CN210006727 U CN 210006727U
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- Prior art keywords
- pin
- collecting electrode
- fin
- frame
- resistant lead
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Abstract
The utility model discloses an high pressure resistant lead frame belongs to semiconductor element technical field the utility model discloses a set up a plurality of frame element on with lower sideband, every frame element includes year piece district, and the top in year piece district is equipped with the fin, and the central point of fin puts and is equipped with the mounting hole, the utility model discloses a thickness with the fin is less than the thickness in year piece district to resin thickness when having increased high-pressure plastic envelope can not strike sparks when guaranteeing high pressure, has increased the high pressure resistant performance of product.
Description
Technical Field
The utility model relates to a semiconductor element technical field, concretely relates to kinds of high pressure resistant lead frame.
Background
The lead frame is used as a chip carrier of an integrated circuit, key structural members for realizing the electrical connection between a lead-out end of an internal circuit of a chip and an external lead by means of bonding materials to form an electrical circuit, play a role of a bridge connected with an external lead, need to use a plastic package lead frame in most semiconductor integrated blocks, and are important basic materials in the electronic information industry.
In the lead frame in the prior art, the thickness of the radiating fin is the same as that of the carrying area, and ignition is easy to occur under high pressure.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide kinds of high pressure resistant lead frames.
kinds of high pressure resistant lead frame, including setting up a plurality of frame cell on the same lower side band, adjacent frame cell is connected through the rib, be equipped with the locating hole on the rib, frame cell includes slide zone, slide zone lower part intermediate position is connected with the collecting electrode pin, the collecting electrode pin left and right sides is equipped with base pin and projecting electrode pin respectively, between collecting electrode pin and the base pin, all be connected through the well muscle between collecting electrode pin and the projecting electrode pin, the collecting electrode pin, base pin and projecting electrode pin lower part are connected with pin respectively, second pin and third pin, base pin and projecting electrode pin upper portion are connected with frame part and splash silk portion respectively, the top in slide zone is equipped with the fin, the central point of fin puts and is equipped with the mounting hole, the thickness of fin is less than the thickness in slide zone;
, arranging ejector rod holes on two sides of the mounting hole;
, arranging a plurality of parallel grooves on the back of the slide area, wherein the cross section of each groove is in a V shape with a wide upper part and a sharp lower part;
, arranging a plurality of opening positioning slots on the lower side belt, wherein the opening positioning slots are positioned on the lower side belt and correspond to the position right below the th pin.
The utility model has the advantages that: the utility model discloses a reduce thickness to the fin to through add the ejector pin hole on the fin, reduced the raw and other materials cost of product, resin thickness when having increased high-pressure plastic envelope can not strike sparks when guaranteeing the product high pressure, makes the product withstand high pressure more.
Drawings
FIG. 1 is a schematic structural view of the present invention,
figure 2 is a cross-sectional view of the structure of the utility model,
the frame comprises a frame unit 1, a lower side band 2, a lower side band 21, an opening positioning groove 3, a rib sheet 31, a positioning hole 4, a chip carrying area 41, a groove 5, a collector pin 6, a base pin 61, a frame part 7, an emitter pin 71, a wire splashing part 8, a middle rib 81, a second pin 82, an th pin 83, a third pin 9, a radiating fin 91, a mounting hole 92 and a ejector rod hole.
Detailed Description
The invention will be further illustrated by the following non-limiting examples , with the understanding that the invention is not limited thereto.
As shown in fig. 1-2, the utility model discloses a kinds of high pressure resistant lead frame, including setting up two frame element 1 on the lower side area 2 with , adjacent frame element 1 is connected through the muscle piece 3, is equipped with locating hole 31 on the muscle piece 3, and frame element 1 includes slide glass district 4, has seted up five parallel recesses 41 on the slide glass district 4 back, the section of recess 41 forms the V font of top width tip down, and slide glass district 4 lower part intermediate position is connected with collecting electrode pin 5, and the collecting electrode pin 5 left and right sides is equipped with base pin 6 and projecting pole pin 7 respectively, between collecting electrode pin 5 and the base pin 6, between collecting electrode pin 5 and the projecting pole pin 7 all be connected through well muscle 8, and collecting electrode pin 5, base pin 6 and the projecting pole pin 7 lower part are connected with pin 82, second pin 81 and third pin 83 respectively, are equipped with opening constant head tank 21 on the lower side area 2, and opening constant head tank 21 is located the position that corresponds to under pin 82 on.
The upper parts of the base pin 6 and the emitter pin 7 are respectively connected with a frame part 61 and a wire splashing part 71, a radiating fin 9 is arranged above the chip carrying area 4, a mounting hole 91 is formed in the center of the radiating fin 9, the thickness of the radiating fin 9 is smaller than that of the chip carrying area 4 and is reduced to 0.5mm from 1.3mm, and ejector rod holes 92 are formed in two sides of the radiating hole 91.
In the utility model, the thickness of the radiating fins 9 is reduced, the resin thickness in the high-pressure plastic package process is increased, and the ejector rod holes 92 are arranged on the radiating fins 9, so that the ejector rod holes 92 after plastic package can not be ignited,
the utility model discloses make the improvement back for prior art, reduced the raw and other materials cost of product to guarantee the withstand voltage height of product.
Claims (4)
1, kinds of high voltage resistant lead frame, including setting up a plurality of frame cell on the same lower sideband, adjacent frame cell is connected through the rib, is equipped with the locating hole on the rib, frame cell is including carrying the piece district, it is connected with the collecting electrode pin to carry piece district lower part intermediate position, the collecting electrode pin left and right sides is equipped with base pin and projecting pole pin respectively, between collecting electrode pin and the base pin, all be connected through well muscle between collecting electrode pin and the projecting pole pin, collecting electrode pin, base pin and projecting pole pin lower part are connected with pin, second pin and third pin respectively, base pin and projecting pole pin upper portion are connected with the frame part respectively and spatter silk portion, its characterized in that, the top in year piece district is equipped with the fin, and the central point of fin puts and is equipped with the mounting hole, and the thickness of fin is less than the thickness in year piece district.
2. The high voltage resistant lead frame of claim 1, wherein the mounting holes are provided with ejector pin holes on both sides.
3. The high-voltage resistant lead frames according to claim 1, wherein the carrier region has parallel grooves on its back surface, and the grooves have a V-shaped cross section with a wide top and a sharp bottom.
4. The high-voltage resistant lead frames according to claim 1, wherein the lower side band has a plurality of positioning slots, and the positioning slots are located on the lower side band at positions corresponding to positions right below the th pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920918335.XU CN210006727U (en) | 2019-06-19 | 2019-06-19 | high-voltage-resistant lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920918335.XU CN210006727U (en) | 2019-06-19 | 2019-06-19 | high-voltage-resistant lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210006727U true CN210006727U (en) | 2020-01-31 |
Family
ID=69309886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920918335.XU Active CN210006727U (en) | 2019-06-19 | 2019-06-19 | high-voltage-resistant lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210006727U (en) |
-
2019
- 2019-06-19 CN CN201920918335.XU patent/CN210006727U/en active Active
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