CN203474946U - Chip electroplating fixture of integrated circuit lead frame - Google Patents
Chip electroplating fixture of integrated circuit lead frame Download PDFInfo
- Publication number
- CN203474946U CN203474946U CN201320600491.4U CN201320600491U CN203474946U CN 203474946 U CN203474946 U CN 203474946U CN 201320600491 U CN201320600491 U CN 201320600491U CN 203474946 U CN203474946 U CN 203474946U
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- CN
- China
- Prior art keywords
- top plate
- lead frame
- electroplating
- lower bolster
- integrated circuit
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- Expired - Fee Related
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Abstract
The utility model discloses a chip electroplating fixture of an integrated circuit lead frame. The fixture comprises a lower template and an upper template covered on the lower template, wherein a mounting groove is formed in the working surface of the lower template, an electrode board is arranged in the mounting groove, a silica gel layer is covered on the outer surface of the upper template, and an electroplating window is respectively formed on the upper template and the silica gel layer corresponding to an electroplating region of a lead frame; an electroplating liquid ejection hole penetrating through the lower template is formed in a position, corresponding to the electroplating window of the upper template, on the lower template, and electroplating liquid discharge grooves for enabling electroplating liquid to flow out are formed in two sides of the electroplating liquid ejection hole of the lower template. The chip electroplating fixture disclosed by the utility model is low in production and application cost, good in electroplating effect and long in service life, so that the production cost of an enterprise is greatly reduced.
Description
Technical field
The utility model relates to a kind of fixture, is exactly slice type electroplating clamper of integrated circuit lead frame.
Background technology
IC adhesive integrated circuit lead frame product while producing generally all needs lead frame to electroplate, to improve the cohesive force of lead frame product and chip, bonding wire.Consider the requirement of the aspects such as cost of goods manifactured, encapsulation performance, the plating of IC class lead frame is divided into a plating and ring plating.On some Du Shiji island and the sharp welding region that goes between, plate a kind of metal (being generally silver) of being convenient to welding.Ring plating is that the lead-in wire point of product and Ji Dao are partly plated to a kind of metal of being convenient to welding, and the shape of plating area is belt.Although the electroplating clamp of existing old-fashioned structure has met the requirement of electroplating, in structure, precision, wearing quality etc. aspect is also short of to some extent, causes conforming product rate not high, and work-ing life is short, has increased the production cost of enterprise.
Utility model content
The purpose of this utility model is exactly that to solve the conforming product rate that known electroplating clamp for lead frame electroplates out not high, fixture work-ing life short problem.
For addressing the above problem, the technical solution adopted in the utility model is: slice type electroplating clamper of integrated circuit lead frame, it is characterized in that this fixture comprise lower bolster, can cover the top plate of lower bolster and be clipped in top plate and lower bolster between as the metal electrode board of electrolysis cathode, top plate and lower bolster are fixed by coupling device, lower bolster and top plate are isolator, the contact surface central authorities of top plate and lower bolster are provided with the mounting groove suitable with battery lead plate shape, battery lead plate is fixed in mounting groove, and mounting groove is stretched out in one end; Described top plate outside surface is coated with layer of silica gel, and the back side of top plate is provided with several and inwardly concaves open slot, is provided with to run through open slot and can pass through the plating window of electroplate liquid in top plate and layer of silica gel in lead frame plating area; The internal surface of described lower bolster offers several sump pits, on lower bolster, be provided with some groups of electroplate liquid jet holes that run through lower bolster, every group of electroplate liquid jet hole is communicated with the open slot on top plate by the through hole on penetrating electrode plate, the open slot of top plate is communicated with the sump pit on lower bolster by the through hole on penetrating electrode plate, and lower bolster electroplate liquid jet hole both sides are provided with and are communicated with the plating liquid discharge groove flowing out for electroplate liquid with sump pit.
Carry out correcting for can be to lead frame off normal time, the both sides in the upper outside electroplating surface of described top plate district are connected with several and can rotate for the eccentric nail to lead frame fine setting correcting, described eccentric nail comprises the conus portion and the rotating shaft being connected with conus portion bottom surface of upper end, and conus portion and spindle central deviate.When drawing framework when biasing, as long as rotate eccentric nail, the conus portion of eccentric nail will swaged lead framework, thereby realizes the correcting of lead frame.
Reverse while placing for preventing lead frame, described top plate both sides are connected with respectively counnter attack nail and the locating pin of through-silicon glue-line.By counnter attack nail and locating pin, insert the corresponding aperture on lead frame, when both can accurately stretch into, be lead frame in the right direction, when reverse, will clash.
For accurately each parts being positioned, before and after described top plate, be provided with the pin that coordinates location.By the relative position of each parts and pin, thereby location is realized in the position of definite each parts.
For convenience of the clamping of mechanical manipulator, described top plate both sides are provided with manipulator clamping groove.
For preventing that feeding progress from making a mistake, described top plate is used for destroying the guide pillar of lead frame while being provided with misdelivery material at the two ends of length direction.When feeding progress makes a mistake, lead frame will or reach on front end guide pillar or reach on the guide pillar of rear end, when anchor leg framework, will be destroyed by guide pillar, in next procedure by go-no-go.
Rotate for convenience eccentric nail, on the conus portion of described eccentric nail, be provided with radial direction through hole.
In sum, the utility model beneficial effect is: the utility model is simple in structure, and production and application cost is low, and the utility model is provided with locating pin and eccentric nail, can accurately locate lead frame, so electroplating effect is good; The utility model long service life, greatly reduces enterprise's production cost.
Accompanying drawing explanation
Fig. 1 is the utility model schematic diagram.
Fig. 2 is along A-A line cut-away view in Fig. 1.
Fig. 3 is along B-B line cut-away view in Fig. 1.
Fig. 4 is along C-C line cut-away view in Fig. 1.
Fig. 5 is the stiffening web figure designing on ring plated product top plate.
Embodiment
As shown in Figure 1, the utility model slice type electroplating clamper of integrated circuit lead frame, this fixture comprise lower bolster 8, can cover the top plate 1 of lower bolster 8 and be clipped in top plate 1 and lower bolster 8 between as the battery lead plate 11 of electrolytic anode, battery lead plate 11 is metal sheet, is metal foil in the present embodiment.Lower bolster 8 and top plate 1 are isolator, and in the present embodiment, lower bolster 8 and top plate 1 are plastic plate.Top plate 1 and lower bolster 8 are fixed by coupling device, in the present embodiment, on lower bolster 8, be provided with steel-wire screw-socket 15, what connect with steel-wire screw-socket 15 is screw, jointly realize the fixing of top plate 1 and lower bolster 8, the contact surface central authorities of top plate 1 and lower bolster 8 are provided with the mounting groove suitable with battery lead plate 11 shapes, and battery lead plate 11 is fixed in mounting groove, mounting groove is stretched out in one end, connects electricity while electroplating use.
As shown in Figure 4, top plate 3 outside surfaces are coated with layer of silica gel 7, the back side of top plate 1 is provided with several and inwardly concaves open slot 17, in top plate 1 and layer of silica gel 7, in lead frame plating area, be provided with and run through several plating windows 6 that open slot 17 can pass through electroplate liquid, in the present embodiment, as shown in Figure 1, along the bar shaped direction of top plate and layer of silica gel 7, being provided with four rows, is longitudinally 10 row, the internal surface of lower bolster 8 offers several sump pits 10, on lower bolster 8, be provided with some groups of electroplate liquid jet holes 12 that run through lower bolster, every group of electroplate liquid jet hole is communicated with the open slot on top plate by the through hole on penetrating electrode plate, the open slot of top plate is communicated with sump pit by the through hole on penetrating electrode plate, lower bolster 8 electroplate liquid jet hole both sides are provided with and are communicated with the electroplate liquid spout 9 flowing out for electroplate liquid with sump pit 10, electroplate liquid spout 9 is for running through the groove of lower bolster 8, electroplate liquid is flowed out and is entered electroplate liquid spout 9 by sump pit 10, realize and discharging.
As shown in Figure 1, the both sides in the upper outside electroplating surface of top plate 1 district are connected with several and can rotate for the eccentric nail 2 to lead frame fine setting correcting, as shown in Figure 2, eccentric nail 2 upper ends are conus portion, bottom is the rotating shaft being connected with conus portion bottom surface, conus portion and spindle central deviate, and rotating shaft is stretched in top plate 1 and can be rotated, and on the conus portion of eccentric nail, is provided with radial direction through hole.During use, by thin bar, stretch in through hole and rotate and can realize adjusting by swaged lead framework.
As shown in Figure 1, top plate 1 both sides are connected with respectively counnter attack nail 3 and the locating pin 13 of through-silicon glue-line 7.Top plate 1 front and back are provided with the pin 5 that coordinates location.Top plate 1 both sides are provided with manipulator clamping groove 14.Top plate 1 is used for destroying the guide pillar 4 of lead frame while being provided with misdelivery material at the two ends of length direction.When feeding progress makes a mistake, send a step pitch or a few step pitch more, lead frame will or reach on front end guide pillar or reach on the guide pillar of rear end, when anchor leg framework, will be destroyed by guide pillar, in next procedure by go-no-go.The stiffening web 16 being connected on top plate 1.Stiffening web figure for design on ring plated product top plate 1, can increase top plate PAD face intensity, makes that PAD face is not easily broken to fall.
The utility model is work like this, and the plating window 6 being arranged on the utility model is consistent with the electroplated district on lead frame, and during plating, lead frame is positioned in layer of silica gel, and electroplating surface contacts with layer of silica gel.On lead frame, compress pressing plate, pressing plate is the metal sheet of conduction, and the cathode electrode of electroplating device is connected on the pressing plate of equipment, and when pressing plate is pushed down product, electrode contacts with product, current lead-through.The anode of electroplating device is connected in fixture on battery lead plate 11.Electroplating solution sprays from electroplate liquid jet hole 12, and by electrochemical reaction, the metal particle in electroplating solution is deposited on lead frame product surface, forms electrolytic coating.Solution after plating is back to liquor box internal recycle through plating liquid discharge groove and uses.
Claims (7)
1. slice type electroplating clamper of integrated circuit lead frame, it is characterized in that this fixture comprise lower bolster (8), cover the top plate (1) on lower bolster (8) and be clipped in top plate (1) and lower bolster (8) between as the metal electrode board (11) of electrolytic anode, top plate (1) and lower bolster (8) are fixed by coupling device, lower bolster and top plate are isolator, the contact surface central authorities of top plate and lower bolster are provided with the mounting groove suitable with battery lead plate shape, battery lead plate (11) is fixed in mounting groove, and mounting groove is stretched out in one end; Described top plate (3) outside surface is coated with layer of silica gel (7), the back side of top plate is provided with several and inwardly concaves open slot, and top plate (1) and layer of silica gel (7) be upper to be provided with in lead frame plating area and to run through open slot and can pass through the plating window (6) of electroplate liquid; The internal surface of described lower bolster (8) offers several sump pits, on lower bolster (8), be provided with the some groups of electroplate liquid jet holes (12) that run through lower bolster, every group of electroplate liquid jet hole is communicated with the open slot on top plate by the through hole on penetrating electrode plate (11), and the open slot on top plate (1) is communicated with the sump pit (10) on lower bolster by the through hole on penetrating electrode plate.
2. slice type electroplating clamper of integrated circuit lead frame according to claim 1, the both sides that it is characterized in that the upper outside electroplating surface of described top plate (1) district are connected with several and can rotate for the eccentric nail (2) to lead frame fine setting correcting, described eccentric nail (2) comprises the conus portion and the rotating shaft being connected with conus portion bottom surface of upper end, and conus portion and spindle central deviate.
3. slice type electroplating clamper of integrated circuit lead frame according to claim 1 and 2, is characterized in that described top plate (1) both sides are connected with respectively counnter attack nail (3) and the locating pin (13) of through-silicon glue-line (7).
4. slice type electroplating clamper of integrated circuit lead frame according to claim 3, is characterized in that being provided with the pin (5) that coordinates location before and after described top plate (1).
5. slice type electroplating clamper of integrated circuit lead frame according to claim 4, is characterized in that described top plate (1) both sides are provided with manipulator clamping groove (14).
6. slice type electroplating clamper of integrated circuit lead frame according to claim 5, is characterized in that described top plate (1) is used for destroying the guide pillar (4) of lead frame while being provided with misdelivery material at the two ends of length direction.
7. slice type electroplating clamper of integrated circuit lead frame according to claim 2, is characterized in that being provided with radial direction through hole on the conus portion of described eccentric nail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320600491.4U CN203474946U (en) | 2013-09-27 | 2013-09-27 | Chip electroplating fixture of integrated circuit lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320600491.4U CN203474946U (en) | 2013-09-27 | 2013-09-27 | Chip electroplating fixture of integrated circuit lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203474946U true CN203474946U (en) | 2014-03-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320600491.4U Expired - Fee Related CN203474946U (en) | 2013-09-27 | 2013-09-27 | Chip electroplating fixture of integrated circuit lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203474946U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103469289A (en) * | 2013-09-27 | 2013-12-25 | 铜陵丰山三佳微电子有限公司 | Integrated circuit lead frame plate type electroplating clamp |
| CN107557827A (en) * | 2017-08-29 | 2018-01-09 | 群茂国际贸易（上海）有限公司 | The conductive mask and conductive mask group of selective electroplating RFID antenna Gold plated Layer |
| CN112760702A (en) * | 2020-12-24 | 2021-05-07 | 铜陵蓝盾丰山微电子有限公司 | Silver plating device for lead frame |
-
2013
- 2013-09-27 CN CN201320600491.4U patent/CN203474946U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103469289A (en) * | 2013-09-27 | 2013-12-25 | 铜陵丰山三佳微电子有限公司 | Integrated circuit lead frame plate type electroplating clamp |
| CN107557827A (en) * | 2017-08-29 | 2018-01-09 | 群茂国际贸易（上海）有限公司 | The conductive mask and conductive mask group of selective electroplating RFID antenna Gold plated Layer |
| CN107557827B (en) * | 2017-08-29 | 2019-10-22 | 群茂国际贸易（上海）有限公司 | The conductive mask and conductive mask group of selective electroplating RFID antenna Gold plated Layer |
| CN112760702A (en) * | 2020-12-24 | 2021-05-07 | 铜陵蓝盾丰山微电子有限公司 | Silver plating device for lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140312 Termination date: 20140927 |
|
| EXPY | Termination of patent right or utility model |