CN209998007U - wafer cleaning and drying machine - Google Patents

wafer cleaning and drying machine Download PDF

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Publication number
CN209998007U
CN209998007U CN201920104493.1U CN201920104493U CN209998007U CN 209998007 U CN209998007 U CN 209998007U CN 201920104493 U CN201920104493 U CN 201920104493U CN 209998007 U CN209998007 U CN 209998007U
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China
Prior art keywords
box body
wafer
lower box
drying machine
wafer cleaning
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CN201920104493.1U
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Chinese (zh)
Inventor
葛林五
李�杰
丁高生
陈景韶
葛林新
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Shanghai Tiniu Technology Co ltd
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Shanghai Tiniu Electromechanical Equipment Co Ltd
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Priority to CN201920104493.1U priority Critical patent/CN209998007U/en
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Abstract

The utility model discloses an wafer washer-dryer, this desiccator includes the upper box body, be provided with drying assembly in the upper box body, the well box body, be provided with the basket of flowers subassembly that is used for holding the wafer in the well box body, and lower box body, upper box body, well box body and lower box body can play and constitute sealed whole, be provided with in the lower box body and be used for the outside exhaust air current the exhaust tube, be used for to the inlet tube that supplies water in the lower box body and be used for the outlet pipe of outside exhaust rivers, the beneficial effects of the utility model are that improve the abluent cleanliness factor of wafer and drying efficiency.

Description

wafer cleaning and drying machine
Technical Field
The utility model belongs to the wafer field, concretely relates to wafer washer-dryer.
Background
In the field of wafer processing, the wafer needs to be cleaned for multiple times, the requirement on cleaning cleanliness is high, and the wafer needs to be dried in time after being cleaned. In both the cleaning and drying processes, it is desirable to ensure that the wafer is not damaged, and to improve the effectiveness and efficiency of the cleaning and drying processes.
Disclosure of Invention
To the problem that exists among the prior art, the utility model provides an wafer washer-dryer, the utility model discloses can improve the dry efficiency of wafer washing.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
wafer cleaning and drying machine comprises an upper box body, a middle box body and a lower box body, wherein the upper box body is internally provided with a drying component, the middle box body is internally provided with a flower basket component for bearing wafers, and
and the lower box body, the upper box body, the middle box body and the lower box body can form a sealed whole body by , and a th exhaust pipe for exhausting airflow to the outside, a water inlet pipe for supplying water into the lower box body and a th water outlet pipe for exhausting water flow to the outside are arranged in the lower box body.
Preferably, the dryer further includes: and a moving mechanism capable of holding the wafer and moving the wafer up and down so that the wafer can be shifted in position in the middle or lower case.
Preferably, the middle box body is provided with a moving wheel, and the middle box body and the upper box body can integrally laterally move to enable the top of the lower box body to be opened or closed.
Preferably, the dryer further comprises a side box body, the side box body is connected to the side of the top of the lower box body, an overflow port is arranged on the top of the side of the lower box body, the side box body is communicated with the inside of the lower box body through the overflow port, and a second water outlet pipe is arranged on the side box body and used for leading out liquid overflowing from the lower box body.
Preferably, the side box body is further communicated with a second air suction pipe for sucking the air flow in the side box body.
Preferably, the bottom of the lower box body has a predetermined oblique angle, the th water outlet pipe is arranged at the bottom of the lower box body, the th suction pipe has a height greater than that of the th water outlet pipe, and the water inlet pipe is arranged between the th water outlet pipe and the th suction pipe.
Preferably, the drying component comprises a shaft tube, wherein a plurality of th air outlet holes are uniformly distributed on the shaft tube, and two ends of the shaft tube are communicated with interfaces.
Preferably, the basket assembly comprises sets of side plates which are oppositely arranged and provided with parallel grooves, the wafers can be placed between every two opposite grooves, the basket assembly further comprises an air duct, the air duct is arranged in the middle of the side plates, and a plurality of second air outlets are formed in the air duct.
A method for cleaning and drying wafer, comprising the following steps:
step 1, moving a middle box body and an upper box body to open the top of the lower box body;
step 2, water is fed through the water inlet pipe, overflows from the overflow port, enters the side box body, is discharged through the second water outlet pipe, and forms a cleaning flow channel in the lower box body;
step 3, the moving mechanism clamps the wafer and downwards enters the lower box body for cleaning;
step 4, moving the middle box body and the upper box body to seal the joint of the middle box body and the lower box body, and introducing nitrogen into the shaft tube;
step 5, after preset time, the moving mechanism clamps the wafer to upwards enter the flower basket assembly, isopropanol and nitrogen are simultaneously introduced into the shaft tube for drying, and meanwhile, the water in the lower box body is discharged through a water outlet pipe and a second water outlet pipe;
step 6, after a second preset time, introducing nitrogen into the shaft tube and the ventilation pipeline, and simultaneously exhausting gas through an -th exhaust tube and a second exhaust tube;
and 7, clamping the wafer downwards by the moving mechanism to enter the lower box body, moving the middle box body and the upper box body to open the top of the lower box body, clamping the wafer upwards by the moving mechanism, and taking out the wafer.
Compared with the prior art, the beneficial effects of the utility model are that:
1. an th exhaust pipe arranged at the bottom of the lower box body is matched with the shaft pipe positioned at the top of the upper box body to form IPA airflow from top to bottom, the IPA airflow is parallel to the surface of the wafer to smoothly complete drying, and nitrogen is discharged from a vent pipeline in the middle of the flower basket assembly to accelerate the whole drying process and improve the drying effect and the drying efficiency;
2. through the overflow device of the side box body, the wafer is cleaned through water flow, and nitrogen is introduced into the upper box body and the middle box body during cleaning, so that the cleanness of the inner parts of all box body structures is ensured;
3. the opening and closing of the top of the lower box body are realized through the moving wheels of the middle box body, and wafers can be conveniently put in and taken out.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only the embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a cross-sectional view of the overall structure diagram of the present invention.
Fig. 2 is a schematic side view of the present invention.
Fig. 3 is a schematic cross-sectional view taken along line B-B in fig. 2.
FIG. 4 is a schematic view of a flower basket assembly.
Fig. 5 is a schematic view of the lower case of the present invention when the top is open.
Detailed Description
The technical solution in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of , but not all embodiments.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
As shown in FIGS. 1 to 5, the present embodiment provides an wafer cleaning and drying machine, which comprises an upper case 1 having a drying module 11 disposed therein, a middle case 2 having a basket assembly 21 disposed therein for receiving a wafer 5, and a basket assembly 2
The lower box 3, the upper box 1, the middle box 2 and the lower box 3 can form a sealed whole body by , the lower box 3 is provided with a air exhaust pipe 31 for discharging air flow to the outside, a water inlet pipe 32 for supplying water to the lower box 3 and a water outlet pipe 33 for discharging water flow to the outside.
The dryer further includes: and a moving mechanism 4 capable of holding the wafer 5 and moving the wafer 5 up and down so that the wafer 5 can be shifted in position in the middle case 2 or the lower case 3.
The middle box body 2 is provided with moving wheels, and the middle box body 2 and the upper box body 1 can integrally move laterally so that the top of the lower box body 3 is opened or closed.
The dryer also comprises a side box body 6, wherein the side box body 6 is connected to the top side of the lower box body 3, the top of the side of the lower box body 3 is provided with an overflow port 61, the side box body 6 is communicated with the inside of the lower box body 3 through the overflow port 61, the side box body 6 is provided with a second water outlet pipe 62, and the second water outlet pipe 62 is used for guiding out liquid overflowing from the lower box body 3.
The side box 6 is also connected to a second air suction pipe 63 for sucking air flow inside the side box 6.
The bottom of the lower box 3 has a predetermined bevel angle, the th water outlet pipe 33 is arranged at the bottom of the lower box 3, the th suction pipe 31 has a height larger than that of the th water outlet pipe 33, and the water inlet pipe 32 is arranged between the th water outlet pipe 33 and the th suction pipe 31.
The drying component 11 comprises a shaft tube 111, a plurality of th air outlets are uniformly distributed on the shaft tube 111, and two ends of the shaft tube 111 are both communicated with a connector 112.
The flower basket assembly 21 comprises groups of side plates 211 which are oppositely arranged and provided with parallel grooves, wafers 5 can be placed between every two opposite grooves, the flower basket assembly 21 further comprises a vent pipe 212, the vent pipe 212 is arranged in the middle of the side plates 211, and a plurality of second air outlet holes are formed in the vent pipe 212.
A method for cleaning and drying wafer, comprising the following steps:
step 1, moving the middle box body 2 and the upper box body 1 to open the top of the lower box body 3;
step 2, water is fed through the water inlet pipe 32, overflows from the overflow port 61, enters the side box body 6, is discharged through the second water outlet pipe 62, and forms a cleaning flow channel in the lower box body 3;
step 3, the moving mechanism 4 clamps the wafer 5 and downwards enters the lower box body 3 for cleaning;
step 4, moving the middle box body 2 and the upper box body 1 to seal the joint of the middle box body 2 and the lower box body 3, and introducing nitrogen into the shaft tube 111;
step 5, after preset time, the moving mechanism 4 clamps the wafer 5 to enter the flower basket assembly 21 upwards, isopropanol and nitrogen are simultaneously introduced into the shaft tube 111 for drying, and simultaneously the water in the lower box body 3 is discharged through the water outlet pipe 33 and the second water outlet pipe 62;
after the step 6 and the second preset time, nitrogen is introduced into the shaft tube 111 and the ventilation pipeline 212, and gas is exhausted through the -th air exhaust tube 31 and the second air exhaust tube 63;
and 7, clamping the wafer 5 downwards by the moving mechanism 4 to enter the lower box body 3, moving the middle box body 2 and the upper box body 1 to open the top of the lower box body 3, clamping the wafer 5 upwards by the moving mechanism 4, and taking out the wafer 5.
A th exhaust pipe arranged at the bottom of the lower box body is matched with a shaft pipe positioned at the top of the upper box body to form IPA airflow from top to bottom, the IPA airflow is parallel to the surface of the wafer and smoothly completes drying, nitrogen is discharged from a ventilation pipeline at the middle position of the flower basket assembly to accelerate the whole drying process, the drying effect and the drying efficiency are improved, the wafer is cleaned through water flow through an overflow device of the side box body, nitrogen is introduced into the upper box body and the middle box body during cleaning, the cleanness of the inner parts of all box body structures is guaranteed, the opening and closing of the top of the lower box body are realized through a moving wheel of the middle box body, and the wafer can be conveniently put in and taken out.
Although the present invention has been described in detail with reference to the above embodiments, it should be understood by those skilled in the art that modifications or improvements based on the disclosure of the present invention can be made without departing from the spirit and scope of the present invention, and these modifications and improvements are within the spirit and scope of the present invention.

Claims (8)

  1. The wafer cleaning dryer of , characterized in that, this desiccator includes:
    the drying device comprises an upper box body (1), wherein a drying component (11) is arranged in the upper box body (1);
    the device comprises a middle box body (2), wherein a flower basket assembly (21) for bearing a wafer (5) is arranged in the middle box body (2); and
    the lower box body (3), the upper box body (1), the middle box body (2) and the lower box body (3) can form a sealed whole body by , and a air exhaust pipe (31) used for exhausting air flow to the outside, a water inlet pipe (32) used for supplying water into the lower box body (3) and a water outlet pipe (33) used for exhausting water flow to the outside are arranged in the lower box body (3).
  2. 2. The wafer cleaning and drying machine of claim 1, wherein the drying machine further comprises: and a moving mechanism (4) capable of holding the wafer (5) and moving the wafer (5) up and down so that the wafer (5) can be shifted in position in the middle box (2) or the lower box (3).
  3. 3. The wafer cleaning and drying machine according to claim 2, wherein the middle case (2) is provided with moving wheels, and the middle case (2) and the upper case (1) are integrally laterally movable such that the top of the lower case (3) is opened or closed.
  4. 4. The wafer cleaning and drying machine of claim 3, wherein the drying machine further comprises:
    the side box body (6), side box body (6) are connected the top side of lower box body (3), side top of lower box body (3) is provided with overflow mouth (61), overflow mouth (61) make side box body (6) with the inside intercommunication of lower box body (3), be provided with second outlet pipe (62) on side box body (6), second outlet pipe (62) are used for leading out the liquid of overflow in lower box body (3).
  5. 5. The wafer cleaning and drying machine according to claim 4, wherein the side box (6) is further connected with a second air suction pipe (63) for sucking the air flow inside the side box (6).
  6. 6. The wafer cleaning and drying machine according to claim 1, wherein the bottom of the lower tank (3) has a predetermined bevel angle, the th outlet tube (33) is disposed at the bottom of the lower tank (3), the th suction tube (31) has a height greater than that of the th outlet tube (33), and the inlet tube (32) is disposed between the th outlet tube (33) and the th suction tube (31).
  7. 7. The wafer cleaning and drying machine of of any of claims 1-6, wherein the drying assembly (11) comprises a shaft tube (111), a plurality of air outlets are uniformly distributed on the shaft tube (111), and the two ends of the shaft tube (111) are communicated with the interfaces (112).
  8. 8. The wafer cleaning and drying machine of claim 7, wherein the basket assembly (21) comprises sets of side plates (211) which are oppositely arranged and provided with parallel grooves, the wafer (5) can be placed between every two opposite grooves, the basket assembly (21) further comprises an air duct (212), the air duct (212) is arranged in the middle of the side plates (211), and a plurality of second air outlet holes are formed in the air duct (212).
CN201920104493.1U 2019-01-22 2019-01-22 wafer cleaning and drying machine Active CN209998007U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920104493.1U CN209998007U (en) 2019-01-22 2019-01-22 wafer cleaning and drying machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920104493.1U CN209998007U (en) 2019-01-22 2019-01-22 wafer cleaning and drying machine

Publications (1)

Publication Number Publication Date
CN209998007U true CN209998007U (en) 2020-01-31

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ID=69299905

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920104493.1U Active CN209998007U (en) 2019-01-22 2019-01-22 wafer cleaning and drying machine

Country Status (1)

Country Link
CN (1) CN209998007U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109719071A (en) * 2019-01-22 2019-05-07 上海提牛机电设备有限公司 A kind of wafer cleaning drying machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109719071A (en) * 2019-01-22 2019-05-07 上海提牛机电设备有限公司 A kind of wafer cleaning drying machine
CN109719071B (en) * 2019-01-22 2024-08-02 上海提牛科技股份有限公司 Wafer cleaning dryer

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Address after: 201405 Room 101, 88 Tong Fu Road, Fengxian District, Shanghai.

Patentee after: Shanghai Tiniu Technology Co.,Ltd.

Address before: 201405 Room 101, 88 Tong Fu Road, Fengxian District, Shanghai.

Patentee before: SHANGHAI STN ELECTROMECHANICAL EQUIPMENT Co.,Ltd.

CP01 Change in the name or title of a patent holder