CN112435940A

CN112435940A - Liquid removing tank and cleaning equipment

Info

Publication number: CN112435940A
Application number: CN202011358874.6A
Authority: CN
Inventors: 左国军; 余兴梅; 汤和平; 丁力; 万红朝
Original assignee: Changzhou Jiejiachuang Precision Machinery Co Ltd
Current assignee: Changzhou Jiejiachuang Precision Machinery Co Ltd
Priority date: 2020-11-27
Filing date: 2020-11-27
Publication date: 2021-03-02

Abstract

The invention provides a liquid removing tank and cleaning equipment. Wherein, the liquid removal groove includes: the silicon wafer carrier can be accommodated in the groove body, and a liquid drainage pipeline is arranged at the bottom of the groove body; and at least part of the liquid removing assembly is arranged in the tank body and is used for removing liquid at the bottom of the silicon wafer carrier arranged in the tank body. According to the technical scheme, the liquid attached to the bottom of the silicon wafer carrier can be effectively removed, the liquid residue at the bottom of the silicon wafer carrier is prevented, so that a drying blind area cannot be generated when the silicon wafer carrier which is subjected to liquid removal operation is dried, the influence on the subsequent processing technology is further prevented, and the quality of a silicon wafer product is improved.

Description

Liquid removing tank and cleaning equipment

Technical Field

The application relates to the technical field of silicon wafer cleaning equipment, in particular to a liquid removing groove and cleaning equipment.

Background

The crystalline silicon cell is one of the commonly used elements in the photovoltaic industry, during the production and manufacturing process of the crystalline silicon cell, a plurality of process operations need to be carried out on the silicon wafer, wherein, when the process operations such as alkali polishing, wool making and the like are carried out, chemical solution needs to be used for carrying out surface treatment on the silicon wafer, and after the surface treatment is finished, the silicon wafer needs to be moved to a drying groove along with a carrier for drying. In the existing cleaning equipment, a drying groove has a certain drying blind area, and the solution at the bottom of a carrier cannot be effectively removed, so that the bottom of the carrier is still remained by residual liquid after drying is finished, and in the process that a silicon wafer moves along with the carrier, the residual liquid is easily contacted with the silicon wafer to influence the drying effect, and the processing process of the subsequent process can be influenced, so that the quality of a silicon wafer product is influenced.

Disclosure of Invention

According to an embodiment of the present invention, it is intended to improve at least one of technical problems existing in the prior art or the related art.

To this end, it is an object according to embodiments of the present invention to provide a deaeration tank.

It is another object according to an embodiment of the present invention to provide a cleaning apparatus.

In order to achieve the above object, according to an embodiment of a first aspect of the present invention, there is provided a liquid removing tank including: the silicon wafer carrier can be accommodated in the groove body, and a liquid drainage pipeline is arranged at the bottom of the groove body; and at least part of the liquid removing assembly is arranged in the tank body and is used for removing liquid at the bottom of the silicon wafer carrier arranged in the tank body.

According to an embodiment of the first aspect of the present invention, the liquid removal tank comprises a tank body and a liquid removal assembly. The tank body is used as a base body of the liquid removing tank and can accommodate a plurality of silicon wafer carriers. At least part of the liquid removing assembly is arranged in the tank body and used for removing liquid at the bottom of the silicon wafer carrier arranged in the tank body, compared with the natural falling of the liquid, the liquid at the bottom of the silicon wafer carrier falls under the external action of the liquid removing assembly, and the liquid removing efficiency is high. The bottom of the tank body is provided with a liquid discharge pipeline for discharging liquid in the tank body outwards.

The liquid removing tank in the scheme can effectively remove liquid attached to the bottom of the silicon wafer carrier, prevents the bottom of the silicon wafer carrier from having liquid residues, does not generate a drying blind area when the silicon wafer carrier which completes the liquid removing operation is dried, further prevents the influence on the subsequent processing technology, and is favorable for improving the quality of silicon wafer products.

In addition, the liquid removing tank in the above technical solution provided by the embodiment of the present invention may further have the following additional technical features:

in the technical scheme, at least part of the liquid removing assembly enables the liquid at the bottom of the silicon wafer carrier to fall under the action of negative pressure.

In the technical scheme, at least part of the liquid removing assembly can generate negative pressure so as to drive the liquid at the bottom of the silicon wafer carrier to fall in an accelerating way by utilizing the negative pressure action on the silicon wafer carrier, and compared with the common liquid removing mode, the liquid removing assembly capable of generating the negative pressure has high liquid removing efficiency.

In the above technical solution, the liquid removing assembly includes: the supporting structure is arranged in the groove body and is connected with the side wall of the groove body, and the supporting structure can support the silicon wafer carrier; the water absorption cotton is arranged on the supporting structure and used for absorbing liquid at the bottom of the silicon wafer carrier; and the negative pressure driving device is arranged outside the tank body and is used for forming negative pressure in the tank body.

In this technical scheme, remove liquid subassembly and include bearing structure, cotton, first ventilation pipeline and negative pressure drive arrangement that absorbs water. The supporting structure is arranged on the side wall in the groove body and used for supporting the silicon wafer carrier; the water absorption cotton is arranged on the supporting structure, so that the water absorption cotton and the silicon wafer carrier are correspondingly arranged, and the liquid at the bottom of the silicon wafer carrier is absorbed through the water absorption cotton, so that the liquid removal is realized. The supporting structure can be in a plate shape, a grid state, a net plate shape or other shapes, wherein the net plate-shaped supporting structure can also play a role in draining the absorbent cotton. The negative pressure driving device communicated with the groove body is used for forming negative pressure in the groove body, so that airflow movement is promoted by utilizing the negative pressure effect, and liquid falling on the silicon wafer carrier is accelerated. The negative pressure driving device includes, but is not limited to, a fan, a vacuum pump, and a vacuum generator.

Furthermore, a first ventilation pipeline can be arranged in the groove body, and two ends of the first ventilation pipeline are respectively connected with the side wall of the groove body through fixing clamping pieces so as to support the first ventilation pipeline; the first ventilation pipeline is provided with a plurality of moisture absorption ports arranged at intervals along the length direction. One end of the first ventilation pipeline is connected with the negative pressure driving device through a pipeline, so that when the negative pressure driving device works, negative pressure is generated at the position of the moisture absorption port, the air flow movement in the groove body is accelerated, and the liquid attached to the bottom of the silicon wafer carrier is accelerated to be separated. The moisture absorption port can also be provided with a nozzle for removing liquid. Wherein the number of the first ventilation pipelines can be one or more; the first ventilation pipeline can be a straight pipe or a U-shaped pipe, when the first ventilation pipeline is the straight pipe, one end of the first ventilation pipeline is connected with the negative pressure driving device, the other end of the first ventilation pipeline is closed, and when the first ventilation pipeline is the U-shaped pipe, two ports are simultaneously connected to the negative pressure driving device. In addition, the first ventilation pipeline can be connected with a ventilation device through a pipeline, so that air is blown into the first ventilation pipeline through the ventilation device, the movement of air flow is promoted, and the falling of liquid on the silicon wafer carrier is accelerated.

In the above technical solution, the liquid removing assembly includes: the supporting structure is arranged in the groove body and is connected with the side wall of the groove body, and the supporting structure can support the silicon wafer carrier; the liquid collecting box is connected to the supporting structure, a first air suction opening is formed in the top of the liquid collecting box and arranged along the extending direction of a bottom rod piece of the silicon wafer carrier, top plates on two sides of the first air suction opening are inclined downwards to be matched with the bottom rod piece of the silicon wafer carrier, and a second air suction opening is formed in the bottom of the liquid collecting box; one end of the negative pressure driving device is connected with the second air suction opening through a pipeline, the negative pressure driving device can enable the liquid collecting box to generate negative pressure so as to collect liquid at the bottom of the silicon wafer carrier, and the other end of the negative pressure driving device is connected with the liquid discharge pipeline through a pipeline.

In this technical scheme, remove liquid subassembly and include bearing structure, album of liquid box and negative pressure drive arrangement. The supporting structure is arranged on the side wall in the groove body and used for supporting the silicon wafer carrier, and meanwhile, the liquid collecting box can be supported. The liquid collecting box penetrates through the supporting structure and is connected with the filter screen plate; the top end of the liquid collecting box is positioned above the supporting structure and corresponds to the bottom rod piece of the silicon wafer carrier, and a first air suction opening extending along the bottom rod piece of the silicon wafer carrier is arranged at the top end of the liquid collecting box; the bottom of collection liquid box is located bearing structure's below, and the bottom of collection liquid box is equipped with the second inlet scoop, and the second inlet scoop passes through the pipeline and is connected to negative pressure drive arrangement. The negative pressure driving device generates negative pressure in the liquid collecting box, and the first air suction opening accelerates the air flow movement at the bottom of the silicon wafer carrier, so that the liquid attached to the bottom of the silicon wafer carrier falls off at an accelerated speed. Wherein, on the top of album liquid box, the roof downward sloping of first suction opening both sides to make the top shape of album liquid box and the bottom member looks adaptation of silicon chip carrier, be favorable to reducing the interval between the surface of bottom member and the suction opening, improve the homogeneity that removes liquid. The number of the liquid collecting boxes corresponds to that of the silicon wafer carriers, and each liquid collecting box is arranged corresponding to one bottom rod piece of each silicon wafer carrier.

In the above technical solution, the liquid removing assembly further includes: the negative pressure pipeline is arranged below the tank body and communicated with the tank body through a through hole in the bottom wall of the tank body, one end, far away from the tank body, of the negative pressure pipeline is connected with the negative pressure driving device, and the negative pressure pipeline can generate negative pressure under the action of the negative pressure driving device so that liquid at the bottom of the silicon wafer carrier falls down at an accelerated speed.

In the technical scheme, the through hole is formed in the bottom of the tank body, the negative pressure pipeline communicated with the tank body is arranged below the tank body and is connected with the negative pressure driving device, so that negative pressure is generated in the negative pressure pipeline under the action of the negative pressure driving device, airflow movement in the tank body is accelerated, liquid falling at the bottom of the silicon wafer carrier is accelerated, and liquid removal efficiency is improved. Wherein, the number of the negative pressure pipelines can be one or more.

In the above technical solution, the liquid removing assembly includes: the supporting structure is arranged in the groove body and is connected with the side wall of the groove body, and the supporting structure can support the silicon wafer carrier; and the water absorption cotton is arranged on the supporting structure and used for absorbing liquid at the bottom of the silicon wafer carrier.

In this technical scheme, except that liquid subassembly includes bearing structure and absorbent cotton. The supporting structure is arranged on the side wall in the groove body and used for supporting the silicon wafer carrier; the water absorption cotton is arranged on the supporting structure, so that the water absorption cotton and the silicon wafer carrier are correspondingly arranged, and the liquid at the bottom of the silicon wafer carrier is absorbed through the water absorption cotton, so that the liquid removal is realized. The absorbent cotton has large coverage area, high liquid removal speed, simple structure and lower cost. The supporting structure can be in a plate shape, a grid state, a net plate shape or other shapes, wherein the net plate-shaped supporting structure can also play a role in draining the absorbent cotton.

In the above technical solution, the liquid removing assembly further includes: the spraying pipeline is arranged in the groove body and connected with the side wall of the groove body, and a plurality of spraying holes are formed in the spraying pipeline and used for spraying water to the absorbent cotton so that the absorbent cotton can keep the humidity required by liquid removal.

In this technical scheme, under the cotton condition of being provided with the absorption of water, through set up the pipeline that sprays in the cell body, be equipped with a plurality of holes that spray on the pipeline to when the humidity of the cotton that absorbs water was low excessively, to the cotton water spray that absorbs water, so that the cotton that absorbs water keeps suitable humidity, in order to improve the cotton effect of absorbing water. The spraying pipe is connected with the side wall of the groove body through a fixing clamping piece; the side wall of the tank body is provided with a through hole, and the spray pipe penetrates through the through hole and is connected into an external water source pipeline so as to supply water into the spray pipe. The waste liquid generated by spraying can be discharged outwards through a liquid discharge pipeline.

In the technical scheme, a liquid discharge air suction opening is formed in the liquid discharge pipeline and is connected to the negative pressure driving device through a pipeline; the liquid discharge pipeline is provided with an inverted siphon section so as to realize sealing of the liquid discharge pipeline by using liquid in the inverted siphon section; wherein, the liquid discharge inlet scoop is positioned between the inverted siphon section and the groove body.

In the technical scheme, the liquid discharge air suction opening is arranged in the liquid discharge pipeline and is connected with the negative pressure driving device through a pipeline, so that the liquid at the bottom of the tank body is accelerated to flow into the liquid discharge pipeline by utilizing the negative pressure generated by the negative pressure driving device, and the liquid discharge speed is accelerated. The inverted siphon section can retain part of liquid so as to enable the liquid discharge pipeline to form water seal and prevent waste gas from flowing back into the tank body.

In an embodiment according to the second aspect of the invention there is provided a cleaning apparatus comprising: a frame body; the process tank is arranged on the frame body, can contain process liquid and is used for carrying out surface processing on the silicon wafer; the liquid removing tank is arranged on the frame body and is used for removing liquid from the bottom of the silicon wafer carrier loaded with the silicon wafers; and the drying groove is arranged on the frame body, and a drying device is arranged in the drying groove and used for drying the silicon wafer and the silicon wafer carrier which are used for completing the liquid removal operation.

According to an embodiment of the second aspect of the present invention, the cleaning apparatus includes a frame body, a process tank, the liquid removing tank of any one of the embodiments of the first aspect, and a drying tank. The frame body is used for supporting and installing the process tank, the liquid removing tank and the drying tank. The process tank can contain process liquid to perform surface processing on the silicon wafer. Wherein, the silicon chip is placed on the silicon chip carrier so as to be convenient for moving. And the silicon wafer after surface processing is moved into a liquid removing tank along with the silicon wafer carrier so as to remove liquid from the bottom of the silicon wafer carrier and prevent residual process liquid from being attached to the bottom when the silicon wafer carrier enters the drying tank. And a drying device is arranged in the drying groove, and after the liquid removing operation of the silicon wafer carrier is completed, the silicon wafer is moved into the drying groove along with the silicon wafer carrier to be dried so as to remove the residual liquid on the silicon wafer and the silicon wafer carrier and facilitate the subsequent processing operation.

It should be noted that, the number of the process tank, the liquid removing tank and the drying tank can be one or more. The process tank, the liquid removing tank and the drying tank are sequentially arranged in the above sequence, so that the length of a moving line of the silicon wafer and the silicon wafer carrier can be reduced, and the processing efficiency can be improved. In addition, the process tank can be used for alkaline polishing, texturing, or other surface finishing processes.

In addition, the cleaning device in this scheme also has all the beneficial effects of the liquid removal tank in any one of the embodiments of the first aspect described above, and details are not repeated here.

In the above technical solution, the cleaning apparatus further includes: the moving device is arranged corresponding to the frame body and used for moving the silicon wafer carrier loaded with the silicon wafers; and the controller is electrically connected with the moving device to control the moving device to move the silicon wafer carrier loaded with the silicon wafers.

In the technical scheme, the moving device corresponding to the frame body is arranged to move the silicon wafer carrier loaded with the silicon wafers through the moving device, so that manual operation is reduced, and the processing efficiency is improved. The controller electrically connected with the moving device is arranged to control the work of the moving device, so that the moving device can move the silicon wafer carrier according to the process program, and the automatic operation is realized. Wherein the moving device includes but is not limited to a robot arm, a manipulator or an industrial robot.

Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of embodiments of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 shows a schematic view of a deaeration tank according to one embodiment of the invention;

FIG. 2 shows a schematic view of a silicon wafer carrier according to one embodiment of the present invention;

FIG. 3 shows a schematic view of a deaeration tank according to one embodiment of the invention;

FIG. 4 shows a schematic view of a deaeration tank according to one embodiment of the invention;

FIG. 5 shows a schematic view of a deaeration tank according to one embodiment of the invention;

FIG. 6 shows a schematic view of a deaeration tank according to one embodiment of the invention;

FIG. 7 shows a schematic view of a deaeration tank according to one embodiment of the invention;

FIG. 8 shows a schematic view of a deaeration tank according to one embodiment of the invention;

FIG. 9 shows a schematic view of a deaeration tank according to one embodiment of the invention;

FIG. 10 shows a schematic view of a deaeration tank according to one embodiment of the invention;

FIG. 11 shows a schematic view of the assembly of a drip cassette according to one embodiment of the present invention;

FIG. 12 shows a schematic view of the assembly of a drip cassette according to one embodiment of the present invention;

FIG. 13 shows a schematic view of the assembly of a drip cassette according to one embodiment of the present invention;

FIG. 14 shows a schematic view of a deaeration tank according to one embodiment of the invention;

FIG. 15 shows a schematic view of a deaeration tank according to one embodiment of the invention;

FIG. 16 shows a schematic view of a deaeration tank according to one embodiment of the invention;

FIG. 17 shows a schematic view of a deaeration tank according to one embodiment of the invention;

FIG. 18 shows a schematic block diagram of a cleaning apparatus according to an embodiment of the invention;

FIG. 19 shows a schematic block diagram of a cleaning apparatus according to one embodiment of the present invention.

Wherein, the correspondence between the reference numbers and the names of the components in fig. 1 to 19 is as follows:

1 liquid removing groove, 11 groove bodies, 111 side walls, 112 bottom walls, 113 through holes, 114 fixing clamping pieces, 13 liquid removing components, 131 first ventilation pipelines, 1311 moisture absorption ports, 133 negative pressure pipelines, 134 supporting structures, 1341 supporting seats, 1342 filter screen plates, 135 liquid collecting boxes, 1351 first air suction ports, 1352 second air suction ports, 1361 third air ventilation pipelines, 1362 side air suction hoods, 1363 air suction cavities, 137 absorbent cotton, 138 spraying pipelines, 1381 spraying holes, 1382 water source inlets, 139 negative pressure driving devices, 14 liquid discharging pipelines, 141 liquid discharging air suction ports, 142 inverted siphon sections, 15 connecting pieces, 2 silicon wafer carriers, 21 bottom rod pieces, 22 end plates, 23 silicon wafers, 3 cleaning equipment, 31 frame bodies, 32 process grooves, 33 drying grooves, 331 drying devices and 34 moving devices.

Detailed Description

In order that the above objects, features and advantages of the embodiments according to the present invention can be more clearly understood, embodiments according to the present invention will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of embodiments according to the invention, however, embodiments according to the invention may be practiced in other ways than those described herein, and therefore the scope of protection of this application is not limited by the specific embodiments disclosed below.

A liquid removing bath and a cleaning apparatus according to some embodiments of the present invention will be described below with reference to FIGS. 1 to 19.

Example one

The embodiment provides a liquid removing tank 1, which comprises a tank body 11 and a liquid removing assembly 13, and is used for performing liquid removing operation on the bottom of a silicon wafer carrier 2 loaded with a silicon wafer 23.

As shown in fig. 1 and 2, the tank 11 is a base of the liquid removing tank 1 and can accommodate a plurality of silicon wafer carriers 2. The bottom wall 112 of the tank body 11 is provided with a through hole 113 connected with the liquid discharge pipeline 14 for discharging liquid outwards. At least part removes liquid subassembly 13 and locates in the cell body 11 to when silicon chip carrier 2 was arranged in the cell body 11, get rid of the liquid of silicon chip carrier 2 bottom through removing liquid subassembly 13, compare in the situation that liquid falls naturally, set up and remove liquid subassembly 13 and can play effectual promotion effect to removing the liquid operation.

The liquid removing tank 1 in the embodiment can effectively remove the liquid attached to the bottom of the silicon wafer carrier 2, and prevent the liquid from remaining at the bottom of the silicon wafer carrier 2, so that a drying blind area cannot be generated when the silicon wafer carrier 2 which completes the liquid removing operation is dried, further the influence on the subsequent processing technology is prevented, and the quality of a silicon wafer product is favorably improved.

Example two

As shown in fig. 1 to 3, the tank 11 is a base of the liquid removing tank 1 and can accommodate a plurality of silicon wafer carriers 2. The bottom wall 112 of the tank body 11 is provided with a through hole 113 connected with the liquid discharge pipeline 14 for discharging liquid outwards. At least part of the liquid removing assembly 13 is arranged in the groove body 11 and corresponds to the silicon wafer carrier 2 when the silicon wafer carrier is arranged in the groove body 11. At least part of the liquid removing assembly 13 can generate negative pressure, so that during liquid removing operation, airflow in the groove body 11 is accelerated to flow under the action of the negative pressure, liquid at the bottom of the silicon wafer carrier 2 is accelerated to fall, and compared with the situation that the liquid falls naturally, the liquid removing efficiency is higher.

EXAMPLE III

The embodiment provides a liquid removal tank 1, which comprises a tank body 11 and a liquid removal assembly 13.

As shown in fig. 3, the liquid removing assembly 13 specifically includes a supporting structure 134, absorbent cotton 137 and a negative pressure driving device 139. Specifically, the support structure 134 is disposed on the sidewall 111 inside the tank 11 to support the wafer carrier 2, so that the wafer carrier 2 can be kept stable during the liquid removing operation. The supporting structure 134 is provided with water absorption cotton 137 and is arranged corresponding to the silicon wafer carrier 2, so that the water absorption cotton 137 is directly contacted with the bottom of the silicon wafer carrier 2 to absorb liquid at the bottom of the silicon wafer carrier 2, and liquid removal is realized. The shape of the support structure 134 includes, but is not limited to, a plate shape, a grid shape, and a mesh plate shape. When the negative pressure driving device 139 works, negative pressure can be formed in the tank 11 to accelerate the liquid on the silicon wafer carrier 2 to fall by using the air flow movement.

Example four

The embodiment provides a liquid removal tank 1, which is further improved on the basis of the third embodiment.

As shown in fig. 3, the liquid removing assembly 13 further includes two first ventilation pipelines 131, and each of the first ventilation pipelines 131 is a straight pipe; each first ventilation pipeline 131 extends along the length direction of the silicon wafer carrier 2 and is respectively connected with the side wall 111 of the slot body 11 through a fixing clamping piece 114 so as to support the first ventilation pipeline 131; the two first ventilation pipes 131 are spaced apart in the height direction. One end of the first ventilation pipeline 131 is connected with the negative pressure driving device 139 through a pipeline, and the other end is closed; each first ventilation pipeline 131 is provided with a plurality of moisture absorption ports 1311 arranged at intervals along the length direction, so that when the negative pressure driving device 139 works, negative pressure is generated at the moisture absorption ports 1311, and liquid attached to the bottom of the silicon wafer carrier 2 is separated in an accelerated manner by accelerating the movement of air flow in the tank body 11, thereby achieving a liquid removal effect. In addition, a nozzle may be provided at the moisture absorption port 1311 to remove the liquid. The negative pressure driving device 139 includes, but is not limited to, a blower, a vacuum pump, and a vacuum generator.

Further, the support structure 134 includes a support base 1341 and a filter screen 1342. The quantity of supporting seat 1341 is a plurality of, and sets up at interval each other, and supporting seat 1341 passes through connecting piece 15 and connects on the inside wall of cell body 11. The filter screen 1342 is disposed on a plurality of supporting seats 1341 for supporting the silicon wafer carrier 2. Wherein, the water absorption cotton 137 is arranged on the filter screen 1342 to absorb the liquid at the bottom of the silicon wafer carrier 2; the meshes of the filter screen 1342 can drain the absorbent cotton 137. At this time, the absorbent cotton 137 may completely cover the upper surface of the filter screen 1342 to expand the range of absorbing liquid. Of course, the absorbent cotton 137 may also only cover part of the filter screen 1342, that is, the absorbent cotton 137 is disposed corresponding to the silicon wafer carrier 2. When the number of the silicon wafer carriers 2 is plural, a plurality of absorbent cottons 137 may be provided to remove the liquid from the bottom of each silicon wafer carrier 2. The support seat 1341 may be a continuous structure provided along the side wall 111 of the tank 11.

It should be noted that the number of the first ventilation pipes 131 may be one or other numbers; the first ventilation pipe 131 may also be a U-shaped pipe, in which case both ports of the first ventilation pipe 131 are connected to the negative pressure driving device 139 at the same time to enhance the air suction effect.

In another implementation manner of this embodiment, the first ventilation pipeline 131 may also be connected to a positive pressure driving device, and the positive pressure driving device (e.g., a blower) blows air into the first ventilation pipeline 131 to form a positive pressure in the first ventilation pipeline 131 and promote the movement of the air flow in the tank 11, thereby accelerating the falling of the liquid on the wafer carrier 2.

EXAMPLE five

As shown in fig. 4, the liquid removing assembly 13 further includes a negative pressure pipeline 133. The negative pressure pipeline 133 is arranged below the tank body 11, the bottom wall 112 of the tank body 11 is provided with a through hole 113 which can be matched with the negative pressure pipeline 133, the negative pressure pipeline 133 is communicated with the tank body 11 through the through hole 113, and one end of the negative pressure pipeline 133, which is far away from the tank body 11, is connected with the negative pressure driving device 139. When the negative pressure driving device 139 works, a negative pressure is generated in the negative pressure pipeline 133, so that the movement of the air flow in the tank body 11 is accelerated, the liquid at the bottom of the silicon wafer carrier 2 is driven to fall down at an accelerated speed, and the liquid removal efficiency can be further improved. The number of the negative pressure pipelines 133 may be the structure shown in fig. 3, but may be one or other numbers.

Further, as shown in fig. 4, a liquid discharge air suction opening 141 is formed in the liquid discharge pipeline 14, and the liquid discharge air suction opening 141 is connected to the negative pressure driving device 139 through a pipeline, so that the negative pressure generated by the negative pressure driving device 139 accelerates the liquid at the bottom of the tank body 11 to flow into the liquid discharge pipeline 14, thereby accelerating the liquid discharge speed. Inverted siphon section 142 is disposed in drain pipe 14 to seal drain pipe 14 with the liquid retained in inverted siphon section 142 to prevent exhaust gas from flowing back into tank 11. The liquid exhaust inlet 141 is located between the inverted siphon section 142 and the tank 11, so that the exhaust gas in the liquid exhaust pipeline 14 flows back under the action of negative pressure.

EXAMPLE six

The embodiment provides a liquid removal tank 1, and is further improved on the basis of the fourth embodiment.

As shown in fig. 5, the liquid removing assembly 13 further includes a spraying pipe 138, and the spraying pipe 138 is disposed in the tank body 11 and connected to the side wall 111 of the tank body 11 through the fixing clip 114. The spraying pipeline 138 is provided with a plurality of spraying holes 1381, one end of the spraying pipeline 138 penetrates through the side wall 111 of the tank body 11 and extends outwards, and one end of the spraying pipeline 138, which is positioned outside the tank body 11, is provided with a water source inlet 1382 for connecting a water source pipeline. After the silicon wafer carrier 2 finishes liquid removal and is moved out of the liquid removal tank 1, water is sprayed to the absorbent cotton 137 through the spraying pipeline 138, so that the absorbent cotton 137 keeps the humidity required by liquid removal. The excess waste liquid generated in the spraying process can be discharged outwards through the liquid discharge pipeline 14.

Furthermore, a liquid discharge air suction opening 141 is formed in the liquid discharge pipeline 14, and the liquid discharge air suction opening 141 is connected to the negative pressure driving device 139 through a pipeline, so that the liquid at the bottom of the tank body 11 is accelerated to flow into the liquid discharge pipeline 14 by using the negative pressure generated by the negative pressure driving device 139, and the liquid discharge speed is further accelerated. Inverted siphon section 142 is disposed in drain pipe 14 to seal drain pipe 14 with the liquid retained in inverted siphon section 142 to prevent exhaust gas from flowing back into tank 11. The liquid exhaust inlet 141 is located between the inverted siphon section 142 and the tank 11, so that the exhaust gas in the liquid exhaust pipeline 14 flows back under the action of negative pressure.

EXAMPLE seven

As shown in fig. 6 and 7, the liquid removing assembly 13 further includes a negative pressure pipeline 133 and a spraying pipeline 138. The negative pressure pipeline 133 is arranged below the tank body 11, the bottom wall 112 of the tank body 11 is provided with a through hole 113 which can be matched with the negative pressure pipeline 133, the negative pressure pipeline 133 is communicated with the tank body 11 through the through hole 113, and one end of the negative pressure pipeline 133, which is far away from the tank body 11, is connected with the negative pressure driving device 139. When the negative pressure driving device 139 works, a negative pressure is generated in the negative pressure pipeline 133, so that the movement of the air flow in the tank body 11 is accelerated, the liquid at the bottom of the silicon wafer carrier 2 is driven to fall down at an accelerated speed, and the liquid removal efficiency can be further improved. The number of the negative pressure pipelines 133 may be the structure shown in fig. 3, but may be one or other numbers.

The spraying pipe 138 is disposed in the tank body 11 and connected to the sidewall 111 of the tank body 11 via the fixing clip 114. The spraying pipeline 138 is provided with a plurality of spraying holes 1381, one end of the spraying pipeline 138 penetrates through the side wall 111 of the tank body 11 and extends outwards, and one end of the spraying pipeline 138, which is positioned outside the tank body 11, is provided with a water source inlet 1382 for connecting a water source pipeline. After the silicon wafer carrier 2 finishes liquid removal and is moved out of the liquid removal tank 1, water is sprayed to the absorbent cotton 137 through the spraying pipeline 138, so that the absorbent cotton 137 keeps the humidity required by liquid removal. The excess waste liquid generated in the spraying process can be discharged outwards through the liquid discharge pipeline 14.

Example eight

As shown in fig. 8, the liquid assembly 13 further includes a third vent line 1361, and the third vent line 1361 is disposed outside the tank body 11 and is communicated with the inside of the tank body 11. Specifically, one end of the third vent line 1361 is connected to the negative pressure driving device 139; a side air draft cover 1362 is arranged between the third vent pipeline 1361 and the side wall 111 of the tank body 11, and the side air draft cover 1362 is of a horn-like structure; the open end of the side draft cover 1362 is communicated with the side wall 111 of the tank body 11, and the other end of the side draft cover 1362 is connected with the third vent line 1361, so as to increase the coverage area of the third vent line 1361. An air suction cavity 1363 communicated with the side air suction cover 1362 is arranged in the groove body 11. When the negative pressure device works, negative pressure is generated in the third ventilation pipeline 1361, and the air flow in the groove body 11 is guided through the air suction cavity 1363, so that the air flow movement is promoted, the liquid falling on the silicon wafer carrier 2 is accelerated, and the liquid removal effect is further enhanced.

In another implementation manner of this embodiment, the third vent line 1361 may also be connected to a positive pressure driving device, and a positive pressure driving device (e.g., a blower) blows air into the third vent line 1361 to form a positive pressure in the third vent line 1361 and promote the movement of the air flow in the tank 11, thereby accelerating the liquid on the silicon wafer carrier 2 to fall down.

Example nine

The embodiment provides a liquid removal tank 1, which is further improved on the basis of the second embodiment. As shown in fig. 1, 9-13, the liquid removal assembly 13 includes a support structure 134, a liquid collection box 135 and a negative pressure driving device 139.

The liquid collecting boxes 135 are arranged in the tank body 11 and used for collecting liquid at the bottom of the silicon wafer carrier 2. Specifically, the support structure 134 includes a support base 1341 and a filter screen 1342. The quantity of supporting seat 1341 is a plurality of, and sets up at interval each other, and supporting seat 1341 passes through connecting piece 15 and connects on the inside wall of cell body 11. The filter screen 1342 is disposed on a plurality of supporting seats 1341 for supporting the silicon wafer carrier 2. The liquid collecting box 135 penetrates through the filter screen 1342 along the height direction and is in nested connection with the filter screen 1342; the top ends of the liquid collecting boxes 135 are positioned above the filter screen plate 1342, and each liquid collecting box 135 is arranged corresponding to one bottom rod piece 21 of the silicon wafer carrier 2; the top end of each liquid collecting box 135 is provided with a first air suction opening 1351 extending along the length direction of the bottom rod member 21 of the silicon wafer carrier 2, and the first air suction opening 1351 faces the bottom rod member 21 of the silicon wafer carrier 2; the bottom of each liquid collecting box 135 is of a funnel-shaped structure, the bottom end of the liquid collecting box 135 is positioned below the filter screen plate 1342 and is provided with a second air suction inlet 1352, and the second air suction inlet 1352 is connected to the negative pressure driving device 139 through a pipeline. When the negative pressure driving device 139 works, negative pressure is generated in the liquid collecting box 135, and the airflow movement at the bottom of the silicon wafer carrier 2 is accelerated through the first air suction opening 1351, so that the liquid attached to the bottom rod 21 of the silicon wafer carrier 2 falls in an accelerated manner; the other end of the negative pressure driving means 139 communicates with the drain line 14 through a line so that the liquid collected in the liquid collecting box 135 is discharged through the drain line 14.

As shown in fig. 11, at the top end of the liquid collecting box 135, the top plates at the two sides of the first air suction opening 1351 are gradually inclined downwards from outside to inside, so that the top of the liquid collecting box 135 forms a structure similar to a horn shape to be matched with the bottom rod member 21 of the silicon wafer carrier 2, and the distance between the outer surface of the bottom rod member 21 and the air suction opening can be reduced, so that the air flow acting on the bottom rod member 21 is more uniform, and the liquid removing effect is improved.

Example ten

The embodiment provides a liquid removal tank 1, which is further improved on the basis of the ninth embodiment.

As shown in fig. 14, the liquid removing assembly further includes two first ventilation pipelines 131, and the first ventilation pipelines are straight pipes; each first ventilation pipeline 131 extends along the length direction of the silicon wafer carrier 2 and is respectively connected with the side wall 111 of the slot body 11 through a fixing clamping piece 114 so as to support the first ventilation pipeline 131; the two first ventilation pipes 131 are spaced apart in the height direction. One end of the first ventilation pipeline 131 is connected with the negative pressure driving device 139 through a pipeline, and the other end is closed; each first ventilation pipeline 131 is provided with a plurality of moisture absorption ports 1311 arranged at intervals along the length direction, so that when the negative pressure driving device 139 works, negative pressure is generated at the moisture absorption ports 1311, and liquid attached to the bottom of the silicon wafer carrier 2 is separated in an accelerated manner by accelerating the movement of air flow in the tank body 11, thereby achieving a liquid removal effect. In addition, a nozzle may be provided at the moisture absorption port 1311 to remove the liquid. The negative pressure driving device 139 includes, but is not limited to, a blower, a vacuum pump, and a vacuum generator.

EXAMPLE eleven

As shown in fig. 15, the liquid removing assembly 13 further includes a negative pressure pipeline 133. The negative pressure pipeline 133 is arranged below the tank body 11, the bottom wall 112 of the tank body 11 is provided with a through hole 113 which can be matched with the negative pressure pipeline 133, the negative pressure pipeline 133 is communicated with the tank body 11 through the through hole 113, and one end of the negative pressure pipeline 133, which is far away from the tank body 11, is connected with the negative pressure driving device 139. When the negative pressure driving device 139 works, negative pressure is generated in the negative pressure pipeline 133, so that the air flow movement in the tank body 11 is accelerated, the liquid at the bottom of the silicon wafer carrier 2 is driven to fall down at an accelerated speed, the liquid which does not enter the liquid collecting box 135 is discharged through the negative pressure pipeline 133, and the liquid removing efficiency can be further improved.

Example twelve

The embodiment provides a liquid removal tank 1, which is further improved on the basis of the ninth embodiment. As shown in fig. 1 and 16, the liquid removing assembly 13 further includes a third ventilating duct 1361, a side draft cover 1362 and a draft cavity 1363.

The third vent line 1361 is disposed outside the tank 11 and is communicated with the inside of the tank 11. Specifically, one end of the third vent line 1361 is connected to the negative pressure driving device 139; a side air draft cover 1362 is arranged between the third vent pipeline 1361 and the side wall 111 of the tank body 11, and the side air draft cover 1362 is of a horn-like structure; the open end of the side draft cover 1362 is communicated with the side wall 111 of the tank body 11, and the other end of the side draft cover 1362 is connected with the third vent line 1361, so as to increase the coverage area of the third vent line 1361. An air suction cavity 1363 communicated with the side air suction cover 1362 is arranged in the groove body 11. When the negative pressure device works, negative pressure is generated in the third vent pipeline 1361, and the air flow in the groove body 11 is guided through the air suction cavity 1363, so that the air flow is promoted to flow into the third vent pipeline 1361, and the liquid removal effect is further enhanced. In addition, the third vent line 1361 may also be connected to a positive pressure driving device, and the positive pressure driving device (e.g., a blower) blows air into the third vent line 1361 to form a positive pressure in the third vent line 1361 and promote the movement of the air flow in the tank 11, thereby accelerating the liquid on the silicon wafer carrier 2 to fall.

It should be noted that, in another implementation manner of this embodiment, the liquid collecting box 135 and the absorbent cotton 137 may be disposed in the tank 11 at the same time, so as to further enhance the liquid removing effect. For example, the absorbent cotton 137 may be disposed corresponding to the bottom rod 21 of the silicon wafer carrier 2, and the liquid collecting box 135 may be disposed corresponding to the bottom of the end plate 22 of the silicon wafer carrier 2, or the absorbent cotton 137 may be disposed corresponding to the bottom of the end plate 22 of the silicon wafer carrier 2, and the liquid collecting box 135 may be disposed corresponding to the bottom rod 21 of the silicon wafer carrier 2, so as to remove the liquid from the bottoms of the bottom rod 21 and the end plate 22 of the silicon wafer carrier 2.

EXAMPLE thirteen

The embodiment provides a liquid removal tank 1, which is further improved on the basis of the first embodiment. As shown in fig. 1 and 17, the liquid removal assembly 13 includes a support structure 134 and absorbent cotton 137.

A support structure 134 is disposed on the sidewall 111 inside the tank 11 to support the wafer carrier 2, so that the wafer carrier 2 can be kept stable during the liquid removal operation. The supporting structure 134 is provided with absorbent cotton 137 so as to directly contact with the bottom wall 112 of the silicon wafer carrier 2 through the absorbent cotton 137 to absorb the liquid at the bottom of the silicon wafer carrier 2, thereby realizing liquid removal. The absorbent cotton 137 has large coverage area, high liquid removal speed, simple structure and lower cost.

Specifically, the support structure 134 includes a support base 1341 and a filter screen 1342. The quantity of supporting seat 1341 is a plurality of, and sets up at interval each other, and supporting seat 1341 passes through connecting piece 15 and connects on the inside wall of cell body 11. The filter screen 1342 is disposed on a plurality of supporting seats 1341 for supporting the silicon wafer carrier 2. Wherein, the water absorption cotton 137 is arranged on the filter screen 1342 to absorb the liquid at the bottom of the silicon wafer carrier 2; the meshes of the filter screen 1342 can drain the absorbent cotton 137. At this time, the absorbent cotton 137 may completely cover the upper surface of the filter screen 1342 to expand the range of absorbing liquid. Of course, the absorbent cotton 137 may also only cover part of the filter screen 1342, that is, the absorbent cotton 137 is disposed corresponding to the silicon wafer carrier 2. When the number of the silicon wafer carriers 2 is plural, a plurality of absorbent cottons 137 may be provided to remove the liquid from the bottom of each silicon wafer carrier 2. The support seat 1341 may be a continuous structure provided along the side wall 111 of the tank 11.

Further, the liquid removing assembly 13 further includes a spraying pipeline 138, and the spraying pipeline 138 is disposed in the tank body 11 and connected to the side wall 111 of the tank body 11. The spraying pipeline 138 is provided with a plurality of spraying holes 1381, one end of the spraying pipeline 138 penetrates through the side wall 111 of the tank body 11 and extends outwards, and one end of the spraying pipeline 138, which is positioned outside the tank body 11, is provided with a water source inlet 1382 for connecting a water source pipeline. After the silicon wafer carrier 2 finishes liquid removal and is moved out of the liquid removal tank 1, water is sprayed to the absorbent cotton 137 through the spraying pipeline 138, so that the absorbent cotton 137 keeps the humidity required by liquid removal. The excess waste liquid generated in the spraying process can be discharged outwards through the liquid discharge pipeline 14.

Example fourteen

The embodiment provides a cleaning device 3, as shown in fig. 1, fig. 2 and fig. 18, comprising a frame body 31, a process tank 32, a liquid removing tank 1 and a drying tank 33 in any of the above embodiments.

The frame body 31 serves as a base body of the cleaning apparatus 3 for supporting and installing the process tank 32, the liquid removing tank 1, and the drying tank 33. The process tank 32 may contain a process liquid to perform various surface processing treatments on the silicon wafer 23. Wherein, during the processing, the silicon wafer 23 is placed on the silicon wafer carrier 2 so as to be moved. The liquid removing tank 1 is used for removing liquid at the bottom of the silicon wafer carrier 2, and the drying tank 33 is provided with a drying device 331 for drying the silicon wafer carrier 2 loaded with silicon wafers comprehensively. The silicon wafer 23 after finishing surface processing moves to the liquid removing tank 1 along with the silicon wafer carrier 2, and the liquid removing assembly 13 of the liquid removing tank 1 is used for removing liquid from the bottom of the silicon wafer carrier 2, so that residual process liquid is prevented from adhering to the bottom when the silicon wafer carrier 2 enters the drying tank 33. After the liquid removing operation is completed, the silicon wafer 23 and the silicon wafer carrier 2 enter the drying tank 33 for drying, so as to remove the residual liquid on the silicon wafer 23 and the residual liquid on the silicon wafer carrier 2, thereby facilitating the subsequent processing operation.

It should be noted that the number of the process tank 32, the liquid removing tank 1 and the drying tank 33 may be one or more. Wherein, the process tank 32, the liquid removing tank 1 and the drying tank 33 are sequentially arranged, the length of the moving line of the silicon wafer 23 and the silicon wafer carrier 2 can be reduced, and the processing efficiency can be improved. In addition, the process tank 32 may be used for alkaline polishing, texturing, or other surface finishing processes.

In addition, the cleaning device 3 in the present scheme also has all the beneficial effects of the liquid removing tank 1 in any of the above embodiments, and details are not repeated here.

Example fifteen

The embodiment provides a cleaning device 3, which is further improved on the basis of the ninth embodiment.

As shown in fig. 1, 2 and 19, the cleaning apparatus 3 further includes a moving device 34 and a controller. The moving device 34 is provided with a device corresponding to the frame body 31, so that the silicon wafer carrier 2 loaded with the silicon wafer 23 is moved by the moving device 34 in the processing process, the manual operation can be reduced, and the processing efficiency is improved. The controller is internally provided with a process program and is electrically connected with the moving device 34 to control the moving device 34, so that the moving device 34 moves the silicon wafer carrier 2 according to the process program to realize automatic operation. The handling device 34 includes, but is not limited to, a robot arm, a manipulator, or an industrial robot.

In a specific implementation manner of this embodiment, one or more process tanks 32 in the existing cleaning equipment can be modified into the deaeration tank 1 in any of the above embodiments, without adding a tank position of the original cleaning equipment. In the processing process, the moving device 34 moves the silicon wafer carrier 2 loaded with the silicon wafers 23 according to the process program under the control of the controller, performs various surface treatment processes in the process tank 32, then moves the silicon wafer carrier 2 to the liquid removing tank 1 for liquid removing operation, and then moves the silicon wafer carrier 2 to the drying tank 33 for drying operation. The drying time of the original cleaning equipment is t1, the process time in the liquid removing groove 1 of the modified cleaning equipment 3 is t2, the drying time of the drying groove 33 is t3, and t1 is t2+ t3, namely the total drying time after modification is unchanged, but the liquid removing and drying effects are better.

In one embodiment of this embodiment, a liquid removal tank and a cleaning apparatus are provided. Wherein, the carrier is used for placing the silicon chip, comprises member and both sides end plate, and the technical problem that the technical scheme that this embodiment provided mainly solved is: and removing the solution of the rod piece at the bottom of the carrier and the solution of the end plates at two sides of the carrier.

(1) Technical scheme one

The water absorption device and the negative pressure device are arranged in the liquid removing tank at the same time.

Except that what cistern including spray pipe way, negative pressure device, water absorption device, the otter board sets up in the inslot backup pad, its structure and carrier bottom looks adaptation, the backup pad sets up through support piece setting on the inside wall of groove, the mesh has been seted up on the otter board, the cotton setting that absorbs water is on the otter board, specially, the cotton complete coverage otter board that absorbs water, be provided with the moisture absorption mouth on the negative pressure pipe way, negative pressure device includes negative pressure pipe way, the pipeline connecting piece, except that set up one negative pressure pipe way in the cistern at least, negative pressure pipe way can be for U type pipe namely pipeline both ends all connect the inlet scoop, or one end is sealed, the pipeline of inlet scoop is connected to one end, the shower, negative pressure pipe accessible location fastener is fixed on the inside wall of groove, the through-hole can be seted.

The carrier approaches to the liquid removing tank along with the movement of the manipulator, when the bottom of the carrier contacts the absorbent cotton, the manipulator stops moving, at the moment, the manipulator does not unhook, stays for a plurality of seconds, and meanwhile, a negative pressure pipeline driving device (a fan, a vacuum pump, a vacuum generator and the like, and products capable of generating negative pressure) in the tank is started to absorb partial moisture; after a certain process time, the negative pressure air suction effect is stopped, and meanwhile, the carrier moves along with the mechanical arm, so that the carrier is separated from the absorbent cotton until the liquid removing groove, and the next drying procedure is carried out.

The manipulator takes the carrier away the back, and the spray pipeline on upper portion in the groove is opened, begins to spray for several seconds, guarantees that the humidity of the resistant pickling surface of water can stop, and unnecessary waste liquid accessible waste liquid discharge port is discharged.

Through setting up the cotton that absorbs water, can effectively get rid of the solution of on the carrier bottom member and carrier end plate bottom, through setting up negative pressure device, can further get rid of the moisture in the dehumidification inslot.

(2) Technical scheme two

In the technical scheme I, the negative pressure device is removed, other structures are kept unchanged, and the solution at the bottom of the carrier is removed in a mode that the water absorption cotton is arranged at the bottom.

(3) Technical scheme three

The liquid removing groove comprises a negative pressure device, a supporting seat and a screen plate, wherein the negative pressure device comprises a negative pressure device arranged on a groove bottom supporting plate and a negative pressure device arranged on a groove side plate, the supporting plate is arranged on the inner side wall of the groove through a supporting piece, the negative pressure device on the groove bottom supporting plate comprises an air suction box and an air suction pipeline, the supporting seat is arranged at the bottom in the groove and is used for placing a carrier, particularly, the air suction box can be arranged on the screen plate, the peripheral side of the screen plate can be arranged on the supporting seat, the air suction box is provided with a first air suction opening and a second air suction opening, the first air suction opening is arranged above the screen plate and is close to a member bar at the bottom of the carrier, the second air suction opening is arranged below the screen plate and is used for connecting an air suction driving device (a fan, a vacuum pump, a vacuum generator and the like, and products capable of, the negative pressure device on the side plate of the groove can be arranged in the same technical scheme, or an air suction area is arranged in the groove, the air suction pipe is connected to the air suction area, and the air suction area is connected with an external air suction device; the bottom of the groove is provided with a liquid outlet which is connected with an external liquid drainage pipeline.

The carrier can be placed on the supporting seat along with the movement of the manipulator is close to the liquid removing groove, the screen plate is arranged on the supporting seat, and the air suction box is arranged on the screen plate, so that the air suction box is close to a bottom rod piece of the carrier and is not in contact with the bottom rod piece of the carrier.

The air suction box is used for removing the solution of the rod piece at the bottom of the carrier, and a negative pressure air suction device can be arranged on the end plate supporting seat for removing the solution at the bottom of the end plate of the carrier. The negative pressure air suction box drives the air flow at the lower part of the carrier, and has the effect of accelerating drainage on liquid attached to the carrier and materials.

In the first and second technical solutions, the moisture absorption port formed in the negative pressure pipeline disposed on the side plate of the tank may also be provided with a nozzle to remove moisture in the tank. The liquid removing tank provided with the negative pressure device can improve the yield and efficiency of the client products. The defects that two drying modes exist in the existing equipment are avoided, namely a drying groove is high in temperature and efficiency and not easy to maintain, and the cleanliness of the groove is low; the other drying groove has low temperature, relatively low drying efficiency and high cleanliness.

The waste discharge port is arranged at the bottom of the liquid removing groove and connected with a waste discharge pipeline, the other end of the waste discharge pipeline is connected with a peripheral waste discharge pipeline, and a siphon-shaped pipeline is arranged on the waste discharge pipeline and used for forming water seal and avoiding waste gas stored in the peripheral waste discharge pipeline from flowing back to the liquid removing groove to influence the process effect.

The silicon wafer cleaning device is characterized in that a negative pressure air suction opening is formed in the waste discharge pipeline, and is particularly connected with an air suction driving device (a fan, a vacuum pump, a vacuum generator and the like can be used as products capable of generating negative pressure) at the bottom of the tank, so that the solution stored on the silicon wafer carrier is guided and flows downwards along the gravity direction, and the liquid removal effect is enhanced.

The technical solution for removing the solution from the bottom of the carrier is not limited to the specific examples in the embodiment, and may include various combination designs, for example, in the first technical solution and the second technical solution, the moisture in the bottom of the carrier bottom rod and the bottom of the carrier end plate is removed by using absorbent cotton, in the third technical solution, the moisture in the bottom of the carrier bottom rod and the bottom of the carrier end plate is removed by using a negative pressure device (i.e., an air suction box) arranged at the bottom of the tank, in one solution, the moisture in the bottom of the carrier bottom rod is removed by using absorbent cotton, the moisture in the bottom of the carrier end plate is removed by using the air suction box, or in one solution, the moisture in the bottom of the carrier bottom rod is removed by using the air suction box, and the moisture in the bottom.

A cleaning device comprises a process tank, a liquid removing tank and a drying tank, a moving device and a device body, wherein silicon wafers to be treated are placed on carriers, solution is introduced into the process tank and is used for processing the surfaces of the silicon wafers, the moving device can be a mechanical arm, the carriers containing the silicon wafers are transported between tank bodies due to the realization, namely, from one process tank to another process tank, the carriers containing the silicon wafers can retain the solution after being processed by the solution in the process tank, the liquid removing tank and the drying tank are arranged to realize drying of the carriers containing the silicon wafers, and the solution on the surfaces of the silicon wafers and the solutions of the carriers are effectively removed.

The technical scheme of the embodiments of the invention is described in detail with reference to the accompanying drawings, so that the liquid attached to the bottom of the silicon wafer carrier can be effectively removed, and the bottom of the silicon wafer carrier is prevented from having liquid residues, so that a drying blind area cannot be generated when the silicon wafer carrier which finishes the liquid removal operation is dried, further the influence on the subsequent processing technology is prevented, and the quality of the silicon wafer product is improved.

In embodiments according to the present invention, the terms "first", "second", "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless expressly limited otherwise. The terms "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. Specific meanings of the above terms in the embodiments according to the present invention can be understood by those of ordinary skill in the art according to specific situations.

In the description of the embodiments according to the present invention, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the embodiments according to the present invention and simplifying the description, but do not indicate or imply that the referred devices or units must have a specific direction, be configured and operated in a specific orientation, and thus, should not be construed as limiting the technical aspects of the present application.

In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example in accordance with the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above is only a preferred embodiment according to the present invention, and is not intended to limit the technical solution of the present application, and it is obvious to those skilled in the art that various modifications and changes can be made to the technical solution of the present application. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the technical scheme of the application shall be included in the protection scope of the application.

Claims

1. A liquid removal tank (1), characterized by comprising:

the silicon wafer carrier (2) can be accommodated in the tank body (11), and a liquid discharge pipeline (14) is arranged at the bottom of the tank body (11) and used for discharging liquid in the tank body (11) outwards;

and at least part of the liquid removing component (13) is arranged in the groove body (11) and is used for removing liquid at the bottom of the silicon wafer carrier (2) in the groove body (11).

2. The deaeration tank (1) according to claim 1,

at least part of the liquid removing assembly (13) enables the liquid at the bottom of the silicon wafer carrier (2) to fall down through the action of negative pressure.

3. The liquid scavenging tank (1) according to claim 2, characterized in that the liquid scavenging assembly (13) comprises:

the supporting structure (134) is arranged in the groove body (11) and is connected with the side wall (111) of the groove body (11), and the supporting structure (134) can support the silicon wafer carrier (2);

the water absorption cotton (137) is arranged on the supporting structure (134) and is used for absorbing liquid at the bottom of the silicon wafer carrier (2);

the negative pressure driving device (139) is arranged outside the tank body (11) and is used for forming negative pressure in the tank body (11).

4. The liquid scavenging tank (1) according to claim 2, characterized in that the liquid scavenging assembly (13) comprises:

the liquid collecting box (135) is connected to the supporting structure (134), a first air suction opening (1351) is formed in the top of the liquid collecting box (135), the first air suction opening (1351) is arranged along the extending direction of the bottom rod piece (21) of the silicon wafer carrier (2), top plates on two sides of the first air suction opening (1351) are inclined downwards to be matched with the bottom rod piece (21) of the silicon wafer carrier (2), and a second air suction opening (1352) is formed in the bottom of the liquid collecting box (135);

one end of the negative pressure driving device (139) is connected with the second air suction opening (1352) through a pipeline, the negative pressure driving device (139) can enable the liquid collecting box (135) to generate negative pressure so as to collect liquid at the bottom of the silicon wafer carrier (2), and the other end of the negative pressure driving device (139) is connected with the liquid drainage pipeline (14) through a pipeline.

5. The liquid scavenging tank (1) according to claim 3 or 4, characterized in that the liquid scavenging assembly (13) further comprises:

the negative pressure pipeline (133) is arranged below the tank body (11) and is communicated with the tank body (11) through a through hole (113) in the bottom wall (112) of the tank body (11), one end of the tank body (11) is far away from the negative pressure pipeline (133) and is connected with the negative pressure driving device (139), and the negative pressure pipeline (133) can generate negative pressure under the action of the negative pressure driving device (139) so as to enable the liquid at the bottom of the silicon wafer carrier (2) to fall down in an accelerating mode.

6. The liquid scavenging tank (1) according to claim 1, characterized in that the liquid scavenging assembly (13) comprises:

and the water absorption cotton (137) is arranged on the supporting structure (134) and is used for absorbing the liquid at the bottom of the silicon wafer carrier (2).

7. The liquid scavenging tank (1) according to claim 3 or 6, characterized in that the liquid scavenging assembly (13) further comprises:

the spraying pipeline (138) is arranged in the tank body (11), the spraying pipeline (138) is connected with the side wall (111) of the tank body (11), and a plurality of spraying holes (1381) are formed in the spraying pipeline (138) and used for spraying water to the water absorption cotton (137) so that the water absorption cotton (137) can keep the humidity required for removing the liquid.

8. A liquid removal tank (1) according to any one of claims 2 to 4 or claim 6,

a liquid discharge air suction opening (141) is formed in the liquid discharge pipeline (14), and the liquid discharge air suction opening (141) is connected to the negative pressure driving device (139) through a pipeline;

an inverted siphon section (142) is arranged in the drainage pipeline (14) so as to enable the drainage pipeline (14) to be sealed by liquid in the inverted siphon section (142);

wherein, the liquid discharge air suction opening (141) is positioned between the inverted siphon section (142) and the groove body (11).

9. A cleaning device (3), characterized by comprising:

a frame body (31);

the process tank (32) is arranged on the frame body (31), and the process tank (32) can contain process liquid and is used for processing the surface of the silicon wafer (23);

the liquid removing tank (1) as defined in any one of claims 1 to 8, arranged on the frame body (31) for performing a liquid removing operation on the bottom of the silicon wafer carrier (2) loaded with the silicon wafer (23);

and the drying groove (33) is arranged on the frame body (31), a drying device (331) is arranged in the drying groove (33) and used for drying the silicon wafer (23) and the silicon wafer carrier (2) after the liquid removing operation is completed.

10. A cleaning device (3) according to claim 9, further comprising:

a moving device (34) which is provided corresponding to the frame body (31) and is used for moving the silicon wafer carrier (2) loaded with the silicon wafer (23);

and the controller is electrically connected with the moving device (34) so as to control the moving device (34) to move the silicon wafer carrier (2) loaded with the silicon wafer (23).