CN205110223U - Communication electronics chip substrate surface treatment system - Google Patents
Communication electronics chip substrate surface treatment system Download PDFInfo
- Publication number
- CN205110223U CN205110223U CN201520871853.2U CN201520871853U CN205110223U CN 205110223 U CN205110223 U CN 205110223U CN 201520871853 U CN201520871853 U CN 201520871853U CN 205110223 U CN205110223 U CN 205110223U
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- air
- chip substrate
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- chamber
- pipe
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- Expired - Fee Related
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Abstract
The utility model relates to a communication electronics chip substrate surface treatment system, which comprises a base, the base upper portion left and right sides is fixedly connected with left side stand and right stand respectively, left side stand and right stand upper portion fixedly connected with roof, be connected with the support frame between left side stand and the right stand, the support frame left and right sides is provided with left drive rollers and right drive rollers respectively, be connected with the conveyer belt between left side drive rollers and the right drive rollers, conveyer belt upper portion is provided with a plurality of chip substrates, right side stand left side lower part is provided with electric motor, be connected with the drive belt between electric motor and the right drive rollers, roof upper portion left side is provided with the gas storage chamber, and gas storage chamber upper portion is connected with the intake pipe, and gas storage chamber sub -unit connection has the air supply pipe, and the air supply pipe sub -unit connection has an air cavity, and it has a plurality of outlet ducts to go out the air cavity sub -unit connection. The utility model discloses a device can carry out surface cleaning to the communication electronics chip substrate effectively to be handled, has improved the surface treatment effect.
Description
Technical field
The utility model belongs to technical field, is specifically related to a kind of communications electronics chip substrate superficial treatment system.
Background technology
Along with mobile Internet popularizing in the whole world, mobile intelligent terminal is nibbling the market space of traditional computer fast.In terminal chip field, the occupation rate of market of communications electronics chip, in continuous lifting, becomes the leader of chip industry gradually.The impurity on chip substrate surface can cause corrosion to chip, causes chip substrate to damage, and affects the normal operation of communication terminal.Therefore, need to carry out cleaning to communications electronics chip substrate surface, the dirt on surface is removed, then carry out drying protection against the tide and dust removal process, thus ensure the quality of chip substrate.
Utility model content
The purpose of this utility model is to provide a kind of communications electronics chip substrate superficial treatment system, to carry out surface cleaning process for communications electronics chip substrate better, improves process result of use.
To achieve these goals, the technical solution of the utility model is as follows.
A kind of communications electronics chip substrate superficial treatment system, comprise pedestal, the left and right sides, pedestal top is fixedly connected with left column and right column respectively, left column and right column top are fixedly connected with top board, bracing frame is connected with between left column and right column, the bracing frame left and right sides is respectively arranged with Left Drive running roller and right Live roller, conveyer belt is connected with between Left Drive running roller and right Live roller, conveyer belt top is provided with multiple chip substrate, right column left lower is provided with electro-motor, is connected with driving-belt between electro-motor and right Live roller; Top board upper left-hand is provided with air storing cavity, air storing cavity top is connected with air inlet pipe, air storing cavity bottom is connected with air supply pipe, air supply pipe bottom is connected with outlet chamber, outlet chamber bottom is connected with multiple escape pipe, and top board upper right is provided with ventilation blower, and ventilation blower bottom is connected with air feed chamber, be connected with air-out chamber on the right side of air feed chamber, bottom, air-out chamber is connected with multiple discharge pipe; Right column right upper portion is provided with dust removal machine, is connected with sweep-up pipe on the left of dust removal machine.
Further, bracing frame top is provided with multiple support running roller.
Further, be provided with power interface on the right side of top board, air feed is provided with heating chamber on the right side of chamber, power interface is provided with power line and is connected with heating tube.
In this device, air inlet pipe connects external pipe, and open the valve switch in air inlet pipe, insulation processing gas enters in air storing cavity for subsequent use from air inlet pipe.To chip substrate be placed on conveyer belt, open the valve switch on air supply pipe, in air storing cavity, insulation processing gas enters outlet chamber from air supply pipe, then from escape pipe blowout, insulate and clean purge to the surface of lower die substrate.Start electro-motor, electro-motor utilizes driving-belt to drive right Live roller to rotate, thus driving conveying belt rotates, and is carried to the right by chip substrate.Support running roller to support chip substrate, avoid chip substrate to drop.Power interface connects external power source, and heating tube heats the gas in air-out chamber, utilizes ventilation blower to improve gas pressure and to supply gas side by side body, make air enter air-out chamber from air feed chamber, then blown out from discharge pipe by hot-air.When chip substrate arrives after below discharge pipe, the hot-air of blowout is utilized to carry out dry damp-proof treatment to chip substrate.Open dust removal machine and carry out dedusting, sucked from sweep-up pipe by the dust on chip substrate surface, dust enters in dust removal machine and collects, and makes chip substrate surface keep clean state.
The beneficial effect of this utility model is: this utility model device can carry out surface cleaning process for communications electronics chip substrate effectively, improves surface treatment effect, conveniently uses better, and convenient and dry damp-proof treatment, conveniently use as required.
Accompanying drawing explanation
Fig. 1 is institute's operative installations structural representation in the utility model embodiment.
Description of symbols in figure: 1, bracing frame; 2, Left Drive running roller; 3, chip substrate; 4, running roller is supported; 5, conveyer belt; 6, electro-motor; 7, pedestal; 8, driving-belt; 9, right Live roller; 10, right column; 11, sweep-up pipe; 12, dust removal machine; 13, heating tube; 14, heating chamber; 15, discharge pipe; 16, power interface; 17, air feed chamber; 18, ventilation blower; 19, top board; 20, air inlet pipe; 21, air supply pipe; 22, outlet chamber; 23, escape pipe; 24, left column; 25, air storing cavity; 26, air-out chamber.
Detailed description of the invention
Below in conjunction with accompanying drawing, detailed description of the invention of the present utility model is described, better to understand the utility model.
Communications electronics chip substrate superficial treatment system as shown in Figure 1, comprise pedestal 7, the left and right sides, pedestal 7 top is fixedly connected with left column 24 and right column 10 respectively, left column 24 and right column 10 top are fixedly connected with top board 19, bracing frame 1 is connected with between left column 24 and right column 10, bracing frame 1 left and right sides is respectively arranged with Left Drive running roller 2 and right Live roller 9, conveyer belt 5 is connected with between Left Drive running roller 2 and right Live roller 9, conveyer belt 5 top is provided with multiple chip substrate 3, right column 10 left lower is provided with electro-motor 6, driving-belt 8 is connected with between electro-motor 6 and right Live roller 9, top board 19 upper left-hand is provided with air storing cavity 25, air storing cavity 25 top is connected with air inlet pipe 20, air storing cavity 25 bottom is connected with air supply pipe 21, air supply pipe 21 bottom is connected with outlet chamber 22, outlet chamber 22 bottom is connected with multiple escape pipe 23, and top board 19 upper right is provided with ventilation blower 18, and ventilation blower 18 bottom is connected with air feed chamber 17, be connected with air-out chamber 26 on the right side of air feed chamber 17, bottom, air-out chamber 26 is connected with multiple discharge pipe 15, right column 10 right upper portion is provided with dust removal machine 12, is connected with sweep-up pipe 11 on the left of dust removal machine 12.Bracing frame 1 top is provided with multiple support running roller 4.Be provided with power interface 16 on the right side of top board 19, on the right side of air feed chamber 17, be provided with heating chamber 14, power interface 16 is provided with power line and is connected with heating tube 13.
In the specific implementation, air inlet pipe 20 connects external pipe to this device, and open the valve switch in air inlet pipe 20, insulation processing gas enters in air storing cavity 25 for subsequent use from air inlet pipe 20.Place on chip substrate 3 on conveyer belt 5, open the valve switch on air supply pipe 21, in air storing cavity 25, insulation processing gas enters outlet chamber 22 from air supply pipe 21, then blows out from escape pipe 23, insulate and clean purge to the surface of lower die substrate 3.Start electro-motor 6, electro-motor 6 utilizes driving-belt 8 to drive right Live roller 9 to rotate, thus driving conveying belt 5 rotates, and is carried to the right by chip substrate 3.Support running roller 4 pairs of chip substrates 3 to support, avoid chip substrate 3 to drop.Power interface 16 connects external power source, and the gas in heating tube 13 pairs of air-out chambeies 26 heats, and utilizes ventilation blower 18 to improve gas pressure and to supply gas side by side body, make air enter air-out chamber 26 from air feed chamber 17, then blown out from discharge pipe 15 by hot-air.When chip substrate 3 arrives after below discharge pipe 15, the hot-air of blowout is utilized to carry out dry damp-proof treatment to chip substrate 3.Open dust removal machine 12 and carry out dedusting, sucked from sweep-up pipe 11 by the dust on chip substrate 3 surface, dust enters in dust removal machine 12 and collects, and makes chip substrate 3 surface keep clean state.
The above is preferred embodiment of the present utility model; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the utility model principle; can also make some improvements and modifications, these improvements and modifications are also considered as protection domain of the present utility model.
Claims (3)
1. a communications electronics chip substrate superficial treatment system, comprise pedestal, it is characterized in that: the left and right sides, described pedestal top is fixedly connected with left column and right column respectively, described left column and right column top are fixedly connected with top board, bracing frame is connected with between described left column and right column, the support frame as described above left and right sides is respectively arranged with Left Drive running roller and right Live roller, conveyer belt is connected with between described Left Drive running roller and right Live roller, described conveyer belt top is provided with multiple chip substrate, described right column left lower is provided with electro-motor, driving-belt is connected with between described electro-motor and right Live roller, described top board upper left-hand is provided with air storing cavity, described air storing cavity top is connected with air inlet pipe, described air storing cavity bottom is connected with air supply pipe, described air supply pipe bottom is connected with outlet chamber, described outlet chamber bottom is connected with multiple escape pipe, and described top board upper right is provided with ventilation blower, and described ventilation blower bottom is connected with air feed chamber, be connected with air-out chamber on the right side of described air feed chamber, bottom, described air-out chamber is connected with multiple discharge pipe, described right column right upper portion is provided with dust removal machine, is connected with sweep-up pipe on the left of described dust removal machine.
2. communications electronics chip substrate superficial treatment system according to claim 1, is characterized in that: support frame as described above top is provided with multiple support running roller.
3. communications electronics chip substrate superficial treatment system according to claim 1, is characterized in that: be provided with power interface on the right side of described top board, is provided with heating chamber, described power interface is provided with power line and is connected with heating tube on the right side of described air feed chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520871853.2U CN205110223U (en) | 2015-11-04 | 2015-11-04 | Communication electronics chip substrate surface treatment system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520871853.2U CN205110223U (en) | 2015-11-04 | 2015-11-04 | Communication electronics chip substrate surface treatment system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205110223U true CN205110223U (en) | 2016-03-30 |
Family
ID=55565871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520871853.2U Expired - Fee Related CN205110223U (en) | 2015-11-04 | 2015-11-04 | Communication electronics chip substrate surface treatment system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205110223U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106222319A (en) * | 2016-08-26 | 2016-12-14 | 无锡市新达轻工机械有限公司 | A kind of leather dust arrester with high-effective dust-removing function |
| WO2021243571A1 (en) * | 2020-06-02 | 2021-12-09 | 李桂军 | Drying heat recovery apparatus for leather production |
-
2015
- 2015-11-04 CN CN201520871853.2U patent/CN205110223U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106222319A (en) * | 2016-08-26 | 2016-12-14 | 无锡市新达轻工机械有限公司 | A kind of leather dust arrester with high-effective dust-removing function |
| WO2021243571A1 (en) * | 2020-06-02 | 2021-12-09 | 李桂军 | Drying heat recovery apparatus for leather production |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160330 Termination date: 20161104 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |