CN209991931U - Hole surface copper integrated thickness measuring device - Google Patents
Hole surface copper integrated thickness measuring device Download PDFInfo
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- CN209991931U CN209991931U CN201921268227.9U CN201921268227U CN209991931U CN 209991931 U CN209991931 U CN 209991931U CN 201921268227 U CN201921268227 U CN 201921268227U CN 209991931 U CN209991931 U CN 209991931U
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Abstract
The utility model relates to a metal thickness measurement technical field discloses a hole face copper integration thickness measuring device. The thickness measuring device mainly comprises two clamps which are arranged in an up-and-down symmetrical mode, and the clamps further comprise two cylinders, mounting plates for mounting the cylinders, a protection flat plate and a five-terminal thickness measuring probe. The thickness measuring method comprises the steps that the five-terminal thickness measuring probe of the two clamps moves to a measuring position, four probes on the five-terminal thickness measuring probe measure the thicknesses of copper layers on the upper surface and the lower surface, and the hole wall copper thickness measuring assembly is combined up and down to measure the voltage of the hole wall copper layer so as to calculate the resistance. And calculating the thickness of the copper layer of the hole wall according to the diameter, the height and the resistance of the copper layer of the hole wall and the thicknesses of the upper copper layer and the lower copper layer. The utility model discloses but two kinds of hole copper parameters of simultaneous measurement in a device, simplified measurement process.
Description
Technical Field
The utility model relates to a metal thickness measurement technical field, concretely relates to hole face copper integration thickness measuring device
Background
With the development of electronic technology, the application of circuit boards is more and more extensive, and the thickness of the surface copper layer and the hole wall copper layer of the circuit board during manufacturing directly affects the signal integrity of the high-frequency high-speed circuit board, such as signal-to-noise ratio and video transmission rate. At present, the thickness of the surface copper layer is only measured on line, and the thickness of the hole wall copper layer is still measured manually. The principle is different, and the probe can not share, must separately measure, and this not only influences the productivity, and the instrument is put the space that needs big moreover, receives the place restriction.
The principle of the existing metal layer thickness gauge is mostly a micro-resistance four-probe method, and a specific measuring method is disclosed in patent document with the patent number of CN 109556504A. The method and the precision instrument are originally used in a laboratory environment, the four-terminal method has no anti-interference function, the production environment has a large amount of strong electric interference, and the rubber sucker on the robot arm of the automatic online instrument can also generate kilovolt electrostatic interference, so that the measurement error is multiplied and is changed from 1% to 10%, and the method and the precision instrument cannot be used at all. Therefore, an improved accurate thickness measuring device is needed, which is used for resisting interference and ensuring the measuring accuracy.
And secondly, the hole copper adopts an eddy current loss measurement principle, is incompatible with a four-terminal probe principle for measuring the thickness of the surface copper, and cannot be used integrally.
Thirdly, for a large integrated circuit, the higher the integration is, the smaller the area of the used circuit board is, and the smaller the diameter of the hole wall copper is, the existing eddy current probe is a single-end insertion type probe, the diameter of a probe at the top of the probe is 0.7mm, the length of the probe is 5mm, the probe needs to be completely inserted into a copper hole to measure the thickness, however, in this way, the thickness cannot be measured for the hole wall copper hole with the diameter smaller than 0.7 mm.
In addition, when the measuring circuit board is a thin plate, the probe directly clamps and measures on two sides, and the circuit board can be damaged in the measuring process due to small stress area.
SUMMERY OF THE UTILITY MODEL
In view of the not enough of background art, the utility model provides a hole face copper integration thickness measuring device, the technical problem that solve be surface copper layer thickness among the prior art and pore wall copper layer thickness separately measure, measure inconvenient, interference immunity is poor and can not measure the copper hole that the diameter is less than 0.7 mm.
For solving the technical problem, the utility model provides a following technical scheme: a hole surface copper integrated thickness measuring device comprises two clamps and a controller which are symmetrically arranged up and down, wherein each clamp comprises a first mounting plate, a first air cylinder is connected in front of the first mounting plate, a telescopic rod of the first air cylinder is connected with an L-shaped second mounting plate, a first fixing plate is connected in front of the second mounting plate, a five-terminal thickness measuring probe is arranged in front of the first fixing plate and comprises four probes which are connected below and are used for measuring the thickness of a surface copper layer, the five-terminal thickness measuring probe comprises a shielding probe and a hole wall copper thickness measuring assembly, wherein the five-terminal thickness measuring probe is electrically connected with a controller, a first probe clamping seat and a second probe clamping seat are symmetrically arranged on two sides of the five-terminal thickness measuring probe, semicircular grooves are formed in the surfaces, facing the five-terminal thickness measuring probe, of the first probe clamping seat and the second probe clamping seat, and the five-terminal thickness measuring probe is fixed in a circular hole formed by connecting the first probe clamping seat and the second probe clamping seat. One side of the first vertical plate is connected to one side of the first probe clamping seat, which deviates from the five-terminal thickness measuring probe, the other side of the first vertical plate is connected with the second fixing plate, the second fixing plate is connected with the telescopic rod of the second air cylinder, and the second air cylinder is connected with the left end of the first fixing plate. One side of the second probe clamping seat, which deviates from the five-terminal thickness measuring probe, is connected with a second vertical plate, and the lower end of the second vertical plate is sequentially connected with the horizontal plate and the first vertical plate through screws. The five-terminal thickness measuring probe penetrates through the horizontal plate. The lower part of the first fixing plate is connected with a protection flat plate, and an opening is arranged on the protection flat plate corresponding to the five-terminal thickness measuring probe.
The thickness measuring method for measuring the micro-resistance by using the five-terminal integrated thickness measuring device for the hole surface copper comprises the following steps of:
s1, moving the five-terminal thickness measuring probes of the two clamps to the measuring positions of the upper surface copper layer and the lower surface copper layer respectively;
s2, measuring the thicknesses of the upper surface copper layer and the lower surface copper layer by four probes on the five-terminal thickness measuring probe according to a micro-resistance four-probe method;
s3, when the thickness of the hole wall copper layer is measured, the hole wall copper thickness measuring components on the two clamps are combined up and down to measure the voltage at two ends of the hole wall copper layer, and then the resistance is calculated;
s4, calculating the thickness of the hole wall copper layer according to the height of the hole wall copper layer, the diameter of the hole wall copper layer, the resistance of the hole wall copper layer, the thickness of the upper surface copper layer and the thickness of the lower surface copper layer;
the area of the protection plate is 4-400 cm2The protective plate is used for fixing a circuit board in measurement, and an elastic piece is further arranged on the protective plate.
The utility model discloses a novel five terminal thickness measurement probes based on four terminal micro resistance measuring principle, including four probes of detection surface copper layer thickness, the pore wall copper thickness measuring subassembly and the anti-interference shielding probe of detection hole wall copper layer thickness, can detect the surface copper layer thickness and the pore wall copper layer thickness of circuit board simultaneously.
Furthermore, the four probes measure the thickness of the surface copper layer according to a micro-resistance four-probe method.
Further, the hole wall copper thickness measuring assembly at least comprises two probes, and each probe is insulated from each other. The hole wall copper thickness measuring component covers a measuring hole on a circuit board to be measured during measurement, the diameter of a probe of the hole wall copper thickness measuring component is larger than the aperture to be measured, and the hole wall copper thickness measuring components of the two clamps are combined up and down to measure the thickness of a hole wall copper layer.
Furthermore, the shielding probe is connected with a filter circuit, and interference signals on the circuit board to be tested are transmitted to the grounding end through the shielding probe.
The five-terminal thickness measuring probe transmits the measuring signal to the controller, and the controller performs operation processing on the measuring signal.
The thickness measuring device is characterized in that a cylinder is used for controlling the five-terminal thickness measuring probe to move up and down, the first cylinder and the second cylinder are driven by constant pressure, and the pressure intensity of the two cylinders is the same.
Compared with the prior art, the utility model beneficial effect who has is:
1: the integrated measurement of the surface copper layer and the hole wall copper layer of the circuit board simplifies the measurement process, improves the production efficiency and reduces the site limitation.
2: during measurement, the protection flat plate in the clamp clamps the circuit board to be measured, the area of the protection flat plate is large, clamping is stable, and the original accurate measurement effect is kept.
3: interference signals on the circuit board to be measured are transmitted to the grounding end through the shielding probe, interference resistance is high, and measurement is stable.
4: the hole wall copper thickness measuring component covers the surface of the hole to be measured when measuring the thickness of the hole wall copper layer, and can measure the thickness of the copper hole with the hole diameter smaller than 0.7 mm.
Drawings
The utility model discloses there is following figure:
FIG. 1 is a schematic view of a hole copper structure measured by the present invention;
fig. 2 is a schematic view of the clamp of the present invention;
FIG. 3 is a schematic diagram of the micro-resistance four-probe method for measuring copper thickness according to the present invention;
fig. 4 is a schematic view of the five-terminal thickness measuring probe of the present invention;
FIG. 5 is a graph of voltage waveforms measured by a conventional four-probe method for micro-resistance;
FIG. 6 is a voltage waveform chart of the hole surface copper integrated thickness measuring device during measurement;
fig. 7 is a schematic diagram of the connection of the shielding probe and the filter circuit.
Description of the drawings: 1. the thickness measuring device comprises a first mounting plate, 2, a second mounting plate, 3, a first fixing plate, 4, a five-terminal thickness measuring probe, 5, a second vertical plate, 6, an elastic piece, 7, a protection flat plate, 8, a second cylinder, 9, a second fixing plate, 10, a first vertical plate, 11, a first probe clamping seat, 12, a first cylinder, 13, an opening, 14, a horizontal plate, 15, a second probe clamping seat, 20, a probe, 21, a hole wall copper thickness measuring component, 22, a shielding probe, 24, an upper surface metal layer, 25, an insulating medium, 26, a lower surface metal layer, 30, an upper surface copper layer, 31, a lower surface copper layer, 32 and a hole wall copper layer.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic drawings and illustrate the basic structure of the present invention only in a schematic manner, and thus show only the components related to the present invention.
As shown in figure 2, the integrated thickness measuring device for the hole surface copper comprises two clamps and a controller which are symmetrically arranged up and down, wherein each clamp comprises a first mounting plate 1, a first cylinder 12 is connected in front of the first mounting plate 1, an expansion rod of the first cylinder 12 is connected with an L-shaped second mounting plate 2, a first fixing plate 3 is connected in front of the second mounting plate 2, a five-terminal thickness measuring probe 4 is arranged in front of the first fixing plate 3, the five-terminal thickness measuring probe 4 comprises four probes 20 which are connected below and are used for measuring the thickness of a surface copper layer, a shielding probe 22 and a hole wall copper thickness measuring component 21, the five-terminal thickness measuring probe 4 is electrically connected with the controller, the two sides of the five-terminal thickness measuring probe 4 are symmetrically provided with a first probe clamping seat 11 and a second probe clamping seat 15, the surfaces of the first probe clamping seat 11 and the second probe clamping seat 15 facing the five-terminal thickness measuring probe 4 are both provided with semicircular grooves, and the five-terminal thickness measuring probe 4 is fixed in a circular hole formed by connecting the first probe clamping seat 11 and the second probe clamping seat 15. One side that first probe cassette 11 deviates from five terminal thickness measuring probe 4 is connected first vertical board 10, and second fixed plate 9 is connected to first vertical board 10 opposite side, and the telescopic link of second cylinder 8 is connected to second fixed plate 9, and the left end of first fixed plate 3 is connected to second cylinder 8, and second vertical board 5 is connected to the one side that second probe cassette 15 deviates from five terminal thickness measuring probe 4, and 5 lower extremes of the vertical board of second connect gradually horizontal plate 14 and first vertical board 10 through the screw. The five-terminal thickness measuring probe 4 passes through the horizontal plate 14. The lower part of the first fixing plate 3 is connected with a protection flat plate 7, and an opening 13 is arranged on the protection flat plate 7 corresponding to the five-terminal thickness measuring probe 4.
As shown in fig. 1, the thickness measuring method for measuring the micro-resistance by using the five-terminal integrated thickness measuring device for the hole surface copper comprises the following steps:
s1, moving the five-terminal thickness measuring probes 4 of the two clamps to the measuring positions of the upper surface copper layer 30 and the lower surface copper layer 31 respectively;
s2, measuring the thicknesses of the upper surface copper layer 30 and the lower surface copper layer 31 by the four probes 20 on the five-terminal thickness measuring probe 4 according to a micro-resistance four-probe method;
s3, when measuring the thickness of the hole wall copper layer 32, the hole wall copper thickness measuring components 21 on the two clamps are combined up and down to measure the voltage at two ends of the hole wall copper layer 32, and further the resistance is calculated;
s4, calculating the thickness of the hole wall copper layer 32 according to the height of the hole wall copper layer 32, the diameter of the hole wall copper layer 32, the resistance of the hole wall copper layer 32, the thickness of the upper surface copper layer 30 and the thickness of the lower surface copper layer 31;
and (3) the copper layer of the hole wall of the circuit board is expanded to form a rectangular copper plate, the resistivity of the metal copper plate is assumed to be a, the length of the metal copper plate is assumed to be L, and the thickness of the copper layer of the hole wall can be calculated by measuring the resistance of the copper layer of the hole wall according to a resistance formula R which is a x L/S if the height L and the diameter D of the copper layer of the hole wall are known.
In the schematic diagram of the five-terminal thickness measuring probe of fig. 4, the five-terminal thickness measuring probe 4 includes four probes 20 for measuring the thickness of the surface copper layer, a hole wall copper thickness measuring assembly 21 for measuring the thickness of the hole wall copper layer, and a shielding probe 22.
The hole wall copper thickness measuring assembly 21 comprises at least two probes, and each probe is insulated from each other. The two probes of the hole wall copper thickness measuring assembly 21 in fig. 4 are in a concentric circle structure, the peripheral probe provides a measuring current, and the inner probe measures the voltage at two ends of a hole wall copper layer. In some embodiments, the two measurement probes of the hole wall copper thickness measurement assembly 21 may also be measured separately.
As shown in fig. 7, one end of the shielding probe 22 contacts the upper surface metal layer 24, the other end is electrically connected to the capacitor C1, the other end of the capacitor C1 is electrically connected to one input end of the amplifier Ai, and the other input end of the amplifier Ai is electrically connected to the ground terminal GND. The interference signal on the circuit board to be measured is transmitted to the ground terminal through the shielding probe 22, so that the measurement precision is improved.
The circuit board to be measured is fixed below the protection flat plate 7, and has a protection effect when the thin plate is measured. The circuit board to be tested can be conveyed to a detection position by selecting the roller conveying mechanism, and the circuit board to be tested is arranged between the rollers. In order to fix the circuit board to be tested on the protection plate 7, the area of the protection plate 7 is adapted to the gap between the rollers, and the maximum area is less than or equal to 400cm2Correspondingly, for measuring smaller circuit boards, the minimum area of the protective plate 7 should be greater than or equal to 4cm2。
The elastic piece 6 arranged on the protection flat plate 7 can prevent the five-terminal thickness measuring probe 4 from impacting a detection object after the air source of the first air cylinder 12 or the second air cylinder 8 is suddenly cut off, and protect the five-terminal thickness measuring probe 4.
In practice, the measured circuit boards have slight difference, and in order to adapt to more measurement environments, the five-terminal thickness measuring probe 4 adopts the cylinder constant-pressure drive to perform micro self-adaptive adjustment. When in measurement, the telescopic rods of the first cylinders 12 of the two clamps drive the connected part to integrally move to the detection position, the protection flat plate 7 clamps the circuit board to be measured on two sides after the connected part reaches the detection position, and the telescopic rods of the second cylinders 8 drive the five-terminal thickness measuring probe 4 to move slightly to measure.
During measurement, four probes 20 on the five-terminal thickness measuring probe 4 of the two fixtures respectively measure the thickness of the upper surface copper layer 30 and the thickness of the lower surface copper layer 31 according to a micro-resistance four-probe method, the hole wall copper thickness measuring assemblies 21 of the two fixtures cover the copper hole to be measured, the voltages at two ends of the hole wall copper layer 32 are measured in an up-and-down combined mode, and then the resistance is calculated. The thickness of the pore wall copper layer 32 is calculated from the thickness of the upper surface copper layer 30, the thickness of the lower surface copper layer 31, the height, diameter and resistance of the pore wall copper layer 32.
As shown in fig. 5, the conventional four-probe method for micro resistance measurement has a voltage fluctuation of 52 mv. As shown in fig. 6, when the five-terminal thickness measuring probe 4 with the shield probe 22 added is used for measurement, the voltage fluctuation amount is 10mv, the fluctuation amount is 20% of that of the micro-resistance four-probe method, the anti-interference performance is improved, and the measurement accuracy is improved.
In addition the utility model discloses can be used to the on-line measuring also can be used to the off-line measuring. The method can also be used for measuring the material thickness and the plating thickness of all conductors such as gold, silver, iron, aluminum and the like.
The schematic diagram of the micro-resistance four-probe method for measuring copper thickness in fig. 3 has a current source and a voltmeter.
In light of the above, the present invention is not limited to the above embodiments, and various changes and modifications can be made by the worker without departing from the scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (6)
1. The utility model provides a hole face copper integration thickness measuring device which characterized in that: the fixture comprises two fixtures and a controller which are symmetrically arranged up and down, the fixture comprises a first mounting plate, the front surface of the first mounting plate is connected with a first air cylinder, the telescopic rod of the first air cylinder is connected with an L-shaped second mounting plate, the front surface of the second mounting plate is connected with a first fixing plate, the front surface of the first fixing plate is provided with a five-terminal thickness measuring probe, the five-terminal thickness measuring probe comprises four probes for measuring the thickness of a copper layer on the lower surface, a shielding probe and a hole wall copper thickness measuring component, the five-terminal thickness measuring probe is electrically connected with the controller, a first probe clamping seat and a second probe clamping seat are symmetrically arranged on two sides of the five-terminal thickness measuring probe, the surfaces of the first probe clamping seat and the second probe clamping seat facing the five-terminal thickness measuring probe are both provided with semicircular grooves, and the surface of the first probe clamping seat departing from the five-terminal thickness measuring probe is connected with one side of a first, the other side of the first vertical plate is connected with a second fixed plate, the second fixed plate is connected with a telescopic rod of a second cylinder, the second cylinder is connected with the left end of the first fixed plate, one surface, deviating from the five-terminal thickness measuring probe, of the second probe clamping seat is connected with a second vertical plate, the lower end of the second vertical plate is sequentially connected with a horizontal plate and the first vertical plate through screws, the five-terminal thickness measuring probe penetrates through the horizontal plate, a protection flat plate is connected below the first fixed plate, and an opening is formed in the protection flat plate, corresponds to the five-terminal thickness measuring probe.
2. The integrated thickness measuring device for the copper on the hole surface as claimed in claim 1, wherein: the protection flat plate is provided with an elastic piece.
3. The integrated thickness measuring device for the copper on the hole surface as claimed in claim 1, wherein: the area of the protection flat plate is 4-400 cm2。
4. The integrated thickness measuring device for the copper on the hole surface as claimed in claim 1, wherein: the hole wall copper thickness measuring component is of a covering type measuring structure and at least comprises two probes, the probes are insulated from each other, and the diameter of each probe is larger than the aperture to be measured.
5. The integrated thickness measuring device for the copper on the hole surface as claimed in claim 1, wherein: the shielding probe is connected with the filter circuit.
6. The integrated thickness measuring device for the copper on the hole surface as claimed in claim 1, wherein: the first cylinder and the second cylinder are driven by constant pressure and have the same air pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921268227.9U CN209991931U (en) | 2019-08-06 | 2019-08-06 | Hole surface copper integrated thickness measuring device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921268227.9U CN209991931U (en) | 2019-08-06 | 2019-08-06 | Hole surface copper integrated thickness measuring device |
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| CN209991931U true CN209991931U (en) | 2020-01-24 |
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| CN201921268227.9U Active CN209991931U (en) | 2019-08-06 | 2019-08-06 | Hole surface copper integrated thickness measuring device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110307776A (en) * | 2019-08-06 | 2019-10-08 | 无锡市帕尔斯仪器有限公司 | A kind of thickness measuring method of hole face copper integration measuring thickness device and five terminal micrometer resistance |
-
2019
- 2019-08-06 CN CN201921268227.9U patent/CN209991931U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110307776A (en) * | 2019-08-06 | 2019-10-08 | 无锡市帕尔斯仪器有限公司 | A kind of thickness measuring method of hole face copper integration measuring thickness device and five terminal micrometer resistance |
| CN110307776B (en) * | 2019-08-06 | 2024-03-26 | 无锡市帕尔斯仪器有限公司 | Hole surface copper integrated thickness measuring device and thickness measuring method of five-terminal micro-resistor |
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