CN207964888U - A kind of test fixture of self-heating type gas sensor ceramic chip - Google Patents
A kind of test fixture of self-heating type gas sensor ceramic chip Download PDFInfo
- Publication number
- CN207964888U CN207964888U CN201820146761.1U CN201820146761U CN207964888U CN 207964888 U CN207964888 U CN 207964888U CN 201820146761 U CN201820146761 U CN 201820146761U CN 207964888 U CN207964888 U CN 207964888U
- Authority
- CN
- China
- Prior art keywords
- plates
- electrical
- structural matrix
- test fixture
- oriented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 42
- 238000012360 testing method Methods 0.000 title claims abstract description 35
- 238000010438 heat treatment Methods 0.000 title claims abstract description 20
- 239000011159 matrix material Substances 0.000 claims abstract description 55
- 239000000523 sample Substances 0.000 claims abstract description 18
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 20
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 18
- -1 polytetrafluoroethylene Polymers 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
Landscapes
- Measuring Oxygen Concentration In Cells (AREA)
Abstract
The utility model provides the test fixture of self-heating type gas sensor ceramic chip, including structural matrix, is clamped in guiding A plates that structural matrix is located above chip guide groove one end, the bent axle screw rod and gap nut of the structure A parts for being clamped in guiding B plates that structural matrix is located at below chip guide groove one end, being clamped in above the structural matrix other end, the structure B parts being clamped in below the structural matrix other end, the electrical A plates being clamped in above structure A parts, the electrical B plates and adjustable test fixture primary clearance position that are clamped in below structure B parts；Structural matrix one end is equipped with chip guide groove；It is oriented to A plates and is oriented between B plates and chip guide groove and constitute ceramic chip location hole, ceramic chip location hole is for being oriented to ceramic chip disengaging test fixture；It is equipped with three pairs of probes and three conductive electrodes on electrical A plates and electrical B plates.The utility model test fixture clamping contact power is adjustable, and electric insulating quality is good, and high temperature insulating is strong, and service life is long.
Description
Technical field
The utility model is related to a kind of test fixture of self-heating type gas sensor ceramic chip, which is suitable for length
The ceramic sensitive chip of strip, head are that self-heating type working region is detected for gas sensitization, tail portion cold end electrical lead wire
Clamping.
Background technology
In today that automotive engineering is widely used, the ownership of automobile is constantly refreshing new historical record, together
When the tail gas pollution of getting worse that also brings；Exhaust Emission Control, the application demand of tail gas monitoring so that ceramic gas oxygen passes
Sensor, NOx sensor the such high temperature of tail gas, high humility complex environment in exhibit one's skill to the full；Its market demand is not
Disconnected is soaring, also brings huge development opportunity to such manufacturing enterprise.
With being constantly progressive for domestic electronic ceramics technology, using zirconia ceramics as the high-temperature heating type ceramics of Typical Representative
The advantages that gas sensor is corrosion-resistant because of its high temperature resistant, and stability is superior, and service life is long, also in some exceedingly odious operating modes
Under be widely used.
When manufacture detects self-heating type gas sensor ceramic chip, often need to test its function, with determination
The reliability of its function；In the prior art, it is the function of test ceramic chip, it is necessary first to heating work region is avoided,
Cold end retaining part is mechanically fixed, and is then electronically connected with test equipment；Ensure in test process thus,
The security risk for avoiding chip overheating that clamping piece is caused to bring；Selected materials need resistance to 250 DEG C or so high temperature, while having again electrical
Insulating properties.
It is completed at the same time the fixture for being mechanically fixed and being electrically connected for manufacture is this, it is necessary to corresponding labyrinth
Machine Design, the mode for mostly using base of ceramic cooperation flexible terminal greatly at present is clamped, and the contact force of terminal is not easy to control；It connects
Touch is too small, causes electrical contact bad；Contact force is excessive, then the scraping contact electrode in plug chip, damages chip appearance
Even disabler.
Utility model content
The technical problem to be solved by the present invention is to provide a kind of to solve the clamping contact power tune of fixture from design
It is whole, it the problems such as chip surface is easy clamped part and scratches, clamping gap adjustment, electric insulation, high temperature insulating, extends using the longevity
Life, extends test application range, reduces a kind of test fixture of self-heating type gas sensor ceramic chip of manufacturing cost.
In order to achieve the above objectives, the technical solution of the utility model is as follows：
A kind of test fixture of self-heating type gas sensor ceramic chip, the test fixture include：
One structural matrix, structural matrix one end are equipped with chip guide groove；
One is clamped in the guiding A plates that structural matrix is located above chip guide groove one end；
One is clamped in the guiding B plates that structural matrix is located at below chip guide groove one end；
It is oriented to A plates and is oriented between B plates and chip guide groove and constitute ceramic chip location hole, ceramic chip location hole is used for
It is oriented to ceramic chip and passes in and out test fixture；
One is clamped in the structure A parts above the structural matrix other end；
One is clamped in the structure B parts below the structural matrix other end；
One is clamped in the electrical A plates above structure A parts；
One is clamped in the electrical B plates below structure B parts；
Three pairs of probes and three conductive electrodes are equipped on electrical A plates and electrical B plates, probe is the spy of internal inserted spring type
Needle, each conductive electrode are mutually electrically connected with corresponding probe, and the welding for electrical lead wire connects；
One end of one bent axle screw rod, bent axle screw rod from bottom to top sequentially passes through electrical B plates, is oriented to B plates, structural matrix, leads
It is reached above electrical A plates to A plates and electrical A plates；
One gap nut, gap nut are rotatably reached mounted on bent axle screw rod on one end above electrical A plates.
In one embodiment of the utility model, the periphery of the structural matrix is equipped with the mounting hole of 6 Φ 3mm,
The mounting hole there are one Φ 4mm is set in the middle part of structural matrix；The peace there are one Φ 4mm is all provided on the electrical A plates and electrical B plates
Fill the mounting hole in hole and two Φ 3mm；It is oriented to A plates and is oriented to and be all provided with that there are four the mounting hole of Φ 3mm, three couples of Φ 2mm on B plates
The mounting hole of pilot hole and a Φ 4mm；The mounting hole there are two Φ 3mm is all provided on structure A parts and structure B parts.
In one embodiment of the utility model, the electrical A plates, structure A parts, structural matrix, structure B parts and electricity
Gas B plates are connected by the mounting hole close installation of respective Φ 3mm.
In one embodiment of the utility model, the guiding A plates, structural matrix and guiding B plates pass sequentially through respectively
It is connected from the mounting hole close installation of Φ 3mm.
In one embodiment of the utility model, bent axle screw rod sequentially pass through electrical B plates, be oriented to B plates, structural matrix,
The Φ 4mm mounting holes being oriented on A plates and electrical A plates are installed with gap nut.
In one embodiment of the utility model, the electrical A plates and electrical B plates are distributed by mirror image of structural matrix,
It is made of the copper-clad plate material of 1mm thickness.
In one embodiment of the utility model, the structural matrix uses the polytetrafluoroethylene (PTFE) material system of thickness 2mm
At.
In one embodiment of the utility model, the guiding A plates and guiding B plates are distributed by mirror image of structural matrix,
It is made of thickness 4mm polytetrafluoroethylene (PTFE) materials.
In one embodiment of the utility model, the structure A parts and structure B parts are distributed by mirror image of structural matrix,
It is made of thickness 5mm polytetrafluoroethylene (PTFE) materials.
Through the above technical solutions, the utility model has the beneficial effects that：
The utility model test fixture clamping contact power is adjustable, and electric insulating quality is good, and high temperature insulating is strong, service life
Long, manufacturing cost is low, has a wide range of application.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other drawings may also be obtained based on these drawings.
Fig. 1 is the utility model assembly diagram；
Fig. 2 is the utility model component fractionation structural representation；
Fig. 3 is the utility model section view；
Number and the corresponding component title represented by letter in figure：
10, structural matrix 11, mounting hole 12, mounting hole 13, chip guide groove 20, guiding A plates 30, guiding B plates
31, mounting hole 32, pilot hole 33, mounting hole 40, structure A parts 50, structure B parts 51, mounting hole 60, electrical A plates 70,
Electrical B plates 71, mounting hole 72, mounting hole 73, probe 74, conductive electrode 80, bent axle screw rod 90, gap nut 110,
Ceramic chip 111, electrode.
Specific implementation mode
In order to make the technical means, creative features, achievement of purpose, and effectiveness of the utility model be easy to understand, under
Face combines and is specifically illustrating, and the utility model is expanded on further.
Shown in Fig. 1 to Fig. 3, the utility model discloses a kind of tests of self-heating type gas sensor ceramic chip
Fixture, test fixture include structural matrix 10, are oriented to A plates 20, are oriented to B plates 30, structure A parts 40, structure B parts 50, electrical A plates
60, electrical B plates 70, bent axle screw rod 80 and gap nut 90.
The periphery of structural matrix 10 is equipped with the mounting hole 11 of 6 Φ 3mm, and the middle part of structural matrix 10 sets that there are one Φ
The mounting hole 12 of 4mm, 10 one end of structural matrix are equipped with chip guide groove 13.
Guiding A plates 20 are clamped in structural matrix 10 and are located above 13 one end of chip guide groove；It is oriented to B plates 30 and is clamped in structure
Matrix 10 is located at below 13 one end of chip guide groove；It is oriented to A plates 20 and is oriented to held tight between B plates 30 and chip guide groove 13
Ceramic chip location hole (being not drawn into figure) is constituted, ceramic chip location hole passes in and out test fixture for being oriented to ceramic chip 110,
Ceramic chip 110 is equipped with electrode 111；It is identical with 30 structure of B plates is oriented to be oriented to A plates 20, is all provided with the peace there are four Φ 3mm thereon
Fill the pilot hole 32 of 31, three pairs of hole Φ 2mm and the mounting hole 33 of a Φ 4mm.
Structure A parts 40 are clamped in above 10 other end of structural matrix, and structure B parts 50 are clamped under 10 other end of structural matrix
Side, structure A parts 40 and structure B 50 structures of part are identical, are all provided with the mounting hole 51 there are two Φ 3mm thereon.
Electrical A plates 60 are clamped in 40 top of structure A parts, and electrical B plates 70 are clamped in 50 lower section of structure B parts, electrical 60 He of A plates
Electrical B 70 structures of plate are identical, are all provided with 71, three pairs of probes of mounting hole of 72, two Φ 3mm of mounting hole there are one Φ 4mm thereon
73 and three conductive electrodes 74, probe 73 is the probe of internal inserted spring type, each conductive electrode 74 and 73 phase of corresponding probe
Electrical connection, the welding for electrical lead wire connect.
One end of bent axle screw rod 80 from bottom to top sequentially passes through electrical B plates 70, is oriented to B plates 30, structural matrix 10, is oriented to A
Plate 20 and electrical A plates 60 reach 60 top of electrical A plates；Gap nut 90 is rotatably reached mounted on bent axle screw rod 80
On one end of electrical 60 top of A plates, bent axle screw rod 80 can adjust the primary clearance of test fixture with 90 installation site of gap nut
Position.
When installation, electrical A plates 60, structure A parts 40, structural matrix 10, structure B parts 50 and electrical B plates 70 are by each
It is connected from the mounting hole 71 of Φ 3mm, mounting hole 51 and 11 close installation of mounting hole；It is oriented to A plates 20, structural matrix 10 and leads
Mounting hole 31 and the connection of 11 close installation of mounting hole of respective Φ 3mm are passed sequentially through to B plates 30；Bent axle screw rod 80 sequentially passes through
Electrical B plates 70 are oriented to B plates 30, structural matrix 10, are oriented to A plates 20 and Φ 4mm mounting holes 72, mounting hole on electrical A plates 60
33 and mounting hole 12 and gap nut 90 install.
When the utility model at work, by operating crank screw rod 80, electrical A plates 60 and electrical B plates 70, drive pair are squeezed
Probe 73 is answered, is contacted by corresponding on ceramic chip 110 electrode of pilot hole 32 111, electrically conducting is completed.
The electrical A plates 60 of the utility model and electrical B plates 70 are distributed with structural matrix 10 for mirror image, using covering for 1mm thickness
Copper coin material is made；Structural matrix 10 is made of the polytetrafluoroethylene (PTFE) material of thickness 2mm；Be oriented to A plates 20 and be oriented to B plates 30 with
Structural matrix 10 is distributed for mirror image, is made of thickness 4mm polytetrafluoroethylene (PTFE) materials；Structure A parts 40 and structure B parts 50 are with structure
Matrix 10 is distributed for mirror image, is made of thickness 5mm polytetrafluoroethylene (PTFE) materials.
Compared with prior art, the present invention has the following advantages：
1, probe contact force is stablized, and protection ceramic chip contacts electrode；Internal inserted spring type elastic probe is used, with spring
Elastic force is buffering, is stablized and effective.
2, probe contacting travel is perpendicular to tested surface；Avoid scuffing of traditional plug-in to chip surface electrode.
3, probe contact gap is adjustable, and gap nut adjusts the primary clearance position of bent axle screw rod, and electrical A is adjusted with this
The gap of plate and electrical B plates adapts to the thickness of different ceramic chips.
4, various material coordinates, and test is safe and reliable；Electrical connection effect is responsible in copper-clad plate, and polytetrafluoroethylene (PTFE) material has
Certain intensity, thermal insulation, high temperature resistance and insulating properties can effectively support test fixture, while again can be heat-insulated
And insulation, it is the ideal material of fixture.
5, easy processing material, cost reduction are easy to maintain；Conventional brace uses the side that ceramic member and flexible terminal are combined
Formula, the two making need molding die, fabrication cycle long；And material selected by test fixture set by the application patent is easily worked,
Manufacturing cost and maintenance cost are low.
The advantages of basic principles and main features and the utility model of the utility model have been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the present utility model is not limited to the above embodiments, described in above embodiments and description
Only illustrate the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
It will have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed range is defined by the appending claims and its equivalent thereof.
Claims (9)
1. a kind of test fixture of self-heating type gas sensor ceramic chip, which is characterized in that the test fixture includes：
One structural matrix, structural matrix one end are equipped with chip guide groove；
One is clamped in the guiding A plates that structural matrix is located above chip guide groove one end；
One is clamped in the guiding B plates that structural matrix is located at below chip guide groove one end；
It is oriented to A plates and is oriented between B plates and chip guide groove and constitute ceramic chip location hole, ceramic chip location hole is for being oriented to
Ceramic chip passes in and out test fixture；
One is clamped in the structure A parts above the structural matrix other end；
One is clamped in the structure B parts below the structural matrix other end；
One is clamped in the electrical A plates above structure A parts；
One is clamped in the electrical B plates below structure B parts；
Three pairs of probes and three conductive electrodes are equipped on electrical A plates and electrical B plates, probe is the probe of internal inserted spring type,
Each conductive electrode is mutually electrically connected with corresponding probe, and the welding for electrical lead wire connects；
One end of one bent axle screw rod, bent axle screw rod from bottom to top sequentially passes through electrical B plates, is oriented to B plates, structural matrix, is oriented to A plates
And electrical A plates reach above electrical A plates；
One gap nut, gap nut are rotatably reached mounted on bent axle screw rod on one end above electrical A plates.
2. a kind of test fixture of self-heating type gas sensor ceramic chip according to claim 1, which is characterized in that
The periphery of the structural matrix is equipped with the mounting hole of 6 Φ 3mm, and the mounting hole there are one Φ 4mm is set in the middle part of structural matrix；
The mounting hole of the mounting hole and two Φ 3mm there are one Φ 4mm is all provided on the electrical A plates and electrical B plates；It is oriented to A plates and leads
It is all provided with that there are four the mounting holes of the mounting hole of Φ 3mm, the pilot hole of three couples of Φ 2mm and a Φ 4mm on B plates；Structure A parts
With the mounting hole there are two Φ 3mm is all provided on structure B parts.
3. a kind of test fixture of self-heating type gas sensor ceramic chip according to claim 2, which is characterized in that
The electrical A plates, structure A parts, structural matrix, structure B parts and electrical B plates are closely pacified by the mounting hole of respective Φ 3mm
Load connects.
4. a kind of test fixture of self-heating type gas sensor ceramic chip according to claim 2, which is characterized in that
It is described to be oriented to A plates, structural matrix and be oriented to the mounting hole close installation connection that B plates pass sequentially through respective Φ 3mm.
5. a kind of test fixture of self-heating type gas sensor ceramic chip according to claim 2, which is characterized in that
Bent axle screw rod sequentially pass through electrical B plates, be oriented to B plates, structural matrix, the Φ 4mm mounting holes that are oriented on A plates and electrical A plates with
Gap nut is installed.
6. a kind of test fixture of self-heating type gas sensor ceramic chip according to claim 1, which is characterized in that
The electrical A plates and electrical B plates are distributed by mirror image of structural matrix, are made of the copper-clad plate material of 1mm thickness.
7. a kind of test fixture of self-heating type gas sensor ceramic chip according to claim 1, which is characterized in that
The structural matrix is made of the polytetrafluoroethylene (PTFE) material of thickness 2mm.
8. a kind of test fixture of self-heating type gas sensor ceramic chip according to claim 1, which is characterized in that
The guiding A plates and guiding B plates are distributed by mirror image of structural matrix, are made of thickness 4mm polytetrafluoroethylene (PTFE) materials.
9. a kind of test fixture of self-heating type gas sensor ceramic chip according to claim 1, which is characterized in that
The structure A parts and structure B parts are distributed by mirror image of structural matrix, are made of thickness 5mm polytetrafluoroethylene (PTFE) materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820146761.1U CN207964888U (en) | 2018-01-29 | 2018-01-29 | A kind of test fixture of self-heating type gas sensor ceramic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820146761.1U CN207964888U (en) | 2018-01-29 | 2018-01-29 | A kind of test fixture of self-heating type gas sensor ceramic chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207964888U true CN207964888U (en) | 2018-10-12 |
Family
ID=63735779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820146761.1U Expired - Fee Related CN207964888U (en) | 2018-01-29 | 2018-01-29 | A kind of test fixture of self-heating type gas sensor ceramic chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207964888U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114088321A (en) * | 2021-10-08 | 2022-02-25 | 宁波大学 | Clamping device for testing sealing of nitrogen oxide sensor core |
-
2018
- 2018-01-29 CN CN201820146761.1U patent/CN207964888U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114088321A (en) * | 2021-10-08 | 2022-02-25 | 宁波大学 | Clamping device for testing sealing of nitrogen oxide sensor core |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207964888U (en) | A kind of test fixture of self-heating type gas sensor ceramic chip | |
| CN112083313A (en) | Test fixture of ultra-thin naked die IGBT chip | |
| CN209911455U (en) | High-temperature conductive material resistivity measuring clamp | |
| CN111289901B (en) | Fuel cell stack voltage inspection structure and method | |
| CN208638330U (en) | A kind of photovoltaic module IV test fixture | |
| CN110927616A (en) | Conductive positioning testing device on LED lamp tube testing production line | |
| CN109324304A (en) | Current-carrying conductor electric cylinders of electric cylinders compression joint mechanism and high current are servo-actuated press contacts device | |
| CN214174507U (en) | Low-resistance detection jig for chip resistor | |
| CN209496127U (en) | Current-carrying conductor electric cylinders of electric cylinders compression joint mechanism and high current are servo-actuated press contacts device | |
| CN209991931U (en) | Hole surface copper integrated thickness measuring device | |
| CN204353638U (en) | A kind of vertical welding mechanism of rotation clamp-type for full-automatic welding machine | |
| CN209878861U (en) | New material production is with electrically conductive detection device | |
| CN205749389U (en) | Clamping device for Oxynitride sensor chip test | |
| CN207866920U (en) | A kind of arrester test device | |
| CN110850317A (en) | Multi-station equal-line long contact module for ACIR (accelerated contact infrared spectroscopy) test | |
| CN209707648U (en) | Quality detecting system applied to circuit board | |
| CN218886084U (en) | Electronic relay tester | |
| CN205665326U (en) | Measurement device for film resistors | |
| CN216391952U (en) | Solid-state relay | |
| CN206153742U (en) | A electrode assembly for special -shaped -section stamping workpiece resistance welds | |
| CN218445251U (en) | Multi-chuck high-temperature resistivity test fixture | |
| CN215728435U (en) | Special detection platform for high-precision tester for conductivity of fabric | |
| CN218213285U (en) | Electric detection tool for gas meter | |
| CN211528642U (en) | Multi-station equal-line long contact module for ACIR (accelerated contact infrared spectroscopy) test | |
| CN220626432U (en) | Terminal for capacitor testing machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181012 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |