CN205749389U - Clamping device for Oxynitride sensor chip test - Google Patents
Clamping device for Oxynitride sensor chip test Download PDFInfo
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- CN205749389U CN205749389U CN201620678317.5U CN201620678317U CN205749389U CN 205749389 U CN205749389 U CN 205749389U CN 201620678317 U CN201620678317 U CN 201620678317U CN 205749389 U CN205749389 U CN 205749389U
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- circuit board
- clamping block
- mounting groove
- probe
- board mounting
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Abstract
nullA kind of clamping device for Oxynitride sensor chip test，The bottom center of upper clamping block is machined with circuit board mounting groove，The middle part of upper circuit board mounting groove is machined with probe aperture，It is fixedly installed circuit board in upper circuit board mounting groove，The elastic tip of upper probe sequentially passes through probe aperture and upper circuit board，And upper probe is welded on circuit board，The bottom of upper clamping block is provided with lower clamping block，The upper surface laminating of the bottom surface of upper clamping block and lower clamping block，The upper surface center of lower clamping block is machined with the chip positioning groove for installing sensor chip and lower circuit board mounting groove，The degree of depth of chip positioning groove is less than the degree of depth of lower circuit board mounting groove，The structure of lower circuit board mounting groove is identical with the structure of upper circuit board mounting groove，The middle part of lower circuit board mounting groove is machined with lower probe aperture，It is fixedly installed lower circuit board in lower circuit board mounting groove，The elastic tip of lower probe sequentially passes through lower probe aperture and lower circuit board，And lower probe is welded on lower circuit board.
Description
Technical field
This utility model belongs to measurement or test device technique field, is specifically related to a kind of for nitrogen oxides tactility apparatus
The clamping device of chip testing.
Background technology
Being continuously increased recently as automobile pollution, motor vehicle exhaust emission become air pollution main source it
One.Harmful components in tail gas mainly have carbon monoxide (CO), unburnt Hydrocarbon (HC), oxynitride
(NOx) and particle matter etc., the discharge of these pollutant has had resulted in serious prestige to health and the living environment of the mankind
The side of body.For this present situation, many countries have formulated increasingly stringent legislation to control the discharge of tail gas.In order to reduce tail gas
The purpose of discharge, it is necessary to monitor tail gas in real time, automobile NOx sensor is the monitoring unit that one of which is important
Part.
The core component of automobile NOx sensor is sensor chip, is to use multilamellar zirconia ceramics film strips lamination
Sintering forms, lamellar structure.Chip afterbody upper and lower surface is all printed with the input for the chip signal of telecommunication of four plane electrodes
With output, electrode width and electrode spacing all at about 0.5mm.Chip head needs the normal work of self-heating to more than 600 DEG C ability
Making, afterbody electrode portion temperature has also reached 200 DEG C.Need bare chip is carried out a series of survey before sensor is encapsulated
Examination, should ensure the good contact of p-wire and chip electrode, ensure the insulation between p-wire again, the most also want user
Just and the high temperature of more than 200 DEG C can be born, it is therefore desirable to a kind of special clamping device realizes the test of bare chip.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of simple in construction, easy to operate, the use of low cost
Clamping device in Oxynitride sensor chip test.
The bottom center solving the technical scheme is that upper clamping block of above-mentioned technical problem is machined with circuit board peace
Tankage, the middle part of upper circuit board mounting groove is machined with probe aperture, is fixedly installed circuit board in upper circuit board mounting groove, on
The elastic tip of probe sequentially passes through probe aperture and upper circuit board, and upper probe is welded on circuit board, another of upper probe
End connection has wire, and the bottom of upper clamping block is provided with the upper surface patch of lower clamping block, the bottom surface of upper clamping block and lower clamping block
Closing, the upper surface center of lower clamping block is machined with the chip positioning groove for installing sensor chip and lower circuit board mounting groove,
The degree of depth of chip positioning groove is less than the degree of depth of lower circuit board mounting groove, the structure of lower circuit board mounting groove and upper circuit board mounting groove
Structure identical, the middle part of lower circuit board mounting groove is machined with lower probe aperture, is fixedly installed lower electricity in lower circuit board mounting groove
Road plate, the elastic tip of lower probe sequentially passes through lower probe aperture and lower circuit board, and lower probe is welded on lower circuit board, lower probe
The other end connect have wire.
Upper clamping block of the present utility model is connected by screw rod with lower clamping block.
Upper circuit board of the present utility model is screwed in upper circuit board mounting groove, and lower circuit board is screwed
In lower circuit board mounting groove.
The quantity of upper probe aperture of the present utility model and lower probe aperture is 4, and upper probe aperture is at upper circuit board mounting groove
Inside being arranged as 2 row 2 row to be staggered, lower probe aperture is corresponding with upper probe aperture and arrangement mode is identical with upper probe aperture.
Upper clamping block of the present utility model and lower clamping block are all politef block.
The beneficial effects of the utility model are as follows:
This utility model achieves and clamps bare chip and the function of test, simple in construction, easy to use, uses probe
As the carrier between chip electrode and p-wire, probe is good with electrode contact to rely on the elasticity of probe can guarantee that, upper clamping
Block and lower clamping block use screw rod to connect, it is ensured that leading when upper clamping block and the location of lower clamping block and upper clamping block slide
To, thus realize the location of upper probe and lower probe and chip electrode, upper clamping block and lower clamping block are politef block,
Both meet the insulating requirements between probe, bear again high temperature during test, the machinability that politef is good simultaneously,
Reduce cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of one embodiment of this utility model.
Fig. 2 is the upward view of upper clamping block 3 in Fig. 1.
Fig. 3 is the lower top view clamping block 6 in Fig. 1.
Detailed description of the invention
To this utility model further description but this utility model is not limited to following with embodiment below in conjunction with the accompanying drawings
Embodiment.
In FIG, for Oxynitride sensor chip test clamping device by screw rod 1, upper probe 2, on step up block
3, upper circuit board 4, lower clamping block 6, lower probe 7, lower circuit board 8 connect and compose.
Upper clamping block 3 and lower clamping block 6 are all politef block, are machined with use at the upper surface center of lower clamping block 6
In the chip positioning groove d and lower circuit board mounting groove f of installation sensor chip 5, the degree of depth of chip positioning groove d is less than lower circuit board
The central axis of the degree of depth of mounting groove f, the centrage of chip positioning groove d and lower circuit board mounting groove f, lower circuit board mounting groove
The bottom of f is machined with lower probe aperture e, such as Fig. 3, is screwed and is provided with lower circuit board 8, test in lower circuit board mounting groove f
The elastic tip of pin 7 sequentially passes through lower probe aperture e and lower circuit board 8, and lower probe 7 is welded on lower circuit board 8, lower probe 7
The other end connects wire, is positioned under the left and right sides of lower circuit board mounting groove f on clamping block 6 and is machined with screw g, in screw g
Being provided with screw rod 1, upper clamping block 3, through the through hole c of upper clamping block 3, is arranged on lower clamping block 6, upper by the upper end of screw rod 1
The bottom center of clamping block 3 is machined with circuit board mounting groove b, the structure of upper circuit board mounting groove b and lower circuit board mounting groove f
Structure identical, the middle part of upper circuit board mounting groove b is machined with probe aperture a, has been screwed in upper circuit board mounting groove b
Upper circuit board 4, the elastic tip of upper probe 2 sequentially passes through probe aperture a and upper circuit board 4, and upper probe 2 is welded on circuit board
On 4, the other end of upper probe 2 connects wire, is locked with lower clamping block 6 by upper clamping block 3 by nut, makes upper clamping block 3
The upper surface laminating of bottom surface and lower clamping block 6, now, the elastic tip of upper probe 2 and lower probe 7 acts against sensor core respectively
Sensor chip 5 is clamped and is fully contacted with the electrode on sensor chip 5 by the both sides up and down of sheet 5.
In the present embodiment, the quantity of described upper probe aperture a and lower probe aperture e is 4, and upper probe aperture a is powering on
Being arranged as 2 row 2 row in road plate 4 mounting groove b to be staggered, lower probe aperture e is corresponding with upper probe aperture a and arrangement mode and upper probe
Hole a is identical.
This utility model achieves and clamps naked sensor chip and the function of test, simple in construction, easy to use, adopts
With probe as the carrier between chip electrode and p-wire, probe is good with electrode contact to rely on the elasticity of probe can guarantee that,
Upper clamping block and lower clamping block use screw rod to connect, it is ensured that when upper clamping block and the location of lower clamping block and upper clamping block slide
Guiding, thus realize the location of upper probe and lower probe and chip electrode, upper clamping block and lower clamping block are polytetrafluoroethyl-ne
Alkene block, had both met the insulating requirements between probe, bore again high temperature during test, the machining that politef is good simultaneously
Performance, reduces cost.
The above, detailed description of the invention the most of the present utility model, but protection domain of the present utility model is not limited to
This, any those familiar with the art, in the technical scope that the invention discloses, can readily occur in change or replace,
All should contain within protection domain of the present utility model.
Claims (5)
1. the clamping device for Oxynitride sensor chip test, it is characterised in that: in the bottom surface of upper clamping block (3)
The heart is machined with circuit board mounting groove (b), and the middle part of upper circuit board mounting groove (b) is machined with probe aperture (a), and upper circuit board is pacified
Being fixedly installed circuit board (4) in tankage (b), the elastic tip of upper probe (2) sequentially passes through probe aperture (a) and upper circuit board
(4), and upper probe (2) is welded on circuit board (4), and the other end of upper probe (2) connects wire, upper clamping block (3)
Bottom is provided with the upper surface laminating of lower clamping block (6), the bottom surface of upper clamping block (3) and lower clamping block (6), lower clamping block (6)
Upper surface center be machined with chip positioning groove (d) for installing sensor chip and lower circuit board mounting groove (f), chip is fixed
The degree of depth of position groove (d) is pacified with upper circuit board less than the degree of depth of lower circuit board mounting groove (f), the structure of lower circuit board mounting groove (f)
The structure of tankage (b) is identical, and the middle part of lower circuit board mounting groove (f) is machined with lower probe aperture (e), lower circuit board mounting groove (f)
Inside being fixedly installed lower circuit board (8), the elastic tip of lower probe (7) sequentially passes through lower probe aperture (e) and lower circuit board (8), and
Lower probe (7) is welded on lower circuit board (8), and the other end of lower probe (7) connects wire.
Clamping device for Oxynitride sensor chip test the most according to claim 1, it is characterised in that: described
Upper clamping block (3) and lower clamping block (6) be connected by screw rod (1), upper clamping block (3) is positioned by screw rod (1) simultaneously.
Clamping device for Oxynitride sensor chip test the most according to claim 1, it is characterised in that: described
Upper circuit board (4) be screwed in upper circuit board (4) mounting groove (b)；Described lower circuit board (8) is screwed
In lower circuit board mounting groove (f).
Clamping device for Oxynitride sensor chip test the most according to claim 1, it is characterised in that: described
Upper probe aperture (a) and the quantity of lower probe aperture (e) be 4, upper probe aperture (a) is arranged in upper circuit board (4) mounting groove (b)
Being classified as 2 row 2 row to be staggered, lower probe aperture (e) is corresponding with upper probe aperture (a) and arrangement mode is identical with upper probe aperture (a).
Clamping device for Oxynitride sensor chip test the most according to claim 1, it is characterised in that: described
Upper clamping block (3) and lower clamping block (6) be all politef block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620678317.5U CN205749389U (en) | 2016-06-30 | 2016-06-30 | Clamping device for Oxynitride sensor chip test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620678317.5U CN205749389U (en) | 2016-06-30 | 2016-06-30 | Clamping device for Oxynitride sensor chip test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205749389U true CN205749389U (en) | 2016-11-30 |
Family
ID=57379926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620678317.5U Active CN205749389U (en) | 2016-06-30 | 2016-06-30 | Clamping device for Oxynitride sensor chip test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205749389U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114088321A (en) * | 2021-10-08 | 2022-02-25 | 宁波大学 | Clamping device for testing sealing of nitrogen oxide sensor core |
-
2016
- 2016-06-30 CN CN201620678317.5U patent/CN205749389U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114088321A (en) * | 2021-10-08 | 2022-02-25 | 宁波大学 | Clamping device for testing sealing of nitrogen oxide sensor core |
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |