CN209982820U - Low-impedance multilayer circuit board - Google Patents
Low-impedance multilayer circuit board Download PDFInfo
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- CN209982820U CN209982820U CN201920647803.4U CN201920647803U CN209982820U CN 209982820 U CN209982820 U CN 209982820U CN 201920647803 U CN201920647803 U CN 201920647803U CN 209982820 U CN209982820 U CN 209982820U
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- circuit board
- multilayer circuit
- board body
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Abstract
The utility model discloses a low-impedance multilayer circuit board, relating to the technical field of circuit boards, which comprises a multilayer circuit board body, the interior of the multilayer circuit board body is filled with a green oil structure layer, the bottom of the multilayer circuit board body is connected with a heat conducting plate, and four corners of the outer part of the multilayer circuit board body are all sleeved with limit frames, the inner part of each limit frame is provided with a clamping groove matched with the corners of the multilayer circuit board body, the bottoms of the four limit frames are all connected with the bottom plate, and the top of the limit frame is provided with a fixed hole, the heat of the multilayer circuit board body can be led out through the heat conducting plate, under the effect of heat-conducting glue layer and radiating groove, can spill the heat from the bottom of device, and then can avoid the device heat dissipation to influence the normal use process of components and parts, the heat radiating efficiency of multilayer circuit board body can further be increased to the heat-conducting glue layer of baffle and its one side.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, concretely relates to low impedance multilayer circuit board.
Background
The circuit board is also called as a circuit board, has the characteristics of high wiring density, light weight, thin thickness and good bending property, enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
In chinese patent No. 201720275839.5, a low impedance multilayer circuit board is disclosed, which describes "through the design of heat dissipation strip, improve the heat dissipation efficiency, rationally control the thickness of green oil structure layer, thereby reduce the overall impedance of multilayer circuit board body, improve the performance of multilayer circuit board body,", but the heat dissipation strip in the device is put at the top of multilayer circuit board body, and then when multilayer circuit board body is in the use, the heat dissipation strip is easy to influence the process of components and parts and circuit board installation, in addition, because the circuit board is easy to be influenced by external force, cause the circuit board to exceed its own angle of buckling, thereby easily leading to the phenomenon that the circuit board breaks down.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a low impedance multilayer circuit board to the heat dissipation strip among the traditional device who proposes in solving above-mentioned background art easily influences the installation of components and parts and circuit board, and the circuit board is difficult to the problem of protection.
In order to achieve the above object, the utility model provides a following technical scheme: a low-impedance multilayer circuit board comprises a multilayer circuit board body, wherein a green oil structure layer is filled in the multilayer circuit board body, a heat conducting plate is connected at the bottom of the multilayer circuit board body, and four corners of the outer part of the multilayer circuit board body are all sleeved with limit frames, the inner part of each limit frame is provided with a clamping groove matched with the corners of the multilayer circuit board body, the bottoms of the four limit frames are all connected with the bottom plate, the top of the limit frame is provided with a fixing hole, the bottom of the bottom plate is provided with an insertion hole matched with the fixing hole, the bottom plate is positioned below the heat conducting plate, the bottom of the bottom plate is provided with a heat radiating groove, the periphery of the top of the bottom plate is fixed with partition plates, the four partition plates and the four limit frames are distributed in a staggered manner, and heat-conducting adhesive layers are filled between the partition plates and the multilayer circuit board body and between the bottom plate and the heat-conducting plate.
Preferably, the limiting frame is laid at the top of the multilayer circuit board body, and a negative pressure groove is formed in the outer wall of the rubber pad.
Preferably, a base plate is fixed at the position, close to the top of the fixing hole, of the top of the limiting frame, and a round hole matched with the fixing hole is formed in the base plate.
Preferably, both sides of the bottom plate are in arc chamfer transition to form arc parts.
Preferably, the outer wall of the limiting frame is provided with an anti-slip groove, and the anti-slip groove is arranged in the horizontal direction.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model discloses a heat-conducting plate can derive the heat of multilayer circuit board body, under the effect of heat-conducting glue film and radiating groove, can spill the heat from the bottom of device, and then can avoid the device heat dissipation to influence the normal use process of components and parts, and the heat-conducting glue film of baffle and its one side can further increase the radiating efficiency of multilayer circuit board body.
(2) The utility model discloses a bottom plate can be consolidated multilayer circuit board body, and spacing frame can protect the turning of multilayer circuit board body, under the effect of draw-in groove, can wholly carry on spacingly to multilayer circuit board body, and then can avoid multilayer circuit board body to receive external force to produce the damage phenomenon.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a front view of the present invention;
fig. 3 is a top view of the present invention;
in the figure: 1-green oil structure layer, 2-bottom plate, 3-heat dissipation groove, 4-fixing hole, 5-heat conducting glue layer, 6-limit frame, 7-rubber pad, 8-backing plate, 9-arc part, 10-multilayer circuit board body, 11-clapboard, 12-antiskid groove, 13-jack, 14-clamping groove and 15-heat conducting plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a low-impedance multilayer circuit board comprises a multilayer circuit board body 10, wherein a green oil structure layer 1 is filled in the multilayer circuit board body 10, a heat conducting plate 15 is connected to the bottom of the multilayer circuit board body 10, limiting frames 6 are sleeved on four corners outside the multilayer circuit board body 10, clamping grooves 14 matched with the corners of the multilayer circuit board body 10 are formed in the limiting frames 6, the bottoms of the four limiting frames 6 are connected with a bottom plate 2, fixing holes 4 are formed in the tops of the limiting frames 6, inserting holes 13 matched with the fixing holes 4 are formed in the bottom of the bottom plate 2, the bottom plate 2 is positioned below the heat conducting plate 15, the limiting frames 6 and the bottom plate 2 can be fixed through the fixing holes 4 and the inserting holes 13, the bottom plate 2 can reinforce the multilayer circuit board body 10, and the limiting frames 6 can protect the corners of the multilayer circuit board body 10, meanwhile, under the action of the clamping groove 14, the whole multilayer circuit board body 10 can be limited, and further the phenomenon that the multilayer circuit board body 10 is damaged by external force can be avoided, the bottom of the bottom plate 2 is provided with the heat dissipation groove 3, the periphery of the top of the bottom plate 2 is fixed with the partition plates 11, the four partition plates 11 and the four limiting frames 6 are distributed in a staggered manner, the heat conduction glue layers 5 are filled between the partition plates 11 and the multilayer circuit board body 10 and between the bottom plate 2 and the heat conduction plate 15, heat generated in the use process of the multilayer circuit board body 10 can be absorbed by the heat conduction plate 15, then the heat can be rapidly dissipated by the heat dissipation groove 3 at the bottom of the bottom plate 2 under the action of the heat conduction glue layers 5, and further the multilayer circuit board body 10 can be dissipated by heat in the normal use process of components, the practicability of the device is greatly increased, and meanwhile, the heat conduction glue layers, thereby further increasing the heat dissipation efficiency of the multilayer wiring board body 10.
Furthermore, the outer wall of the limiting frame 6 is provided with an anti-skid groove 12, and the anti-skid groove 12 is arranged in the horizontal direction.
Further, the top position department that limit frame 6 just is located multilayer circuit board body 10 has laid rubber pad 7, and the outer wall of rubber pad 7 is equipped with the negative pressure groove outward, and after limit frame 6 and bottom plate 2 were fixed stable, rubber pad 7 can prevent that limit frame 6 from direct and multilayer circuit board body 10 contact extrusion to stability when further improving multilayer circuit board body 10 and using.
Specifically, the top position department that the top of spacing frame 6 is close to fixed orifices 4 is fixed with backing plate 8, the inside of backing plate 8 seted up with fixed orifices 4 assorted round hole, when fixing spacing frame 6 and bottom plate 2 through the bolt, backing plate 8 can improve the stability between spacing frame 6 and the bottom plate 2.
Specifically, both sides of the bottom plate 2 are in arc chamfer transition to form an arc portion 9, so that the scratch phenomenon of the bottom plate 2 on the hand of a user can be avoided.
The utility model discloses a theory of operation and use flow: the utility model discloses a when using, the accessible bolt is fixed spacing frame 6 and bottom plate 2 with jack 13, later bottom plate 2 can consolidate multilayer circuit board body 10, spacing frame 6 can carry out the guard action to multilayer circuit board body 10's turning, under draw-in groove 14's effect, can wholly carry on spacingly to multilayer circuit board body 10, and then can improve multilayer circuit board body 10's stability, the heat that its produced can be absorbed by heat-conducting plate 15 when multilayer circuit board body 10 uses for a long time, under heat-conducting glue layer 5's effect, can be with heat-conducting plate 15 quick follow radiating groove 3 effluvium, and then make multilayer circuit board body 10 components and parts still can normal use, and heat-conducting glue layer 5 of baffle 11 one side can dispel the heat to multilayer circuit board body 10's side, thereby can improve device's whole radiating efficiency.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A low impedance multilayer circuit board, includes multilayer circuit board body (10), the inside packing of multilayer circuit board body (10) has green oil structural layer (1), its characterized in that: the bottom of multilayer circuit board body (10) is connected with heat-conducting plate (15), and four corners in the outside of multilayer circuit board body (10) all overlap and be equipped with spacing frame (6), spacing frame (6) inside seted up with multilayer circuit board body (10) turning assorted draw-in groove (14), four the bottom of spacing frame (6) all is connected with bottom plate (2), and fixed orifices (4) have been seted up at the top of spacing frame (6), bottom plate (2) the bottom seted up with fixed orifices (4) assorted jack (13), and bottom plate (2) are located the below of heat-conducting plate (15), radiating groove (3) have been seted up to the bottom of bottom plate (2), and all be fixed with baffle (11), four around the top of bottom plate (2) baffle (11) and four spacing frame (6) crisscross distribution, it has the guide to all to fill between baffle (11) and multilayer circuit board body (10) and between bottom plate (2) and heat-conducting plate (15) A thermal adhesive layer (5).
2. The low impedance multilayer wiring board of claim 1, wherein: and a rubber pad (7) is laid at the position of the limiting frame (6) and positioned at the top of the multilayer circuit board body (10), and a negative pressure groove is formed outside the outer wall of the rubber pad (7).
3. The low impedance multilayer wiring board of claim 1, wherein: the top position department that the top of spacing frame (6) is close to fixed orifices (4) is fixed with backing plate (8), the round hole with fixed orifices (4) assorted is seted up to the inside of backing plate (8).
4. The low impedance multilayer wiring board of claim 1, wherein: and both sides of the bottom plate (2) are in arc chamfer transition to form arc parts (9).
5. The low impedance multilayer wiring board of claim 1, wherein: the outer wall of the limiting frame (6) is provided with an anti-skidding groove (12), and the anti-skidding groove (12) is arranged in the horizontal direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920647803.4U CN209982820U (en) | 2019-05-08 | 2019-05-08 | Low-impedance multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920647803.4U CN209982820U (en) | 2019-05-08 | 2019-05-08 | Low-impedance multilayer circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN209982820U true CN209982820U (en) | 2020-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920647803.4U Active CN209982820U (en) | 2019-05-08 | 2019-05-08 | Low-impedance multilayer circuit board |
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| CN (1) | CN209982820U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074178A (en) * | 2020-09-29 | 2020-12-11 | 绍兴上虞锴达电子有限公司 | Durable type heat dissipation circuit board |
-
2019
- 2019-05-08 CN CN201920647803.4U patent/CN209982820U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074178A (en) * | 2020-09-29 | 2020-12-11 | 绍兴上虞锴达电子有限公司 | Durable type heat dissipation circuit board |
| CN112074178B (en) * | 2020-09-29 | 2022-07-12 | 绍兴上虞锴达电子有限公司 | Durable type heat dissipation circuit board |
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