CN209747464U - Film sticking device - Google Patents
Film sticking device Download PDFInfo
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- CN209747464U CN209747464U CN201920344345.7U CN201920344345U CN209747464U CN 209747464 U CN209747464 U CN 209747464U CN 201920344345 U CN201920344345 U CN 201920344345U CN 209747464 U CN209747464 U CN 209747464U
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- film
- pad pasting
- film sticking
- locking
- laminating
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Abstract
The utility model discloses a pad pasting device, including pad pasting support, first pad pasting platform, press mold mechanism, second pad pasting platform, pad pasting lift actuating mechanism, locate the second pad pasting platform and be used for the sealing washer that contacts with first pad pasting platform, be used for to carry out the evacuation subassembly of evacuation between first pad pasting platform and the second pad pasting platform and locate between first pad pasting platform and the second pad pasting platform and be used for locking the locking Assembly of first pad pasting platform and second pad pasting platform. After a sealing ring on the second film pasting table is in sealing contact with the first film pasting table, the locking assembly locks the first film pasting table and the second film pasting table, the vacuumizing assembly vacuumizes the space between the first film pasting table and the second film pasting table, so that air between the first film pasting table and the second film pasting table is pumped away, then the film pressing mechanism acts to apply force to the dry film and the wafer, and due to the fact that the space between the first film pasting table and the second film pasting table is close to a vacuum state, bubbles are prevented from existing between the wafer and the dry film after the dry film is attached to the wafer.
Description
Technical Field
The utility model relates to a pad pasting equipment field especially relates to a pad pasting device.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be processed on a silicon wafer to form an integrated circuit product with specific electrical functions.
In the production process of products such as wafers and the like, finished products need to be subjected to film pasting treatment, a film pressing mechanism is usually used for attaching a dry film to the surface of the wafer, but the problem that bubbles exist between the dry film and the wafer after the film is pasted by the existing film pasting device is solved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a pad pasting device aims at solving prior art, has the problem of bubble between dry film and the wafer.
To achieve the purpose, the utility model adopts the following technical proposal:
Pad pasting device, including pad pasting support, fixed locating the first pad pasting platform of pad pasting support, locate the film pressing mechanism of first pad pasting platform, with the relative second pad pasting platform that sets up of first pad pasting platform, be used for the drive the pad pasting lift drive mechanism of second pad pasting platform motion, locate the second pad pasting platform and be used for with the sealing washer that first pad pasting platform contacted, be used for right first pad pasting platform with carry out the evacuation subassembly of evacuation between the second pad pasting platform and locate first pad pasting platform with just be used for locking between the second pad pasting platform first pad pasting platform with the locking Assembly of second pad pasting platform.
Further, the vacuum-pumping assembly comprises a vacuum pump and a vacuum pipe connected with the vacuum pump; and the first film sticking table and/or the second film sticking table are/is provided with vacuum holes communicated with the vacuum tube.
Further, press mold mechanism include with first pad pasting platform links to each other and is located first pad pasting platform with press mold gasbag between the second pad pasting platform and be used for doing press mold air pump of press mold gasbag air feed.
further, press mold mechanism including locate the press mold cylinder of first pad pasting platform, with the expansion end of press mold cylinder links to each other and is located first pad pasting platform with press mold board between the second pad pasting platform.
Further, the film sticking lifting driving mechanism comprises a film sticking base and a lifting cylinder arranged on the film sticking base; and the second film sticking table is connected with the movable end of the lifting cylinder.
Furthermore, the film lifting driving mechanism further comprises a film guide rail and a film sliding driving cylinder, wherein the film guide rail is connected with the film base in a sliding mode, and the film sliding driving cylinder is used for driving the film base to slide along the film guide rail.
Furthermore, the pad pasting base has been seted up the pad pasting guiding hole, pad pasting lift actuating mechanism still is including being located the pad pasting guide bar in the pad pasting guiding hole, the pad pasting guide bar with the second pad pasting platform links to each other, the pad pasting guide bar in the pad pasting guiding hole with pad pasting base sliding connection.
Further, first pad pasting platform is equipped with first heating element, first heating element include first heating member, with first heating member is close to the first heat-conducting member that one side of second pad pasting platform links to each other, and with first heating member keep away from the first heat-insulating member that one side of first heat-conducting member links to each other.
Furthermore, the second pad pasting platform is provided with a second heating assembly, and the second heating assembly comprises a second heating element, a second heat-conducting element and a second heat-insulating element, wherein the second heat-conducting element is connected with one side, close to the first pad pasting platform, of the second heating element, and the second heat-insulating element is connected with one side, far away from the second heat-conducting element, of the second heating element.
Furthermore, the locking assembly comprises a first locking block arranged on the first film sticking table, a first locking rod connected with the second film sticking table in a sliding manner, and a first locking driving piece arranged on the second film sticking table and used for driving the first locking rod to move; the first locking block is provided with a first locking hole matched with the first locking rod.
Furthermore, the locking assembly further comprises a first guide block arranged on the second film sticking table, and a first guide hole for the first locking rod to pass through is formed in the first guide block.
Furthermore, the locking assembly further comprises a first fixing block arranged on the second film sticking table, a first fixing hole corresponding to the first locking rod is formed in the first fixing block, and the first fixing block and the first guide block are opposite and arranged at intervals.
Furthermore, the pad pasting support includes two pad pasting risers that relative and interval set up, the pad pasting riser has seted up the pad pasting hole of stepping down.
The utility model has the advantages that: after a sealing ring on the second film pasting table is in sealing contact with the first film pasting table, the locking assembly locks the first film pasting table and the second film pasting table, the vacuumizing assembly vacuumizes the space between the first film pasting table and the second film pasting table, so that air between the first film pasting table and the second film pasting table is pumped away, then the film pressing mechanism acts to apply force to the dry film and the wafer, and due to the fact that the first film pasting table and the second film pasting table are close to a vacuum state, air bubbles are prevented from existing between the wafer and the dry film after the dry film is attached to the wafer.
Drawings
in order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
Fig. 1 is a schematic structural view of a film sticking device in an embodiment of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
Fig. 3 is a schematic structural diagram of a locking assembly according to an embodiment of the present invention;
Fig. 4 is a cross-sectional view of a film application device in an embodiment of the present invention;
In the figure:
1. Sticking a film bracket; 11. pasting a film vertical plate; 2. a first film pasting table; 3. a film pressing mechanism; 31. a film pressing cylinder; 32. a film pressing plate; 4. a second film pasting table; 5. a film sticking lifting driving mechanism; 51. a film pasting base; 52. a lifting cylinder; 53. pasting a film guide rail; 54. the film is attached to slide to drive the cylinder; 55. a film pasting guide rod; 6. a locking assembly; 61. a first locking block; 611. a first locking hole; 62. a first locking lever; 63. a first locking drive; 64. a first guide block; 65. a first fixed block; 651. a first fixing hole; 7. a seal ring; 8. a first heating assembly; 81. a first heating member; 82. a first heat-conducting member; 83. a first thermal insulation member; 9. a second heating assembly; 91. a second heating member; 92. a second heat-conducting member; 93. a second thermal shield.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
The following describes the implementation of the present invention in detail with reference to specific embodiments.
As shown in fig. 1-4, the embodiment of the utility model provides a pad pasting device, including pad pasting support 1, the fixed first pad pasting platform 2 of locating pad pasting support 1, locate the press mold mechanism 3 of first pad pasting platform 2, the second pad pasting platform 4 that sets up relatively with first pad pasting platform 2, a pad pasting lift actuating mechanism 5 for driving the motion of second pad pasting platform 4, locate second pad pasting platform 4 and be used for the sealing washer 7 that contacts with first pad pasting platform 2, a vacuumizing assembly for carrying out the evacuation between first pad pasting platform 2 and the second pad pasting platform 4, and locate between first pad pasting platform 2 and the second pad pasting platform 4 and be used for locking the locking Assembly 6 of first pad pasting platform 2 and second pad pasting platform 4.
The utility model discloses an in the embodiment, the pad pasting process of pad pasting device is: the wafer is placed on the second film sticking table 4, a dry film is positioned between the first film sticking table 2 and the second film sticking table 4 and is positioned right above the wafer, then the film sticking lifting driving mechanism 5 drives the second film sticking table 4 to ascend and gradually approach the first film sticking table 2, when a sealing ring 7 on the second film sticking table 4 is tightly sealed with the first film sticking table 2, the locking component 6 locks the first film sticking table 2 and the second film sticking table 4, the vacuumizing component vacuumizes the space between the first film sticking table 2 and the second film sticking table 4, so that air between the first film sticking table 2 and the second film sticking table 4 is pumped away, then the film pressing mechanism 3 acts to apply force to the dry film and the wafer, and because the space between the first film sticking table 2 and the second film sticking table 4 is close to a vacuum state, bubbles are prevented from being formed between the wafer and the dry film after the dry film is stuck on the wafer, and because the locking component 6 locks the first film sticking table 2 and the second film sticking table 4, therefore, when the film pressing mechanism 3 acts to apply force to the dry film and the wafer, relative motion cannot occur between the first film pasting table 2 and the second film pasting table 4, so that the first film pasting table 2 and the second film pasting table 4 cannot enter external air, bubbles between the dry film and the wafer are avoided, meanwhile, the film pressing mechanism 3 can fully apply force to the dry film and the wafer, and the tightness of the laminating between the dry film and the wafer is guaranteed.
Further, as another specific embodiment of the film pasting device provided by the present invention, the vacuum pumping assembly (not shown in the figures) comprises a vacuum pump and a vacuum tube connected to the vacuum pump; the first film sticking table 2 or the second film sticking table 4 is provided with a vacuum hole communicated with the vacuum tube; the first film sticking table 2 and the second film sticking table 4 can be simultaneously provided with vacuum holes. The vacuum pump is used for pumping air between the first film sticking table 2 and the second film sticking table 4 through the vacuum pipe and a vacuum hole communicated with the vacuum pipe, so that the vacuumizing effect is realized. When the vacuum hole is arranged on the second film sticking table 4, the vacuum hole is positioned in the boundary range of the sealing ring 7; when the vacuum hole is arranged on the first film sticking table 2, the vacuum hole is positioned in the annular range of the first film sticking table 2 contacted with the sealing ring 7.
Further, as the utility model provides a another kind of embodiment of pad pasting device, film pressing mechanism 3 includes and links to each other and be located the film pressing gasbag between first pad pasting platform 2 and the second pad pasting platform 4 with first pad pasting platform 2 and is used for the film pressing air pump (not shown in the figure) for film pressing gasbag air feed. The film pressing air pump is inflated to the film pressing air bag through the film pressing air pipe, and the volume expands and closely presses the dry film on the wafer after the film pressing air bag is inflated, and because the film pressing air bag is filled with gas, the film pressing air bag is the same basically to the pressure that dry film and wafer were applyed everywhere for the dry film all everywhere with the better laminating of wafer, avoided the poor problem of local laminating effect, and then promoted the effect with dry film pressfitting in wafer.
further, please refer to fig. 1 and 4, as another embodiment of the film laminating apparatus provided by the present invention, the film pressing mechanism 3 includes a film pressing cylinder 31 disposed on the first film laminating table 2, and a film pressing plate 32 connected to the movable end of the film pressing cylinder 31 and located between the first film laminating table 2 and the second film laminating table 4. The piston rod (also called the movable end) of the film pressing cylinder 31 drives the film pressing plate 32 to move and apply force to the dry film and the wafer, so as to compress the dry film and the wafer, thereby completing the film pressing action.
Further, referring to fig. 1 and 4, as another embodiment of the film sticking device provided by the present invention, the film sticking lifting driving mechanism 5 includes a film sticking base 51 and a lifting cylinder 52 disposed on the film sticking base 51; the second film sticking table 4 is connected with the movable end of the lifting cylinder 52. The lifting cylinder 52 arranged on the film sticking base 51 drives the second film sticking table 4 to move up and down so as to realize the contact between the first film sticking table 2 and the sealing ring 7 on the second film sticking table 4.
Further, referring to fig. 1 and 4, as another embodiment of the film sticking device provided by the present invention, the film sticking lifting driving mechanism 5 further includes a film sticking guide 53 slidably connected to the film sticking base 51, and a film sticking sliding driving cylinder 54 for driving the film sticking base 51 to slide along the film sticking guide 53. The film-sticking sliding driving cylinder 54 can drive the film-sticking base 51 to slide along the film-sticking guide rail 53, so that the wafer can leave the position right below the first film-sticking table 2 along with the second film-sticking table 4 and the film-sticking base 51 after the second film-sticking table 4 finishes film sticking, and the wafer can be taken out for blanking by manpower and a manipulator.
further, please refer to fig. 1 and 4, as another embodiment of the film sticking device provided by the present invention, a film sticking guide hole has been opened on the film sticking base 51, the film sticking lifting driving mechanism 5 further comprises a film sticking guide rod 55 located in the film sticking guide hole, the film sticking guide rod 55 is connected to the second film sticking table 4, and the film sticking guide rod 55 is slidably connected to the film sticking base 51 in the film sticking guide hole. When the lifting cylinder 52 drives the second film sticking table 4 to move in the vertical direction, the film sticking guide rod 55 connected with the second film sticking table 4 slides in the film sticking guide hole and the film sticking base 51, so that the transverse deviation of the second film sticking table 4 is avoided.
Further, please refer to fig. 4, as another embodiment of the film laminating apparatus provided by the present invention, the first film laminating table 2 is provided with a first heating component 8, and the first heating component 8 includes a first heating component 81, a first heat conducting member 82 connected to one side of the first heating component 81 close to the second film laminating table 4, and a first heat insulating member 83 connected to one side of the first heating component 81 far away from the first heat conducting member 82. The first heating element 81 generates heat to conduct the heat to the lamination air bag (or to the lamination plate 32 in other embodiments) through the first heat conducting element 82 and heat the dry film, so as to relieve the hardening of the glue on the dry film. The first heat insulation member 83 is disposed on one side of the first heating member 81 away from the first heat conduction member 82, so that heat generated by the first heating member 81 is prevented from being transferred to other positions, and the utilization rate of the heat is improved.
Further, please refer to fig. 4, as another embodiment of the film pasting device provided by the present invention, the second film pasting table 4 is provided with a second heating component 9, the second heating component 9 includes a second heating component 91, a second heat conducting member 92 connected to one side of the second heating component 91 close to the first film pasting table 2, and a second heat insulating member 93 connected to one side of the second heating component 91 far away from the second heat conducting member 92. The second heating component 9 can be matched with the first heating component 8 to heat the dry film, and further the hardening of glue on the dry film is relieved. The second heating member 91 generates heat and transmits the heat to the second film laminating table 4 through the second heat-conducting member 92, so that the wafer and the dry film placed on the second film laminating table 4 are heated. One side of keeping away from first pad pasting platform 2 at second heating member 91 sets up second heat insulating part 93, avoids the heat to the direction transmission of keeping away from first pad pasting platform 2, promotes thermal utilization ratio.
Further, referring to fig. 1-3, as another embodiment of the film sticking device provided by the present invention, the locking assembly 6 includes a first locking block 61 disposed on the first film sticking table 2, a first locking rod 62 slidably connected to the second film sticking table 4, and a first locking driving member 63 disposed on the second film sticking table 4 and used for driving the first locking rod 62 to move; the first locking block 61 is provided with a first locking hole 611 to be engaged with the first locking rod 62. The process that locking Assembly 6 locks first pad pasting platform 2 and second pad pasting platform 4 does: the first locking driving member 63 (which may be a driving member such as an air cylinder) drives the first locking rod 62 to move and extend into the first locking hole 611 of the first locking block 61 on the first film sticking table 2, and at this time, the first locking rod 62 limits the first locking block 61, so that the first film sticking table 2 cannot move relative to the second film sticking table 4.
Further, referring to fig. 1-3, as another embodiment of the film sticking device provided by the present invention, the locking assembly 6 further includes a first guiding block 64 disposed on the second film sticking table 4, and the first guiding block 64 is provided with a first guiding hole for the first locking rod 62 to pass through. The first locking rod 62 is slidably connected to the second film sticking table 4 in the first guide hole.
Further, referring to fig. 1-3, as another embodiment of the film sticking device provided by the present invention, the locking assembly 6 further includes a first fixing block 65 disposed on the second film sticking table 4, the first fixing block 65 is provided with a first fixing hole 651 corresponding to the first locking rod 62, and the first fixing block 65 is disposed opposite to and spaced apart from the first guiding block 64. After first locking lever 62 stretched into in the first locking hole 611 of first locking piece 61 on first pad pasting platform 2, first locking lever 62 continued to move to first fixed orifices 651 on first fixed block 65, first locking piece 61 was located between first fixed block 65 and first guide block 64 this moment, the both ends of first locking lever 62 were located first fixed block 65 and first guide block 64 respectively, promote the locking effect to first locking piece 61, guarantee the locking effect to between first pad pasting platform 2 and the second pad pasting platform 4.
Further, as another specific embodiment of the film sticking device provided by the present invention, the locking assembly 6 comprises a second locking block disposed on the second film sticking table 4, a second locking rod slidably connected to the first film sticking table 2, and a second locking driving member disposed on the first film sticking table 2 and used for driving the second locking rod to move; the second locking block is provided with a second locking hole (not shown in the figure) matched with the second locking rod. The process that locking Assembly 6 locks first pad pasting platform 2 and second pad pasting platform 4 does: the second locking driving piece (can be driving pieces such as an air cylinder) drives the second locking rod to move and stretch into a second locking hole of a second locking block on the second film sticking table 4, and the second locking rod limits the second locking block at the moment, so that the second film sticking table 4 cannot move relative to the first film sticking table 2.
Further, as the utility model provides a another kind of embodiment of pad pasting device, locking Assembly 6 is still including the second guide block of locating first pad pasting platform 2, and the second guide block is offered so that the second guiding hole (not shown in the figure) that the second check lock pole passes through. The second locking rod is in sliding connection with the first film sticking table 2 in the second guide hole.
further, as the utility model provides a another kind of embodiment of pad pasting device, locking Assembly 6 is still including the second fixed block of locating first pad pasting platform 2, and the second fixed block is seted up and is set up with the corresponding second fixed orifices of second check lock pole, and the second fixed block is relative and the interval with the second guide block (not shown in the figure). After the second locking rod stretches into the second locking hole of the second locking block on the second film sticking table 4, the second locking rod continues to move into the second fixing hole on the second fixing block, the second locking block is located between the second fixing block and the second guide block at the moment, two ends of the second locking rod are located in the second fixing block and the second guide block respectively, the locking effect on the second locking block is improved, and the locking effect between the first film sticking table 2 and the second film sticking table 4 is guaranteed.
Further, please refer to fig. 1, as another embodiment of the film sticking device provided by the present invention, the film sticking bracket 1 includes two opposite and spaced film sticking vertical plates 11, and the film sticking vertical plates 11 are provided with film sticking yielding holes. First pad pasting platform 2 installation is fixed in between two pad pasting risers 11, and second pad pasting platform 4 is located first pad pasting platform 2 under, and the pad pasting hole of stepping down is in order to supply banding dry film to get into between first pad pasting platform 2 and the second pad pasting platform 4, and sustainable provides the dry film for the wafer.
It is to be noted that the solution in another embodiment may be a further modified embodiment on the basis of other examples.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. Pad pasting device, its characterized in that includes the pad pasting support, fixes locating the first pad pasting platform of pad pasting support, locates the pressure membrane mechanism of first pad pasting platform, with the relative second pad pasting platform that sets up of first pad pasting platform, be used for the drive the pad pasting lift actuating mechanism of second pad pasting platform motion, locate the second pad pasting platform and be used for with the sealing washer that first pad pasting platform contacted, be used for right first pad pasting platform with carry out the evacuation subassembly of evacuation between the second pad pasting platform and locate first pad pasting platform with just be used for locking between the second pad pasting platform first pad pasting platform with the locking subassembly of second pad pasting platform.
2. The film pasting device as claimed in claim 1, wherein the vacuum pumping assembly comprises a vacuum pump and a vacuum tube connected to the vacuum pump; and the first film sticking table and/or the second film sticking table are/is provided with vacuum holes communicated with the vacuum tube.
3. The film laminating device according to claim 1, wherein the film laminating mechanism comprises a film laminating air bag connected with the first film laminating table and positioned between the first film laminating table and the second film laminating table, and a film laminating air pump for supplying air to the film laminating air bag.
4. The laminating device according to claim 1, wherein the film pressing mechanism comprises a film pressing cylinder arranged on the first laminating table and a film pressing plate connected with a movable end of the film pressing cylinder and positioned between the first laminating table and the second laminating table.
5. The film sticking device according to claim 1, wherein the film sticking lifting driving mechanism comprises a film sticking base and a lifting cylinder arranged on the film sticking base; and the second film sticking table is connected with the movable end of the lifting cylinder.
6. The film sticking device according to claim 5, wherein the film sticking lifting driving mechanism further comprises a film sticking guide rail in sliding connection with the film sticking base, and a film sticking sliding driving cylinder for driving the film sticking base to slide along the film sticking guide rail.
7. The film sticking device according to claim 5, wherein the film sticking base is provided with a film sticking guide hole, the film sticking lifting driving mechanism further comprises a film sticking guide rod positioned in the film sticking guide hole, the film sticking guide rod is connected with the second film sticking table, and the film sticking guide rod is slidably connected with the film sticking base in the film sticking guide hole.
8. a laminating device according to any one of claims 1-7, characterized in that the first laminating station is provided with a first heating assembly comprising first heating elements, a first heat-conducting member connected to a side of the first heating elements which is adjacent to the second laminating station, and a first heat-insulating member connected to a side of the first heating elements which is remote from the first heat-conducting member.
9. A laminating device according to any one of claims 1-7, characterized in that the second laminating station is provided with a second heating assembly comprising a second heating element, a second heat-conducting member connected to a side of the second heating element which is adjacent to the first laminating station, and a second heat-insulating member connected to a side of the second heating element which is remote from the second heat-conducting member.
10. The film sticking device according to any one of claims 1 to 7, wherein the locking assembly comprises a first locking block arranged on the first film sticking table, a first locking rod connected with the second film sticking table in a sliding manner, and a first locking driving piece arranged on the second film sticking table and used for driving the first locking rod to move; the first locking block is provided with a first locking hole matched with the first locking rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920344345.7U CN209747464U (en) | 2019-03-18 | 2019-03-18 | Film sticking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920344345.7U CN209747464U (en) | 2019-03-18 | 2019-03-18 | Film sticking device |
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| CN209747464U true CN209747464U (en) | 2019-12-06 |
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| CN201920344345.7U Active CN209747464U (en) | 2019-03-18 | 2019-03-18 | Film sticking device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111025843A (en) * | 2019-12-24 | 2020-04-17 | 无锡中微掩模电子有限公司 | Novel 5 very little mask version pad pasting instrument |
| CN111710620A (en) * | 2019-03-18 | 2020-09-25 | 广东思沃精密机械有限公司 | Film sticking device |
| CN113327878A (en) * | 2021-08-03 | 2021-08-31 | 四川明泰微电子有限公司 | Wafer loading device and wafer film pasting device |
-
2019
- 2019-03-18 CN CN201920344345.7U patent/CN209747464U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111710620A (en) * | 2019-03-18 | 2020-09-25 | 广东思沃精密机械有限公司 | Film sticking device |
| CN111025843A (en) * | 2019-12-24 | 2020-04-17 | 无锡中微掩模电子有限公司 | Novel 5 very little mask version pad pasting instrument |
| CN113327878A (en) * | 2021-08-03 | 2021-08-31 | 四川明泰微电子有限公司 | Wafer loading device and wafer film pasting device |
| CN113327878B (en) * | 2021-08-03 | 2021-10-08 | 四川明泰微电子有限公司 | Wafer loading device and wafer film pasting device |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 523000 building 13, No. 2, Xingye Road, Songshanhu Park, Dongguan City, Guangdong Province Patentee after: Guangdong Siwo advanced equipment Co.,Ltd. Address before: 523000 1st floor, building a, No.1 Rd Rd Rd, Songshanhu hi tech Industrial Park, Dongguan City, Guangdong Province Patentee before: GUANGDONG SOWOTECH Co.,Ltd. |