CN205498261U - PCB board vacuum lamination device - Google Patents
PCB board vacuum lamination device Download PDFInfo
- Publication number
- CN205498261U CN205498261U CN201620151844.0U CN201620151844U CN205498261U CN 205498261 U CN205498261 U CN 205498261U CN 201620151844 U CN201620151844 U CN 201620151844U CN 205498261 U CN205498261 U CN 205498261U
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- China
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- sliding panel
- frame
- dip mold
- screw thread
- pcb board
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Abstract
The utility model discloses a PCB board vacuum lamination device, which comprises a frame, the cylinder, draw pressure sensor, be no less than 2 guide bar, the dip mold, the sliding plate, go up the moulding -die, sealed frame, the sealing washer, a controller, in operation, place the raw materials in the constant head tank, controller control cylinder drives and draws pressure sensor to link firmly to such an extent that the sliding plate moves down under the direction limiting displacement of guide bar, and simultaneously, the heating pipe heats last moulding -die, along with the cylinder action, sealed frame inserts in the sealing washer, the space sealing that feasible sealed frame and dip mold are constituteed, afterwards, through quick -operation joint with this space vacuum production, go up the moulding -die and carry out the vacuum pressfitting with the dip mold cooperation to the raw materials, through drawing pressure sensor can directly set for pressfitting pressure. The device simple structure carries out automatic vacuum pressfitting to the raw materials, and the homoenergetic satisfies pressfitting flexible and rigidity PCB board, improvement product percent of pass, reduction in production cost.
Description
Technical field
This utility model relates to a kind of press fit device, particularly relates to a kind of pcb board vacuum lamination apparatus.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed substrate, is important
Electronic unit, be the supporter of electronic devices and components, be electronic devices and components electrical connection carrier, printed board develops into from monolayer
Two-sided, multilamellar and flexibility, and remain on respective development trend.Flexible board needs to carry out at evacuation when lamination
Reason, to prevent the generation of bubble, required pressure force is less, and rigid plate processes without evacuation, but needs bigger pressure force, causes
Rigid plate and flexible board need different laminater when producing, and improve the production cost of pcb board.In view of disadvantages described above, real
It is necessary to design a kind of pcb board vacuum lamination apparatus.
Utility model content
Technical problem to be solved in the utility model is: provides a kind of pcb board vacuum lamination apparatus, solves rigidity
Plate and flexible sheet layer pressure device cannot be compatible problem.
For solving above-mentioned technical problem, the technical solution of the utility model is: a kind of pcb board vacuum lamination apparatus, including
Frame, cylinder, pull pressure sensor, guide post no less than 2, dip mold, sliding panel, top die, sealing frame, sealing ring,
Controller, described cylinder is positioned at frame upper end, and described cylinder is connected with frame screw thread, and described pull pressure sensor is positioned at
Cylinder lower end, described pull pressure sensor is connected with cylinder screw thread, and described guide post is positioned at frame upper end, described guiding
Bar is connected with frame screw thread, and described guide post runs through dip mold, and described dip mold is connected with guide rod thread, described cunning
Dynamic plate is positioned at guide post upper end and is positioned at pull pressure sensor lower end, and described sliding panel slides with guide post and is connected and and tension and compression
Force transducer screw thread is connected, and described top die is positioned at sliding panel bottom centre, described top die and sliding panel screw thread phase
Even, described sealing frame is positioned at sliding panel bottom centre and is positioned at top die outer wall, described sealing frame and sliding panel one
Being connected and be movably connected with top die, described dip mold is additionally provided with sealing ring, and described sealing ring is connected with dip mold close-fitting,
Described controller is positioned at frame upper end, and described controller is connected with frame screw thread.
This utility model further improves as follows:
Further, described dip mold is additionally provided with locating slot, and described locating slot is positioned at dip mold upper end center, institute
The locating slot stated is not through dip mold.
Further, described sliding panel is additionally provided with and adds heat pipe, described add heat pipe be positioned at sliding panel bottom centre and
Being positioned at inside top die, the described heat pipe that adds is connected with sliding panel screw thread and is movably connected with top die.
Further, described sliding panel is additionally provided with anticollison block, and described anticollison block is positioned at bottom sliding panel and is positioned at leads
To bar outer wall, described anticollison block is connected with sliding panel screw thread and is connected with guide post gap.
Further, described sealing frame is additionally provided with snap joint, and described snap joint is positioned at sealing frame outer wall, described
Snap joint be connected with sealing frame screw thread.
Compared with prior art, this pcb board vacuum lamination apparatus, during work, raw material is positioned in locating slot, controller
Control cylinder and drive connected that sliding panel moves down under the guide and limit effect of guide post with pull pressure sensor, meanwhile, heating
Top die is heated by pipe, and along with cylinder action, sealing frame is inserted in sealing ring so that the sky that sealing frame forms with dip mold
Between seal, subsequently, by snap joint, this space is evacuated, top die coordinates with dip mold raw material is carried out Vacuum Pressure
Close, can directly set pressing pressure by pull pressure sensor.This apparatus structure is simple, and raw material is carried out automatic vacuum pressure
Close, all can meet the flexible and pressing of rigidity pcb board, improve conforming product rate, reduce production cost.
Accompanying drawing explanation
Fig. 1 illustrates this utility model front view
Frame 1 cylinder 2
Pull pressure sensor 3 guide post 4
Dip mold 5 sliding panel 6
Top die 7 sealing frame 8
Sealing ring 9 controller 10
Locating slot 501 adds heat pipe 601
Anticollison block 602 snap joint 801
Detailed description of the invention
As it is shown in figure 1, a kind of pcb board vacuum lamination apparatus, including frame 1, cylinder 2, pull pressure sensor 3, no less than 2
The guide post 4 of part, dip mold 5, sliding panel 6, top die 7, sealing frame 8, sealing ring 9, controller 10, described cylinder 2 is positioned at
Frame 1 upper end, described cylinder 2 is connected with frame 1 screw thread, and described pull pressure sensor 3 is positioned at cylinder 2 lower end, described
Pull pressure sensor 3 is connected with cylinder 2 screw thread, and described guide post 4 is positioned at frame 1 upper end, described guide post 4 and frame 1
Screw thread is connected, and described guide post 4 runs through dip mold 5, and described dip mold 5 is connected with guide post 4 screw thread, described sliding panel
6 are positioned at guide post 4 upper end and are positioned at pull pressure sensor 3 lower end, described sliding panel 6 and guide post 4 slide be connected and with draw
Pressure transducer 3 screw thread is connected, and described top die 5 is positioned at sliding panel 6 bottom centre, described top die 5 and sliding panel 6
Screw thread is connected, and described sealing frame 8 is positioned at sliding panel 6 bottom centre and is positioned at top die 7 outer wall, described sealing frame 8 with
Sliding panel 6 one is connected and is movably connected with top die 7, and described dip mold 5 is additionally provided with sealing ring 9, described sealing ring 9 with
Dip mold 5 close-fitting is connected, and described controller 10 is positioned at frame 1 upper end, and described controller 10 is connected with frame 1 screw thread, institute
The dip mold 5 stated is additionally provided with locating slot 501, and described locating slot 501 is positioned at dip mold 5 upper end center, described locating slot
501 not through dip mold 5, and described sliding panel 6 is additionally provided with and adds heat pipe 601, and the described heat pipe 601 that adds is positioned at bottom sliding panel 6
Center and be positioned at inside top die 7, the described heat pipe 601 that adds is connected with sliding panel 6 screw thread and is movably connected with top die 7,
Described sliding panel 6 is additionally provided with anticollison block 602, and described anticollison block 602 is positioned at bottom sliding panel 6 and is positioned at guide post 4 outer wall,
Described anticollison block 602 is connected with sliding panel 6 screw thread and is connected with guide post 4 gap, and described sealing frame 8 is additionally provided with and quickly connects
801, described snap joint 801 is positioned at sealing frame 8 outer wall, and described snap joint 801 is connected with sealing frame 8 screw thread, should
Pcb board vacuum lamination apparatus, during work, is positioned over raw material in locating slot 501, and controller 10 controls cylinder 2 and drives and tension and compression
Force transducer 3 is connected that sliding panel 6 moves down under the guide and limit effect of guide post 4, meanwhile, adds heat pipe 601 and enters top die 7
Row heating, along with cylinder 2 action, sealing frame 8 is inserted in sealing ring 9 so that the space sealing that sealing frame 8 forms with dip mold 5,
Subsequently, being evacuated in this space by snap joint 801, top die 7 coordinates with dip mold 5 raw material is carried out vacuum pressing-combining,
Pressing pressure can be directly set by pull pressure sensor 3.This apparatus structure is simple, and raw material is carried out automatic vacuum pressing,
All can meet the flexible and pressing of rigidity pcb board, improve conforming product rate, reduce production cost.
This utility model is not limited to above-mentioned specific embodiment, and those of ordinary skill in the art visualizes from above-mentioned
Sending out, without performing creative labour, all conversion made, within all falling within protection domain of the present utility model.
Claims (5)
1. a pcb board vacuum lamination apparatus, including frame, it is characterised in that also includes cylinder, pull pressure sensor, be no less than
The guide post of 2, dip mold, sliding panel, top die, sealing frame, sealing ring, controller, described cylinder is positioned at frame upper end,
Described cylinder is connected with frame screw thread, and described pull pressure sensor is positioned at cylinder lower end, described pull pressure sensor with
Cylinder screw thread is connected, and described guide post is positioned at frame upper end, and described guide post is connected with frame screw thread, described guide post
Running through dip mold, described dip mold is connected with guide rod thread, and described sliding panel is positioned at guide post upper end and is positioned at tension and compression
Force transducer lower end, described sliding panel slides with guide post and is connected and is connected with pull pressure sensor screw thread, described upper pressure
Mould is positioned at sliding panel bottom centre, and described top die is connected with sliding panel screw thread, and described sealing frame is positioned at the bottom of sliding panel
Center, portion and be positioned at top die outer wall, described sealing frame is connected with sliding panel one and is movably connected with top die, described
Dip mold be additionally provided with sealing ring, described sealing ring is connected with dip mold close-fitting, and described controller is positioned at frame upper end, institute
The controller stated is connected with frame screw thread.
2. pcb board vacuum lamination apparatus as claimed in claim 1, it is characterised in that described dip mold is additionally provided with locating slot,
Described locating slot is positioned at dip mold upper end center, and described locating slot is not through dip mold.
3. pcb board vacuum lamination apparatus as claimed in claim 2, it is characterised in that described sliding panel is additionally provided with and adds heat pipe,
The described heat pipe that adds is positioned at sliding panel bottom centre and is positioned at inside top die, and the described heat pipe that adds is connected with sliding panel screw thread
And be movably connected with top die.
4. pcb board vacuum lamination apparatus as claimed in claim 3, it is characterised in that described sliding panel is additionally provided with anticollison block,
Described anticollison block is positioned at bottom sliding panel and is positioned at guide post outer wall, described anticollison block be connected with sliding panel screw thread and with lead
It is connected to bar gap.
5. pcb board vacuum lamination apparatus as claimed in claim 4, it is characterised in that described sealing frame is additionally provided with and quickly connects
Head, described snap joint is positioned at sealing frame outer wall, and described snap joint is connected with sealing frame screw thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620151844.0U CN205498261U (en) | 2016-02-29 | 2016-02-29 | PCB board vacuum lamination device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620151844.0U CN205498261U (en) | 2016-02-29 | 2016-02-29 | PCB board vacuum lamination device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205498261U true CN205498261U (en) | 2016-08-24 |
Family
ID=56727183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620151844.0U Active CN205498261U (en) | 2016-02-29 | 2016-02-29 | PCB board vacuum lamination device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205498261U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108817255A (en) * | 2018-06-20 | 2018-11-16 | 江苏英杰电子器件有限公司 | Assembled mechanism for radiator assembly unit |
| CN113518518A (en) * | 2021-04-13 | 2021-10-19 | 重庆市和鑫达电子有限公司 | PCB board vacuum lamination device |
-
2016
- 2016-02-29 CN CN201620151844.0U patent/CN205498261U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108817255A (en) * | 2018-06-20 | 2018-11-16 | 江苏英杰电子器件有限公司 | Assembled mechanism for radiator assembly unit |
| CN108817255B (en) * | 2018-06-20 | 2024-04-05 | 江苏英杰电子器件有限公司 | Assembling mechanism for radiator assembling unit |
| CN113518518A (en) * | 2021-04-13 | 2021-10-19 | 重庆市和鑫达电子有限公司 | PCB board vacuum lamination device |
| CN113518518B (en) * | 2021-04-13 | 2022-06-28 | 重庆市和鑫达电子有限公司 | PCB board vacuum lamination device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |