CN209729904U - Heart rate sensor encapsulating structure and electronic equipment - Google Patents
Heart rate sensor encapsulating structure and electronic equipment Download PDFInfo
- Publication number
- CN209729904U CN209729904U CN201920787565.7U CN201920787565U CN209729904U CN 209729904 U CN209729904 U CN 209729904U CN 201920787565 U CN201920787565 U CN 201920787565U CN 209729904 U CN209729904 U CN 209729904U
- Authority
- CN
- China
- Prior art keywords
- heart rate
- rate sensor
- photodiode
- encapsulating structure
- accommodating space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
Abstract
The utility model discloses a kind of heart rate sensor encapsulating structure and electronic equipments, the heart rate sensor encapsulating structure includes substrate, is electrically connected with the substrate respectively by conducting wire set on the photodiode and signal processing chip of the substrate opposite sides, the photodiode and the signal processing chip；Surface of the substrate far from the photodiode is recessed to form the first accommodating space to close to the photodiode direction, and the signal processing chip is set in first accommodating space.Heart rate sensor encapsulating structure production process provided by the utility model is simple.
Description
Technical field
The utility model relates to electroacoustic switch technology fields more particularly to a kind of heart rate sensor encapsulating structure and electronics to set
It is standby.
Background technique
With the improvement of living standards, more and more common people pass through heart rate equipment detecting/monitoring heart rate, to realize body
The monitoring of situation.Existing electronic equipment over-borrowing helps photoelectric technology acquisition pulse wave to carry out monitor heart rate, and electronic equipment includes carrying out
The signal collected signal processing chip (AFE) of the photodiode (PD) and processing photodiode of photoinduction.Due to photoelectricity
One PN junction of diode master (PN junction) device, one end are to carry out the photoinduction end of photoinduction, and other end end is back
Gold solder disk, and signal processing chip is to be connected using wire bonding (Wire Bonding, WB).Make at photodiode and signal
Reason chip cannot directly carry out stacking setting, need through silicon pinboard (Si Interposer), viscous brilliant gummed paper (Film on
Wire, FOW) etc. realize that photodiode and signal processing chip are electrically connected, increase assembling difficulty and production cost.
Therefore, it is necessary to provide a kind of novel heart rate sensor encapsulating structure, to solve the above technical problems.
Utility model content
The main purpose of the utility model is to provide a kind of heart rate sensor encapsulating structure and electronic equipments, it is intended to solve
In existing electronic equipment, need to realize that photodiode and signal processing chip are electrically connected by silicon pinboard, viscous brilliant gummed paper etc.,
The technical issues of assembling big difficulty and high production cost.
To achieve the above object, heart rate sensor encapsulating structure provided by the utility model includes substrate, is set to the base
The photodiode and signal processing chip of plate opposite sides, the photodiode and the signal processing chip pass through respectively
Conducting wire is electrically connected with the substrate；Surface of the substrate far from the photodiode is to close to the photodiode direction
Recess forms the first accommodating space, and the signal processing chip is set in first accommodating space.
Preferably, the first insulating layer is filled in first accommodating space, first insulating layer encapsulates at the signal
Reason chip and the conducting wire being connect with the signal processing chip.
Preferably, the photodiode includes photoinduction end and electric connecting terminal, and the photoinduction end passes through the conducting wire
It is electrically connected with the substrate, the electric connecting terminal is directly electrically connected with the substrate.
Preferably, the thickness of first insulating layer is less than or equal to the depth of first accommodating space.
Preferably, the heart rate sensor encapsulating structure further includes second insulating layer, described in the second insulating layer package
Photodiode and the conducting wire being connect with the photodiode, surface of the second insulating layer far from the photodiode
It is recessed to form the second accommodating space to close to the photodiode direction, it is empty that the photoinduction end is exposed to second receiving
Between and towards the opening of second accommodating space.
Preferably, the heart rate sensor encapsulating structure further includes the light transmitting sheet in second accommodating space, institute
Light transmitting sheet is stated to be covered on the photoinduction end.
Preferably, along the entering light direction of second accommodating space, the cross-sectional area of second accommodating space gradually subtracts
It is small.
Preferably, the substrate includes ontology, is set to the intrinsic conducting wire and the multiple and conducting wire
The conductive site of electrical connection, the conduction site expose to the ontology, and the conduction site is used for and the conducting wire and outside
Circuit electrical connection.
Preferably, the conductive site is distributed around first accommodating space.
The utility model additionally provides a kind of electronic equipment, including shell and heart rate sensor encapsulating structure above-mentioned；Institute
State that loophole is offered on shell is corresponding with the photodiode.
In the technical solution of the utility model, by opening up the first accommodating space on substrate, so that at signal
Reason chip is mountable to be electrically connected in the first accommodating space and with substrate, by setting up signal processing chip and photodiode separately
With substrate two sides, so that signal processing chip and photodiode can be electrically connected with substrate respectively by way of stacking, and save
It goes using the conduct pieces such as silicon pinboard, viscous brilliant gummed paper, save the cost, while simplifying preparation section.It, will in compared to the prior art
In on substrate, the utility model provides heart rate sensor encapsulating structure for photodiode and the direct tiled arrangements of signal processing chip
Planar dimension is smaller, convenient for the Miniaturization Design of product.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is heart rate sensor encapsulating structure the schematic diagram of the section structure in the prior art.
Embodiment drawing reference numeral explanation:
| Label | Title | Label | Title |
| 100 | Heart rate sensor encapsulating structure | 1 | Substrate |
| 11 | Ontology | 12 | First accommodating space |
| 13 | Conducting wire | 15 | Conductive site |
| 3 | Photodiode | 31 | Photoinduction end |
| 33 | Electric connecting terminal | 5 | Signal processing chip |
| 7 | Conducting wire | 8 | First insulating layer |
| 9 | Second insulating layer | 92 | Second accommodating space |
The utility model aim is realized, the embodiments will be further described with reference to the accompanying drawings for functional characteristics and advantage.
Specific embodiment
Below in conjunction with the attached drawing in the present embodiment, the technical solution in the present embodiment is clearly and completely described,
Obviously, described embodiment is only a part of the embodiment of the utility model, instead of all the embodiments.Based on this reality
It is obtained by those of ordinary skill in the art without making creative efforts every other with the embodiment in novel
Embodiment is fallen within the protection scope of the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used for solving in the present embodiment
It releases in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, if this is specific
When posture changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and cannot manage
Solution is its relative importance of indication or suggestion or the quantity for implicitly indicating indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include at least one of the features.It is " more in the description of the present invention,
It is a " it is meant that at least two, such as two, three etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " connection ", " fixation " etc. should do broad sense reason
Solution, for example, " fixation " may be a fixed connection, may be a detachable connection, or integral；It can be mechanical connection, it can also
To be electrical connection；It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary
Or the interaction relationship of two elements, unless otherwise restricted clearly.It for the ordinary skill in the art, can be with
The concrete meaning of above-mentioned term in the present invention is understood as the case may be.
It in addition, the technical solution between each embodiment of the utility model can be combined with each other, but must be with ability
Based on domain those of ordinary skill can be realized, it will be understood that when the combination of technical solution appearance is conflicting or cannot achieve
The combination of this technical solution is not present, also not within the protection scope of the requires of the utility model.It should be appreciated that this place is retouched
The specific embodiment stated is only used to explain the utility model, is not used to limit the utility model.
As shown in Figure 1, heart rate sensor encapsulating structure 100 provided by the utility model includes substrate 1, is set to the substrate
The photodiode 3 and signal processing chip 5 of 1 opposite sides, the photodiode 3 and the signal processing chip 5 are distinguished
It is electrically connected by conducting wire 7 with the substrate 1；Surface of the substrate 1 far from the photodiode 3 is to close to the photoelectricity two
3 direction of pole pipe is recessed to form the first accommodating space 12, and the signal processing chip 5 is set in first accommodating space 12.
Specifically, photodiode 3 includes photoinduction end 31 and electric connecting terminal 33, and photoinduction end 31 detects that ambient light is believed
Number, the optical signal received is converted into electric signal by photodiode 3, is transferred to by electric connecting terminal 33, conducting wire 7 and substrate 1
The electric signal received is handled and is transferred to external display device or signal by signal processing chip 5, signal processing chip 5
The electronic components such as sending device, the secondary operation such as to be shown, analyzed using the electric signal.The utility model by
The first accommodating space 12 is opened up on substrate 1, so that signal processing chip 5 is mountable in the first accommodating space 12 and and base
Plate 1 be electrically connected, by by signal processing chip 5 and photodiode 3 set up separately with 1 two sides of substrate so that 5 He of signal processing chip
Photodiode 3 can be electrically connected with substrate 1 respectively by way of stacking, and eliminated the need for silicon pinboard, viscous brilliant gummed paper etc. and led
Electric part, save the cost, while simplifying preparation section.In compared to the prior art, by photodiode 3 and signal processing chip 5
For direct tiled arrangements on substrate 1, the utility model offer 100 planar dimension of heart rate sensor encapsulating structure is smaller, convenient for producing
The Miniaturization Design of product.
Further, the first insulating layer 8 is filled in first accommodating space 12, the first insulating layer 8 encapsulates the signal
Processing chip 5 and the conducting wire 7 being connect with the signal processing chip 5.By filling first in first accommodating space 12 absolutely
The conducting wire 7 that edge layer 8 encapsulates the signal processing chip 5 and connect with the signal processing chip 5.To can avoid sensing heart rate
Conducting wire 7 is collapsed or breaks during device encapsulating structure 100 is reprocessed or in use process, influences product quality and service life.
Still further, the thickness of first insulating layer 8 is less than or equal to the depth of first accommodating space 12.
The measurement direction of the thickness of first insulating layer 8, the measurement direction of the depth of the first accommodating space 12 are with the thickness of parallel substrate 1
Direction is reference system.The thickness that the first insulating layer 8 is arranged is less than or equal to the depth of first accommodating space 12, is at signal
Reason chip 5 and the conducting wire 7 being electrically connected with signal processing chip 5 prop up space, are conducive to be further ensured that conducting wire 7 and signal processing
The stability that chip 5 connects.
In one embodiment, the photodiode 3 includes photoinduction end 31 and electric connecting terminal 33, the photoinduction end 31
It is connect by the conducting wire 7 with the substrate 1, the electric connecting terminal 33 is directly electrically connected with the substrate 1.In the present embodiment
In, electric connecting terminal 33 is back gold solder disk.It is directly electrically connected with the substrate 1 by the electric connecting terminal 33, to eliminate the need for
The conduct pieces such as silicon pinboard, viscous brilliant gummed paper, save the cost.
In one embodiment, the heart rate sensor encapsulating structure 100 further includes second insulating layer 9, second insulation
The conducting wire 79 package of layer the photodiode 3 and connect with the photodiode 3, the second insulating layer 9 is far from described
The surface of photodiode 3 is recessed to form the second accommodating space 92 to close to 3 direction of photodiode, the photoinduction end
31 are exposed to second accommodating space 92 and towards the opening of second accommodating space 92.Second insulating layer 9 specifically can be with
Material identical as 8 use of the first insulating layer or different materials are made.In the present embodiment, first insulating layer 8 and described
Two insulating layers 9 are gluing process machine-shaping structure.Second insulating layer 9 wrap up the photodiode 3 and with the photoelectricity two
Pole pipe 3 connect conducting wire 7, thus can avoid heart rate sensor encapsulating structure 100 reprocess during or use process in conducting wire 7
It is collapsed or breaks, influence product quality and service life.Second accommodating space is exposed to by the way that the photoinduction end 31 is arranged
92 and towards the opening of second accommodating space 92, to guarantee that photoinduction end 31 can effectively receive external optical signals.
Further, the heart rate sensor encapsulating structure 100 further includes saturating in second accommodating space 92
Mating plate, the light transmitting sheet cover the photoinduction end 31.Specifically, light transmitting sheet is made of translucent material, specifically can be glass
Light transmitting sheet, plastic light-transmission piece etc., those skilled in the art can according to need the light transmitting sheet of selection suitable material.
Still further, along the entering light direction of second accommodating space 92, the cross section of second accommodating space 92
Product is gradually reduced.That is the second accommodating space 92 be it is horn-like, light-inletting quantity and entering light angle can be increased.
In one embodiment, the substrate 1 includes ontology 11, the conducting wire 13 in the ontology 11 and multiple
The conductive site 15 being electrically connected with the conducting wire 13, the conduction site 15 expose to the ontology 11, the conductive bit
Point 15 with the conducting wire 7 and external circuit for being electrically connected.Conducting wire 7 includes that the diode connecting with the photodiode 3 is led
Line 7 and the chip conducting wire 7 connecting with signal processing chip 5 are led in the present embodiment with what the diode wire 7 was connect
Potential point 15 exposes to the substrate 1 close to the outer surface of the photodiode 3, the conduction connecting with the chip conducting wire 7
Site 15 exposes to the bottom surface of second accommodating space 92, and the conductive site 15 for being electrically connected with external circuit exposes to institute
State outer surface of the substrate 1 far from the photodiode 3.
In another embodiment, the conductive site 15 is distributed around first accommodating space 12.By surrounding first
Accommodating space 12 is arranged, to can avoid corresponding 1 thinner thickness of substrate of the first accommodating space 12, difficulty of processing is big, after processing
The technical issues of structural instability.
The utility model additionally provides a kind of electronic equipment, including shell (not shown) and heart rate sensor above-mentioned encapsulation
It is corresponding with the photodiode 5 to offer loophole on the shell for structure 100.External optical signal is penetrated by loophole
On photodiode 5.Since the electronic equipment includes the entire infrastructure of aforementioned heart rate sensor encapsulating structure 100, correspondingly,
All beneficial effects with aforementioned heart rate sensor encapsulating structure, details are not described herein.
The above is only the preferred embodiments of the utility model, and therefore it does not limit the scope of the patent of the utility model, all
Equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, is applied directly or indirectly in
Other related technical areas are also included in the patent protection scope of the utility model.
Claims (10)
1. a kind of heart rate sensor encapsulating structure, which is characterized in that including substrate, set on the photoelectricity two of the substrate opposite sides
Pole pipe and signal processing chip, the photodiode and the signal processing chip pass through conducting wire respectively and are electrically connected with the substrate
It connects；Surface of the substrate far from the photodiode to form the first receiving sky to being recessed close to the photodiode direction
Between, the signal processing chip is set in first accommodating space.
2. heart rate sensor encapsulating structure according to claim 1, which is characterized in that filling in first accommodating space
First insulating layer, the conducting wire that first insulating layer encapsulates the signal processing chip and connect with the signal processing chip.
3. heart rate sensor encapsulating structure according to claim 2, which is characterized in that the thickness of first insulating layer is small
In or equal to first accommodating space depth.
4. heart rate sensor encapsulating structure according to claim 1, which is characterized in that the photodiode includes light sensation
It should hold and electric connecting terminal, the photoinduction end are electrically connected with the substrate by the conducting wire, the electric connecting terminal is directly and institute
State substrate electrical connection.
5. heart rate sensor encapsulating structure according to claim 4, which is characterized in that the heart rate sensor encapsulating structure
It further include second insulating layer, the second insulating layer is wrapped up the photodiode and led with what the photodiode was connect
Line, surface of the second insulating layer far from the photodiode are recessed to form second to close to the photodiode direction
Accommodating space, the photoinduction end are exposed to second accommodating space and towards the openings of second accommodating space.
6. heart rate sensor encapsulating structure according to claim 5, which is characterized in that the heart rate sensor encapsulating structure
It further include the light transmitting sheet in second accommodating space, the light transmitting sheet is covered on the photoinduction end.
7. heart rate sensor encapsulating structure according to claim 6, which is characterized in that along second accommodating space into
The cross-sectional area of light direction, second accommodating space is gradually reduced.
8. heart rate sensor encapsulating structure according to any one of claim 1 to 7, which is characterized in that the substrate packet
Include ontology, set on the intrinsic conducting wire and multiple conductive sites being electrically connected with the conducting wire, the conduction
Site exposes to the ontology, and the conduction site with the conducting wire and external circuit for being electrically connected.
9. heart rate sensor encapsulating structure according to claim 8, which is characterized in that the conduction site is around described the
The distribution of one accommodating space.
10. a kind of electronic equipment, which is characterized in that including heart rate sensor described in shell and any one of claims 1 to 9
Encapsulating structure；It is corresponding with the photodiode that loophole is offered on the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920787565.7U CN209729904U (en) | 2019-05-28 | 2019-05-28 | Heart rate sensor encapsulating structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920787565.7U CN209729904U (en) | 2019-05-28 | 2019-05-28 | Heart rate sensor encapsulating structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209729904U true CN209729904U (en) | 2019-12-03 |
Family
ID=68674908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920787565.7U Active CN209729904U (en) | 2019-05-28 | 2019-05-28 | Heart rate sensor encapsulating structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209729904U (en) |
-
2019
- 2019-05-28 CN CN201920787565.7U patent/CN209729904U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI284407B (en) | Package device with electromagnetic interference shield | |
| US7348551B2 (en) | Remote-control light receiving unit and electronic apparatus using the same | |
| US7138695B2 (en) | Image sensor module and method for fabricating the same | |
| TWI246778B (en) | Light-receiving module | |
| CN209729904U (en) | Heart rate sensor encapsulating structure and electronic equipment | |
| JP2004088076A (en) | Built-in camera module | |
| CN213847009U (en) | Intelligent microphone packaging structure and electronic equipment | |
| CN102903722A (en) | Thin-type active detection module and manufacturing method thereof | |
| TWI282633B (en) | Optical electronics integrated semiconductor device and method for fabricating the same | |
| CN211205630U (en) | Waterproof barometer | |
| CN210123288U (en) | Multifunctional integrated sensor | |
| CN113035826A (en) | Packaging module, manufacturing method of packaging module and electronic equipment | |
| JP3502061B2 (en) | Image sensor stack package structure | |
| CN209161474U (en) | Combination sensor | |
| US7638865B2 (en) | Sensor package | |
| US7476036B2 (en) | Optocoupler for converting optical signals into electrical signals and vice versa | |
| JP2004200631A (en) | Optical sensor package structure | |
| CN101427366A (en) | A microwave chip supporting structure | |
| CN213694155U (en) | Intelligent microphone packaging structure and electronic equipment | |
| JP3645833B2 (en) | Image sensor stack package structure | |
| CN111666783A (en) | Substrate structure, sensor module, electronic device and mounting method | |
| CN216648300U (en) | Integrated photoelectric detection sensor and electronic equipment | |
| CN209626212U (en) | A kind of WLP device | |
| CN209675269U (en) | A kind of encapsulation chip, chip module and terminal | |
| CN209472762U (en) | Matrix structure, sensor module and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |