CN209659710U

CN209659710U - A kind of encapsulation pattern and printed circuit board

Info

Publication number: CN209659710U
Application number: CN201822222873.3U
Authority: CN
Inventors: 赵一鸣
Original assignee: Zhejiang Dahua Technology Co Ltd
Current assignee: Zhejiang Dahua Technology Co Ltd
Priority date: 2018-12-27
Filing date: 2018-12-27
Publication date: 2019-11-19
Anticipated expiration: 2028-12-27

Abstract

The utility model discloses a kind of encapsulation pattern and printed circuit board, the encapsulation pattern includes: the first body region, the second body region and the pin region for being distributed in the first body region periphery；Second body region includes the pin region；First body region and pin region form the first encapsulation pattern, and the first encapsulation pattern is for encapsulating the first device to be packaged；Second body region and pin region form the second encapsulation pattern, and the second encapsulation pattern is for encapsulating the second device to be packaged.Since in utility model embodiment, the encapsulation pattern on printed circuit board includes the first encapsulation pattern for encapsulating the first device to be packaged, and the second encapsulation pattern for encapsulating the second device to be packaged.Different components can be compatible with.Also, do not include the tin cream for adhesion heat dissipation bonding pad, thus can be to avoid the device for being used without heat dissipation bonding pad when, caused tin cream rises device herein, and there are the risks of failure welding.

Description

A kind of encapsulation pattern and printed circuit board

Technical field

The utility model relates to printed circuit board encapsulation technology field more particularly to a kind of encapsulation patterns and printed circuit Plate.

Background technique

Printed circuit board, also known as printed circuit board (Printed circuit board, PCB), are electronic component electric appliance The supplier of connection.The surface printing of PCB has the encapsulation pattern of electronic component to be packaged, can be with according to the encapsulation pattern Simply and accurately electronic component to be packaged is encapsulated on PCB.

Same component has many different suppliers in most of electronic products, and there are the identical one kind of function The PCB of component encapsulates pattern different problems.To solve the above-mentioned problems, different encapsulation patterns is carried out in the prior art Superposition, in order to guarantee compatibility, includes being used in encapsulation pattern in the prior art since certain components include heat dissipation bonding pad The tin cream of adhesion heat dissipation bonding pad.When using the component for needing heat dissipation bonding pad, heat dissipation bonding pad is sticked on tin cream.Also band in this way Carry out problem newly, if the device with intermediate radiator pad does not use, and when using another device without heat dissipation bonding pad, this Sample will lead to the presence due to intermediate tin cream, device herein can be risen, there are the risks of failure welding.

Utility model content

The utility model embodiment provides a kind of encapsulation pattern and printed circuit board, to solve in the prior art due to The presence of tin cream can rise device herein, there are problems that the risk of failure welding.

The utility model embodiment provides a kind of encapsulation pattern, and the encapsulation pattern includes: the first body region, and second Body region and the pin region for being distributed in the first body region periphery；Second body region includes the pin area Domain；

First body region and pin region form the first encapsulation pattern, and the first encapsulation pattern is for encapsulating the One device to be packaged；

Second body region and pin region form the second encapsulation pattern, and the second encapsulation pattern is for encapsulating the Two devices to be packaged.

Further, first body region includes silk-screen.

Further, the material of the silk-screen includes white oil.

Further, be provided with the first via hole on the pin region, the pin region by first via hole into Row wiring.

Further, the second via hole is provided in first body region, second via hole is for radiating.

On the other hand, the utility model embodiment provides a kind of printed circuit board, is printed on the printed circuit board Above-mentioned encapsulation pattern.

The utility model embodiment provides a kind of encapsulation pattern and printed circuit board, and the encapsulation pattern includes: first Body region, the second body region and the pin region for being distributed in the first body region periphery；Second body region Include the pin region；First body region and pin region form the first encapsulation pattern, the first encapsulation pattern For encapsulating the first device to be packaged；Second body region and pin region form the second encapsulation pattern, second envelope Pattern is filled for encapsulating the second device to be packaged.

Since in utility model embodiment, the encapsulation pattern on printed circuit board includes for encapsulating the first device to be packaged First encapsulation pattern of part, and the second encapsulation pattern for encapsulating the second device to be packaged.Different components can be compatible with. Also, since heat dissipation bonding pad only plays heat dissipation effect, if heat dissipation bonding pad adhesion is placed on a printed circuit, nor affect on Function, therefore encapsulation pattern provided by the embodiment of the utility model does not include tin cream for adhesion heat dissipation bonding pad, therefore can be with When avoiding the device for being used without heat dissipation bonding pad, caused tin cream rises device herein, and there are the risks of failure welding.

Detailed description of the invention

It, below will be to required in embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model Attached drawing to be used is briefly introduced, it should be apparent that, the accompanying drawings in the following description is only some implementations of the utility model Example, for those of ordinary skill in the art, without creative efforts, can also be according to these attached drawings Obtain other attached drawings.

Fig. 1 is a kind of encapsulation pattern schematic diagram that the utility model embodiment 1 provides；

Fig. 2 is the first encapsulation pattern schematic diagram that the utility model embodiment 1 provides；

Fig. 3 is the second encapsulation pattern schematic diagram that the utility model embodiment 1 provides；

Fig. 4 is the encapsulation pattern schematic diagram that the utility model embodiment 2 provides；

Fig. 5 is the encapsulation pattern schematic diagram that the utility model embodiment 3 provides；

Fig. 6 is the encapsulation pattern schematic diagram that the utility model embodiment 4 provides.

Specific embodiment

The utility model is described in further detail below in conjunction with attached drawing, it is clear that described embodiment is only It is the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, this field is general Logical technical staff all other embodiment obtained without making creative work belongs to the utility model guarantor The range of shield.

Embodiment 1:

Fig. 1 is a kind of encapsulation pattern schematic diagram provided by the embodiment of the utility model, and the encapsulation pattern includes: first main Body region 11, the second body region 12 and the pin region 13 for being distributed in 11 periphery of the first body region；Described second is main Body region 12 includes the pin region 13；

First body region 11 and pin region 13 form the first encapsulation pattern, and the first encapsulation pattern is for sealing Fill the first device to be packaged；

Second body region 12 and pin region 13 form the second encapsulation pattern, and the second encapsulation pattern is for sealing Fill the second device to be packaged.

In the utility model embodiment, the first device to be packaged and the second device to be packaged are respectively function identical one In class device, the device of difference encapsulation pattern.First body region 11 and pin region 13 form the first encapsulation pattern, for sealing The first device to be packaged is filled, Fig. 2 is the first encapsulation pattern schematic diagram.Second body region 12 and pin region 13 form the second envelope Pattern is filled, for encapsulating the second device to be packaged, Fig. 3 is the second encapsulation pattern schematic diagram.As shown in Figure 1, Figure 2 and Fig. 3 is it is found that Fig. 1 For the superposition of Fig. 2 and Fig. 3.

It should be noted that the first device to be packaged and the second device to be packaged in the utility model embodiment are not Two devices to be packaged, but represent the two classes device to be packaged of device main body and two kinds of device pin different relativeness.In In the utility model embodiment, device pin is located at the periphery of device main body in the first device to be packaged；Second device to be packaged Middle device main body region includes device pin.

For above-mentioned two classes device to be packaged, as long as number of pin is identical, corresponding pin in two classes device to be packaged The distance between difference be less than preset threshold value, encapsulation pattern provided by the embodiment of the utility model can be compatible with.

Corresponding two classes device to be packaged all includes 8 pins referring to figs. 2 and 3, and in Fig. 2 pin 1 and pin 8 it Between distance and Fig. 3 in the distance between pin 1 and pin 8 difference be less than preset threshold value；In Fig. 2 between pin 1 and pin 2 Distance is less than preset threshold value etc., therefore Fig. 2 and shown in Fig. 3 first with the distance between pin 1 and pin 2 difference in Fig. 3 Encapsulation pattern and the second encapsulation pattern can be superimposed to obtain encapsulation pattern shown in FIG. 1.

Embodiment 2:

Heat dissipation bonding pad in device including heat dissipation bonding pad is directly contacted with the cabling on printed circuit board, and there are short-circuit wind Danger, in order to avoid the above problem, on the basis of the above embodiments, Fig. 4 is encapsulation pattern provided by the embodiment of the utility model Schematic diagram, first body region 11 include silk-screen 111.

Silk-screen 111 is arranged in the first body region 11, thus by walking on intermediate heat dissipation bonding pad and printed circuit board Line isolation, to avoid short-circuit risks.

The material of the silk-screen includes white oil.A thin layer of white oil is brushed in the first body region 11, has both been avoided that short Transportation work style danger, will not rise device, therefore, will not there is the risk of failure welding.

Embodiment 3:

In order to realize the wiring in pin region 13, on the basis of the various embodiments described above, Fig. 5 is the utility model embodiment The encapsulation pattern schematic diagram of offer, the first via hole 131 is provided on the pin region 13, and the pin region 13 passes through described First via hole 131 is routed.

As shown in figure 5, being provided with the first via hole 131 on pin region 13, the quantity of the first via hole 131 can be according to wait seal The number of pin of dress device is arranged, such as the number of pin of device to be packaged is 8, then can set on pin region 13 8 the first via holes 131 are set, also, the position of each first via hole 131 is corresponding with the pin positions of device to be packaged.

Wiring for pin region 13 can use the outwardly extending wire laying mode of lead, but lead in this way is longer, And wiring is relative complex, in the utility model embodiment, the first via hole 131 is provided on pin region 13, lead can be worn The first via hole 131 is crossed, to complete to be routed, such mode can reduce the complexity of wiring.

Embodiment 4:

In order to increase heat dissipation effect, on the basis of the various embodiments described above, Fig. 6 is envelope provided by the embodiment of the utility model Pattern schematic diagram is filled, the second via hole 112 is provided in first body region 11, second via hole 112 is for radiating.

In the utility model embodiment, the quantity of the second via hole 112 is not defined, is not influencing printed circuit board Under the premise of normal use, the quantity of the second via hole 112 is more, and heat dissipation effect is better.

Another embodiment of the utility model provides a kind of printed circuit board, and any institute is printed on the printed circuit board The encapsulation pattern stated.In the encapsulation pattern, including the first encapsulation pattern for encapsulating the first device to be packaged, and it is used for Encapsulate the second encapsulation pattern of the second device to be packaged.Different components can be compatible with.Also, since heat dissipation bonding pad only plays Heat dissipation effect nor affects on function, therefore the utility model is implemented if heat dissipation bonding pad adhesion is placed on a printed circuit The encapsulation pattern that example provides does not include the tin cream for adhesion heat dissipation bonding pad, therefore can be to avoid the device for being used without heat dissipation bonding pad When part, caused tin cream rises device herein, and there are the risks of failure welding.

Although the preferred embodiment of the utility model has been described, once a person skilled in the art knows basic Creative concept, then additional changes and modifications may be made to these embodiments.It is wrapped so the following claims are intended to be interpreted as It includes preferred embodiment and falls into all change and modification of the scope of the utility model.

Obviously, it is practical without departing from this can to carry out various modification and variations to the utility model by those skilled in the art Novel spirit and scope.If in this way, these modifications and variations of the present invention belong to the utility model claims and Within the scope of its equivalent technologies, then the utility model is also intended to include these modifications and variations.

Claims

1. a kind of encapsulation pattern, which is characterized in that the encapsulation pattern includes: the first body region, the second body region and point Pin region of the cloth in the first body region periphery；Second body region includes the pin region；

First body region and pin region form the first encapsulation pattern, the first encapsulation pattern for encapsulate first to Packaging；

Second body region and pin region form the second encapsulation pattern, the second encapsulation pattern for encapsulate second to Packaging.

2. encapsulation pattern as described in claim 1, which is characterized in that first body region includes silk-screen.

3. encapsulation pattern as claimed in claim 2, which is characterized in that the material of the silk-screen includes white oil.

4. encapsulation pattern as described in claim 1, which is characterized in that the first via hole is provided on the pin region, it is described Pin region is routed by first via hole.

5. encapsulation pattern as described in claim 1, which is characterized in that it is provided with the second via hole in first body region, Second via hole is for radiating.

6. a kind of printed circuit board, which is characterized in that it is described in any item to be printed with claim 1-5 on the printed circuit board Encapsulate pattern.