CN109413846A - Highly integrated electric-controlled plate and electric appliance - Google Patents
Highly integrated electric-controlled plate and electric appliance Download PDFInfo
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- CN109413846A CN109413846A CN201811645539.7A CN201811645539A CN109413846A CN 109413846 A CN109413846 A CN 109413846A CN 201811645539 A CN201811645539 A CN 201811645539A CN 109413846 A CN109413846 A CN 109413846A
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- highly integrated
- ipm
- electric
- controlled plate
- wiring board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses highly integrated electric-controlled plate and electric appliances.The highly integrated electric-controlled plate includes: printed wiring board；Forceful electric power element, the front of printed wiring board is arranged in forceful electric power element, forceful electric power element includes highly integrated IPM, highly integrated IPM is integrated with blower IPM and compressor IPM, highly integrated IPM includes the substrate of half encapsulation, it is fixed on a printed-wiring board by direct insertion pin with the substrate of the circuit structure that substrate front side is arranged in, half encapsulation；And the back side of printed wiring board is arranged in light current element, light current element, light current element includes MCU, PFC amplifier circuit, IPM amplifier circuit and PFC current protecting circuit, and light current element is electrical connected with highly integrated IPM.The highly integrated electric-controlled plate at least one of has the following advantages that as a result: having effective area, is conducive to automatically controlled miniaturization, and cost is relatively low；The isolation of strong and weak electric device may be implemented, strong and weak electrical interference can be effectively reduced；With good heat dissipation performance.
Description
Technical field
The present invention relates to electrical device manufacturing fields, and in particular, to highly integrated electric-controlled plate and electric appliance.
Background technique
Air conditioner electric control is mainly by MCU (micro-control unit), blower IPM (intelligent power module), compressor IPM, PFC (function
Rate factor correcting) circuit and corresponding PFC current protecting circuit, PFC sampling and IPM amplifier circuit composition.Above-mentioned electricity
Line structure, which is mounted in pcb board (printed wiring board), constitutes electric-controlled plate, electric-controlled plate upper fan IPM, compressor IPM, pfc circuit with
And the operation of corresponding PFC current protecting circuit, PFC sampling and IPM amplifier circuit, it is controlled and is realized by MCU.Wherein,
Blower IPM and compressor IPM respectively by 6 IGBT (insulated gate bipolar transistor) switching devices, (high pressure determines phase to 6 FRD
Device) and corresponding driving IC composition, pfc circuit by rectifier bridge, inductance, capacitor and PFC switch sections (driving IC, IGBT, FRD,
Diode) it forms, there is corresponding sampling resistor respectively in blower IPM, compressor IPM and pfc circuit.
However, current electric-controlled plate and electric appliance still has much room for improvement.
Summary of the invention
The application is to be made based on inventor to the discovery of following facts and problem and understanding:
Current electric-controlled plate limits the process of automatically controlled miniaturization, to influence the miniaturization of electric appliance.Inventors have found that this
Mainly since the area of current electric-controlled plate is larger caused.Specifically, on the one hand, existing automatically controlled design is by all electricity
Line structure establishment is mounted in single layer printed wiring board, and in other words, circuit structure is mounted on the same table of printed wiring board
On face, the circuit structure for constituting electric-controlled plate is more, and the area of occupancy is larger, causes the area of electric-controlled plate larger.On the other hand, on
Stating circuit structure includes forceful electric power element and light current element, in order to reduce strong and weak electrical interference, usually by forceful electric power element and light current member
Part isolation setting, and the isolation of strong and weak electric device needs to increase the area of electric-controlled plate to realize, further increases electric-controlled plate
Area.In another aspect, the elements quantity of heat production such as blower IPM, compressor IPM in circuit structure is higher, the design of electric-controlled plate is also needed
Consider heat dissipation factor, and then further increases the area of electric-controlled plate.Automatically controlled plate suqare is larger, seriously limits automatically controlled small-sized
The process of change affects the development of electric appliance miniaturization.
The present invention is directed to alleviate or solve the problems, such as above-mentioned at least one of refer at least to some extent.
In one aspect of the invention, the invention proposes a kind of highly integrated electric-controlled plates.The highly integrated electric-controlled plate includes: print
Brush wiring board；The front of the printed wiring board is arranged in forceful electric power element, the forceful electric power element, and the forceful electric power element includes high collection
At IPM, it includes the substrate of half encapsulation that the highly integrated IPM, which is integrated with blower IPM and compressor IPM, the highly integrated IPM,
The printing is fixed on by direct insertion pin with the substrate of the circuit structure that the substrate front side is arranged in, half encapsulation
On wiring board；And the back side of the printed wiring board is arranged in light current element, the light current element, the light current element includes
MCU, PFC amplifier circuit, IPM amplifier circuit and PFC current protecting circuit, and the light current element and the height
Integrated IPM is electrical connected.The highly integrated electric-controlled plate at least one of has the following advantages that as a result: having effective area, favorably
In automatically controlled miniaturization, and cost is relatively low；The isolation of strong and weak electric device may be implemented, strong and weak electrical interference can be effectively reduced；Tool
There is good heat dissipation performance.
According to an embodiment of the invention, the encapsulated layer of half encapsulation wraps up the circuit structure and the substrate
Front, and the back side of the exposure substrate.Thus, it is possible to the heat-sinking capability of the highly integrated IPM be improved, so that this is highly integrated
Electric-controlled plate has good heat dissipation performance.
According to an embodiment of the invention, the highly integrated IPM is further integrated with pfc circuit, sampling resistor and temperature-sensitive
Resistance.The highly integrated IPM integrated level with higher as a result, reduces the area of highly integrated electric-controlled plate, is conducive to automatically controlled small
Type.
According to an embodiment of the invention, the highly integrated electric-controlled plate further comprises: PFC capacitor and PFC inductance, it is described
The front of the printed wiring board is arranged in PFC capacitor and the PFC inductance.Thus, it is possible to effectively utilize printed wire
The area of plate is conducive to the miniaturization of the highly integrated electric-controlled plate.
According to an embodiment of the invention, orthographic projection of the MCU in the printed wiring board, is located at described highly integrated
IPM is in the range of orthographic projection in the printed wiring board.As a result, the signal transmission distance between MCU and highly integrated IPM compared with
It is short, it is possible to prevente effectively from interference seals in signal path.
According to an embodiment of the invention, the printed wiring board is provided with via hole, the light current element with it is described highly integrated
IPM realizes electrical connection by the via hole.Thus, it is possible to realize being electrically connected for light current element and highly integrated IPM, and make above-mentioned
Signal transmission distance between element is shorter, and interference is effectively avoided to seal in signal path.
According to an embodiment of the invention, the printed wiring board has multiple heat release holes, the heat release hole is located at the height
The integrated corresponding region IPM, and be arranged around the MCU.Heat release hole is conducive to the heat diffusion for generating highly integrated IPM outside
Portion, so as to further increase the heat dissipation performance of the highly integrated electric-controlled plate.
According to an embodiment of the invention, being provided with layers of copper in the heat release hole.The capacity of heat transmission of copper is stronger, thus, it is possible to
Further increase the heat dissipation performance of the highly integrated electric-controlled plate.
According to an embodiment of the invention, being provided with tin metal in the layers of copper.Thus, it is possible to which it is highly integrated to further increase this
The heat dissipation performance of electric-controlled plate.
In another aspect of this invention, the invention proposes a kind of electric appliances.According to an embodiment of the invention, the electric appliance includes
Mentioned-above highly integrated electric-controlled plate, the electric appliance has whole features of mentioned-above highly integrated electric-controlled plate and excellent as a result,
Point, details are not described herein.Generally speaking, the small volume of the electric appliance meets the demand for development of electric appliance miniaturization.
Detailed description of the invention
Fig. 1 shows the structural schematic diagram of highly integrated electric-controlled plate according to an embodiment of the invention；
Fig. 2 shows the top view of highly integrated IPM according to an embodiment of the invention；
Fig. 3 shows the structural schematic diagram of highly integrated IPM according to an embodiment of the invention；
Fig. 4 shows the top view of electric-controlled plate in the prior art；
Fig. 5 shows the structural schematic diagram of highly integrated electric-controlled plate according to an embodiment of the invention；
Fig. 6 shows the top view of highly integrated electric-controlled plate according to an embodiment of the invention；And
Fig. 7 shows the top view of highly integrated electric-controlled plate in accordance with another embodiment of the present invention.
Appended drawing reference:
100: printed wiring board；200: highly integrated IPM；210: substrate；220: circuit structure；230: encapsulated layer；300:PFC
Circuit；310:PFC capacitor；320:PFC inductance；330:PFC rectifier bridge；340:PFC switch sections；400: light current element；410:
MCU；420:PFC amplifier circuit and IPM amplifier circuit；430:PFC current protecting circuit；500: compressor IPM；
510: compressor horsepower switch sections；600: blower IPM；610: power of fan switch sections；10: pin；20: diode；30:
IGBT；40:FRD；50: driving IC；60: sampling resistor；70: thermistor；80: heat release hole.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings.Below with reference to
The embodiment of attached drawing description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
In one aspect of the invention, the invention proposes a kind of highly integrated electric-controlled plates.According to an embodiment of the invention, ginseng
Fig. 1-Fig. 3 is examined, which includes: printed wiring board 100, forceful electric power element and light current element 400.Wherein, forceful electric power
The front of printed wiring board 100 is arranged in element, and forceful electric power element includes highly integrated IPM200, and highly integrated IPM 200 is integrated with wind
Machine IPM and compressor IPM (referring to Fig. 2), and highly integrated IPM 200 includes the substrate 210 of half encapsulation, and is arranged in substrate
210 positive circuit structures 220 (referring to Fig. 3), the substrate 210 of half encapsulation are fixed on printed wire by direct insertion pin 10
On plate 100, the back side of printed wiring board 100 is arranged in light current element 400, and light current element 400 includes that MCU 410, PFC sampling are put
Big circuit and IPM amplifier circuit 420 and PFC current protecting circuit 430, and light current element 400 and highly integrated IPM 200
It is electrical connected and (cabling being electrical connected is not shown in the figure).The highly integrated electric-controlled plate at least one of has the following advantages that as a result:
With effective area, be conducive to automatically controlled miniaturization, and cost is relatively low；The isolation of strong and weak electric device, Ke Yiyou may be implemented
Effect reduces strong and weak electrical interference；With good heat dissipation performance.
According to an embodiment of the invention, the forceful electric power element and light current element on the electric-controlled plate are in contrast forceful electric power members
The power of part is higher, larger by electric current, the higher frequency of fever is lower, the power of light current element is lower, it is smaller to pass through electric current,
It generates heat lower and frequency is higher, for example, pfc circuit, intelligent power module etc. are forceful electric power element, micro-control unit etc. is light current member
Part.
According to an embodiment of the invention, the highly integrated electric-controlled plate is integrated with highly integrated IPM, MCU, PFC amplifier circuit
With the structures such as IPM amplifier circuit and PFC current protecting circuit.Wherein, the highly integrated IPM of forceful electric power is located at printed wiring board
Side, MCU, PFC amplifier circuit and IPM amplifier circuit and PFC current protecting circuit of light current are located at printing
Being kept completely separate for strong and weak electric device may be implemented in the other side of wiring board, the design of two-layer printed circuit plate, reduces strong and weak interference
And signal interference, and can significantly reduce the area of highly integrated electric-controlled plate, be conducive to the process of automatically controlled miniaturization.
In order to make it easy to understand, highly integrated electric-controlled plate according to an embodiment of the present invention is briefly described first below:
As previously mentioned, the area of electric-controlled plate is larger at present, the process of automatically controlled miniaturization is limited.Specifically, with reference to Fig. 4,
Existing electric-controlled plate includes: printed wiring board 100 and circuit structure, and circuit structure is arranged at the same of printed wiring board 100
On one surface.Wherein, circuit structure includes: MCU 410, pfc circuit 300, PFC amplifier circuit and IPM amplifier
Circuit 420, PFC current protecting circuit 430, compressor IPM 500 and blower IPM 600.Since foregoing circuit structure is all provided with
It sets in the same side of printed wiring board, the area of occupancy is larger, larger so as to cause the area of electric-controlled plate.Secondly, foregoing circuit
Structure include forceful electric power element (for example, compressor IPM 500 and blower IPM 600) and light current element (for example, MCU 410,
PFC amplifier circuit and IPM amplifier circuit 420 and PFC current protecting circuit 430), it is dry in order to reduce strong and weak electricity
It disturbs, setting is usually isolated with light current element for forceful electric power element, and the area that the isolation of strong and weak electric device needs to increase electric-controlled plate comes
It realizes, further increases the area of electric-controlled plate.Furthermore the elements such as blower IPM600, compressor IPM 500 in circuit structure
It generates heat in the process of running more serious, the design of electric-controlled plate also needs to consider heat dissipation factor, and then further increases automatically controlled
The area of plate.Automatically controlled plate suqare is larger, seriously limits the process of automatically controlled miniaturization, affects the development of electric appliance miniaturization.
According to an embodiment of the invention, by the way that the structures such as blower IPM, compressor IPM and pfc circuit are integrated, with structure
Half encapsulating structure is used, which is arranged in the front of printed wiring board at highly integrated IPM, the highly integrated IPM, it will
The back of printed wiring board is arranged in MCU, PFC amplifier circuit and IPM amplifier circuit and PFC current protecting circuit
Face, the highly integrated IPM can reduce the area of the highly integrated electric-controlled plate as a result, and can improve the heat dissipation of the highly integrated electric-controlled plate
Performance, and the layering setting of strong and weak electric device, can further decrease the area of the highly integrated electric-controlled plate, be conducive to automatically controlled small-sized
Change, and the isolation of strong and weak electric device may be implemented, effectively reduces the interference of strong and weak electricity.
Below according to specific embodiments of the present invention, each structure of the highly integrated electric-controlled plate is described in detail:
According to an embodiment of the invention, highly integrated IPM 200 is integrated with compressor IPM and blower IPM with reference to Fig. 2, and
The front of substrate 210 is arranged in compressor IPM and blower IPM.Specifically, compressor IPM includes compressor horsepower switch portion
Dividing 510 and driving IC 50A, wherein compressor horsepower switch sections 510 include 6 IGBT 30B and 6 FRD 40B,
The driving IC 50A of compressor is integrated with the driving circuit of PFC switch sections 340.Blower IPM includes power of fan switch sections
610 and driving IC 50B, wherein power of fan switch sections 610 include 6 IGBT30C and 6 FRD 40C.As a result,
The highly integrated IPM integrated level with higher.
According to an embodiment of the invention, the highly integrated IPM may be used also in order to further increase the integrated level of the highly integrated IPM
To be integrated with pfc circuit, sampling resistor 60 and thermistor 70, and the front of substrate 210 is arranged in said elements.Specifically
, pfc circuit includes PFC rectifier bridge 330 and PFC switch sections 340, wherein PFC rectifier bridge 330 includes 4 diodes
20A, PFC switch sections 340 include diode 20B, IGBT 30A and FRD 40A.Sampling resistor 60 includes PFC sampling resistor
60A, compressor sampling resistor 60B and blower sampling resistor 60C.Thermistor 70 is used to detect inside the highly integrated IPM
Temperature.According to an embodiment of the invention, since highly integrated IPM is to be integrated in printed wire in such a way that half encapsulation is direct insertion
On plate 100, therefore the pin 10 of the highly integrated IPM can be in such a way that power be electrically separated.Specifically, pin 10 includes weak
Electric pin 10A and forceful electric power pin 10B, and the highly integrated IPM is fixed on a printed-wiring board by direct insertion pin 10, thus
It can interact to avoid strong and weak electricity element.The highly integrated IPM integrated level with higher as a result, it is highly integrated to can reduce this
The area of electric-controlled plate is conducive to the process of automatically controlled miniaturization.
According to an embodiment of the invention, highly integrated IPM 200 includes substrate 210, the circuit knot of half encapsulation with reference to Fig. 3
Structure 220 and encapsulated layer 230.Wherein, substrate 210 can be aluminum substrate, and the front of substrate 210 is arranged in circuit structure 220, electricity
Line structure 220 includes previously described integrated component, for example, compressor IPM, blower IPM, pfc circuit etc., encapsulated layer 230 is wrapped
Wrap up in the front of circuit structure 220 and substrate 210, and the back side of exposure substrate 210.Thus, it is possible to improve the highly integrated IPM's
Heat-sinking capability, so that the highly integrated electric-controlled plate has good heat dissipation performance.
According to an embodiment of the invention, the highly integrated IPM is packaged by the way of plastic packaging, plastic packaging is formed as a result,
Encapsulated layer can play electrical isolation and protective effect.According to an embodiment of the invention, encapsulated layer 230 can be by resin shape
At, specifically, encapsulated layer 230 can be and be formed by thermosetting resin, it can also be and formed by thermoplastic resin, by
This, can make encapsulated layer have good sealing effect.According to an embodiment of the invention, the highly integrated IPM is encapsulated using half
The encapsulating structure of double slotting arrays has good heat dissipation performance, and greatly improves the integrated level of IPM, reliability, reduces
Cost reduces the area of highly integrated electric-controlled plate.
According to an embodiment of the invention, the highly integrated electric-controlled plate can also include PFC capacitor 310 with reference to Fig. 5 and Fig. 6
And PFC inductance 320, PFC capacitor 310 and PFC inductance 320 are being arranged at printed wiring board just with highly integrated IPM 200
Face 100A.Since the volume of PFC capacitor and PFC inductance in pfc circuit is larger, PFC capacitor and PFC inductance are arranged in Gao Ji
, can be excessive to avoid the volume of highly integrated IPM outside IPM, so as to effectively utilize the area of printed wiring board, favorably
In the miniaturization of the highly integrated electric-controlled plate.
According to an embodiment of the invention, MCU 410, PFC amplifier circuit and IPM sampling are put with reference to Fig. 1 and Fig. 7
Big circuit 420 and PFC current protecting circuit 430 are arranged at the back side 100B of printed wiring board.Implementation according to the present invention
Example, with reference to Fig. 5, orthographic projection of the MCU 410 in printed wiring board 100 is located at highly integrated IPM 200 in printed wiring board 100
In the range of upper orthographic projection, in other words, MCU 410 is corresponding with the position of highly integrated IPM 200.As a result, relative to MCU with
Highly integrated IPM is arranged in for the same surface of printed wiring board simultaneously, and MCU and highly integrated IPM are separately positioned on printed wire
The back side and front of plate, and be oppositely arranged, signal transmission distance between the two can be shortened, so as to effectively avoid interfering
It seals in signal path.
According to an embodiment of the invention, printed wiring board 100 is provided with via hole (not shown), light current element 400 with
Highly integrated IPM 200 realizes electrical connection by the via hole.Thus, it is possible to realize being electrically connected for light current element and highly integrated IPM, and
So that the signal transmission distance between said elements is shorter, interference is effectively avoided to seal in signal path.Reality according to the present invention
Apply example, printed wiring board 100 carries out two-sided cabling (not shown), cabling by above-mentioned via hole connect highly integrated IPM200 with
And light current element 400, to realize the use function of highly integrated electric-controlled plate.
According to an embodiment of the invention, highly integrated IPM 200 and light current element 400 consolidating in 100 two sides of printed wiring board
Fixed and 100 two sides of printed wiring board electrical connections can be realized by wave-soldering.Thus, it is possible to obtain strong and weak electric device
It is layered the highly integrated electric-controlled plate of setting.
According to an embodiment of the invention, printed wiring board 100 has multiple heat release holes 80, heat release hole 80 with reference to Fig. 5-Fig. 7
It is arranged positioned at the corresponding region highly integrated IPM 200, and around MCU 410.Heat release hole is conducive to the heat for generating highly integrated IPM
Amount is diffused into outside, so as to further increase the heat dissipation performance of the highly integrated electric-controlled plate.
According to an embodiment of the invention, being also provided with layers of copper in heat release hole 80.The capacity of heat transmission of copper is stronger, as a result,
It can be further improved the heat dissipation performance of the highly integrated electric-controlled plate.According to an embodiment of the invention, being also provided in layers of copper
Tin metal.Thus, it is possible to further increase the heat dissipation performance of the highly integrated electric-controlled plate.
In another aspect of this invention, the invention proposes a kind of electric appliances.According to an embodiment of the invention, the electric appliance includes
Previously described highly integrated electric-controlled plate, the electric appliance has whole features of previously described highly integrated electric-controlled plate and excellent as a result,
Point, details are not described herein.Generally speaking, the small volume of the electric appliance meets the demand for development of electric appliance miniaturization.
According to an embodiment of the invention, the electric appliance can be air-conditioning, washing machine, refrigerator, electromagnetic oven etc., and in above-mentioned electric appliance
Highly integrated electric-controlled plate can be realized function possessed by highly integrated electric-controlled plate described in preceding sections.Above-mentioned electric appliance as a result,
The advantages of all having small volume meets the demand for development of electric appliance miniaturization.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (10)
1. a kind of highly integrated electric-controlled plate characterized by comprising
Printed wiring board；
The front of the printed wiring board is arranged in forceful electric power element, the forceful electric power element, and the forceful electric power element includes highly integrated
It includes the substrate of half encapsulation that IPM, the highly integrated IPM, which are integrated with blower IPM and compressor IPM, the highly integrated IPM, and
The circuit structure of the substrate front side is set, and the substrate of half encapsulation is fixed on the track by direct insertion pin
On the plate of road；And
The back side of the printed wiring board is arranged in light current element, the light current element, and the light current element includes that MCU, PFC are adopted
Sample amplifying circuit, IPM amplifier circuit and PFC current protecting circuit, and the light current element and the highly integrated IPM electricity
Property be connected.
2. highly integrated electric-controlled plate according to claim 1, which is characterized in that described in the encapsulated layer package of half encapsulation
The front of circuit structure and the substrate, and the back side of the exposure substrate.
3. highly integrated electric-controlled plate according to claim 1, which is characterized in that the highly integrated IPM is further integrated with PFC
Circuit, sampling resistor and thermistor.
4. highly integrated electric-controlled plate according to claim 3, which is characterized in that further comprise:
The front of the printed wiring board is arranged in PFC capacitor and PFC inductance, the PFC capacitor and the PFC inductance.
5. highly integrated electric-controlled plate according to claim 1, which is characterized in that the MCU is in the printed wiring board
Orthographic projection is located at the highly integrated IPM in the range of orthographic projection in the printed wiring board.
6. highly integrated electric-controlled plate according to claim 1, which is characterized in that the printed wiring board is provided with via hole, institute
It states light current element and is electrically connected with the highly integrated IPM by via hole realization.
7. highly integrated electric-controlled plate according to claim 1, which is characterized in that the printed wiring board has multiple heat dissipations
Hole, the heat release hole is located at the corresponding region the highly integrated IPM, and is arranged around the MCU.
8. highly integrated electric-controlled plate according to claim 7, which is characterized in that be provided with layers of copper in the heat release hole.
9. highly integrated electric-controlled plate according to claim 8, which is characterized in that be provided with tin metal in the layers of copper.
10. a kind of electric appliance, which is characterized in that including the described in any item highly integrated electric-controlled plates of claim 1-9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811645539.7A CN109413846A (en) | 2018-12-29 | 2018-12-29 | Highly integrated electric-controlled plate and electric appliance |
| PCT/CN2019/088851 WO2019237915A1 (en) | 2018-06-13 | 2019-05-28 | High-integrated electronic control board and electrical appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811645539.7A CN109413846A (en) | 2018-12-29 | 2018-12-29 | Highly integrated electric-controlled plate and electric appliance |
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| Publication Number | Publication Date |
|---|---|
| CN109413846A true CN109413846A (en) | 2019-03-01 |
Family
ID=65461722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811645539.7A Pending CN109413846A (en) | 2018-06-13 | 2018-12-29 | Highly integrated electric-controlled plate and electric appliance |
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Cited By (10)
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| CN110365217A (en) * | 2019-08-12 | 2019-10-22 | 黄山学院 | High power density GaN full-bridge LLC power module |
| CN110380604A (en) * | 2019-08-12 | 2019-10-25 | 无锡派微科技有限公司 | Grid-connected power generation system high pressure wide input range GaN power module |
| CN110401369A (en) * | 2019-08-12 | 2019-11-01 | 黄山学院 | High efficient high power density GaN full-bridge inverter module |
| CN110401354A (en) * | 2019-08-12 | 2019-11-01 | 无锡派微科技有限公司 | The high-power GaN half-bridge LLC charging module of new-energy automobile |
| CN110429838A (en) * | 2019-08-12 | 2019-11-08 | 黄山学院 | High power density GaN synchronous rectification POL power supply module |
| CN110429850A (en) * | 2019-08-12 | 2019-11-08 | 无锡派微科技有限公司 | Grid-connected power generation system high efficiency GaN three-phase inverter module |
| CN110445373A (en) * | 2019-08-12 | 2019-11-12 | 黄山学院 | High power density GaN capacitance series formula interleaved parallel PFC power module |
| CN110445372A (en) * | 2019-08-12 | 2019-11-12 | 无锡派微科技有限公司 | GaN interleaved parallel PFC power module for wireless charging system |
| WO2019237915A1 (en) * | 2018-06-13 | 2019-12-19 | 广东美的制冷设备有限公司 | High-integrated electronic control board and electrical appliance |
| CN110677051A (en) * | 2019-08-12 | 2020-01-10 | 洛阳光度智能科技有限公司 | High efficiency adapter module |
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| CN110445373A (en) * | 2019-08-12 | 2019-11-12 | 黄山学院 | High power density GaN capacitance series formula interleaved parallel PFC power module |
| CN110380604A (en) * | 2019-08-12 | 2019-10-25 | 无锡派微科技有限公司 | Grid-connected power generation system high pressure wide input range GaN power module |
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| CN110429838A (en) * | 2019-08-12 | 2019-11-08 | 黄山学院 | High power density GaN synchronous rectification POL power supply module |
| CN110429850A (en) * | 2019-08-12 | 2019-11-08 | 无锡派微科技有限公司 | Grid-connected power generation system high efficiency GaN three-phase inverter module |
| CN110365217A (en) * | 2019-08-12 | 2019-10-22 | 黄山学院 | High power density GaN full-bridge LLC power module |
| CN110445372A (en) * | 2019-08-12 | 2019-11-12 | 无锡派微科技有限公司 | GaN interleaved parallel PFC power module for wireless charging system |
| CN110401369A (en) * | 2019-08-12 | 2019-11-01 | 黄山学院 | High efficient high power density GaN full-bridge inverter module |
| CN110677051A (en) * | 2019-08-12 | 2020-01-10 | 洛阳光度智能科技有限公司 | High efficiency adapter module |
| CN110380604B (en) * | 2019-08-12 | 2020-12-01 | 无锡派微科技有限公司 | High-voltage wide-input-range GaN power module for new energy power generation system |
| CN110429850B (en) * | 2019-08-12 | 2021-02-23 | 无锡派微科技有限公司 | High-efficiency GaN three-phase inverter module for new energy power generation system |
| CN110429838B (en) * | 2019-08-12 | 2021-02-23 | 黄山学院 | High-power-density GaN synchronous rectification load point power supply module |
| CN110365217B (en) * | 2019-08-12 | 2021-03-12 | 黄山学院 | High-power-density GaN full-bridge LLC power supply module |
| CN110445373B (en) * | 2019-08-12 | 2021-08-06 | 黄山学院 | High-power-density GaN capacitor series connection type interleaving parallel PFC power supply module |
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Application publication date: 20190301 |