CN108848613A - A kind of encapsulation and PCB circuit board of electronic component - Google Patents
A kind of encapsulation and PCB circuit board of electronic component Download PDFInfo
- Publication number
- CN108848613A CN108848613A CN201810871378.7A CN201810871378A CN108848613A CN 108848613 A CN108848613 A CN 108848613A CN 201810871378 A CN201810871378 A CN 201810871378A CN 108848613 A CN108848613 A CN 108848613A
- Authority
- CN
- China
- Prior art keywords
- encapsulation
- component
- area
- pad
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
Abstract
The invention discloses a kind of encapsulation of electronic component, including：Frame is encapsulated, at least two pads inside encapsulation frame are set, the electronic component on pad is set；Wherein, the electronic component being arranged on each pad includes the first component and the second component, and the first component and the second component are identical for function type, but two components that size is different.It is in the present invention that two electronic components of redundancy are integrally disposed on the same pad, it can either be in the requirement for meeting electronic component redundancy packaging electronic parts, the space of occupied PCB circuit board can be reduced again, and then meet the needs of user is to PCB circuit board small size.The present invention also provides a kind of PCB circuit boards, have above-mentioned beneficial effect.
Description
Technical field
The present invention relates to electronic component encapsulation technology fields, encapsulation and PCB more particularly to a kind of electronic component
Circuit board.
Background technique
PCB circuit board (printed circuit board) is in electronics industry using a kind of relatively more extensive device.It is by will be various
Electronic device, such as capacitor, resistance electronic device are welded on substrate, and each electronic device is connected according to certain mode
It connects, so that entire PCB circuit board can be realized certain function.
Electronic product is increasingly to miniaturization now, and the requirement to PCB circuit board is also higher and higher, it is desirable to circuit board
That does is smaller and smaller, or even most of product can have requirement for height to component.The size for how reducing PCB circuit board at present is big
It is small, make urgent problem in industry.
Summary of the invention
The object of the present invention is to provide a kind of encapsulation of electronic component and PCB circuit board, solves and how to reduce PCB
The problem of size of circuit board.
In order to solve the above technical problems, the present invention provides a kind of encapsulation of electronic component, including：
Frame is encapsulated, at least two pads inside the encapsulation frame are set, the electronics on the pad is set
Component；Wherein, the electronic component being arranged on each pad include the first component and the second component, described first
Component and second component are identical for function type, but two components that size is different.
Wherein, the pad includes first area and second area；Wherein, first component is welded in described first
Region, and first area size and the first component size size match；Second component is welded in institute
Second area is stated, and the second area size and the second component size size match.
It wherein, include two pads in the encapsulation frame, the first area of the pad and second area are
Rectangle, and the area of the first area is greater than the area of the second area, and the second area of two pads is located at
Between the first area of two pads.
Wherein, ground hole, the ground plane electricity of the pcb board where the ground hole and the encapsulation are additionally provided on the pad
Connection.
Wherein, the ground hole is blind hole or through-hole.
Wherein, the electronic component is any one component in capacitor, resistance, diode or potentiometer.
Wherein, the pad is tinfoil paper pad or copper foil pad.
The present invention also provides a kind of PCB circuit board, including substrate and encapsulation described in any of the above embodiments, the envelopes
Installing is placed on the substrate.
Wherein, the substrate is ceramic substrate.
Electronic component encapsulation provided by the present invention, is arranged two different electricity on the same pad in encapsulation frame
The function type of sub- component, two of them electronic component is identical, but specification is different, it is possible to be two electronics member devices
Part is all capacitor, but the big capacitor of a capacitor is small, to meet the requirement of setting electronic component, compared with the existing technology
In, for the electronic component of two redundancies, it is often provided on for the encapsulation in different encapsulation frames, it will be superfluous in the present invention
Two remaining electronic components are integrally disposed, can either be in the requirement for meeting electronic component redundancy packaging electronic parts, again
The space of occupied PCB circuit board can be reduced, and then meet the needs of user is to PCB circuit board small size.
The present invention also provides a kind of PCB circuit boards, have above-mentioned beneficial effect.
Detailed description of the invention
It, below will be to embodiment or existing for the clearer technical solution for illustrating the embodiment of the present invention or the prior art
Attached drawing needed in technical description is briefly described, it should be apparent that, the accompanying drawings in the following description is only this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the package structure diagram of electronic component provided in an embodiment of the present invention；
Fig. 2 is the package structure diagram of electronic component in the prior art.
Specific embodiment
In order to enable those skilled in the art to better understand the solution of the present invention, with reference to the accompanying drawings and detailed description
The present invention is described in further detail.Obviously, described embodiments are only a part of the embodiments of the present invention, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, shall fall within the protection scope of the present invention.
As shown in FIG. 1, FIG. 1 is the package structure diagram of electronic component provided in an embodiment of the present invention, electronics members
The encapsulation of device may include：
Frame 1 is encapsulated, the electronic component on pad 2 is arranged at least two pads 2 inside setting encapsulation frame 1；
Wherein, the electronic component being arranged on each pad 2 includes the first component and the second component, and first yuan
Device and the second component are identical for function type, but two components that size is different.
It should be noted that the encapsulation of electronic component provided in the present embodiment, is mainly used in PCB circuit board
The encapsulation of electronic component.For the encapsulation of conventional electronic component, usually it is arranged at least two in encapsulation frame 1
A pad 2, each 2 regular array of pad, and certain gap is reserved between pad 2；And only encapsulation setting on each pad 2
One electronic component.
Optionally, the electronic component in the present invention specifically can be any in capacitor, resistance, diode or potentiometer
A kind of component, in this present invention with no restrictions.
Optionally, the pad 2 encapsulated in the present invention in frame 1 can be tinfoil paper pad or copper foil pad.
For currently used PCB circuit board, for the electronic component of a certain type, generally require to be arranged
The two different models of size, the electronic component of big model mainly use in equipment is debugged, and answer equipment is practical
In, it is only necessary to using the electronic component of congenerous ting model.
But it if is completed in equipment debugging and then ting model is installed into the electronic component dismounting of big model
Electronic component, easily damage circuit board.Therefore, in the actual operation process, generally require redundancy and two function classes are set
Type is identical, and the electronic component that model is of different sizes；And under normal conditions, the size of the electronic component of ting model
It is often and smaller than the size of the electronic component of big model.As shown in Fig. 2, Fig. 2 is the envelope of electronic component in the prior art
Assembling structure schematic diagram usually encapsulates the electronic component of big model and the electronic component of ting model when being packaged
In in different encapsulation frames 1；An electronic component is only welded in Fig. 2 on each pad 2, encapsulates two if necessary to redundancy
The identical electronic component of function, generally according to mode setting structure approximation shown in Fig. 2, two different encapsulation of size, are answered
In the electronic component for welding two identical functions.This results in needing more spaces same for accommodating in PCB circuit board
The electronic component of kind function, and then the size of PCB circuit board is caused to increase, this does not obviously meet PCB circuit board small size
It is required that.
Therefore in embodiment provided by the present invention, electronic component with the same function is set to the same encapsulation
In frame 1 on the same pad 2, relative to being not need that there are gaps between two electronic components with a certain function
, it is only necessary to the preset clearance between adjacent pad 2；In compared with the existing technology, pad 2 where the electronic component of big model
Between need to reserve certain gap, preset clearance is also required to where the electronic component of ting model between pad 2, in the present invention
Because the electronic component of two kinds of models of size to be packaged on same pad 2, the total quantity of pad 2 is just reduced in whole circuit board
Half, the occupied space in gap between adjacent pad 2 are also reduced by, and then reduce whole circuit board for encapsulating electronics
The occupied space of component.To meet the needs of circuit board small size.
Based on above-mentioned any embodiment, in another embodiment of the present invention, can further include：
Pad 22 includes first area 21 and second area 22；Wherein, the first component is welded in first area 21, and
One region, 21 size and the first component size size match；Second component is welded in second area 22, and second
22 size of region and the second component size size match.
Specifically, as shown in Figure 1, because each pad 2 on need to encapsulate setting two function types it is identical, gauge size
Different electronic components, then, in order to reduce the area of pad 2 to the full extent, two edges can be delimited and be connected with each other
Two regions as setting 2 first area 21 of pad and second area 22, and the first component is welded in first area 21, and
21 size of first area and the first component size size match；Second component is welded in second area 22, and
Two regions, 22 size and the second component size size match.So pad 2 size just and two electronics
Component gross area size is adapted, and reduces the area of pad 2 to the full extent.
Optionally, in a specific embodiment of the invention, to encapsulate tool in frame 1, there are two carry out for pad 2
It illustrates, can specifically include：
The first area 21 of pad 2 and second area 22 are rectangle, and the area of first area 21 is greater than second area
22 area, and the second area 22 of two pads 2 is located between the first area 21 of two pads 2.
As shown in Figure 1, it should be noted that the gap reserved required for the electronic device for adjacent big model is to need
It is greater than the electronic component of adjacent ting model, the electronic component of two ting models is arranged in two big electronics member device
Between part, plays the role of the two big model electronic component of isolation, make full use of between being reserved between big model electronic component
Position of the space of gap as setting ting model electronic component.And the reserved spacing between two pads 2 can satisfy it is small-sized
Required reserved clearance space between number electronic component.
It should be noted that be only to be illustrated for specific pad 2 by encapsulating in frame 1 in the present embodiment, by
The present embodiment can be readily conceivable that it is other similar by big model electronic component be arranged between ting model electronic component
Embodiment, no longer repeat one by one in this present invention, but the scheme as such should belong to protection model of the invention
It encloses.
Based on above-mentioned any embodiment, in another specific embodiment of the present invention, can further include：
Ground hole 3, the ground plane electrical connection of the pcb board where ground hole 3 and the encapsulation are additionally provided on pad 2.
Ground hole 3 is set on pad 2 in the present invention, can be prevented since design space is insufficient or staff omits and leads
The problem of causing electronic component that cannot be grounded, and ground hole 3 is set on pad 2, also further save PCB circuit
The design space of plate.
Optionally, for the ground hole 3 being arranged on pad 2, it can be blind hole and be also possible to through-hole.
Specifically, for being not specifically limited in the shape present invention of ground hole 3, annular ground hole 3 generally can be used, only
It wants to be connected with PCB circuit board ground plane.
Ground hole 3, after electronic component is welded on pad 2, electronics member device are set on pad 2 in the present embodiment
Part can be directly grounded by ground hole 3, without being connected on neighbouring ground wire by coiling again, avoid electronic component
It is limited and is influenced by space when ground connection, but also the surface structure of entire PCB circuit board is more aesthetically pleasing.
A kind of specific embodiment of PCB circuit board is additionally provided in the present invention, can specifically include：
Substrate, and the electronic component being packaged on substrate, the electronic component according to above-mentioned any embodiment envelope
Assembling structure is packaged on substrate.
Further, in another specific embodiment of the present invention, the substrate of PCB circuit board is ceramic substrate.
Function is arranged on each each pad 2 encapsulated inside frame 1 on substrate in PCB circuit board provided by the present invention
Can identical and two electronic components that gauge size is different, on the basis of redundancy encapsulates setting electronic component, further
Ground reduces the occupied space of electronic component, reduces the size of PCB circuit board to the full extent, meets PCB circuit
The requirement of plate small size.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with it is other
The difference of embodiment, same or similar part may refer to each other between each embodiment.
The encapsulation and PCB circuit board of electronic component provided by the present invention are described in detail above.Herein
In apply that a specific example illustrates the principle and implementation of the invention, the explanation of above example is only intended to sides
Assistant solves method and its core concept of the invention.It should be pointed out that for those skilled in the art, not
, can be with several improvements and modifications are made to the present invention under the premise of being detached from the principle of the invention, these improvement and modification are also fallen into
In the protection scope of the claims in the present invention.
Claims (9)
1. a kind of encapsulation of electronic component, which is characterized in that including：
Frame is encapsulated, at least two pads inside the encapsulation frame are set, the electronics member device on the pad is set
Part；
Wherein, the electronic component being arranged on each pad include the first component and the second component, described first yuan
Device and second component are identical for function type, but two components that size is different.
2. encapsulation as described in claim 1, which is characterized in that the pad includes first area and second area；Wherein, institute
It states the first component and is welded in the first area, and first area size and the first component size size match
It closes；Second component is welded in the second area, and the second area size and the second component size are big
It is small to match.
3. encapsulation as claimed in claim 2, which is characterized in that include two pads, the weldering in the encapsulation frame
The first area of disk and second area are rectangle, and the area of the first area is greater than the area of the second area, and
The second area of two pads is located between the first area of two pads.
4. encapsulation as described in any one of claims 1 to 3, which is characterized in that ground hole is additionally provided on the pad, it is described to connect
The ground plane of pcb board where ground hole and the encapsulation is electrically connected.
5. encapsulation as claimed in claim 4, which is characterized in that the ground hole is blind hole or through-hole.
6. encapsulation as claimed in claim 4, which is characterized in that the electronic component is capacitor, resistance, diode or current potential
Any one component in device.
7. encapsulation as claimed in claim 6, which is characterized in that the pad is tinfoil paper pad or copper foil pad.
8. a kind of PCB circuit board, which is characterized in that including substrate and the described in any item encapsulation of the claims 1 to 5,
The encapsulation is set on the substrate.
9. PCB circuit board as claimed in claim 7, which is characterized in that the substrate is ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810871378.7A CN108848613A (en) | 2018-08-02 | 2018-08-02 | A kind of encapsulation and PCB circuit board of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810871378.7A CN108848613A (en) | 2018-08-02 | 2018-08-02 | A kind of encapsulation and PCB circuit board of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108848613A true CN108848613A (en) | 2018-11-20 |
Family
ID=64195241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810871378.7A Pending CN108848613A (en) | 2018-08-02 | 2018-08-02 | A kind of encapsulation and PCB circuit board of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108848613A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110299265A (en) * | 2019-05-06 | 2019-10-01 | 上海空间电源研究所 | Relay is mounted on high resistance ground structure and its installation method in printed board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5683788A (en) * | 1996-01-29 | 1997-11-04 | Dell Usa, L.P. | Apparatus for multi-component PCB mounting |
| CN1889808A (en) * | 2005-06-28 | 2007-01-03 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board overlap pad wiring structure |
| CN101394708A (en) * | 2008-10-20 | 2009-03-25 | 北京巨数数字技术开发有限公司 | Circuit board and design method therefor |
| US20160029485A1 (en) * | 2014-07-22 | 2016-01-28 | Cree, Inc. | Solder pads, methods, and systems for circuitry components |
-
2018
- 2018-08-02 CN CN201810871378.7A patent/CN108848613A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5683788A (en) * | 1996-01-29 | 1997-11-04 | Dell Usa, L.P. | Apparatus for multi-component PCB mounting |
| CN1889808A (en) * | 2005-06-28 | 2007-01-03 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board overlap pad wiring structure |
| CN101394708A (en) * | 2008-10-20 | 2009-03-25 | 北京巨数数字技术开发有限公司 | Circuit board and design method therefor |
| US20160029485A1 (en) * | 2014-07-22 | 2016-01-28 | Cree, Inc. | Solder pads, methods, and systems for circuitry components |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110299265A (en) * | 2019-05-06 | 2019-10-01 | 上海空间电源研究所 | Relay is mounted on high resistance ground structure and its installation method in printed board |
| CN110299265B (en) * | 2019-05-06 | 2021-10-15 | 上海空间电源研究所 | High-resistance grounding structure for mounting relay on printed board and mounting method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181120 |
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| RJ01 | Rejection of invention patent application after publication |