CN209641684U - A kind of heat dissipation LED package support - Google Patents
A kind of heat dissipation LED package support Download PDFInfo
- Publication number
- CN209641684U CN209641684U CN201920500915.7U CN201920500915U CN209641684U CN 209641684 U CN209641684 U CN 209641684U CN 201920500915 U CN201920500915 U CN 201920500915U CN 209641684 U CN209641684 U CN 209641684U
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- CN
- China
- Prior art keywords
- area
- insulation board
- heat dissipation
- cushion block
- pedestal
- Prior art date
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- Expired - Fee Related
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Abstract
A kind of heat dissipation LED package support provided by the utility model, including pedestal, the pedestal is equipped with processing platform, the edge of the processing platform is equipped with echo area, chip accommodating area is equipped in the middle part of the processing platform, chip accommodating area two sides are respectively equipped with positive terminal area, negative terminal area, the first insulation board is fixed between the positive terminal area and the chip accommodating area, the first arc cushion block and first insulation board are equipped with the first gold thread slot, the second insulation board is fixed between the negative terminal area and the chip accommodating area, the second arc cushion block and second insulation board are equipped with the second gold thread slot.The LED package support of the utility model increases two gold thread slots, and two gold threads can be fixed, gold thread deviation when avoiding plastic packaging, and radiating groove and several hemispherical projections are increased on pedestal, increases the surface area of pedestal, improves heat dissipation performance.
Description
Technical field
The utility model relates to LED encapsulation technology fields, and in particular to a kind of heat dissipation LED package support.
Background technique
In lighting technical field, LED light source uses low voltage, less energy consumption, strong applicability, stability height, polychrome due to it
Shine the advantages that, gradually replaced original light bulb and as mainstream lighting source of new generation.LED light source include LED chip and
The bracket of LED chip is installed, LED core plate rack is as support LED chip and provides the important component of electric energy, and whether performance is excellent
The good quality for affecting LED light source.
LED encapsulation using etc. different cups are high or different shapes, conventional has round cup, square cup, the encapsulation of oval cup bracket.It is existing
Some LED package supports, usually chip connect positive pin, negative pin by gold thread, are then encapsulated using epoxy resin,
Since gold thread is not fixed in encapsulation process, gold thread is caused to be easy to pull apart.
Utility model content
In view of the above problems, the utility model provides a kind of heat dissipation LED package support, two gold thread slots, energy are increased
It is enough that two gold threads are fixed, gold thread deviation when avoiding plastic packaging, and radiating groove and several hemispherical projections are increased on pedestal, increase
The big surface area of pedestal, improves heat dissipation performance.
To achieve the above object, the utility model solves by the following technical programs:
A kind of heat dissipation LED package support, including pedestal, the pedestal is equipped with the processing platform to lower recess, described
The edge of processing platform is equipped with echo area, and chip accommodating area, chip accommodating area two sides point are equipped in the middle part of the processing platform
Not She You positive terminal area, negative terminal area, be fixed with the first insulation between the positive terminal area and the chip accommodating area
Plate, is additionally provided with positive pin slot, the first arc cushion block in the positive terminal area, the first arc cushion block be connected to it is described just
Between pole pin slot and first insulation board, the first arc cushion block and first insulation board are equipped with the first gold thread
Slot is fixed with the second insulation board, is additionally provided in the negative terminal area between the negative terminal area and the chip accommodating area
Negative pin slot, the second arc cushion block, the second arc cushion block are connected to the negative pin slot and second insulation board
Between, the second arc cushion block and second insulation board are equipped with the second gold thread slot.
Specifically, the echo area surface is coated with mirror surface silver coating.
Specifically, the two sides that the pedestal is close to the chip accommodating area are additionally provided with radiating groove.
Specifically, the depth of the radiating groove is 3mm.
Specifically, the pedestal lower end surface is additionally provided with several hemispherical projections.
The beneficial effects of the utility model are:
The first, the LED package support of the utility model increases two gold thread slots in chip accommodating area two sides, can be right
Two gold threads are fixed, and gold thread deviation when avoiding plastic packaging improves product quality；
The second, it is additionally provided with radiating groove in the two sides that pedestal is close to chip accommodating area, is additionally provided in pedestal lower end surface several
Hemispherical projections increase the surface area of pedestal, improve heat dissipation performance.
Detailed description of the invention
Fig. 1 is a kind of schematic perspective view of heat dissipation LED package support of the utility model.
Appended drawing reference are as follows: pedestal 1, the first insulation board 11, positive pin slot 12, the first arc cushion block 13, the second insulation board
14, negative pin slot 15, the second arc cushion block 16, radiating groove 17, hemispherical projections 18, echo area 21, chip accommodating area 22, just
Pole Wiring area 23, negative terminal area 24, the first gold thread slot 31, the second gold thread slot 32.
Specific embodiment
The utility model is described in further detail below with reference to embodiment and attached drawing, but the implementation of the utility model
Mode is without being limited thereto.
As shown in Figure 1:
A kind of heat dissipation LED package support, including pedestal 1, pedestal 1 are equipped with the processing platform to lower recess, and processing is flat
The edge of platform is equipped with echo area 21, is equipped with chip accommodating area 22 in the middle part of processing platform, 22 two sides of chip accommodating area are respectively equipped with just
Pole Wiring area 23, negative terminal area 24 are fixed with the first insulation board 11 between positive terminal area 23 and chip accommodating area 22, anode
Positive pin slot 12, the first arc cushion block 13 are additionally provided in Wiring area 23, the first arc cushion block 13 is connected to positive pin slot 12
Between the first insulation board 11, the first arc cushion block 13 and the first insulation board 11 are equipped with the first gold thread slot 31, negative terminal area
It is fixed with the second insulation board 14 between 24 and chip accommodating area 22, negative pin slot 15, second is additionally provided in negative terminal area 24
Arc cushion block 16, the second arc cushion block 16 are connected between negative pin slot 15 and the second insulation board 14, the second arc cushion block 16
It is equipped with the second gold thread slot 32 with the second insulation board 14, chip placement is used in chip accommodating area 22, is used in positive pin slot 12
In placing positive pin, is realized and be electrically connected by the first gold thread between positive pin and chip, is used in negative pin slot 15
Negative pin is placed, is realized and is electrically connected by the second gold thread between negative pin and chip, the first gold thread slot 31 is for fixing
First gold thread, the second gold thread slot 32 is for fixing the second gold thread.
Preferably, 21 surface of echo area is coated with mirror surface silver coating, and the light that mirror surface silver coating can issue chip is anti-
It penetrates.
Preferably, in order to make the chip heat in chip accommodating area be easier to be lost to the external world, LED package support is improved
Heat dissipation performance is additionally provided with radiating groove 17 in the two sides that pedestal 1 is close to chip accommodating area 22.
Preferably, the depth of radiating groove 17 is 3mm.
Preferably, 1 lower end surface of pedestal is additionally provided with several hemispherical projections 18, increases the surface area of 1 lower end surface of pedestal, mentions
The high heat dissipation effect of LED package support.
Above embodiments only express a kind of embodiment of the utility model, and the description thereof is more specific and detailed, but simultaneously
Therefore it cannot be interpreted as that a limitation on the scope of the patent of the present invention.It should be pointed out that for the ordinary skill of this field
For personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these belong to this
The protection scope of utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (5)
1. a kind of heat dissipation LED package support, which is characterized in that including pedestal (1), the pedestal (1) is equipped with to lower recess
Processing platform, the edge of the processing platform is equipped with echo area (21), chip accommodating area is equipped in the middle part of the processing platform
(22), chip accommodating area (22) two sides are respectively equipped with positive terminal area (23), negative terminal area (24), the positive terminal
It is fixed between area (23) and the chip accommodating area (22) the first insulation board (11), is additionally provided in the positive terminal area (23)
Positive pin slot (12), the first arc cushion block (13), the first arc cushion block (13) are connected to the positive pin slot (12)
Between first insulation board (11), the first arc cushion block (13) and first insulation board (11) are equipped with the first gold medal
Wire casing (31) is fixed with the second insulation board (14) between the negative terminal area (24) and the chip accommodating area (22), described
Negative pin slot (15), the second arc cushion block (16) are additionally provided in negative terminal area (24), the second arc cushion block (16) is even
It connects between the negative pin slot (15) and second insulation board (14), the second arc cushion block (16) and described second
Insulation board (14) is equipped with the second gold thread slot (32).
2. a kind of heat dissipation LED package support according to claim 1, which is characterized in that echo area (21) surface
Coated with mirror surface silver coating.
3. a kind of heat dissipation LED package support according to claim 1, which is characterized in that the pedestal (1) is close to described
The two sides of chip accommodating area (22) are additionally provided with radiating groove (17).
4. a kind of heat dissipation LED package support according to claim 3, which is characterized in that the depth of the radiating groove (17)
Degree is 3mm.
5. a kind of heat dissipation LED package support according to claim 1, which is characterized in that pedestal (1) lower end surface is also
Equipped with several hemispherical projections (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920500915.7U CN209641684U (en) | 2019-04-15 | 2019-04-15 | A kind of heat dissipation LED package support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920500915.7U CN209641684U (en) | 2019-04-15 | 2019-04-15 | A kind of heat dissipation LED package support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209641684U true CN209641684U (en) | 2019-11-15 |
Family
ID=68497581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920500915.7U Expired - Fee Related CN209641684U (en) | 2019-04-15 | 2019-04-15 | A kind of heat dissipation LED package support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209641684U (en) |
-
2019
- 2019-04-15 CN CN201920500915.7U patent/CN209641684U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191115 Termination date: 20210415 |