CN209639311U - Liquid semiconductor refrigeration system and refrigeration equipment are drunk in heat pipe flowing - Google Patents
Liquid semiconductor refrigeration system and refrigeration equipment are drunk in heat pipe flowing Download PDFInfo
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- CN209639311U CN209639311U CN201920233224.5U CN201920233224U CN209639311U CN 209639311 U CN209639311 U CN 209639311U CN 201920233224 U CN201920233224 U CN 201920233224U CN 209639311 U CN209639311 U CN 209639311U
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Abstract
The utility model relates to field of refrigeration equipment, discloses a kind of heat pipe flowing and drink liquid semiconductor refrigeration system and refrigeration equipment, which includes semiconductor refrigeration chip, storage container, liquid flow line and heat-pipe radiator；The side of storage container is equipped with or is formed with the conduction cooling part that inner surface is exposed to the storage container inner cavity, and the cold end of semiconductor refrigeration chip is contacted with conduction cooling part, at least one inlet and at least one liquid outlet are additionally provided on storage container；Inlet and liquid outlet pass through liquid flow line in storage container external connection, and the flowing fluid path of liquid flow line and storage container inner cavity formation closed loop, flow fluid road is equipped with pumping installations；Heat-pipe radiator is contacted with the hot end of semiconductor refrigeration chip.Liquid flow line promotes to drink the thermal convection campaign of liquid, the difference in height formation local turbulent of inlet and liquid outlet in the utility model, and heat-pipe radiator effectively promotes the hot-side heat dissipation of semiconductor refrigeration chip, promotes refrigeration performance.
Description
Technical field
The utility model relates to field of refrigeration equipments, drink liquid semiconductor refrigeration system more particularly to a kind of flowing of heat pipe
System and with its refrigeration equipment.
Background technique
Refrigeration modes are divided into two kinds in current liquid refrigerating equipment: one is using refrigeration compressor as workpiece,
Principle is identical as general refrigerator, its advantage is that refrigeration is fast, refrigerating capacity is big, the disadvantage is that structure is complicated, price is high；Another kind is with half
Conductor refrigerating chip is workpiece, is a kind of special refrigeration modes using Peltier effect, have structure it is simple, without refrigerant
More environmentally friendly, the advantages that noise is small, light-weight, production technology is high, the disadvantage is that refrigeration is slow, refrigerating capacity is small.Semiconductor refrigeration chip exists
After energization, two end face heating, while freeze, refrigerating capacity other than the characteristic by chip itself is influenced, also by
Cold and hot end heat dissipation/heat exchange property seriously affects.
Currently on the market in the semiconductor refrigeration system of liquid refrigerating equipment, the cold end of semiconductor refrigeration chip generally passes through
Radiation aluminium is directly contacted with the liquid in storage container, so that fluid temperature gradually decreases.This structure has the drawback that
Liquid in storage container only does free convection campaign, and the fluid temperature of storage container top and bottom forms biggish temperature ladder
Degree；The cold end of semiconductor refrigeration chip only relies on that radiation aluminium is thermally conductive, small with the contact area of liquid, and refrigerating speed is slow, low efficiency.
Summary of the invention
In order to overcome the shortcomings of the prior art, the utility model technical problems to be solved first are to provide a kind of heat
Liquid semiconductor refrigeration system is drunk in pipe flowing, not only can effectively solve the problems, such as that semiconductor refrigerating speed is slow, low efficiency, but also can
To promote liquid local turbulent, the speed of cold diffusion is improved.
The utility model also proposes a kind of refrigeration equipment, and the refrigeration equipment includes that above-mentioned heat pipe flowing is drunk liquid and partly led
System cooling system
In order to solve the above-mentioned basic technique problems of the utility model, in a first aspect, the utility model provides a kind of heat pipe
Liquid semiconductor refrigeration system, including semiconductor refrigeration chip, storage container, liquid flow line and heat pipe heat radiation are drunk in flowing
Device；The side of the storage container is equipped with or is formed with the conduction cooling part that inner surface is exposed to the storage container inner cavity, described
The cold end of semiconductor refrigeration chip is contacted with the conduction cooling part, at least one inlet and at least is additionally provided on the storage container
One liquid outlet；The inlet and the liquid outlet by the liquid flow line in the storage container external connection,
The liquid flow line and the storage container inner cavity form the flowing fluid path of closed loop, and flow fluid road is equipped with pumping dress
It sets；The heat-pipe radiator is contacted with the hot end of the semiconductor refrigeration chip.
Preferably, what the flowing fluid path of the closed loop was formed, which drinks liquid motion track, can guide the heat for drinking liquid right
Stream movement, and local turbulent can be formed in the regional area of the motion profile.
Preferably, the top of the storage container is arranged in the inlet, and the liquid outlet setting is held in the storage
The lower part of device, the local turbulent can be formed by the hydraulic shock of drinking that difference in height generates.
Preferably, removably leakproofness is connect the conduction cooling part with the storage container.
Preferably, the conduction cooling part includes conduction cooling plate and the flow-disturbing fin on the inner surface of the conduction cooling plate, wherein
The flow-disturbing fin protrudes into intracavitary in the storage container, outer surface and the semiconductor refrigeration chip of the conduction cooling plate
Cold end contact.
Preferably, conduction cooling part construction opening is formed on the side wall of the storage container, the week of the conduction cooling part construction opening
It encloses and is equipped with the mounting hole being mutually matched with the conduction cooling plate, the conduction cooling part is installed on the side wall of the storage container to seal
Close the conduction cooling part construction opening.
Preferably, the outer cup of the flow-disturbing fin is equipped with deflector, is formed and is led between the deflector and the conduction cooling plate
Circulation road, the liquid flow line pass to the flow-guiding channel through the inlet.
Preferably, the deflector is vertically arranged, and the inside of the deflector is equipped with multiple water conservancy diversion bulge-structures.
Preferably, the heat-pipe radiator include heat pipe unit, radiating piece and for the radiating piece provide cooling wind
Cooling wind driven device, the heat pipe unit are arranged between the radiating piece and the hot end of the semiconductor refrigeration chip with energy
Enough heat dissipations.
Preferably, the radiating piece includes side plate and cooling fin, forms cooling wind convection current air duct between the cooling fin,
Described in cooling wind driven device include be arranged in cooling wind convection current air duct import air supply device and/or setting it is cold at this
But the extractor fan of wind convection current ducting outlet.
Preferably, the heat pipe unit is contacted with the hot end of the semiconductor refrigeration chip or neighbouring part is heat pipe steaming
Hair portion is heat pipe condensation part with the heat sink contact or neighbouring part, wherein the heat pipe unit includes substrate and heat pipe,
Be formed with corrugated heat pipe on the substrate, the interlude of the heat pipe be embedded in the corrugated heat pipe and protruded from the corrugated heat pipe with
It is contacted with the hot end of the semiconductor refrigeration chip, both ends region bends since the two sides of the radiating piece are inserted into this respectively to dissipate
The inside of warmware.
Preferably, the hollow channel in the heat pipe forms closed cooling fluid lumen, the tube wall shape of each heat pipe
At along the heat pipe length direction and circumferentially distributed multiple outside hollow boss.
Second aspect, the utility model provide a kind of refrigeration equipment, including body, are equipped in the body described above
Heat pipe flowing drink liquid semiconductor refrigeration system.
Compared with prior art, the beneficial effects of the utility model are: liquid is drunk in the heat pipe flowing of the utility model
In semiconductor refrigeration system, the cold end of semiconductor refrigeration chip is contacted and is led with the liquid of drinking in storage container by conduction cooling part
It is cold, while the liquid of drinking in storage container carries out outer loop flowing by liquid flow line, promotes drink in storage container
With the pressure thermal convection campaign of liquid, avoids the occurrence of and drink the non-uniform phenomenon of liquid cooling effect in storage container, utilize heat
Tube radiator radiates to the hot end of semiconductor refrigeration chip, to promote the refrigeration performance of semiconductor refrigeration chip cold end.
In the preferred embodiment, the utility model is drunk using the formation of the difference in height of storage container inlet and liquid outlet
Liquid local turbulent, the diffusion of enhancing cold energy and the mixing for drinking liquid, improve refrigerating efficiency；In addition, using deflector with lead
Flow-guiding channel is formed between cold part, makes to drink liquid and is directly entered flow-guiding channel through liquid flow line and is contacted with conduction cooling part, is increased
Big flow-disturbing fin nearby drinks the flowing velocity of liquid, improves the coefficient of heat transfer, and flow-disturbing fin structure makes to drink liquid logical in water conservancy diversion
Also local turbulent is formed in road, promotes cold diffusion, and bulge-structure and flow-disturbing the fin structure promotion of deflector are drunk liquid and led
Stronger local turbulent is formed in circulation road, promotes heat transmitting；The inside of radiating piece is inserted at the heat pipe both ends of heat-pipe radiator,
Heat dissipation area is increased, the structure of heat pipe hollow boss also enhances radiating rate, makes hot end and the ring of semiconductor refrigeration chip
The temperature difference of border temperature reduces, and the equilibrium temperature of corresponding semiconductor refrigeration chip cold end reduces, and improves refrigerating capacity.
Detailed description of the invention
Fig. 1 is a kind of overall structure diagram of specific embodiment of the utility model；
Fig. 2 is a kind of structural schematic diagram of specific embodiment of conduction cooling part in the utility model；
Fig. 3 is the overall structure diagram of another specific embodiment of the utility model；
Fig. 4 is a kind of structural schematic diagram of specific embodiment of deflector in the utility model；
Fig. 5 is a kind of structural schematic diagram of specific embodiment of heat-pipe radiator in the utility model；
Fig. 6 is the structural schematic diagram of another specific embodiment of heat-pipe radiator in the utility model.
Description of symbols
1 semiconductor refrigeration chip, 2 conduction cooling part
21 conduction cooling plate, 22 flow-disturbing fin
23 mounting hole, 3 storage container
4 inlet, 5 liquid outlet
6 liquid flow line, 7 pumping installations
8 heat-pipe radiator, 81 heat pipe unit
811 substrate, 812 heat pipe
813 corrugated heat pipe, 814 hollow boss
82 radiating piece, 821 side plate
822 cooling fin, 823 cooling wind convection current air duct
83 cooling 9 deflectors of wind driven device
91 water conservancy diversion bulge-structures
Specific embodiment
Specific embodiment of the present utility model is described in detail below in conjunction with attached drawing.It should be understood that herein
Described specific embodiment is only used for describing and explaining the present invention, and is not intended to limit the utility model.
In the description of the present invention, it should be understood that term " on ", "lower", "left", "right", "inner", "outside",
The orientation or positional relationship of the instructions such as "top", "bottom" is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of retouching
State the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with
Specific orientation construction and operation, therefore should not be understood as limiting the present invention.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connection ", " contact " shall be understood in a broad sense, for example, contact can be and abut directly on contact, be also possible to through intermediate matchmaker
It is situated between and carries out mediate contact.For the ordinary skill in the art, above-mentioned term can be understood at this as the case may be
Concrete meaning in utility model.
The utility model provides a kind of flowing of heat pipe first and drinks liquid semiconductor refrigeration system, as shown in Figure 1, including half
Conductor refrigerating chip 1, storage container 3, liquid flow line 6 and heat-pipe radiator 8, the side of storage container 3 is equipped with or one
It is formed with the conduction cooling part 2 that inner surface is exposed to the storage container inner cavity, the cold end of semiconductor refrigeration chip 1 is contacted with conduction cooling part 2,
At least one inlet 4 and at least one liquid outlet 5 are additionally provided on storage container 3；Inlet 4 and liquid outlet 5 pass through liquid flow
For dynamic pipeline 6 in 3 external connection of storage container, the flowing fluid path of liquid flow line 6 and 3 inner cavity of storage container formation closed loop should
Flow fluid road is equipped with pumping installations 7；Heat-pipe radiator 8 is contacted with the hot end of semiconductor refrigeration chip 1.
The heat pipe flowing of the utility model, which is drunk liquid semiconductor refrigeration system and be can be applied to, various need to cool down liquid
Electric appliance or equipment in, such as water dispenser is also possible to fruit juice mixer or beverage dispenser etc..Pass through the above-mentioned basic fundamental of the utility model
Liquid semiconductor refrigeration system is drunk in the heat pipe flowing of scheme, and semiconductor refrigeration chip 1 is when connecting direct current, the heat of cold end
It is moved to hot end, causes cold junction temperature to reduce, hot-side temperature raising, forms the cold and hot end of semiconductor refrigeration chip 1, partly lead
Body refrigerating chip 1 is to when drinking liquid and cooling down, drinking liquid from liquid outlet 5 in storage container 3 in storage container 3
Outflow is flowed into from inlet 4 again after liquid flow line 6, and the liquid of drinking in storage container 1 is made to be in outer loop flowing
State is greatly facilitated in storage container 3 and drinks liquid thermal convection campaign, avoids in storage container 3 liquid cooling effect not
Uniform phenomenon, while heat-pipe radiator 8 rapidly goes out the thermal energy conduction in 1 hot end of semiconductor refrigeration chip, so that semiconductor
The hot end of refrigerating chip 1 and the temperature difference of cold end keep stable state, to maintain the refrigeration performance of semiconductor refrigeration chip 1.
It should be noted that the utility model heat pipe flowing drink liquid semiconductor refrigeration system can be it is vertical
Structure is also possible to horizontal type structure, will be described in detail with vertical structure to the utility model in specific embodiment.In addition,
The setting of the inlet 4 and liquid outlet 5 of above-mentioned storage container, can be inlet 4 and the one-to-one correspondence of liquid outlet 5 passes through liquid flow
Dynamic pipeline 6 is connected to, and is also possible to an inlet 4 and is connected to by distribution pipeline with multiple liquid outlets 5, can also be multiple feed liquors
Mouth 5 is connected to a liquid outlet 4 through liquid flow line 6.The setting of above-mentioned pumping installations 7 can be pumping installations 7 set on liquid
On the pipeline of body flow line 6, it is also possible to pumping installations 7 and is directly connect with liquid outlet 5, the outlet and liquid flow of pumping installations
The dynamic connection of pipeline 6 passes to inlet 4.
As shown in Figure 1, the top of storage container 3 is arranged in inlet 4, the lower part of storage container 3 is arranged in liquid outlet 5,
The liquid local turbulent to be formed in storage container 3 is impacted with the difference in height using inlet 4 and liquid outlet 5, is conducive to storage and is held
The liquid of 3 bottom of device is cooling, promotes the convective motion that liquid is drunk in storage container 3, is conducive to uniform to liquid progress is drunk
Cooling.In this way, by the pumping of pumping installations 7, drinking liquid going out from 3 lower part of storage container during refrigeration work
Liquid mouth 5 is extracted out, enters the top in storage container 3 from the inlet 4 on 3 top of storage container via liquid flow line 6.So
The liquid of drinking of 3 lower part of storage container is constantly extracted out, while 3 top of storage container is newest that cooled to drink liquid continuous
Filling is constantly recycled by this, forms a kind of forced circulation movement for drinking liquid.Liquid is drunk due to 3 lower part of storage container
It is constantly extracted out, the liquid needs of drinking in storage container 3 are constantly filled into lower part, drink liquid in such storage container 3
A kind of trend constantly moved from top to bottom is presented in entirety, and this movement is different from thermal natural convection motion profile, but a kind of
By design, relatively accurate control drink the pressure thermal convection campaign of liquid motion track.That is, in the utility model
In technical solution, relatively precisely controls in storage container 3 and drink the motion profile of liquid, so that the movement for drinking liquid is complied with
And a kind of pressure thermal convection campaign is formed, the forced-convection heat transfer of liquid is formed and promote to drink, refrigeration effect is effectively improved
Rate reduces rapidly so that drinking fluid temperature, and the forced-convection heat transfer coefficient for drinking liquid reaches 1000-15000W/ (m2·
DEG C), refrigerating efficiency significantly improves, and rapidly, while it is uniform to drink fluid temperature for refrigeration, will not generate again bottom temp it is low,
The high phenomenon of head temperature, is effectively promoted the usage experience of user.
It should be noted that the pressure thermal convection fortune of liquid motion track is drunk in the relatively accurate control of the utility model
It is dynamic, however it is not limited to the control mode that above-mentioned inlet is formed in top, liquid outlet in lower part, for example, it is also possible to be held in storage
Liquid driving device is set in device 3, drives the liquid of drinking near conduction cooling part 2 to move to the direction far from conduction cooling part 2, other areas
The liquid of drinking in domain is constantly inserted, and to form the pressure thermal convection campaign for drinking liquid, be can also be and is arranged in storage container 3
Impeller controls the thermal convection campaign for drinking liquid by agitation mode.
Further, conduction cooling part 2 includes conduction cooling plate 21 and the flow-disturbing fin 22 on the inner surface of conduction cooling plate 21, flow-disturbing
Fin 22 protrudes into intracavitary in storage container 3, and the outer surface of conduction cooling plate 21 is contacted with the cold end of semiconductor refrigeration chip 1 to carry out
Heat transmitting, flow-disturbing fin 22 make to drink in storage container 3 liquid formed on the motion profile for forcing thermal convection campaign it is local disorderly
Stream further enhances cold energy diffusion and liquid mixing, improves refrigerating efficiency.Conduction cooling part 2 can be with storage container 3 removably
Leakproofness connection, specifically, is formed with conduction cooling part construction opening on the side wall of storage container 3, the conduction cooling part construction opening
Surrounding is equipped with the mounting hole being mutually matched with conduction cooling plate 21, and the mounting hole 23 on conduction cooling plate 21 is as shown in Fig. 2, conduction cooling part 2 is pacified
It is attached on the side wall of storage container 3 to close conduction cooling part construction opening, and is sealed by a seal ring installation, it is dismountable to pacify
Dress form is conducive to the cleaning and maintenance to storage containers inner parts such as storage container 3, conduction cooling plates 21.Conduction cooling part 2 is also possible to
It is integrally formed with storage container 3.
As a preferred implementation manner, as shown in figure 3, the outside of flow-disturbing fin 22 is covered with deflector 9 vertically, this is led
Flow-guiding channel is formed between flowing plate 9 and conduction cooling plate 21, the liquid feeding end of liquid flow line 6 can be inserted to conduction cooling through inlet 4
The top of plate 21, directly passes to flow-guiding channel for the liquid after flows outside and contacts with conduction cooling part 2 and cool down, at this point, liquid
Body forms the local turbulent in flow-guiding channel under the action of flow-disturbing fin 22, and the flowing velocity of liquid increases, improve liquid with
The coefficient of heat transfer between flow-disturbing fin promotes refrigerating efficiency.In order to which the structure for improving liquid flow line 6 in storage container 3 is steady
Qualitative, the top of deflector 9 can be equipped with the through-hole passed through for liquid flow line 6.As shown in figure 4, the inside of deflector 9 can be set
There are multiple arc-shaped water conservancy diversion bulge-structures 91, further strengthens the liquid turbulent flow phenomenon in flow-guiding channel, while increasing liquid
By the time of flow-guiding channel, the i.e. time of contact of elongated fluid and conduction cooling part 2, reinforce refrigeration effect, water conservancy diversion bulge-structure 91
It can also be designed to triangle or other convex shapes.
As a preferred implementation manner, as shown in figure 5, heat-pipe radiator 8 includes heat pipe unit 81, radiating piece 82 and uses
In providing the cooling wind driven device 83 of cooling wind to the radiating piece 82, heat pipe unit 81 is arranged in radiating piece 82 and semiconductor system
Can radiate between the hot end of cold core piece 1.Radiating piece 82 includes side plate 821 and cooling fin 822, is formed between cooling fin 822
Cooling wind convection current air duct 823, wherein cooling wind driven device 83 includes the air-supply dress that 823 import of cooling wind convection current air duct is arranged in
Set and/or be arranged in the extractor fan of the cooling wind convection current air duct 823 outlet.Heat pipe unit 81 and semiconductor refrigeration chip 1
Hot end contact or neighbouring part are heat pipe evaporation part, contact with radiating piece 82 or neighbouring part is heat pipe condensation part, wherein
Heat pipe unit 81 includes substrate 811 and heat pipe 812, is formed with corrugated heat pipe 813 on substrate 811, the interlude of heat pipe 812 is embedded
Protrusion is with the hot end of semiconductor refrigeration chip 1 to contact in corrugated heat pipe 813 and from the corrugated heat pipe 813, both ends region bends with
Respectively since the two sides of radiating piece 82 are inserted into the inside of the radiating piece 82, at this point, heat pipe 812 can not only be passed by substrate 811
Lead the heat in 1 hot end of semiconductor refrigeration chip, can also directly absorb the heat in hot end, the both ends region bends of heat pipe 812 with
Respectively since the two sides of radiating piece 82 are inserted into the inside of the radiating piece 82, connecing for 812 condensation part of heat pipe and cooling fin 822 is increased
Contacting surface product, while improving radiating efficiency, also effectively reduces the volume of heat-pipe radiator 8.It is hollow logical in heat pipe 812
Road forms closed cooling fluid lumen, and heat pipe evaporation part absorbs the heat in 1 hot end of semiconductor refrigeration chip, intraluminal cooling fluid
It is evaporated and heat is brought to heat pipe condensation part, heat pipe condensation part is condensed back by 82 radiating and cooling of radiating piece, cooling fluid to heat
Pipe evaporation part, so repeating the cyclic process that cooling fluid evaporation-condensation flows back, constantly opposite heat tube 812 radiates.Cooling fin
822 can be used the aluminium flake or copper sheet of good heat conductivity, and the heat for being conducive to heat pipe 812 is quickly distributed on cooling fin 822.
As shown in fig. 6, the tube wall of each heat pipe 812 formed along heat pipe 812 length direction and it is circumferentially distributed it is multiple to
Outer hollow boss 814 expands the contact area of cooling fluid steam and 812 tube wall of heat pipe after evaporation by hollow boss 814,
It in the pilot process of steam to heat pipe condensation part, will constantly be condensed, be then refluxed for heat pipe evaporation part, further be increased
The speed to radiate by force.
According to the refrigeration equipment of the utility model second aspect embodiment, including body, above-mentioned heat pipe is equipped in body
Liquid semiconductor refrigeration system is drunk in flowing, is conducive to the refrigerating efficiency for improving refrigeration equipment.
By upper description as it can be seen that liquid semiconductor refrigeration system is drunk in the heat pipe flowing of the utility model, pass through pumping installations 7
The forced convection movement for forming and promote to drink in storage container 3 liquid with liquid flow line 6 utilizes inlet 4 and liquid out
The difference in height of mouth 5, flow-disturbing fin 22 form many places in storage container 3 and drink liquid local turbulent, control in storage container 3 not
Liquid of drinking with region constantly moves, and the coefficient of heat transfer of semiconductor refrigerating is effectively improved, so that it is rapid to drink fluid temperature
It reduces, refrigerating efficiency significantly improves, and the fluid temperature of drinking in storage container keeps uniformly, avoiding generating bottom temp
Phenomenon low, head temperature is high is inserted into the inside of radiating piece 82 using 812 both ends of heat pipe of heat-pipe radiator 8, increased scattered
Heat area also effectively reduces the volume of heat-pipe radiator 8, and the hollow boss 814 on heat pipe 812 further enhances heat dissipation speed
Degree effectively reduces the temperature difference in semiconductor refrigeration chip 1 hot end and cold end, improves the refrigeration performance of semiconductor refrigeration chip 1.
Preferred embodiments of the present invention, still, the utility model and unlimited are described in detail in conjunction with attached drawing above
Detail in above embodiment can be to the skill of the utility model in the range of the technology design of the utility model
Art scheme carries out a variety of simple variants, these simple variants belong to the protection scope of the utility model.
It is further to note that specific technical features described in the above specific embodiments, in not lance
It in the case where shield, can be combined in any appropriate way, in order to avoid unnecessary repetition, the utility model is to each
No further explanation will be given for the possible combination of kind.
In addition, any combination can also be carried out between a variety of different embodiments of the utility model, as long as it is not disobeyed
The thought for carrying on the back the utility model, equally should be considered as content disclosed in the utility model.
Claims (13)
1. liquid semiconductor refrigeration system is drunk in a kind of heat pipe flowing, which is characterized in that including semiconductor refrigeration chip (1), deposit
Storage container (3), liquid flow line (6) and heat-pipe radiator (8)；
The side of the storage container (3) is equipped with or is formed with the conduction cooling part that inner surface is exposed to the storage container inner cavity
(2), the cold end of the semiconductor refrigeration chip (1) is contacted with the conduction cooling part (2), be additionally provided on the storage container (3) to
A few inlet (4) and at least one liquid outlet (5)；
The inlet (4) and the liquid outlet (5) are external in the storage container (3) by the liquid flow line (6)
Connection, the liquid flow line (6) and the storage container (3) inner cavity form the flowing fluid path of closed loop, flow fluid road
Equipped with pumping installations (7)；
The heat-pipe radiator (8) contacts with the hot end of the semiconductor refrigeration chip (1).
2. liquid semiconductor refrigeration system is drunk in heat pipe flowing according to claim 1, which is characterized in that the closed loop
What flowing fluid path was formed, which drinks liquid motion track, can guide the thermal convection campaign for drinking liquid, and can be in the movement rail
The regional area of mark forms local turbulent.
3. liquid semiconductor refrigeration system is drunk in heat pipe flowing according to claim 2, which is characterized in that the inlet
(4) setting is arranged on the top of the storage container (3), the liquid outlet (5) in the lower part of the storage container (3), with energy
It is enough that the local turbulent is formed by the hydraulic shock of drinking that difference in height generates.
4. liquid semiconductor refrigeration system is drunk in heat pipe flowing according to claim 1, which is characterized in that the conduction cooling part
(2) removably leakproofness is connect with the storage container (3).
5. liquid semiconductor refrigeration system is drunk in heat pipe flowing according to claim 1, which is characterized in that the conduction cooling part
(2) the flow-disturbing fin (22) for including conduction cooling plate (21) and being located on the inner surface of the conduction cooling plate (21), wherein the flow-disturbing wing
Piece (22) protrudes into intracavitary in the storage container (3), the outer surface of the conduction cooling plate (21) and the semiconductor refrigeration chip
(1) cold end contact.
6. liquid semiconductor refrigeration system is drunk in heat pipe flowing according to claim 5, which is characterized in that the storage is held
It is formed with conduction cooling part construction opening on the side wall of device (3), is set around the conduction cooling part construction opening on the conduction cooling plate (21)
There is the mounting hole being mutually matched, the conduction cooling part (2) is installed on the side wall of the storage container (3) to close the conduction cooling part
Construction opening.
7. liquid semiconductor refrigeration system is drunk in heat pipe flowing according to claim 5, which is characterized in that the flow-disturbing wing
The outer cup of piece (22) is equipped with deflector (9), forms flow-guiding channel between the deflector (9) and the conduction cooling plate (21), described
Liquid flow line (6) passes to the flow-guiding channel through the inlet (4).
8. liquid semiconductor refrigeration system is drunk in heat pipe flowing according to claim 7, which is characterized in that the deflector
(9) it is vertically arranged, and the inside of the deflector (9) is equipped with multiple water conservancy diversion bulge-structures.
9. liquid semiconductor refrigeration system is drunk in heat pipe flowing according to any one of claim 1 to 8, feature exists
In the heat-pipe radiator (8) includes heat pipe unit (81), radiating piece (82) and is used to provide cooling wind to the radiating piece (82)
Cooling wind driven device (83), the heat pipe unit (81) is arranged in the radiating piece (82) and the semiconductor refrigeration chip
(1) can radiate between hot end.
10. liquid semiconductor refrigeration system is drunk in heat pipe flowing according to claim 9, which is characterized in that the heat dissipation
Part (82) includes side plate (821) and cooling fin (822), forms cooling wind convection current air duct (823) between the cooling fin (822),
Wherein the cooling wind driving device (83) include setting cooling wind convection current air duct (823) import air supply device and/
Or the extractor fan that setting exports in the cooling wind convection current air duct (823).
11. liquid semiconductor refrigeration system is drunk in heat pipe flowing according to claim 10, which is characterized in that the heat pipe
Unit (81) is contacted with the hot end of the semiconductor refrigeration chip (1) or neighbouring part is heat pipe evaporation part, with the heat dissipation
Part (82) contact or neighbouring part are heat pipe condensation part, wherein the heat pipe unit (81) includes substrate (811) and heat pipe
(812), it is formed with corrugated heat pipe (813) on the substrate (811), the interlude of the heat pipe (812) is embedded the corrugated heat pipe
(813) for protrusion to contact with the hot end of the semiconductor refrigeration chip (1), two end regions are curved in and from the corrugated heat pipe (813)
Song is respectively since the two sides of the radiating piece (82) are inserted into the inside of the radiating piece (82).
12. liquid semiconductor refrigeration system is drunk in heat pipe flowing according to claim 9, which is characterized in that the heat pipe
(812) hollow channel in forms closed cooling fluid lumen, and the tube wall of each heat pipe (812) is formed along the heat pipe
(812) length direction and circumferentially distributed multiple outside hollow boss (814).
13. a kind of refrigeration equipment, including body, which is characterized in that be equipped in the body and appoint according to claim 1 in 12
Liquid semiconductor refrigeration system is drunk in the flowing of heat pipe described in one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920233224.5U CN209639311U (en) | 2019-02-21 | 2019-02-21 | Liquid semiconductor refrigeration system and refrigeration equipment are drunk in heat pipe flowing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920233224.5U CN209639311U (en) | 2019-02-21 | 2019-02-21 | Liquid semiconductor refrigeration system and refrigeration equipment are drunk in heat pipe flowing |
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|---|---|
| CN209639311U true CN209639311U (en) | 2019-11-15 |
Family
ID=68494236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920233224.5U Active CN209639311U (en) | 2019-02-21 | 2019-02-21 | Liquid semiconductor refrigeration system and refrigeration equipment are drunk in heat pipe flowing |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111623551A (en) * | 2020-06-12 | 2020-09-04 | 广东奥达信制冷科技有限公司 | Refrigerating system and refrigerating equipment |
| CN112930072A (en) * | 2019-12-05 | 2021-06-08 | 惠安永恒机械有限公司 | Application of motor controller |
| CN115183496A (en) * | 2022-07-08 | 2022-10-14 | 广东富信科技股份有限公司 | Thermoelectric refrigerating device |
| CN116538719A (en) * | 2023-07-07 | 2023-08-04 | 苏州八匹马超导科技有限公司 | Thermal switch and ultra-low temperature system |
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2019
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| CN111623551A (en) * | 2020-06-12 | 2020-09-04 | 广东奥达信制冷科技有限公司 | Refrigerating system and refrigerating equipment |
| CN115183496A (en) * | 2022-07-08 | 2022-10-14 | 广东富信科技股份有限公司 | Thermoelectric refrigerating device |
| CN115183496B (en) * | 2022-07-08 | 2024-03-26 | 广东富信科技股份有限公司 | Thermoelectric refrigerating device |
| CN116538719A (en) * | 2023-07-07 | 2023-08-04 | 苏州八匹马超导科技有限公司 | Thermal switch and ultra-low temperature system |
| CN116538719B (en) * | 2023-07-07 | 2023-09-08 | 苏州八匹马超导科技有限公司 | Thermal switch and ultra-low temperature system |
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