CN109900146A - A kind of double tapered microchannel heat sink with Paleocoenosis fossil stratum - Google Patents
A kind of double tapered microchannel heat sink with Paleocoenosis fossil stratum Download PDFInfo
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- CN109900146A CN109900146A CN201910243573.XA CN201910243573A CN109900146A CN 109900146 A CN109900146 A CN 109900146A CN 201910243573 A CN201910243573 A CN 201910243573A CN 109900146 A CN109900146 A CN 109900146A
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- refrigerant
- heat sink
- microchannel heat
- water tank
- microchannel
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- 239000003507 refrigerant Substances 0.000 claims abstract description 92
- 239000000498 cooling water Substances 0.000 claims abstract description 28
- 238000009833 condensation Methods 0.000 claims abstract description 23
- 230000005494 condensation Effects 0.000 claims abstract description 23
- 238000001704 evaporation Methods 0.000 claims abstract description 21
- 230000008020 evaporation Effects 0.000 claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 230000005484 gravity Effects 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims description 5
- 238000002309 gasification Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000002207 thermal evaporation Methods 0.000 claims description 2
- 208000002925 dental caries Diseases 0.000 claims 1
- 238000001727 in vivo Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 4
- 238000004134 energy conservation Methods 0.000 abstract description 3
- 239000012530 fluid Substances 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Abstract
The present invention relates to hot pipe technique field more particularly to a kind of double tapered microchannel heat sinks with Paleocoenosis fossil stratum.Conveying pipe of refrigerant including condensation end, evaporation ends and connection condensation end, evaporation ends, the condensation end are cooling water tank, are provided with micro-channel condenser in the cooling water tank cavity；The evaporation ends are endothermic box, the endothermic box is the cavity body structure for being internally provided with cavity, microchannel heat sink is provided in the cavity of the endothermic box, the microchannel heat sink top is provided with that the refrigerant through endothermic box top portals and refrigerant enters hole, the radiator that the present invention designs be negative pressure caused by after being condensed as refrigerant gas and condensed refrigerant liquid by gravity as circulation power, therefore can also accomplish energy conservation while obtaining powerful heat exchange property.
Description
Technical field
The present invention relates to hot pipe technique field more particularly to a kind of double tapered microchannel heat dissipations with Paleocoenosis fossil stratum
Device.
Background technique
Microfluid heat dissipation technology is a kind of emerging embedded chip grade enhancing cooling technology.It is continuous by minute yardstick
Fluid carries out chip directly cooling, reduces in long-range radiating mode each heat sink thermal resistance to the maximum extent to radiating efficiency
It influences, thus the significantly cooling efficiency of heat radiation device.Cooling fluid is divided into using microchannel by microchannel heat sink
Small fluid, each combination of fluids cool down the element of required heat dissipation.
The thermal resistance of micro-channel heat exchanger and heat exchange environment is extremely low, has high heat exchange efficiency, the fluid separated is not
It exchanges heat on same microchannel flow passages, can have excellent average temperature performance, and because the structure of micro-channel heat exchanger is smaller,
Individual radiator, high reliablity can be designed for different radiating requirements, therefore be widely used in computer cluster, data
The electronic element radiatings such as library instrument and equipment, cloud computing center are also used for the heat dissipation of various micro-structures.Inside microchannels fluid
Runner is small, therefore the rarely element of single Thermal Performance of Micro Channels, is commonly the microchannel tube bank that multiple microchannels are composed
Or micro channel array exchanges heat.Distribution pipe or distributing trough are installed at micro-channel tubes beam entrance, to accomplish uniform flow field as far as possible,
Fluid is flowed by distribution pipe, is flowed out after exchanging heat in microchannel by outlet.Heat exchange can be phase-change heat-exchange in microchannel, can also be with
It is single-phase heat exchange, when microchannel structure is simple, phase-change heat-exchange can have better heat exchange property, and it is complicated for working as in microchannel
When structure, phase-change heat-exchange has high pressure drop, and heat exchanging is unfavorable.
Thermal siphon is a seed type of heat pipe.It utilizes the vaporization and condensation and work of working medium as general heat pipe
Matter does not need external impetus and automatic cycle to transmit heat.Compared with general heat pipe, thermal siphon does not have liquid-sucking core, condensation water
Evaporator section is flowed back into from condensation section and does not rely on capillary force caused by liquid-sucking core, but relies on the gravity of condensation water itself, is closed
Formula thermal siphon have structure it is simple it is easily fabricated, heat transfer efficiency is high, working condition is stables, operating temperature range extensively, maintenance cost
Low advantage, therefore can be used as the efficient element on ground in all kinds of heat-transfer equipments, application field is quite extensive, all with day
Increase, has played huge superiority in the heat integration of all trades and professions and heat recovery technology.Common thermal siphon
Pipe is that steam along thermal siphon pipe internal channel rises to condensation end after the evaporation of bottom, the refrigerant condensed after condensation end condensation
Liquid, which is affected by gravity, returns to evaporation ends.In this process, when tube refrigerant filling rate is larger, only due to heat exchanging part
It is confined to evaporation ends surrounding and bottom wall, therefore heat exchange area is smaller, while the refrigerant far from wall surface is because temperature compares wall
Refrigerant temperature near face is low, can lead to partial liquefaction to the refrigerant gas cooling by thermal evaporation, hinder refrigerator gas
Condensation end heat exchange is risen to, further reduced heat exchange efficiency, can not meet the heat dissipation of now highly integrated microelectronic chip,
This just needs to find a kind of radiator of microelectronics heat flow density that can satisfy very fast growth, the bipyramid with thermal siphon
Degree microchannel heat sink can then play its characteristic in this case.Existing radiator is largely the circle using standard
Or rectangle thermal siphon, heat exchange area is small, and face high fill-ratio the case where heat transfer be easy deteriorate；And existing microchannel dissipates
The hot generally existing microchannel flow passages length of device is too long, and pressure drop is larger, and the situation that fluid distribution is uneven, and inside microchannels are empty
Between it is narrow, the expansion of the refrigerant of endothermic gasification can cause to hinder to subsequent refrigerant liquid, influence fluid circulation, reduce and change
The thermal efficiency.The present invention proposes a kind of double tapered microchannel heat sink with thermal siphon, by by thermal siphon and microchannel
It combines, heat exchange area, enhanced heat exchange efficiency can be increased, and open up double tapered inclined-plane on microchannel top, can reduce
The obstruction that gas expansion circulates to fluid.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, adapt to reality and need, and provide a kind of with thermal siphon time
The double tapered microchannel heat sink on road.
In order to achieve the object of the present invention, a kind of the technical solution adopted by the present invention are as follows: bipyramid with Paleocoenosis fossil stratum
Microchannel heat sink is spent, the conveying pipe of refrigerant 3 including condensation end, evaporation ends and connection condensation end, evaporation ends, the condensation
End is cooling water tank 1, is provided with micro-channel condenser 4 in 1 cavity of cooling water tank；The evaporation ends are endothermic box 2, described
Endothermic box 2 is the cavity body structure for being internally provided with cavity, and microchannel heat sink 5 is provided in the cavity of the endothermic box 2, described
The refrigerant that 5 top of microchannel heat sink is provided with through 2 top of endothermic box portal 7 and refrigerant enter hole 6, the refrigerant
Portal 7 and refrigerant enter hole 6 and be connected to 1 bottom of cooling water tank by conveying pipe of refrigerant 3, portal 7 with the refrigerant
The conveying pipe of refrigerant 3 of connection is inserted into 90 degree of 1 inner bending of cooling water tank and opening and micro-channel condenser 4 are opposite；Liquid
Refrigerant passes through conveying pipe of refrigerant 3 under gravity and is flowed into 2 cavity of endothermic box, in 2 endothermic gasification of endothermic box,
Gaseous refrigerant enters cooling water tank 1 and is condensed under system circulation and buoyancy, and 1 internal pressure of cooling water tank increases before condensing
Greatly, it gives refrigerant and enters 6 pressure of hole, accelerate liquid refrigerant and flow into endothermic box 2；1 internal pressure of cooling water tank reduces after condensation,
Negative pressure is formed, accelerates gaseous refrigerant and flows into cooling water tank 1.
The micro-channel condenser 4 is provided with multiple microchannels with the microchannel heat sink 5 at equal intervals；It is described micro-
The microchannel circulating direction and refrigerant of multi-pass condenser 4 and the microchannel heat sink 5 enter hole 6, refrigerant portals 7 bottom
Line direction is consistent.
The micro-channel condenser 4 is arranged at the top of the cavity of cooling water tank 1.
The refrigerant enters hole 6 and is arranged in 5 top center of microchannel heat sink, and the refrigerant portals 7 settings micro- logical
5 top two sides of road radiator.
The refrigerant portal 7 with the refrigerant enter hole 6 include upper end cylindrical cavity portion 8, circular cone cavity portion 9 and
The free end in the rectangular cavities portion 10 of bottom, the cylindrical cavity portion 8 is connected to conveying pipe of refrigerant 3, the rectangular cavities portion
And microchannel heat sink 5 is oppositely arranged and the length being open is identical as 5 length of microchannel heat sink at 10 bottom openings.
Wind deflector 11 is provided at the top of the microchannel heat sink 5, the wind-guiding face of 11 bottom of wind deflector is V-shaped,
Refrigerant that microchannel heat sink 5 gasifies is portalled 7 guidance to the refrigerant of two sides.
2 bottom of endothermic box is provided with opening, and the opening is provided with matching bottom cover 12, the bottom cover 12
Top is provided with limiting slot, and the microchannel heat sink 5 is arranged in limiting slot.
The beneficial effects of the present invention are:
The present invention provides a kind of double tapered microchannel heat sink with thermal siphon, by combining thermal siphon and micro-
Channel heat radiator significantly increases the effective heat exchange area of evaporation ends, and opens up double tapered above the evaporation ends of microchannel
Inclined-plane, increases the space of gas expansion, and bubble is shifted onto refrigerant outlet by guiding performance, keeps the wet spy of evaporation wall surface
Property, enhanced heat exchange efficiency.The radiator that the present invention designs is negative pressure caused by after being condensed as refrigerant gas and condensed system
Cryogen liquid by gravity as circulation power, therefore can also accomplish energy conservation while obtaining powerful heat exchange property.
Detailed description of the invention
The present invention is described further with case study on implementation with reference to the accompanying drawing.
Fig. 1 is external structure schematic diagram of the invention；
Fig. 2 is cross-sectional view of the invention；
Fig. 3 is conveying pipe of refrigerant cross-sectional view of the invention；
Fig. 4 is micro-channel condenser schematic diagram of the invention；
Fig. 5 is microchannel heat sink schematic diagram of the invention.
Specific embodiment
Present invention will be further explained below with reference to the attached drawings and examples:
Referring to Fig. 1-5.
The invention discloses a kind of double tapered microchannel heat sink with Paleocoenosis fossil stratum, including condensation end, evaporation ends
And the conveying pipe of refrigerant 3 of connection condensation end, evaporation ends, the condensation end are cooling water tank 1,1 cavity of cooling water tank
Inside it is provided with micro-channel condenser 4；The evaporation ends are endothermic box 2, and the endothermic box 2 is the cavity knot for being internally provided with cavity
Structure, microchannel heat sink 5 is provided in the cavity of the endothermic box 2, and 5 top of microchannel heat sink is provided with through heat absorption
The refrigerant on 2 top of case portal 7 and refrigerant enter hole 6, the refrigerant portal 7 and refrigerant enter hole 6 and pass through refrigeration
Agent delivery pipe 3 is connected to 1 bottom of cooling water tank, is inserted into cooling water with the refrigerant conveying pipe of refrigerant 3 that 7 are connected to that portals
90 degree of 1 inner bending of case and opening and micro-channel condenser 4 are opposite；It is defeated that liquid refrigerant passes through refrigerant under gravity
Send pipe 3 to be flowed into 2 cavity of endothermic box, in 2 endothermic gasification of endothermic box, under system circulation and buoyancy gaseous refrigerant into
Enter cooling water tank 1 to be condensed, 1 internal pressure of cooling water tank increases before condensing, and gives refrigerant and enters 6 pressure of hole, accelerates liquid
Refrigerant flows into endothermic box 2；1 internal pressure of cooling water tank reduces after condensation, forms negative pressure, accelerates gaseous refrigerant and flows into cooling
Water tank 1.
The micro-channel condenser 4 is provided with multiple microchannels with the microchannel heat sink 5 at equal intervals；It is described micro-
The microchannel circulating direction and refrigerant of multi-pass condenser 4 and the microchannel heat sink 5 enter hole 6, refrigerant portals 7 bottom
Line direction is consistent.
The micro-channel condenser 4 is arranged at the top of the cavity of cooling water tank 1.
The refrigerant enters hole 6 and is arranged in 5 top center of microchannel heat sink, and the refrigerant portals 7 settings micro- logical
5 top two sides of road radiator.
The refrigerant portal 7 with the refrigerant enter hole 6 include upper end cylindrical cavity portion 8, circular cone cavity portion 9 and
The free end in the rectangular cavities portion 10 of bottom, the cylindrical cavity portion 8 is connected to conveying pipe of refrigerant 3, the rectangular cavities portion
And microchannel heat sink 5 is oppositely arranged and the length being open is identical as 5 length of microchannel heat sink at 10 bottom openings.
Wind deflector 11 is provided at the top of the microchannel heat sink 5, the wind-guiding face of 11 bottom of wind deflector is V-shaped,
Refrigerant that microchannel heat sink 5 gasifies is portalled 7 guidance to the refrigerant of two sides.
2 bottom of endothermic box is provided with opening, and the opening is provided with matching bottom cover 12, the bottom cover 12
Top is provided with limiting slot, and the microchannel heat sink 5 is arranged in limiting slot.
Use principle of the invention is summarized as follows:
After electronic component starting, evaporation ends start to receive heat, and Paleocoenosis fossil stratum double tapered microchannel heat sink starts,
The microchannel of bottom solves the problems, such as that conventional thermal siphon heat exchange area of working as is small, and refrigerant comes to life after evaporation ends heat absorption,
The refrigerant gas that gasification generates, which rises and flows to refrigerant along wind deflector 11, to portal 7, in this course, air bubble expansion.
When refrigerant gas rises to cooler bin, become refrigerant liquid, the gas pressure drop in cooler bin after being condensed by the condenser
Low, the pressure of conveying pipe of refrigerant and outlet is negative, and accelerates the refrigerant circulation speed of thermal siphon, and exchange capability of heat further adds
By force；There is the refrigerant liquid of certain altitude inside cooler bin, under gravity, flows to and freeze along conveying pipe of refrigerant
Agent enters hole, is entering evaporation ends by rectangular cavities portion 10, is finally reaching microchannel, recycle again after heated.
Double tapered microchannel heat sink of the present invention with thermal siphon, which devises, to be increased heat exchange area, expands gas
Body expansion space, the structure for accelerating thermal siphon circulation rate can satisfy the high hot-fluid of present highly integrated electronic component
Density, and radiator is free of movable part, and operational reliability is high, utilizes negative pressure and gravity drive, energy conservation and environmental protection.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalents made by bright specification and accompanying drawing content are applied directly or indirectly in relevant technical field, are similarly included in
In scope of patent protection of the invention.
Claims (7)
1. a kind of double tapered microchannel heat sink with Paleocoenosis fossil stratum, including condensation end, evaporation ends and connection condensation end,
The conveying pipe of refrigerant (3) of evaporation ends, it is characterised in that: the condensation end is cooling water tank (1), cooling water tank (1) chamber
It is provided with micro-channel condenser (4) in vivo；The evaporation ends are endothermic box (2), and the endothermic box (2) is to be internally provided with cavity
Cavity body structure, be provided with microchannel heat sink (5) in the cavity of the endothermic box (2), microchannel heat sink (5) top
Be provided with that the refrigerant through endothermic box (2) top portals (7) and refrigerant enters hole (6), the refrigerant portal (7) and
Refrigerant enters hole (6) and is connected to by conveying pipe of refrigerant (3) with cooling water tank (1) bottom, portals (7) even with the refrigerant
Logical conveying pipe of refrigerant (3) is inserted into 90 degree of cooling water tank (1) inner bending and opening and micro-channel condenser (4) are opposite；
Liquid refrigerant passes through conveying pipe of refrigerant under gravity, and (3 are flowed into endothermic box (in 2 cavitys, inhales in endothermic box (2)
Thermal evaporation, gaseous refrigerant enters cooling water tank (1) and is condensed under system circulation and buoyancy, cooling water tank before condensing
(1) internal pressure increases, and gives refrigerant and enters hole (6) pressure, accelerates liquid refrigerant and flows into endothermic box (2)；It is cooling after condensation
Water tank (1) internal pressure reduces, and forms negative pressure, accelerates gaseous refrigerant and flows into cooling water tank (1).
2. a kind of double tapered microchannel heat sink with Paleocoenosis fossil stratum according to claim 1, it is characterised in that；Institute
It states micro-channel condenser (4) and the microchannel heat sink (5) and is provided with multiple microchannels at equal intervals；The microchannel is cold
The bottom that the microchannel circulating direction and refrigerant of condenser (4) and the microchannel heat sink (5) enter hole (6), refrigerant portals (7)
Portion line direction is consistent.
3. a kind of double tapered microchannel heat sink with Paleocoenosis fossil stratum according to claim 1, it is characterised in that；Institute
Micro-channel condenser (4) setting is stated at the top of the cavity of cooling water tank (1).
4. a kind of double tapered microchannel heat sink with Paleocoenosis fossil stratum according to claim 1, it is characterised in that；Institute
State refrigerant enter hole (6) be arranged in microchannel heat sink (5) top center, the refrigerant portal (7) setting microchannel dissipate
Two sides at the top of hot device (5).
5. a kind of double tapered microchannel heat sink with Paleocoenosis fossil stratum according to claim 4, it is characterised in that；Institute
State refrigerant portal (7) and the refrigerant to enter hole (6) include upper end cylindrical cavity portion (8), circular cone cavity portion (9) and bottom
The free end in the rectangular cavities portion (10) in portion, the cylindrical cavity portion (8) is connected to conveying pipe of refrigerant (3), the rectangular cavity
The length and microchannel heat sink (5) length for being oppositely arranged and being open with microchannel heat sink (5) at body portion (10) bottom opening
It is identical.
6. a kind of double tapered microchannel heat sink with Paleocoenosis fossil stratum according to claim 5, it is characterised in that；Institute
It states and is provided with tapered wind deflector (11) at the top of microchannel heat sink (5), the wind-guiding face of wind deflector (11) bottom is in " V "
Shape, by microchannel heat sink (5) gasification refrigerant to the refrigerant of two sides portal (7) guide.
7. a kind of double tapered microchannel heat sink with Paleocoenosis fossil stratum according to claim 1, it is characterised in that；Institute
It states endothermic box (2) bottom and is provided with opening, the opening is provided with matching bottom cover (12), at the top of the bottom cover (12)
It is provided with limiting slot, the microchannel heat sink (5) is arranged in limiting slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910243573.XA CN109900146A (en) | 2019-03-28 | 2019-03-28 | A kind of double tapered microchannel heat sink with Paleocoenosis fossil stratum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910243573.XA CN109900146A (en) | 2019-03-28 | 2019-03-28 | A kind of double tapered microchannel heat sink with Paleocoenosis fossil stratum |
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| Publication Number | Publication Date |
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| CN109900146A true CN109900146A (en) | 2019-06-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910243573.XA Pending CN109900146A (en) | 2019-03-28 | 2019-03-28 | A kind of double tapered microchannel heat sink with Paleocoenosis fossil stratum |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112165839A (en) * | 2020-10-23 | 2021-01-01 | 华南理工大学 | Heat dissipation system of electrical equipment |
| CN112503983A (en) * | 2020-11-13 | 2021-03-16 | 苏州浪潮智能科技有限公司 | Gravity thermosiphon radiator and machining method thereof |
| CN114096108A (en) * | 2020-08-24 | 2022-02-25 | 华为技术有限公司 | Heat sink and method for manufacturing the same |
| TWI763417B (en) * | 2021-04-07 | 2022-05-01 | 宏碁股份有限公司 | Heat dissipation module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1551724A (en) * | 2003-05-12 | 2004-12-01 | Sapa股份公司 | Thermosyphon and method for producing it |
| JP2008249314A (en) * | 2007-03-30 | 2008-10-16 | Nec Corp | Thermosiphon type boiling cooler |
| CN103384808A (en) * | 2011-02-22 | 2013-11-06 | 日本电气株式会社 | Cooling device and method for producing same |
| CN107003072A (en) * | 2014-11-11 | 2017-08-01 | 丹麦丹腾制冷股份公司 | Thermal siphon block and thermosiphon system for heat transfer |
| CN209978680U (en) * | 2019-03-28 | 2020-01-21 | 南昌大学 | Double-taper micro-channel radiator with thermosyphon loop |
-
2019
- 2019-03-28 CN CN201910243573.XA patent/CN109900146A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1551724A (en) * | 2003-05-12 | 2004-12-01 | Sapa股份公司 | Thermosyphon and method for producing it |
| JP2008249314A (en) * | 2007-03-30 | 2008-10-16 | Nec Corp | Thermosiphon type boiling cooler |
| CN103384808A (en) * | 2011-02-22 | 2013-11-06 | 日本电气株式会社 | Cooling device and method for producing same |
| CN107003072A (en) * | 2014-11-11 | 2017-08-01 | 丹麦丹腾制冷股份公司 | Thermal siphon block and thermosiphon system for heat transfer |
| CN209978680U (en) * | 2019-03-28 | 2020-01-21 | 南昌大学 | Double-taper micro-channel radiator with thermosyphon loop |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114096108A (en) * | 2020-08-24 | 2022-02-25 | 华为技术有限公司 | Heat sink and method for manufacturing the same |
| CN112165839A (en) * | 2020-10-23 | 2021-01-01 | 华南理工大学 | Heat dissipation system of electrical equipment |
| CN112165839B (en) * | 2020-10-23 | 2021-07-02 | 华南理工大学 | Heat dissipation system of electrical equipment |
| CN112503983A (en) * | 2020-11-13 | 2021-03-16 | 苏州浪潮智能科技有限公司 | Gravity thermosiphon radiator and machining method thereof |
| CN112503983B (en) * | 2020-11-13 | 2022-12-27 | 苏州浪潮智能科技有限公司 | Gravity thermosiphon radiator and processing method thereof |
| TWI763417B (en) * | 2021-04-07 | 2022-05-01 | 宏碁股份有限公司 | Heat dissipation module |
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