CN209544331U - Preform fills out tin slot wire frame and its potted element - Google Patents
Preform fills out tin slot wire frame and its potted element Download PDFInfo
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- CN209544331U CN209544331U CN201920433352.4U CN201920433352U CN209544331U CN 209544331 U CN209544331 U CN 209544331U CN 201920433352 U CN201920433352 U CN 201920433352U CN 209544331 U CN209544331 U CN 209544331U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
A kind of preform fills out tin slot wire frame, includes preform glue-line, lead frame and solder unit.The preform glue-line has center, the external zones of the collar center, the upper surface and the lower surface reversely with each other, and tin groove is eaten towards what the upper surface direction was recessed in the lower surface in multiple Self cleavage roads, the lead frame has an a plurality of pin for being embedded at the preform glue-line, and each pin, which has, eats that tin groove is externally exposed to eat tin face from one of them.The solder unit has multiple solder layers, the solder layer be located at it is described eat tin groove, and lid covers at least part of surface for eating tin face and eat the exposed preform glue-line of tin groove certainly respectively.The utility model also provide it is a kind of using the preform fill out tin slot wire frame encapsulation obtained by potted element.
Description
Technical field
The utility model relates to a kind of lead frame and potted elements, more particularly to a kind of preform lead frame and its encapsulation
Element.
Background technique
The existing semiconductor package using square flat outer-pin-free (QFN, quad flat no-lead) encapsulation,
Since the pin of QFN does not extend outwardly, which can substantially reduce the size of semiconductor package.However, also because
For no outwardly extending pin, therefore, when by this semiconductor package be applied to it is subsequent with other welding circuit boards when,
Generally also the more difficult bottom surface from the pin rises to the side of the pin via reflow (reflow) for solder for welding.
However, the contact area of the mechanical strength and solder and pin that are connect with circuit board due to the semiconductor package is had greatly
Relationship, and when the solder can not appear from the side of pin, it also has no way of directly learning pin from appearance detection in processing procedure process
With the welding situation of solder, and the difficulty of detection is increased.
Refering to fig. 1, in order to allow solder to be easier to the edge reflow (reflow) in pin exposed, increase pin and solder
Contact area, to promote the intensity and reliability of welding, and can be convenient for the weldering of the pin and solder of visual confirmation potted element
Quality is connect, 2016/0148877A1 early stage publication number Patent Case in the U.S. is disclosed and utilized semiconductor element in lead frame routing
After the completion of encapsulation, in the way of cutting twice, first with the pin 12 of a wider cutter wire cutting frame, and in pin 12
The bottom surface 121 of (Fig. 1 only shows one of pin 12) forms a groove 13, then, in shape on the pin 12 and the groove 13
At one layer of electroplated layer 14, finally, again cutting off the pin 12 with another relatively narrow cutter, and make QFN potted element through cutting
The side 122 of exposed pin 12 generates a break difference structure 15 afterwards.Therefore, (scheme when by the QFN potted element and other circuit boards
Non- formula) via solder connection when, solder can be allowed to be easy to from the bottom surface reflow of pin 12 to side by the break difference structure 15.So
And this mode must carry out again cutting twice after encapsulation and can reach, still, repeatedly cutting is not only time-consuming and cutter are easily lost
Have and increase processing procedure cost, and because lead frame is usually to be made of copper for material, when cutting, is easy to produce metal kernel
Side, and under the premise of potted element size is smaller and smaller, remaining metal flash is easy that shadow can be caused to adjacent pin 12
It rings, and then influences the reliability of potted element.
Summary of the invention
The purpose of this utility model is to provide a kind of preforms to fill out tin slot wire frame.
The preform of the utility model fills out tin slot wire frame, includes preform glue-line, lead frame and solder unit.
The preform glue-line is made of insulating polymer material, and with upper surface reversely with each other, lower surface, multiple oneself should
Tin groove, a plurality of Cutting Road and multiple of interleaved arrangement in length and breadth each other are eaten towards what the upper surface direction was recessed in lower surface
By the chip setting unit that the Cutting Road of interleaved adjacent is defined in length and breadth two-by-two, each chip setting unit has center
The external zones in area and the collar center, each, which eats tin groove, has positioned at the firstth area of the Cutting Road, and respectively from this
The both ends in one area extend to the secondth area of the external zones of the adjacent chip setting unit.
The lead frame is constructed from a material that be electrically conducting and is embedded at the preform glue-line, recessed with tin is eaten described in a plurality of respectively correspond
The pin of slot, each pin have wiring face, two bottom surfaces, and connect two bottom surfaces and towards the upper of the preform glue-line
Surface direction recess eats tin face, wherein the wiring face is the external zones from one of chip setting unit via adjacent
Cutting Road extends to the external zones of adjacent another one chip setting unit, and the wiring face can be from the preform glue-line
Upper surface is exposed and coplanar with the upper surface, which extended from the wiring face and respectively from two adjacent chips
The lower surface of setting unit is exposed and coplanar with the lower surface, and each is eaten the meeting of tin face and eat tin groove accordingly to exposed certainly
Out.
The solder unit has multiple solder layers, and the solder layer, which is located at, described eats tin groove, and the solder layer
Lid covers at least part of surface for eating tin face and the exposed preform glue-line of tin groove is eaten from this.
Preferably, the preform fills out tin slot wire frame, wherein the solder layer at least covers corresponding positioned at the cutting
The surface for eating tin face and the adjacent preform glue-line in tin face is eaten with this in road.
Preferably, the preform fills out tin slot wire frame, wherein the solder layer, which is at least filled out, covers the body for eating tin groove
Long-pending 1/2.
Preferably, the preform fills out tin slot wire frame, which also includes multiple chip seats, the chip seat point
It is not embedded at the center of the chip setting unit, and with the pin each other in spacing interval, and each chip
The top surface and its bottom surface of seat are exposed from the upper surface and the lower surface respectively and coplanar with the upper surface and the lower surface.
Preferably, the preform fills out tin slot wire frame, the wiring face of the top surface of the chip seat and the pin is also
With at least one layer of conductive coating different from the pin constituent material.
The another object of the utility model is to provide a kind of preform and fills out tin slot wire frame potted element.
The preform of the utility model fills out tin slot wire frame potted element, comprising preforming glue-line, lead frame unit,
Solder unit and semiconductor die blade unit.
The preform glue-line is made of insulating polymer material, is had upper surface reversely with each other, lower surface, is connected on this
The outer peripheral surface of surface and the lower surface and multiple respective independent and penetrate through from the outer peripheral surface to the lower surface and eat tin through-hole, and
Define external zones of the preform glue-line with center and the collar center.
The lead frame unit is constructed from a material that be electrically conducting and is embedded at the preform glue-line, has a plurality of electrical property each other independent,
Be embedded at the external zones and it is corresponding described in eat the pin of tin through-hole, each pin have it is exposed from the upper surface and with table on this
The coplanar wiring face in face, extend from the wiring face and and with the outer peripheral surface coplanar side exposed from the outer peripheral surface, from should
Exposed and coplanar with the lower surface bottom surface in lower surface, and connect the side and the bottom surface eat tin face, and this eats Xi Mianhui
It is self-corresponding to eat the exposing of tin through-hole.
The solder unit has multiple solder layers, and the solder layer is placed into described eats tin through-hole respectively.
Semiconductor wafer and a plurality of order of the semiconductor die blade unit with the center for being set to the preform glue-line
The conducting wire that the semiconductor wafer is electrically connected with the wiring face of the pin.
Preferably, the preform fills out tin slot wire frame potted element, wherein the lead frame unit, which also has, to be embedded at
The chip seat of the center, the top surface and its bottom surface of the chip seat are respectively under the upper surface of the corresponding center and this
Surface exposure, and it is coplanar with the upper surface and the lower surface, and the semiconductor wafer is set to the top surface of the chip seat.
Preferably, the preform fills out tin slot wire frame potted element, wherein the solder layer connects with the pin
There are also at least one layer of conductive coatings different from the pin constituent material between line face.
Preferably, the preform fills out tin slot wire frame potted element, also comprising cover the semiconductor die blade unit and
The encapsulation glue-line of the upper surface.
The beneficial effect of the utility model is: it is formed using the position for corresponding to Cutting Road in pin and eats tin groove, and
Solder layer further is filled eating tin groove, therefore, in cutting process, is generated using solder layer cladding cutting process
Metal flash avoids generating metal flash, and increases the Bonding strength of pin and preform glue-line using solder layer, in addition,
Potted element after encapsulation can eat tin groove by this and increase contact area and effective area, and be easier to visual detection.
Detailed description of the invention
Fig. 1 is a flow diagram, illustrates the encapsulating structure that chip package is carried out using the lead frame of Fig. 1；
Fig. 2 is side top perspective view, illustrates that the utility model preform fills out an embodiment of tin slot wire frame；
Fig. 3 is a face upwarding stereogram, aids in illustrating the bottom view of the embodiment；
Fig. 4 is a sectional block diagram, illustrates the sectional structure of the 4-4 secant along Fig. 2；
Fig. 5 to 10 is structural schematic diagram, aids in illustrating the embodiment in the structural schematic diagram of manufacturing process；
Figure 11 is a schematic cross-sectional view, illustrates the potted element semi-finished product formed after being packaged using the embodiment；
Figure 12 is a perspective view, illustrates that preform obtained by being encapsulated, being cut using the embodiment is filled out tin slot wire frame and sealed
Fill element；
Figure 13 is a schematic cross-sectional view, aids in illustrating Figure 12；And
Figure 14 is a schematic cross-sectional view, illustrates that the preform fills out the structure state that tin slot wire frame also has conductive coating
Sample.
Specific embodiment
The utility model is described in detail with reference to the accompanying drawings and embodiments.
Before the utility model is described in detail, it shall be noted that in the following description content, similar component is with phase
With number indicate.Cooperation is refering to the embodiment that Fig. 2 to Fig. 4, Fig. 2 are that the utility model preform fills out tin slot wire frame
Side top perspective view, Fig. 3 is the back parallax stereogram of Fig. 2, and Fig. 4 is the cross-sectional view of the 4-4 secant along Fig. 2.
The embodiment includes a preform glue-line 2, a lead frame 3 and a solder unit 4.
Specifically, which is made of insulating polymer material, have a upper surface 21 reversely with each other,
A lower surface 22 and multiple tin groove 23 is eaten from the lower surface 22 towards what 21 direction of upper surface was recessed.Define it is a plurality of each other
It the Cutting Road 24 of interleaved arrangement and multiple is set in length and breadth by multiple chips being spaced each other that the Cutting Road 24 defines
Set unit 25.Fig. 2 only illustrates two of them chip setting unit 25.Wherein, each chip setting unit 25 is by indulging two-by-two
The Cutting Road 24 of horizontal interleaved adjacent is defined, the external zones 252 with a center 251 and the collar center 251.And
Each eats the firstth area that tin groove 23 is located at the Cutting Road 24 with one, and extends to respectively from the both ends in firstth area adjacent
The chip setting unit 25 the external zones 252 the secondth area.
It is noted that the aperture for eating tin groove 23 can be the both ends point being unanimously also possible to from firstth area
It is not tapered towards secondth area, using the varying aperture in firstth area and the secondth area, the tin groove 23 of eating can be allowed to be somebody's turn to do in neighbouring
The intersection in the firstth area and the secondth area has maximum diameter of hole, and is able to allow and subsequent fills out the encapsulation of tin slot wire frame via the preform
And preform obtained by cutting fills out tin slot wire frame potted element, can obtain having maximum open eats tin through-hole.
The lead frame 3 is embedded at the preform glue-line 2, has multiple chip seats 31 for being embedded at the center 251, and more
Item is embedded at the external zones 252, at the gap setting and each other electrically independent pin 32 with the chip seat 31.The chip seat 31
With the pin 32 by identical conductive material, such as: copper, copper series alloy or iron-nickel alloy etc. are constituted.
Each chip seat 31 has one reversed with the top surface 311 for the top surface 311 of semiconductor element setting and one
Bottom surface 312, the top surface 311 and the bottom surface 312 are exposed simultaneously from the upper surface 21 of the preform glue-line 2 and the lower surface 22 respectively
It is coplanar with the upper surface 21 and the lower surface 22.
The pin 32 respectively corresponds this and eats the setting of 23 position of tin groove.Each pin 32 has a wiring face 321, two
Eat tin face 323 in a bottom surface 322 and one.Wherein, the wiring face 321 is the external zones 252 from one of chip setting unit 25
The external zones 252 of adjacent another one chip setting unit 25, meeting table from this are extended to via adjacent Cutting Road 24
Face 21 is exposed and coplanar with the upper surface 21.Two bottom surfaces 322 be from the wiring face 321 extend and it is adjacent from two respectively
Chip setting unit 25 lower surface 22 it is exposed and coplanar with the lower surface 22.This, which eats tin face 323, can connect two bottoms
Face 322, and be recessed towards 21 direction of the upper surface of the preform glue-line 2, and can be from eat tin groove 23 accordingly to exposing outside.
The solder unit 4 has multiple solder layers 41, and the solder layer 41 is placed into respectively described eats tin groove 23, and institute
State solder layer 41 cover respectively cover it is at least part of eat tin face 323, and eat the table of the exposed preform glue-line 2 of tin groove 23 certainly
Face.When it is implemented, the solder layer 41 at least covers and corresponding is located at eating tin face 323 and eating tin face with this for the Cutting Road 24
The surface of the 323 adjacent preform glue-lines 2.Preferably, the solder layer 41, which is at least filled out, covers the volume for eating tin groove 23
1/2.
Specifically, the solder layer 41 be by with the same or similar Sn-containing alloy material of the soldering tin material of subsequent encapsulation
Material is constituted, can using allowing solder to cover the surface eaten tin face 323 and eat the exposed preform glue-line 2 of tin groove 23 certainly
Allow it is subsequent fill out tin slot wire frame in the cutting process after semiconductor component packing via the preform, by the solder layer
The copper metal flash that cutting process generates is coated, to avoid generation after cutting/kish flash, and can be by the solder layer
41 increase the Bonding strength of pin 32 and preform glue-line 2, avoid when cutting because of pin 32 and preform glue caused by cutting external force
Layer 2 is removed.In addition, encapsulation after potted element when later use scolding tin is connect with circuit board (not shown), using the weldering
The bed of material 41 promotes the compatibility with solder, increases reflow (reflow) and climbs the degree of tin, and is easier to visual detection.
Hereby the preparation method that the aforementioned preform fills out tin slot wire frame is described as follows.
Firstly, refering to Fig. 5, provide one by the compositions such as conductive material, such as copper, copper alloy or iron-nickel alloy substrate
900, and the Cutting Road 24 that longitudinal and transverse direction is alternatively arranged and intersects with each other is defined in the substrate 900, and by adjacent in length and breadth two-by-two
And 24 common definition of Cutting Road of intersection, it is spaced each other and in the chip setting unit 25 of array arrangement.Fig. 5 only illustrates wherein two
A chip setting unit 25.
Then, first time etch process is carried out.Refering to the front schematic view that Fig. 6,7, Fig. 6 are after etching, Fig. 7 is erosion for cooperation
Schematic rear view after quarter.900 unnecessary portion of substrate is etched and is removed, and in the predetermined of the chip setting unit 25
Position formed chip seat 31 and it is a plurality of from the Cutting Road 24 extend to adjacent chip seat 31 and with the corresponding chip seat
31 at spacing interval pin semi-finished product 320.
Then, it will be located in a mold (not shown) by the substrate 900 of first time etch process, with being molded into mode
Forming glue material is poured into, which is the encapsulating material selected from insulation, such as epoxy resin, and the forming glue material is allowed to fill up through losing
The hole of the substrate 900 after quarter, and the preform glue-line 2 is formed after enabling the forming glue material solidify, it can be obtained as shown in Figure 8
Lead frame semi-finished product.Wherein, Fig. 8 is the schematic rear view of the lead frame semi-finished product.
Then, cooperation carries out second to the lead frame semi-finished product and etches refering to Fig. 9.Can be obtained has as shown in Figure 9
Eat the preformed leads frame of tin groove.Fig. 9 is the dorsal view with the preformed leads frame for eating tin groove after etching.
Specifically, which etched from the bottom surface of the pin semi-finished product 320, by the pin half
Finished product 320 is in the corresponding region for being located at 24 position of Cutting Road and 24 two sides of Cutting Road towards the pin semi-finished product 320
The etching of top surface direction, and tin groove 23 is eaten described in being formed, and the remaining pin semi-finished product 320 after etching removal is allowed to form institute
State pin 32, and the pin 32 can have that tin groove 23 is externally exposed to eat tin face 323 from eating accordingly.
Finally, cooperation is the partial enlarged view of Fig. 9 refering to Fig. 4,9,10, Figure 10.Weldering is filled then at the tin groove 23 of eating
Material forms the weldering eaten tin face 323 and the preform glue-line 2 and eat the surface of the exposing of tin groove 23 described in for covering the pin 32
After the bed of material 41, the preform as shown in Figure 4 can be obtained and fill out tin slot wire frame.
Refering to fig. 11, it is then first when filling out tin slot wire frame using the aforementioned preform and carrying out semiconductor component packing
Semiconductor wafer 51 is set to the top surface 311 of the chip seat 31, then recycles routing processing procedure, formation allows the semiconductor
The conducting wire 52 that chip 51 is electrically connected with the pin 32, obtains semiconductor die blade unit 5.Then an insulating materials is recycled to carry out
Encapsulation forms one and covers the semiconductor die blade unit 5 and the encapsulation glue-line 6 of 2 upper surface 21 of preform glue-line, obtains such as Figure 11
Shown in potted element semi-finished product.
Finally, being cut (as shown by arrows) further along the Cutting Road 24, monolithic as shown in figure 12 can be obtained
The preform of encapsulation fills out tin slot wire frame potted element.
It is continuous cooperation refering to fig. 11 to 13, Figure 13 be the 13-13 secant along Figure 12 cross-sectional view.Since the preform fills out Xi Gou
Slot leaded package element is to fill out the cutting of Cutting Road 24 of tin slot wire frame along the preform and obtain, therefore, should after cutting
The pin 32 that preform fills out tin slot wire frame potted element can generate it is one exposed from the outer peripheral surface 26 of the preform glue-line 2, and
Tin face 323 is eaten with this to connect and the side 324 coplanar with the outer peripheral surface 26.And the tin groove 23 of eating then can after cutting
It is formed multiple respective independent and eats tin through-hole 27 from the outer peripheral surface 26 perforation to the lower surface 22；And the solder layer 41 is then
It fills out and eats tin through-hole 27 described in covering, and eat the surface of the exposed preform glue-line 2 of tin through-hole 27 from this.
In addition, it is noted that when the leaded package element is when size is smaller or thermal diffusivity requires lower, it can also
To be not required to that there is the chip seat 31, but the semiconductor wafer 51 is directly arranged in the center of the preform glue-line 2
251。
Refering to fig. 14, in some embodiments, it can also be led forming as shown in Figure 9 having and eat the preforming of tin groove
After coil holder, film-plating process is first carried out, Yu Suoshu chip seat 31 and the exposed surface of the pin 32 re-form one or more layers
Conductive coating 7 (Figure 14 is illustrated by taking one layer of conductive coating 7 as an example), then fills solder then at the tin groove 23 of eating, and is formed
Solder layer 41.The conductive coating 7 is different from 32 constituent material of pin, can be metal or alloy, for example, nickel, palladium, silver or
The metal or alloy such as gold can assist the wettability of solder Yu the pin 32 using the conductive coating 7, increase solder layer 41 and draw
Foot 32 then, and can reinforce the preformed leads frame and subsequent encapsulation polymer insulation encapsulating material and with the conducting wire
52 adherence or reliability.
It fills out the formation of tin slot wire frame in conclusion the utility model is used in the preform and eats tin groove 23, and in institute
It states and eats tin groove 23 and fill solder layer 41 in advance.Therefore, when using the preform fill out tin slot wire frame carry out semiconductor element
Encapsulation, and the copper metal flash generated during singulation by the solder layer 41 cladding cutting process after encapsulation, and keep away
Exempt to lead to the problem of/remaining metal flash after cutting, and pin 32 can be increased by solder layer 41 with preform glue-line 2 then
Intensity, when reducing cutting because the shortcomings that pin 32 and preform glue-line 2 are removed caused by cutting external force.In addition, after encapsulation, singulation
Potted element is promoted affine with solder when later use scolding tin is connect with circuit board (not shown) using the solder layer 41
Property, increasing reflow (reflow) climbs the degree of tin, can also be easier to other than it can increase the contact area of solder and the pin 32
In visual detection, so the purpose of this utility model can be reached really.
Claims (9)
1. a kind of preform fills out tin slot wire frame, it is used for packaging semiconductor, it is characterised in that: the preform to fill out tin groove
Lead frame includes:
Preform glue-line is made of insulating polymer material, has upper surface reversely with each other, lower surface, multiple from the following table
Tin groove, a plurality of Cutting Road and multiple by two of interleaved arrangement in length and breadth each other are eaten facing towards what the upper surface direction was recessed
The chip setting unit that the Cutting Road of two interleaved adjacents in length and breadth is defined, each chip setting unit have center, and
The external zones of the collar center, each, which eats tin groove, has positioned at the firstth area of the Cutting Road, and respectively from firstth area
Both ends extend to the adjacent chip setting unit external zones the secondth area；
Lead frame is constructed from a material that be electrically conducting and is embedded at the preform glue-line, has and eats tin groove described in a plurality of respectively correspond
Pin, each pin have wiring face, two bottom surfaces, and connect two bottom surfaces and towards the upper surface of the preform glue-line
Direction recess eats tin face, wherein the wiring face is the external zones from one of chip setting unit via adjacent cutting
Road extends to the external zones of adjacent another one chip setting unit, and the wiring face can be from the upper table of the preform glue-line
Face is exposed and coplanar with the upper surface, which is to extend from the wiring face and be arranged respectively from two adjacent chips
The lower surface of unit is exposed and coplanar with the lower surface, and each eat tin face can be from eat tin groove accordingly to exposing outside；
And
Solder unit, has multiple solder layers, the solder layer be located at it is described eat tin groove, and the solder layer lid cover to
The least a portion of surface for eating tin face and the exposed preform glue-line of tin groove is eaten from this.
2. preform according to claim 1 fills out tin slot wire frame, it is characterised in that: the solder layer at least covers pair
The surface for eating tin face and the adjacent preform glue-line in tin face is eaten with this of the Cutting Road should be located at.
3. preform according to claim 2 fills out tin slot wire frame, it is characterised in that: the solder layer, which is at least filled out, covers this
Eat the 1/2 of the volume of tin groove.
4. preform according to claim 1 fills out tin slot wire frame, it is characterised in that: the lead frame also includes multiple crystalline substances
Bar, the chip seat are embedded at the center of the chip setting unit respectively, and with the pin each other in spacing
Interval, and the top surface of each chip seat and its bottom surface are exposed from the upper surface and the lower surface respectively, and with the upper surface and
The lower surface is coplanar.
5. preform according to claim 4 fills out tin slot wire frame, it is characterised in that: the top surface of the chip seat and institute
The wiring face for stating pin also has at least one layer of conductive coating different from the pin constituent material.
6. a kind of preform fills out tin slot wire frame potted element, it is characterised in that: include:
Preform glue-line is made of insulating polymer material, is had upper surface reversely with each other, lower surface, is connected the upper surface
And the outer peripheral surface of the lower surface and multiple respective independent and penetrate through from the outer peripheral surface to the lower surface and eat tin through-hole, definition should
Preform glue-line has the external zones of center and the collar center；
Lead frame unit is constructed from a material that be electrically conducting and is embedded at the preform glue-line, has a plurality of electrical property each other independent, is embedded at
The pin of tin through-hole is eaten described in the external zones and correspondence, each pin has exposed from the upper surface and puts down altogether with the upper surface
The wiring face in face, extend from the wiring face and and with the outer peripheral surface coplanar side exposed from the outer peripheral surface, from the lower surface
Exposed and coplanar with lower surface bottom surface, and connect the side and the bottom surface eat tin face, and this eat tin face can be from corresponding
Eat tin through-hole to exposing outside；
Solder unit, has multiple solder layers, and the solder layer is placed into described eats tin through-hole respectively；And
Semiconductor die blade unit, the semiconductor wafer for the center for being set to the preform glue-line with one and a plurality of order should
The conducting wire that semiconductor wafer is electrically connected with the wiring face of the pin.
7. preform according to claim 6 fills out tin slot wire frame potted element, it is characterised in that: the lead frame unit
The chip seat for being also embedded at the center with one, the top surface and its bottom surface of the chip seat are respectively from the corresponding center
The upper surface and the lower surface are exposed, and coplanar with the upper surface and the lower surface, and the semiconductor wafer is set to the crystalline substance
The top surface of bar.
8. preform according to claim 6 fills out tin slot wire frame potted element, it is characterised in that: the solder layer with
There are also at least one layer of conductive coatings different from the pin constituent material between the wiring face of the pin.
9. preform according to claim 6 fills out tin slot wire frame potted element, it is characterised in that: the preform fills out tin
Slot wire frame potted element also includes the encapsulation glue-line for covering the semiconductor die blade unit and the upper surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920433352.4U CN209544331U (en) | 2019-04-01 | 2019-04-01 | Preform fills out tin slot wire frame and its potted element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20210134754A1 (en) * | 2019-10-30 | 2021-05-06 | Shinko Electric Industries Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20210134754A1 (en) * | 2019-10-30 | 2021-05-06 | Shinko Electric Industries Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| US11929342B2 (en) * | 2019-10-30 | 2024-03-12 | Shinko Electric Industries Co., Ltd. | Semiconductor device with leads having step surfaces |
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