CN109243988A - Packaging body and its packaging method - Google Patents
Packaging body and its packaging method Download PDFInfo
- Publication number
- CN109243988A CN109243988A CN201811074815.9A CN201811074815A CN109243988A CN 109243988 A CN109243988 A CN 109243988A CN 201811074815 A CN201811074815 A CN 201811074815A CN 109243988 A CN109243988 A CN 109243988A
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- Prior art keywords
- muscle
- packaging
- metal
- connects
- connect
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 127
- 238000000034 method Methods 0.000 title claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 104
- 239000002184 metal Substances 0.000 claims abstract description 104
- 210000003205 muscle Anatomy 0.000 claims abstract description 97
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 32
- 230000009194 climbing Effects 0.000 claims abstract description 11
- 150000002739 metals Chemical class 0.000 claims description 18
- 238000005538 encapsulation Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 12
- 238000003466 welding Methods 0.000 abstract description 5
- 238000012790 confirmation Methods 0.000 abstract description 4
- 229910052718 tin Inorganic materials 0.000 description 26
- 238000010586 diagram Methods 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000005022 packaging material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The present invention provides a kind of packaging body and its packaging method.It the advantage is that, the metal connects the bottom surface of muscle in step-like, tin layers can be climbed described in being then covered in the side of step-like structure, when the packaging body is connect with external structure (such as printed circuit board), metal connects bottom surface and the solder contact of muscle, due to the presence for climbing tin layers, the solder can also climb along the side of step-like structure, and then solder can be observed from the side of packaging body, consequently facilitating the welding situation of confirmation packaging body, and then improve the reliability and solderability of packaging body.
Description
Technical field
The present invention relates to field of semiconductor package more particularly to a kind of packaging body and its packaging methods.
Background technique
Semiconductor packaging encapsulates form there are many including, wherein the square flat non-pin of quad flat package series
Encapsulation has shorter signal transmission path and comparatively faster signal transmission speed, therefore is one of the mainstream of encapsulation kenel.
Fig. 1 is the structural schematic diagram of existing square flat no-pin packaging body.Referring to Fig. 1, square flat non-pin
The bottom surface of packaging body 10 has multiple pins 11, and the pin 11 does not protrude from 10 surface of packaging body.The pin 11
Bottom surface is exposed to the bottom surface of the square flat no-pin packaging body 10, and the side of the pin 11 is exposed to the quad flat
The side of leadless packages body 10.There are solderable metal layers 12 in the bottom surface of the pin 11, in order to tie with circuit board etc.
Structure is welded, and the side of the pin 11, then without solderable metal layers, the side of the pin 11, which can expose to state, draws
The ground of foot 11, for example, the side of the pin 11 exposes copper material.Its shortcoming is that tin is not climbed in the side of the pin 11,
It is difficult to observe the welding situation for confirming the square flat no-pin packaging body 10, this kind of square flat no-pin packaging body 10 can
It is not high by property and solderability, formed this kind of square flat no-pin packaging body 10 packaging method be not suitable for prepare reliability and
The demanding product of solderability.
Therefore, develop a kind of packaging method suitable for preparing the demanding product of reliability, solderability and reliability, can
The high encapsulating products of weldering property become emphasis.
Summary of the invention
The technical problem to be solved by the invention is to provide a kind of packaging body and its packaging methods, can be improved encapsulation
The reliability and solderability of body.
To solve the above-mentioned problems, the present invention provides a kind of packaging method, include the following steps: to provide a lead frame
Frame, the lead frame have the framework of multiple frame units and the multiple frame units of connection, and the frame unit has
One packaging line and at least a metal connect muscle, and the metal connects muscle and connect with the framework；Carry out it is pre-packaged, to the lead frame
Plastic packaging is carried out, and the metal for exposing the lead frame back side connects muscle；Connect muscle intersection in the packaging line and the metal, at least
It removes the part metals on the inside of the packaging line and connects muscle, so that the thickness that the metal connects muscle towards one end of packaging line is less than institute
The thickness that metal connects the one end of muscle far from packaging line is stated, is that step-like metal connects muscle to form bottom surface；Connect the bottom of muscle in metal
Face, which forms one, can climb tin layers；Encapsulation, and cut, form multiple packaging bodies independent of each other.
In one embodiment, before removing the step of part metals on the inside of the packaging line connect muscle, the metal connects
Muscle is all-metal structure.
In one embodiment, connect muscle intersection in the packaging line and the metal, using the method for lower surface half-etching
It removes the part metals on the inside of the packaging line and connects muscle.
In one embodiment, the encapsulation step includes die bond and routing technique.
The present invention also provides a kind of packaging bodies comprising plastic-sealed body and at least a metal connect muscle, and each metal connects muscle
Bottom surface and side be exposed to the bottom surface and side of the plastic-sealed body, the metal connect muscle towards packaging body edge one end thickness
Degree is less than the metal and connects thickness of the muscle towards one end of package interior, so that the metal connects the bottom surface of muscle in step
Shape, tin layers can be climbed by being covered with one in the bottom surface that the metal connects muscle.
In one embodiment, the tin layers of climbing are metal layer.
In one embodiment, the side for climbing tin layers is exposed to the side of the plastic-sealed body.
In one embodiment, multiple metals connect muscle and are symmetrical arranged.
In one embodiment, the packaging body further includes a Ji Dao, and the bottom surface of the Ji Dao is exposed to the plastic-sealed body
Bottom surface is provided with chip in the Ji Dao, and the plastic-sealed body coats the chip.
It is an advantage of the current invention that the metal connects the bottom surface of muscle in step-like, then covered in the side of step-like structure
Tin layers can be climbed described in having, when the packaging body to be connect with external structure (such as printed circuit board), metal connects the bottom surface of muscle
With solder contact, due to the presence for climbing tin layers, the solder can also climb along the side of step-like structure, Jin Erneng
It is enough to observe solder from the side of packaging body, consequently facilitating the welding situation of confirmation packaging body, and then improve the reliable of packaging body
Property and solderability.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of existing square flat no-pin packaging body；
Fig. 2 is the step schematic diagram of packaging method of the present invention；
Fig. 3 A~Fig. 3 H is the flow diagram of packaging method of the present invention；
Fig. 4 is the structural schematic diagram of an embodiment of the packaging body.
Specific embodiment
It elaborates with reference to the accompanying drawing to the specific embodiment of packaging body provided by the invention and its packaging method.
Wherein, in various figures, it in order to illustrate technical solution of the present invention, is only symbolically painted related to technical solution of the present invention
All parts between relative positional relationship, wherein the size with actual size of all parts may not met, the present invention couple
This is without limiting.
The present invention provides a kind of packaging method.Fig. 2 is the step schematic diagram of packaging method of the present invention.Referring to Fig. 2, this hair
Bright packaging method include the following steps: step S20, provide a lead frame, the lead frame have multiple frame units and
The framework of multiple frame units is connected, there is the frame unit packaging line and an at least metal to connect muscle, the metal
Even muscle is connect with the framework；Step S21, progress is pre-packaged, carries out plastic packaging to the lead frame, and expose lead frame
The metal at the back side connects muscle；Step S22, connect muscle intersection in the packaging line and the metal, at least remove in the packaging line
The part metals of side connect muscle, so that the thickness that the metal connects muscle towards one end of packaging line is less than the metal and connects muscle far from envelope
The thickness of one end of wiring is that step-like metal connects muscle to form bottom surface；Step S23, one is formed in the bottom surface that metal connects muscle
Tin layers can be climbed；Step S24, it encapsulates；Step S25, it cuts, forms multiple packaging bodies independent of each other.
Fig. 3 A~Fig. 3 H is the flow diagram of packaging method of the present invention.
Step S20 and Fig. 3 A is please referred to, a lead frame 300 is provided.The lead frame 300 has multiple frame units
301 and the multiple frame units 301 of connection framework 302.In the present embodiment, in order to clearly illustrate the technology of the present invention side
Case is only painted four frame units 301.Each frame unit 301 has a packaging line 303 and at least a metal connects muscle
304.Wherein, the packaging line 303 is not entity structure, and encapsulation boundary when being subsequent encapsulating process uses in the accompanying drawings
Dotted line is painted.The metal connects muscle 304 and connect with the framework 302, wherein in the present embodiment, the metal connects muscle 304 and is
All-metal structure.In addition, each frame unit 301 further includes other conventional structures, for example, base island 305, no longer superfluous herein
It states.
Step S21 and Fig. 3 B are please referred to, packaging method of the present invention include thes steps that one is pre-packaged, i.e., to the lead frame
Frame 300 is carried out pre-filled using plastic packaging material 320.Plastic packaging is carried out to the lead frame 300, and exposes the wire frame 300
The metal at the back side connects muscle 304.Fig. 3 B is the schematic diagram at 300 back side of lead frame.As can be seen from Figure 3B, in the lead
The back side of frame 300, the lead frame 300 by 320 plastic packaging of plastic packaging material, only expose the metal connect muscle 304 bottom surface and
The bottom surface on the base island 305.Wherein, in the subsequent process, the bottom surface that all or part of metal connects muscle 304 needs and other
Structure is electrically connected.
Please refer to step S22, Fig. 3 C and Fig. 3 D, wherein Fig. 3 D is side, sectional view, the packaging line 303 with
The metal connects 304 intersection of muscle, and the part metals at least removing 303 inside of packaging line connect muscle 304, so that the metal
Even the thickness of muscle 304 towards one end of packaging line 303 is less than the thickness that the metal connects the one end of muscle 304 far from packaging line 303,
It is that step-like metal connects muscle 304 to form bottom surface.Wherein, the part metals for removing 303 inside of packaging line connect the finger of muscle 304
Be that the thickness direction removal part metals for connecting muscle 304 in metal connect muscle 304, in the length direction for connecting muscle 304 along the metal,
The metal connects muscle 304 or continuous structure.
Specifically, connecting 304 intersection of muscle with the metal in the packaging line 303, can only remove in packaging line 303
The part metals of side connect muscle, and the part metals that can also remove 303 inside of packaging line and outside connect muscle 304.Please refer to figure
3D, after removal part metals connect muscle 304, in the inside of the packaging line 303, the metal connects muscle 304 towards packaging line 303
The thickness L1 of one end is less than the thickness L2 that the metal connects the one end of muscle 304 far from packaging line 303, forms a step-like structure.
For example, in the present embodiment, the metal for removing 303 inside of packaging line and outside connects muscle 304.Wherein, the packaging line 303
Inside refers to that the packaging line 303 towards the side inside the frame unit 301, refers on the outside of the packaging line 303
Side of the packaging line 303 away from the inside of the frame unit 301.It removes the part metals and connects the method for muscle 304 and include
But it is not limited to lower surface half-etching technique.
Please refer to step S23 and Fig. 3 E, wherein Fig. 3 E is side, sectional view, connects the bottom surface of muscle 304 in the metal
Tin layers 306 can be climbed by forming one.Specifically, being handled using the methods of plating the bottom surface of the lead frame 300, then exist
It is exposed to the metal except the plastic packaging material 320 and connects and form one on the bottom surface of muscle 304 and can climb tin layers 306.Metal shown in Fig. 3 E
Even the step-like bottom surface of muscle 304 all can be climbed tin layers 306 and be covered.In the present embodiment, due to the bottom surface on the base island 305
Also it is exposed to except the plastic packaging material 320, then the bottom surface on the base island 305 also can be climbed tin layers 306 and be covered.Wherein, described can
The material for climbing tin layers 306 includes but is not limited to tin, nickel, palladium, copper and its alloy, and the tin layers 306 of climbing allow solder to climb.
In this step, the metal connects the bottom surface of muscle 304 in step-like, then in the side of step-like structure (in such as figure
Arrow A institute presentation surface, the i.e. direction towards 301 side of encapsulation unit) be again covered with it is described can climb tin layers 306, from the lead
The side of the step-like structure can be observed in the side of frame unit 301.
Please refer to step S24 and Fig. 3 F, wherein Fig. 3 F is side, sectional view, is packaged technique, forms multiple envelopes
Fill body 307.Specifically, the packaging technology includes the techniques such as die bond, routing and plastic packaging.It is conventional packaging technology, mesh
Be to form multiple packaging bodies 307.
Please refer to step S25, Fig. 3 G and Fig. 3 H, wherein Fig. 3 G is side, sectional view, and Fig. 3 H is the solid of packaging body
Schematic diagram is cut, and forms multiple packaging bodies 307 independent of each other, metal, which connects muscle 304, can be used as the packaging body 307
Pin uses.Wherein, the cutting method includes but is not limited to machine cuts or laser cutting etc..It is described to climb in cut place
The side of tin layers 306 is exposed to the side of packaging body 304, and the side that the metal connects muscle 304 is exposed to the side of packaging body 304
Face.
For the packaging body 307 formed after cutting, although the metal described in cutting position connects muscle 304 and exposes ground,
It is, since the metal connects the bottom surface of muscle 304 in step-like, then in the side of step-like structure (as indicated by arrow A in figure
Surface, the i.e. direction towards 307 side of packaging body) it is covered with and described can climb tin layers 306.Then when by the packaging body 307 and outside
When portion's structure (such as printed circuit board) connects, metal connects bottom surface and the solder contact of muscle 304, climbs tin layers 306 due to described
Presence, the solder can also climb along the side of step-like structure, and then can observe weldering from the side of packaging body 307
Material, consequently facilitating the welding situation of confirmation packaging body 307.
The present invention also provides a kind of packaging bodies.Fig. 4 is the structural schematic diagram of an embodiment of the packaging body, wherein Fig. 4
To overturn view, i.e., the schematic diagram of the described packaging body bottom surface upward.Referring to Fig. 4, the packaging body 4 include plastic-sealed body 400 and
At least a metal connects muscle 401.In the present embodiment, 8 metals are schematically painted and connect muscle 401, multiple metals connect muscle 401
It is symmetrical arranged, any metal can be connected the pin that muscle 401 is set as packaging body 4 according to actual needs.
Each metal connects the bottom surface of muscle 401 and side is exposed to the bottom surface and side of the plastic-sealed body 400.The gold
The thickness for belonging to even muscle 401 towards the one end at 4 edge of packaging body is less than the metal and connects muscle 401 towards one end inside packaging body 4
Thickness be then able to observe that institute in the side of the packaging body 4 so that the metal connects the bottom surface of muscle 401 in step-like
State the side (surface shown as indicated by the arrows in the figure) of step-like structure.
Tin layers 402 can be climbed by being covered with one in the bottom surface that the metal connects muscle 401, i.e., be covered on the step-like structure
It is described to climb tin layers 402.The tin layers of climbing include but is not limited to metal layer, and material includes but is not limited to tin, nickel, palladium, copper
And its alloy.The side for climbing tin layers 402 is exposed to the side of the plastic-sealed body 4.
Further, the packaging body 4 further includes a base island 403.The bottom surface on the base island 403 is exposed to the plastic-sealed body
400 bottom surface.Wherein, the structures such as settable chip (not being painted in attached drawing) on the base island 403, the plastic-sealed body 400 wrap
Cover the chip.Wherein, the internal structure of the packaging body 4 is conventional structure, is repeated no more.
For packaging body 4 of the present invention, since the metal connects the bottom surface of muscle 401 in step-like, then in step-like knot
The side (surface as indicated by arrow A in figure, the i.e. direction towards 4 side of packaging body) of structure can climb tin layers described in being covered with
402.Then when the packaging body 4 to be connect with external structure (such as printed circuit board), metal connects bottom surface and the solder of muscle 401
Contact, due to the presence for climbing tin layers 402, the solder can also climb along the side of step-like structure, and then can
Solder is observed from the side of packaging body 4, consequently facilitating the welding situation of confirmation packaging body 4.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (9)
1. a kind of packaging method, which comprises the steps of:
One lead frame is provided, the lead frame has the framework of multiple frame units and the multiple frame units of connection,
There is the frame unit packaging line and an at least metal to connect muscle, and the metal connects muscle and connect with the framework；
It carries out pre-packaged, plastic packaging is carried out to the lead frame, and the metal for exposing the lead frame back side connects muscle；
Connect muscle intersection in the packaging line and the metal, at least removes the part metals on the inside of the packaging line and connect muscle, make
It obtains the thickness that the metal connects muscle towards one end of packaging line and is less than the thickness that the metal connects the one end of muscle far from packaging line, with
Forming bottom surface is that step-like metal connects muscle；
Tin layers can be climbed by forming one in the bottom surface that metal connects muscle；
Encapsulation, and cut, form multiple packaging bodies independent of each other.
2. packaging method according to claim 1, which is characterized in that connect removing the part metals on the inside of the packaging line
Before the step of muscle, it is all-metal structure that the metal, which connects muscle,.
3. packaging method according to claim 1, which is characterized in that connect muscle in the packaging line and the metal and have a common boundary
Place, connects muscle using the part metals that the method for lower surface half-etching removes on the inside of the packaging line.
4. packaging method according to claim 1, which is characterized in that the encapsulation step includes die bond and routing technique.
5. a kind of packaging body, which is characterized in that including plastic-sealed body and an at least metal connects muscle, and each metal connects the bottom surface of muscle
And side is exposed to the bottom surface and side of the plastic-sealed body, the thickness that the metal connects muscle towards the one end at packaging body edge is less than
The metal connects muscle towards the thickness of one end of package interior, so that the metal connects the bottom surface of muscle in step-like, in institute
It states metal and connects the bottom surface of muscle and be covered with one and can climb tin layers.
6. packaging body according to claim 5, which is characterized in that the tin layers of climbing are metal layer.
7. packaging body according to claim 5, which is characterized in that the side for climbing tin layers is exposed to the plastic-sealed body
Side.
8. packaging body according to claim 5, which is characterized in that multiple metals connect muscle and are symmetrical arranged.
9. packaging body according to claim 5, which is characterized in that the packaging body further includes a Ji Dao, the Ji Dao's
Bottom surface is exposed to the bottom surface of the plastic-sealed body, the Ji Dao is provided with chip, the plastic-sealed body coats the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811074815.9A CN109243988A (en) | 2018-09-14 | 2018-09-14 | Packaging body and its packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811074815.9A CN109243988A (en) | 2018-09-14 | 2018-09-14 | Packaging body and its packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109243988A true CN109243988A (en) | 2019-01-18 |
Family
ID=65058502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811074815.9A Pending CN109243988A (en) | 2018-09-14 | 2018-09-14 | Packaging body and its packaging method |
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| Country | Link |
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| CN (1) | CN109243988A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111163595A (en) * | 2020-01-03 | 2020-05-15 | 珠海格力电器股份有限公司 | Chip packaging method |
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| CN1638111A (en) * | 2003-12-25 | 2005-07-13 | 株式会社瑞萨科技 | Method of manufacturing a semiconductor device |
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