CN209515657U

CN209515657U - A kind of encapsulating structure

Info

Publication number: CN209515657U
Application number: CN201822263046.9U
Authority: CN
Inventors: 张江华; 梁新夫; 沈锦新; 周海峰; 吴昊平; 周青云
Original assignee: Jiangsu Changjiang Electronics Technology Co Ltd
Current assignee: JCET Group Co Ltd
Priority date: 2018-12-31
Filing date: 2018-12-31
Publication date: 2019-10-18
Anticipated expiration: 2028-12-31

Abstract

The utility model relates to a kind of encapsulating structures, it includes substrate (1), metallic circuit layer (2) are provided on the substrate (1), chip (3) are provided on the metallic circuit layer (2), there are multiple ground pads (6) and power supply weld pad (7) in chip (3) front, convex block on partial earthing weld pad (6) is together in series to form ground terminal convex block (4), convex block on partial power weld pad (7) is together in series to form power end convex block (5), the chip (3) is connected by ground terminal convex block (4) power end convex block (5) and with metallic circuit layer (2), insulating materials (8) are filled between ground terminal convex block (4) the power end convex block (5).A kind of encapsulating structure of the utility model, convex block in chip front side partial power weld pad or ground pad is together in series by it, forms the projection cube structure of strip, can reduce packaged resistance, and insulating materials can be allowed to fill between chip and substrate, guarantee overall package reliability of structure.

Description

A kind of encapsulating structure

Technical field

The utility model relates to a kind of encapsulating structures, belong to technical field of semiconductor encapsulation.

Background technique

The product of low-voltage, high current, in order to which the electric connection provided between chip and substrate is by independent one by one Metal coupling realize that and the number of slugs of two electrodes is very more (as shown in FIG. 1 to 3).

Weld pad on chip is all to be powered by convex block, but the impedance that this design will cause intermediate region is larger, leads The voltage in this region is caused to reduce.

With the development of electronic technology, requirement of the client to electronic product is higher and higher.It is produced in some low-voltages, high current In product, for the voltage for guaranteeing chip, need to realize using three layers of above substrate.

Utility model content

Technical problem to be solved in the utility model is to provide a kind of encapsulating structure for the above-mentioned prior art, it is by core The positive partial power weld pad of piece or ground pad are together in series, and form the projection cube structure of strip, can reduce packaged resistance.

The technical scheme in the invention for solving the above technical problem are as follows: a kind of encapsulating structure, it includes substrate, described It is provided with metallic circuit layer on substrate, chip is provided on the metallic circuit layer, the chip front side there are multiple ground pads With power supply weld pad, the convex block on partial earthing weld pad is together in series to form ground terminal convex block, the convex block string on partial power weld pad Connection gets up to form power end convex block, and the chip is connected by ground terminal convex block and power end convex block with metallic circuit layer, institute It states between ground terminal convex block and power end convex block filled with insulating materials.

The shape of the ground terminal convex block or power end convex block is strip.

Compared with the prior art, the advantages of the utility model are:

1, partial power end convex block or partial earthing end convex block are together in series to form the projection cube structure of strip, can allow absolutely Edge material is filled between chip and substrate, guarantees overall package reliability of structure；

2, chip is electrically connected to substrate by the projection cube structure of strip, and the pressure drop of chip pad to substrate is reduced, can To reduce packaged resistance, while the convex block area for connecting chip and substrate increases, and package cooling enhancing, chip operating temperature is low, Chip operation is more stable, while can reduce the cost of additional heat dissipation equipment；

3, partial power end convex block or partial earthing end convex block are together in series to form the projection cube structure of strip, can reduce Packaged resistance reduces the loss of chip supply voltage, improves single digital cash chip and calculates power, improves chip efficiency, furthermore reduce It is low in energy consumption caused by encapsulation, reduce product power consumption.

Detailed description of the invention

Fig. 1 is the schematic diagram of the end existing chip VSS (ground terminal) convex block.

Fig. 2 is the schematic diagram of the end existing chip VCC (power end) convex block.

Fig. 3 is the schematic diagram of the end existing chip VCC/VSS convex block.

Fig. 4 is a kind of schematic diagram of encapsulating structure of the utility model.

Fig. 5 is the schematic diagram of the end chip VCC/VSS convex block in Fig. 4.

Wherein:

Substrate 1

Metallic circuit layer 2

Chip 3

Ground terminal convex block 4

Power end convex block 5

Ground pad 6

Power supply weld pad 7

Insulating materials 8.

Specific embodiment

The utility model is described in further detail below in conjunction with figure embodiment.

Referring to fig. 4, Fig. 5, the utility model relates to a kind of encapsulating structure, it includes substrate 1, is arranged on the substrate 1 There is metallic circuit layer 2, chip 3 is provided on the metallic circuit layer 2, there are multiple ground pads 6 and power supply in 3 front of chip Weld pad 7, the convex block on partial earthing weld pad 6 are together in series to form ground terminal convex block 4, the convex block series connection on partial power weld pad 7 Getting up to be formed power end convex block 5, the chip 3 is connected by 4 power end convex block 5 of ground terminal convex block and with metallic circuit layer 2, Insulating materials 8 is filled between the 4 power end convex block 5 of ground terminal convex block.

The shape of the ground terminal convex block 4 or power end convex block 5 is strip.

Outside above-described embodiment, the utility model further includes having other embodiments, all using equivalents or equivalent to replace The technical solution that the mode of changing is formed should all be fallen within the protection scope of the utility model claims.

Claims

1. a kind of encapsulating structure, it is characterised in that: it includes substrate (1), is provided with metallic circuit layer (2) on the substrate (1), It is provided with chip (3) on the metallic circuit layer (2), there are multiple ground pads (6) and power supply weld pad in chip (3) front (7), the convex block on partial earthing weld pad (6) is together in series to be formed ground terminal convex block (4), the convex block on partial power weld pad (7) It is together in series to be formed power end convex block (5), the chip (3) passes through ground terminal convex block (4) power end convex block (5) and and metal wire Road floor (2) is connected, and is filled with insulating materials (8) between ground terminal convex block (4) the power end convex block (5).

2. a kind of encapsulating structure according to claim 1, it is characterised in that: the ground terminal convex block (4) or power end are convex The shape of block (5) is strip.