CN209461430U - A kind of slow lifting trough body structure preventing silicon wafer adhesion - Google Patents
A kind of slow lifting trough body structure preventing silicon wafer adhesion Download PDFInfo
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- CN209461430U CN209461430U CN201920697192.4U CN201920697192U CN209461430U CN 209461430 U CN209461430 U CN 209461430U CN 201920697192 U CN201920697192 U CN 201920697192U CN 209461430 U CN209461430 U CN 209461430U
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- silicon wafer
- slow lifting
- pallet
- body structure
- trough body
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Abstract
The utility model discloses a kind of slow lifting trough body structures for preventing silicon wafer adhesion, including lift slot slowly, are provided with pallet in the slow lifting slot, several isolation boards are equidistantly arranged at intervals on the pallet, the isolation board two sides offer drainage trough.The drainage trough of the isolation board two sides setting is in cross-distribution, and the drainage trough of each side is provided with 10-15 root, and draining groove width is 0.5-0.7mm, depth 0.3-0.4mm.The utility model is not in the case where being changed existing trough body structure and clamp fixture, simply the slow lifting intracorporal pallet of slot is transformed, increase the isolation board of one group of equidistant interval, and pass through the drainage trough opened up thereon, it can effectively prevent the adhesion of thin silicon wafer, silicon wafer yields is improved, practicability is very strong, highly promotes.
Description
Technical field
The utility model relates to silicon wafer wool making technical field, specially a kind of slow lifting groove body knot for preventing silicon wafer adhesion
Structure.
Background technique
Proposing effect drop is originally the manufacturing permanent theme of photovoltaic.In current silicon based cells piece manufacturing cost, supplied materials silicon wafer
Cost still occupies 50% or more, and the thinner silicon wafer of use obviously can directly reduce cell piece cost, improves competitiveness.But it is thinner
Silicon wafer mean higher flexible and bendable curvature.When monocrystalline silicon piece thickness is reduced to 160 μm or less, making herbs into wool board tradition
Frock clamp be not sufficient to ensure that silicon wafer possesses enough spacing to prevent silicon wafer from having adhesion existing before entering drying tank
The generation of elephant.Silicon wafer, due to the adsorption capacity of water between silicon wafer, causes two panels silicon wafer to be attached together when being raised from liquid,
The adhesion of adjacent sheet not only results in liquor residue on silicon wafer, and the drying effect for also resulting in silicon wafer is bad, remained on surface water
Mark influences to work as process yield, and causes difficulty to the production of next diffusing procedure, and steam will be to high temperature furnace in diffusion process
Pipe pollutes, and influences production yield.
The factor for influencing silicon wafer adhesion not only has the thickness of silicon wafer, the spacing that there are also silicon wafers in the gaily decorated basket.In existence conditions
Under, the overall dimensions of gaily decorated basket tooling are that the size of adaptation making herbs into wool groove body has been fixed, and change gaily decorated basket size and are bound to make to entire
Suede equipment is transformed, and cost and complexity are all higher, and without changing gaily decorated basket overall dimensions size, silicon wafer spacing has not had
The space further increased.
Thus under the trend that silicon wafer thickness further decreases, a kind of simple and easy method for improving silicon wafer adhesion is found
It is necessary, but the monocrystalline making herbs into wool board in industry is mostly slot type at present, and slow lifting slot is provided with before drying tank, is led to
It crosses and the gaily decorated basket is slowly lifted from water the amount of liquid reduction so that silicon chip surface absorption, prevent silicon wafer adhesion.
But such method is smaller in silicon wafer thickness, when toughness is higher, due to capillary phenomenon, moisture of the silicon wafer close to place
It can not flow down, lead to silicon wafer adhesion, hot air circulation drying effect of the silicon wafer of adhesion in drying tank be not good enough, leads to after silicon slice charging
Moisture is often still had, and there is liftable bottom tray inside general slow lifting slot, to realize the promotion of the gaily decorated basket, usually
Pallet result is relatively simple, only has liftable function, so needing a kind of novel slow lifting slot structure that solution adhesion is gone to ask
Topic.
Utility model content
The purpose of this utility model is to provide a kind of slow lifting trough body structures for preventing silicon wafer adhesion, to solve above-mentioned back
The problem of being proposed in scape technology.
To achieve the above object, the utility model provides the following technical solutions:
A kind of slow lifting trough body structure preventing silicon wafer adhesion, including slot is lifted slowly, support is provided in the slow lifting slot
Disk is equidistantly arranged at intervals with several isolation boards on the pallet, and the isolation board two sides offer drainage trough.
Preferably, four corners of the pallet are fixedly installed gaily decorated basket stuck point.
Preferably, the isolation board is highly 6-8cm with a thickness of 1.0-1.5mm, width 3-4cm.
Preferably, the drainage trough of the isolation board two sides setting is in cross-distribution, and the drainage trough of each side is provided with
10-15 root, and draining groove width is 0.5-0.7mm, depth 0.3-0.4mm.
Preferably, the spacing between the every two pieces adjacent isolation boards is 4mm.
Compared with prior art, the utility model has the beneficial effects that
The utility model is not in the case where being changed existing trough body structure and clamp fixture, simply to slow lifting slot
Intracorporal pallet is transformed, and increases the isolation board of one group of equidistant interval, and the drainage trough by opening up thereon, can be effective
The adhesion of thin silicon wafer is prevented, improves silicon wafer yields, practicability is very strong, highly promotes.
Detailed description of the invention
Fig. 1 is the overall structure schematic top plan view of the utility model；
Fig. 2 is the overall structure schematic front view of the utility model；
Fig. 3 is the overall structure left view schematic diagram of the utility model；
Fig. 4 be the utility model pallet with board connecting structure schematic front view is isolated；
Fig. 5 be the utility model pallet with board connecting structure left view schematic diagram is isolated；
Fig. 6 is drainage trough CONSTRUCTED SPECIFICATION schematic diagram on the isolation board of the utility model.
In figure: 1 slow lifting slot, 2 pallets, 3 isolation boards, 4 drainage troughs, 5 gaily decorated basket stuck points.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-6 is please referred to, the utility model provides a kind of technical solution:
A kind of slow lifting trough body structure preventing silicon wafer adhesion, including slot 1 is lifted slowly, slow lift in slot 1 is provided with pallet
2, four corners of pallet 2 are fixedly installed gaily decorated basket stuck point 5, and gaily decorated basket stuck point 5 is used to block the gaily decorated basket for holding silicon wafer, pallet
Several isolation boards 3 are equidistantly arranged at intervals on 2, isolation board 3 is highly 6-8cm with a thickness of 1.0-1.5mm, width 3-4cm,
The drainage trough 4 of 3 two sides of isolation board setting is in cross-distribution, and the drainage trough 4 of each side is provided with 10-15 root, and drainage trough 4
Width is 0.5-0.7mm, depth 0.3-0.4mm, and the spacing between every two pieces of adjacent separator plates 3 is 4mm, 3 two sides of isolation board
Face offers drainage trough 4.
Embodiment one:
There is liftable bottom tray 2, the utility model is by being added one in the intermediate of pallet 2 inside slow lifting slot 1
Row have drainage trough 4 isolation board 3, isolation board 3 can enter silicon wafer gap in, in gaily decorated basket lifting process, by silicon wafer it
Between liquid by drainage trough 4 import lower section groove body, avoiding liquid from remaining between silicon wafer leads to adhesion, and the utility model is existing
In structure basis, by simply adding component, the ability of anti-silicon wafer adhesion is realized.
For isolation board 3 with a thickness of 1.5mm, top is flat, and spacing is suitable with silicon wafer spacing, about 4mm, and the gaily decorated basket enters slow lifting slot
1 when being placed on pallet 2, and by laser positioning, silicon wafer spacing is standing for those in the field, in the gaily decorated basket is set to about 4mm
Left and right, precision guarantee that isolation board 3 enters silicon wafer gap enough, and 3 height of isolation board is 8cm, reaches silicon wafer central region, top
It is smooth, prevent plowing from silicon wafer, width drains groove width 0.7mm, depth 0.4mm, spacing 2.5mm in 4cm, two sides cross-distribution,
Every face is evenly distributed with 11 drainage troughs, simple right in the case where not being changed to existing trough body structure and clamp fixture
The structure on pallet 2 in slow lifting slot 1 is transformed, and is increased by one group of isolation board 3, is effectively prevent the adhesion of thin silicon wafer, improves
Yield.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of slow lifting trough body structure for preventing silicon wafer adhesion, including slot (1) is lifted slowly, setting in the slow lifting slot (1)
There are pallet (2), it is characterised in that: be equidistantly arranged at intervals with several isolation boards (3) on the pallet (2), the isolation board (3) two
Side offers drainage trough (4).
2. a kind of slow lifting trough body structure for preventing silicon wafer adhesion according to claim 1, it is characterised in that: the pallet
(2) four corners are fixedly installed gaily decorated basket stuck point (5).
3. a kind of slow lifting trough body structure for preventing silicon wafer adhesion according to claim 1, it is characterised in that: the isolation
Plate (3) is highly 6-8cm with a thickness of 1.0-1.5mm, width 3-4cm.
4. a kind of slow lifting trough body structure for preventing silicon wafer adhesion according to claim 1, it is characterised in that: the isolation
The drainage trough (4) of plate (3) two sides setting is in cross-distribution, and the drainage trough (4) of each side is provided with 10-15 root, and drains
Slot (4) width is 0.5-0.7mm, depth 0.3-0.4mm.
5. a kind of slow lifting trough body structure for preventing silicon wafer adhesion according to claim 1, it is characterised in that: every two pieces of phases
Spacing between the adjacent isolation board (3) is 4mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920697192.4U CN209461430U (en) | 2019-05-16 | 2019-05-16 | A kind of slow lifting trough body structure preventing silicon wafer adhesion |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920697192.4U CN209461430U (en) | 2019-05-16 | 2019-05-16 | A kind of slow lifting trough body structure preventing silicon wafer adhesion |
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| CN209461430U true CN209461430U (en) | 2019-10-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110034056A (en) * | 2019-05-16 | 2019-07-19 | 通威太阳能（安徽）有限公司 | A kind of slow lifting trough body structure preventing silicon wafer adhesion |
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2019
- 2019-05-16 CN CN201920697192.4U patent/CN209461430U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110034056A (en) * | 2019-05-16 | 2019-07-19 | 通威太阳能（安徽）有限公司 | A kind of slow lifting trough body structure preventing silicon wafer adhesion |
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