CN209402818U - A kind of board structure of circuit of easy heat radiation - Google Patents
A kind of board structure of circuit of easy heat radiation Download PDFInfo
- Publication number
- CN209402818U CN209402818U CN201821718556.4U CN201821718556U CN209402818U CN 209402818 U CN209402818 U CN 209402818U CN 201821718556 U CN201821718556 U CN 201821718556U CN 209402818 U CN209402818 U CN 209402818U
- Authority
- CN
- China
- Prior art keywords
- prop
- circuit
- plate
- heat radiation
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a kind of board structure of circuit of easy heat radiation, including upper plate, lower plate and radiator structure, upper plate is fixedly connected on the top of lower plate, upper plate is fixedly connected with lower plate by radiator structure, heating element is fixedly installed above upper plate, heating element is socketed with metal clips, aperture is offered in the middle part of metal clips, the ground of metal clips is fixed with cooling fin, radiator structure includes connecting column, heat release hole, lower prop and upper prop, the top of upper prop is fixedly connected with upper plate, and the bottom end of lower prop is fixedly connected with lower plate, and lower prop is connected with upper prop by connecting column.Pass through setting cooling fin and radiator structure component in the device, it can radiate to electric hot plate, with wide applicability, board structure of circuit heat dissipation effect to solve the problems, such as existing easy heat radiation mentioned above in the background art is poor, the production and use of board structure of circuit suitable for easy heat radiation have good development prospect.
Description
Technical field
The utility model relates to board house technical field, specially a kind of circuit board.
Background technique
The title of circuit board has: wiring board, pcb board, aluminum substrate, high frequency plate, thick copper sheet, impedance plate, PCB, ultra-thin route
Plate, ultrathin circuit board, printed circuit board etc..Circuit board makes circuit miniaturization, intuitiveization, batch production for fixed circuit and
Optimization electrical appliance layout plays an important role.
Existing circuit board, component are higher and higher for heat dissipation for circuit board requirement, but for a few thing severe
For circuit board or high-power circuit plate under environment, heat dissipation problem is a critical issue, electricity in the prior art always
The heat dissipation effect of road plate is poor, and the component frequently resulted on circuit board can not work normally, to affect the stabilization of circuit board
Property, it is therefore desirable to upgraded and be transformed on the basis of available circuit plate, to overcome existing issue and deficiency, is provided a kind of easy
The board structure of circuit of heat dissipation.
Utility model content
The utility model aim is to solve the technical problem of available circuit plate heat dissipation effect difference, provides a kind of easy heat radiation
Board structure of circuit can radiate to electric hot plate by setting cooling fin and radiator structure component in the device, have extensive
Practicability, the board structure of circuit heat dissipation effect to solve the problems, such as existing easy heat radiation mentioned above in the background art is poor.
To achieve the above object, the utility model provides the following technical solutions: a kind of board structure of circuit of easy heat radiation, including
Upper plate, lower plate and radiator structure, upper plate are fixedly connected on the top of lower plate, and upper plate is fixedly connected with lower plate by radiator structure；
Heating element is fixedly installed above upper plate, heating element is socketed with metal clips, opens in the middle part of metal clips
Equipped with aperture, the shape of aperture is identical as heating element, and perforated area is greater than heating element cross-sectional area, metal clips
Ground is fixed with cooling fin, and cooling fin is fitted closely with heating element；
Radiator structure includes connecting column, heat release hole, lower prop and upper prop, and the top of upper prop is fixedly connected with upper plate, lower prop
Bottom end is fixedly connected with lower plate, and lower prop is connected with upper prop by connecting column, and connecting column is provided with multiple, and connecting column is placed equidistant with,
Connecting column is fixedly connected between column and upper prop in a ring, and heat release hole is embedded in lower prop and upper prop surface, if heat release hole is provided with
Dry, and be uniformly distributed, insulation filling is provided in lower prop and upper prop.
As a further solution of the present invention: the shape of the aperture is identical as heating element.
As a further solution of the present invention: the perforated area is greater than heating element cross-sectional area.
As a further solution of the present invention: the cooling fin is fitted closely with heating element.
As a further solution of the present invention: the connecting column is provided with multiple, connecting column is placed equidistant with, connecting column
It is fixedly connected between column and upper prop in a ring.
As a further solution of the present invention: the heat release hole is provided with several, and it is uniformly distributed.
As a further solution of the present invention: being provided with insulation filling in the lower prop and upper prop.
The utility model has the following beneficial effects:
(1) the utility model aim is to solve the technical problem of available circuit plate heat dissipation effect difference, provides a kind of fugitive
The board structure of circuit of heat can radiate to electric hot plate by setting cooling fin and radiator structure component in the device, have
Wide applicability.
(2) the utility model has the advantage of, by being equipped with aperture for entangling heating element in metal clips, this
Heating element is firmly entangled by metal clips, is radiated using cooling fin to heating element, passes through heat dissipation
Hole radiates to bilevel circuit board, by the insulation filling being arranged inside upper lower prop, can make using upper lower prop
Circuit board also can be carried out conduction, to solve the heat dissipation problem of circuit board, be set as being placed equidistant with by connecting column, there are
Gap is radiated.
To sum up, the utility model avoids the technical problem of available circuit plate heat dissipation effect difference, there is very high promotional value.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model.
Fig. 2 is the radiator structure schematic diagram of the utility model.
Fig. 3 is the metal clips structural schematic diagram of the utility model.
In Fig. 1-3: 1- upper plate, 2- lower plate, 3- heating element, 4- metal clips, 5- radiator structure, 6- connecting column, 7-
Heat release hole, 8- lower prop, 9- upper prop, 10- cooling fin, 11- aperture.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Upper plate 1, lower plate 2 used in the utility model, heating element 3, connecting column 6 can by market buy or
Private customized gained.
Please refer to Fig. 1~3, in the utility model embodiment, a kind of board structure of circuit of easy heat radiation, including upper plate 1, lower plate
2 and radiator structure 5, upper plate 1 is fixedly connected on the top of lower plate 2, upper plate 1 and lower plate 2 and is fixedly connected by radiator structure 5；
It is fixedly installed heating element 3 above upper plate 1, heating element 3 is socketed with metal clips 4, in metal clips 4
Portion offers aperture 11, and the shape of aperture 11 is identical as heating element 3, and 11 area of aperture is greater than 3 cross section of heating element
Product, the ground of metal clips 4 are fixed with cooling fin 10, and cooling fin 10 is fitted closely with heating element 3, by metal clips
4 are equipped with the aperture for entangling heating element 3, this entangles metal clips 4 firmly heating element 3, utilize
Cooling fin 4 radiates to heating element 3；
Radiator structure 5 includes connecting column 6, heat release hole 7, lower prop 8 and upper prop 9, and the top of upper prop 9 is fixedly connected with upper plate 1,
The bottom end of lower prop 8 is fixedly connected with lower plate 2, and lower prop 8 and upper prop 9 are connected by connecting column 6, and connecting column 6 is provided with multiple, connection
Column 6 is placed equidistant with, and connecting column 6 is fixedly connected in a ring between column 8 and upper prop 9, is set as being placed equidistant with by connecting column 6,
There are gaps, radiate, and heat release hole 7 is embedded in 9 surface of lower prop 8 and upper prop, and heat release hole 7 is provided with several, and uniformly divide
Cloth radiates to bilevel circuit board by heat release hole 7, insulation filling is provided in lower prop 8 and upper prop 9, by upper
The insulation filling being arranged inside lower prop, can also to can be carried out conduction using the circuit board of upper lower prop, to solve circuit
The heat dissipation problem of plate.
When using a kind of board structure of circuit of easy heat radiation of the utility model, firstly, being installed to circuit board, upper plate 7
It is radiated with lower plate 2 by radiator structure 5, heat release hole 7 radiates, and the insulation filling on upper prop 9 and lower prop 8 makes circuit board
Beam conduction, the aperture 11 on metal clips 4 are socketed on heating element 3, and cooling fin 10 radiates.
The above are merely preferred embodiments of the present invention, it is noted that for those skilled in the art,
Without departing from the concept of the premise utility, several modifications and improvements can also be made, these also should be considered as practical
Novel protection scope, these all will not influence the effect and patent practicability of the utility model implementation.
Claims (7)
1. a kind of board structure of circuit of easy heat radiation, including upper plate (1), lower plate (2) and radiator structure (5), upper plate (1) are fixedly connected
In the top of lower plate (2), upper plate (1) is fixedly connected with lower plate (2) by radiator structure (5)；
It is characterized by: being fixedly installed heating element (3) above upper plate (1), heating element (3) is socketed with metal clips
(4), it is offered aperture (11) in the middle part of metal clips (4), the ground of metal clips (4) is fixed with cooling fin (10)；
Radiator structure (5) includes connecting column (6), heat release hole (7), lower prop (8) and upper prop (9), the top of upper prop (9) and upper plate
(1) it being fixedly connected, the bottom end of lower prop (8) is fixedly connected with lower plate (2), and lower prop (8) and upper prop (9) are connected by connecting column (6),
Heat release hole (7) is embedded in lower prop (8) and upper prop (9) surface.
2. a kind of board structure of circuit of easy heat radiation according to claim 1, it is characterised in that: the shape of the aperture (11)
It is identical as heating element (3).
3. a kind of board structure of circuit of easy heat radiation according to claim 1, it is characterised in that: aperture (11) area is big
In heating element (3) cross-sectional area.
4. a kind of board structure of circuit of easy heat radiation according to claim 1, it is characterised in that: the cooling fin (10) and hair
Hot component (3) fits closely.
5. a kind of board structure of circuit of easy heat radiation according to claim 1, it is characterised in that: connecting column (6) setting
Have multiple, connecting column (6) is placed equidistant with, and connecting column (6) is fixedly connected in a ring between lower prop (8) and upper prop (9).
6. a kind of board structure of circuit of easy heat radiation according to claim 1, it is characterised in that: heat release hole (7) setting
There are several, and is uniformly distributed.
7. a kind of board structure of circuit of easy heat radiation according to claim 1, it is characterised in that: the lower prop (8) and upper prop
(9) insulation filling is provided in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821718556.4U CN209402818U (en) | 2018-10-23 | 2018-10-23 | A kind of board structure of circuit of easy heat radiation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821718556.4U CN209402818U (en) | 2018-10-23 | 2018-10-23 | A kind of board structure of circuit of easy heat radiation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209402818U true CN209402818U (en) | 2019-09-17 |
Family
ID=67878806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821718556.4U Expired - Fee Related CN209402818U (en) | 2018-10-23 | 2018-10-23 | A kind of board structure of circuit of easy heat radiation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209402818U (en) |
-
2018
- 2018-10-23 CN CN201821718556.4U patent/CN209402818U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190917 Termination date: 20201023 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |