CN206272960U - A kind of mounting structure of the onboard electronic device of circuit - Google Patents
A kind of mounting structure of the onboard electronic device of circuit Download PDFInfo
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- CN206272960U CN206272960U CN201621174829.4U CN201621174829U CN206272960U CN 206272960 U CN206272960 U CN 206272960U CN 201621174829 U CN201621174829 U CN 201621174829U CN 206272960 U CN206272960 U CN 206272960U
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- electronic device
- pad
- mounting structure
- elongated slot
- circuit according
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Abstract
The utility model provides a kind of mounting structure of the onboard electronic device of circuit, is related to electronic equipment manufacture technology field, the problem that can prevent electronic device from being ftractureed because of the expansion or shrinkage of circuit board.The mounting structure of the onboard electronic device of the circuit includes circuit board and electronic device, and the electronic device is fixed by pad with the circuit board, and the pad is provided with elongated slot.The utility model is used to install electronic device on circuit boards.
Description
Technical field
The utility model is related to electronic equipment manufacture technology field, more particularly to a kind of onboard electronic device of circuit installation
Structure.
Background technology
At present, in electronic equipment manufacture technology field, in order to minimize, lightweight, electronic device is typically arranged on electricity
On the plate of road, with integrated various functions, simplify structure.
The mode that electronic device is installed on circuit boards is generally in the prior art directly is welded and fixed, as shown in figure 1,
It is flow chart in the prior art by electronic device welding on circuit boards.It can be seen that electronic device 01 is directly put
Put in the position to be installed of circuit board 02, be then welded and fixed, the wiring contact 03 of electronic device 01 passes through connecting plate 04
It is connected with circuit board.
But, there is problems with the technical scheme of prior art：Due to electronic device 01 and circuit board 02 operationally
Heating, and the general making material than electronic device 01 of thermal coefficient of expansion of the making material of circuit board 02 thermal coefficient of expansion
Greatly, by electronic device 01 and circuit board 02 it is directly integrally welded after, when the expansion or shrinkage at different temperatures of circuit board 02
The stress of generation can be applied directly on electronic device, and then pulls the bottom surface of electronic device, make what electronic device ftractureed
Phenomenon.
Utility model content
The utility model provides a kind of mounting structure of the onboard electronic device of circuit, can prevent electronic device because circuit board
Expansion or shrinkage and the problem that ftractures.
To reach above-mentioned purpose, embodiment of the present utility model is adopted the following technical scheme that：
The utility model first aspect provides a kind of mounting structure of the onboard electronic device of circuit, including：Circuit board and
Electronic device, the electronic device is fixed by pad with the circuit board, and the pad is provided with elongated slot.
The mounting structure of the onboard electronic device of circuit of the present utility model, because electronic device is consolidated by pad with circuit board
Fixed, the stress that circuit board expansion or shrinkage at different temperatures is produced first is applied on pad, and after pad is provided with elongated slot,
The stress that the circuit board of a part brings is can absorb using the gap of elongated slot, and then is transferred to the stress of electronic device and dropped significantly
Low, compared to existing technology, the stress that circuit board is produced is not applied directly on electronic device, but during by pad, using length
Groove come absorb a part stress, and then can prevent electronic device because circuit board expansion or shrinkage and asking for ftractureing
Topic.
In the first optional implementation of first aspect, the bottom surface of the shape of the pad and the electronic device
Profile is adapted, and the elongated slot is opened to the outward flange of the pad.Because the edge of electronic device is easier cracking, because
This, elongated slot is opened to the outward flange of pad, because the bottom profile of shape and the electronic device of pad is adapted, so can be with
Emphasis eliminates the stress near electronic device edge, the problem for further preventing electronic device from ftractureing.
In second optional implementation of first aspect, the elongated slot is two, and two elongated slots prolong
Stretch direction orthogonal.The stress that circuit board is produced has in all directions, if an elongated slot were only set, and the elongated slot would be open-minded
It is so, unsatisfactory in the absorbed effect of the stress of the bearing of trend of the elongated slot to outward flange, therefore, in order to by this direction
Stress reduce, elongated slot is set to two, and bearing of trend is orthogonal, it can be ensured that the stress of all directions can be absorbed one
Part.
In the third optional implementation of first aspect, the elongated slot is multiple, and multiple elongated slots are along described
The outward flange of pad is uniformly distributed for one week.Elongated slot is uniformly distributed for one week along the outward flange of pad, makes the outer peripheral stress of pad
It is dispersed, and then stress intensity suffered by the outward flange of electronic device bottom surface is consistent, the effect for preventing electronic device from ftractureing more may be used
Lean on.
In the 4th kind of optional implementation of first aspect, the pad is rectangular configuration, two of the pad
Short side is respectively equipped with an elongated slot vertical with the short side, two sides long of the pad be respectively equipped with it is multiple with it is described
The vertical elongated slot in side long.When pad is set to rectangular configuration, when short side sets elongated slot, on the one hand limited by short side dimension
System, should not set multiple elongated slots, and the length of another elongated slot for being conveniently arranged on short side can not be long, otherwise influence pad integrally to tie
The intensity of structure, it is therefore preferred that being respectively equipped with an elongated slot vertical with short side in two short sides, is provided with many on two sides long
The individual elongated slot vertical with side long.
In the 5th kind of optional implementation of first aspect, the material thermal expansion coefficient of the pad and the electronics
The difference of the material thermal expansion coefficient of device is less than or equal to 1 (unit：1E-6/℃).Make the thermal coefficient of expansion of the material of pad
If larger with the difference of thermal expansion coefficients of the material for making electronic device, as not equality of temperature between pad and electronic device
Spend and produce stress, so, be unfavorable for preventing the problem of Cracking of electronic device, therefore, when the making material of pad is selected, really
The difference protected between the thermal coefficient of expansion of the material and the material thermal expansion coefficient of electronic device is less than or equal to 1, to ensure pad
And electronic device between produce stress will not be excessive and cause electronic device to ftracture.
In the 6th kind of optional implementation of first aspect, the electronic device by ceramic material, the pad
Piece is made by metal material.
In the 7th kind of optional implementation of first aspect, the pad and the circuit board, and the pad
Fixed by way of multi-point welding with the electronic device.Using multi-point welding, compared to the mode relatively directly all welded,
By pad dispersion just by the stress transmission point dispersion of circuit board, absorption of the pad to stress is more beneficial for；In addition, electronic device
With the connection that the connected mode of circuit board also has contact pin mode, such scheme is suitable only for the less feelings of size of electronic devices
Condition, when size of electronic devices is larger, against the fixed inevitable not firm enough of contact pin, therefore, by the way of multi-point welding also
The fastness connected between electronic device, pad and circuit board can be improved, this scheme is applied to large-sized electronics device
Part installs situation on circuit boards.
In the 8th kind of optional implementation of first aspect, multiple pads are uniform along the surface of the pad
Distribution.
In the 9th kind of optional implementation of first aspect, the pad is provided with position limiting structure, the spacing knot
Structure can limit the electronic device with the relative position of the pad.As a result of the mode of multi-point welding, and on pad
Elongated slot is provided with, in order that pad is accurately positioned with pad, it is thus necessary to determine that relative position when electronic device is fixed with pad, because
This, there is provided position limiting structure, the electronic device is limited with the relative position of the pad.
In the tenth kind of optional implementation of first aspect, the position limiting structure is to be arranged on the pad adjacent two
The baffle plate of individual side edge, the baffle plate two side walls adjacent with the electronic device against.
In a kind of the tenth optional implementation of first aspect, the electronic device is provided with contact, and the contact is worn
Cross the elongated slot to be abutted with the conductiving point of the circuit board, the contact is fixed with the circuit board by surface mounting technique.
Brief description of the drawings
In order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or the accompanying drawing to be used needed for description of the prior art is briefly described, it should be apparent that, drawings in the following description are only
It is some embodiments of the present utility model.
Fig. 1 is directly welded at the structural representation on circuit board for the electronic device of prior art；
Fig. 2 is the structural representation of the mounting structure of the onboard electronic device of circuit that the utility model embodiment is provided；
Fig. 3 illustrates for the decomposition texture of the mounting structure of the onboard electronic device of circuit that the utility model embodiment is provided
Figure；
Fig. 4 is the structural representation of the pad of the mounting structure of the onboard electronic device of circuit that the utility model embodiment is provided
Figure；
Fig. 5 is multiple welding on the pad of the mounting structure of the onboard electronic device of circuit that the utility model embodiment is provided
The structural representation of point；
Fig. 6 is the structural representation of the electronic device of the onboard electronic device of circuit that the utility model embodiment is provided.
Specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Describe in detail, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole implementation
Example.
In description of the present utility model, it is to be understood that term " " center ", " on ", D score, "front", "rear",
The orientation or position relationship of the instruction such as "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward " are based on accompanying drawing institute
The orientation or position relationship for showing, are for only for ease of description the utility model and simplify description, signified rather than indicating or implying
Device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this practicality
New limitation.
In description of the present utility model, unless otherwise indicated, " multiple " is meant that two or more.
Embodiment of the present utility model provides a kind of mounting structure of the onboard electronic device of circuit, such as Fig. 2 and Fig. 3 institutes
Show, including：Circuit board 1 and electronic device 2, electronic device 2 are fixed by pad 3 with circuit board 1, and pad 3 is provided with elongated slot 4.
The mounting structure of the onboard electronic device of circuit of the present utility model, as shown in Figures 2 and 3, because electronic device 2 is logical
Cross pad 3 to be fixed with circuit board 1, the stress that the expansion or shrinkage at different temperatures of circuit board 1 is produced first is applied to pad 3
On, and after pad 3 is provided with elongated slot 4, the stress that the circuit board 1 of a part brings, Jin Erchuan are can absorb using the gap of elongated slot 4
The stress for being handed to electronic device 2 is substantially reduced, and compared to existing technology, the stress that circuit board 1 is produced is not applied directly to electronics device
On part 2, but during by pad 3, the stress of a part is absorbed using elongated slot 4, and then electronic device 2 can be prevented because circuit
The expansion or shrinkage of plate 1 and the problem that ftractures.
Because the edge of electronic device 2 is easier cracking, therefore, it is further to prevent electronic device 2 from crack at edge
Problem, as shown in figure 4, the bottom profile of the shape of pad 3 and electronic device 2 is adapted, elongated slot 4 is opened outer to pad 3
Edge.Elongated slot 4 is opened to the outward flange of pad 3, because the shape of pad 3 is adapted with the bottom profile of electronic device 2, this
Sample, elongated slot 4 is best near the effect of the stress absorption of the position at edge to pad, and then is transferred to the bottom edge of electronic device 2
Relative also minimum of stress, therefore, so stress near the edge of electronic device 2 can be absorbed with emphasis, further prevent electricity
The problem that sub- device 2 ftractures from marginal position.
The stress that circuit board 1 is produced has in all directions, if an elongated slot 4 were only set, and the elongated slot 4 would be opened to pad
The outward flange of piece 3, it is so, unsatisfactory in the absorbed effect of the stress of the bearing of trend of the elongated slot 4, therefore, in order to by this
The stress in direction reduces, reference picture 4, and elongated slot 4 is two, and the bearing of trend of two elongated slots 4 is orthogonal.Elongated slot 4 is set to
Two, and bearing of trend is orthogonal, it can be ensured that the stress of all directions can be absorbed a part.
In order to increase the reliability for preventing electronic device 2 from ftractureing, 2 bottom edge of electronic device should all be answered for one week
The absorption of power, as shown in figure 4, elongated slot 4 is multiple, multiple elongated slots 4 are uniformly distributed for one week along the outward flange of pad 3.By the edge of elongated slot 4
The outward flange of pad 3 is uniformly distributed for one week, makes the outer peripheral stress of pad 3 dispersed, and then the bottom surface outward flange of electronic device 2
Suffered stress intensity is consistent, and the effect for preventing electronic device 2 from ftractureing is more reliable.
The shape of pad 3 is adapted with the bottom profile of electronic device 2, as a example by this is sentenced when pad 3 is rectangle, such as Fig. 4
Shown, pad 3 is rectangular configuration, and two short sides of pad 3 are respectively equipped with an elongated slot 4 vertical with short side, two of pad 3
It is long while be respectively equipped with it is multiple with it is long while vertical elongated slot 4.When pad 3 is set to rectangular configuration, when short side sets elongated slot 4,
On the one hand limited by short side dimension, multiple elongated slots 4 should not be set, the length of another elongated slot 4 for being conveniently arranged on short side can not mistake
It is long, otherwise influence the integrally-built intensity of pad 3, it is therefore preferred that two short sides be respectively equipped with one it is vertical with short side
Elongated slot 4, two it is long while be provided with it is multiple with it is long while vertical elongated slot 4.
If making the thermal coefficient of expansion of the material of pad 3 and the difference of thermal expansion coefficients of the material for making electronic device 2
It is larger, between pad 3 and electronic device 2 as different temperatures and produce stress, so, be unfavorable for preventing electronic device 2
Problem of Cracking, therefore, when the making material of pad 3 is selected, it is ensured that the thermal coefficient of expansion of the material and the material of electronic device 2
Difference between material thermal coefficient of expansion is less than or equal to 1, to ensure that the stress produced between pad 3 and electronic device 2 will not be excessive
And cause electronic device 2 to ftracture.
The material of electronic device 2 has various, and by taking dielectric filter as an example, its material is general by ceramic making, accordingly
, the material selection of pad 3 should meet the scope of above-mentioned difference of thermal expansion coefficient, and metal material can substantially meet the model
Enclose, and because the tensile strength of metal material is high, be unlikely to deform, it is therefore preferred that electronic device 2 is by ceramic material, pad
Piece 3 is made by metal material.
Pad 3 and circuit board 1, and pad 3 are fixed with electronic device 2 by way of multi-point welding.Using multiple spot
Welding, compared to the modes of relatively direct whole welding, pad dispersion is just disperseed the stress transmission of circuit board 1, more favorably
In absorption of the pad 3 to stress；In addition, the connected mode of electronic device 2 and circuit board 1 also has the connection of contact pin mode, so
Scheme be suitable only for the less situation of size of electronic devices, when size of electronic devices is larger, the fixation against contact pin must
It is so not firm enough, therefore, can also improve what is connected between electronic device 2, pad 3 and circuit board 1 by the way of multi-point welding
Fastness, enables this scheme that situation on the circuit card 1 is installed suitable for large-sized electronic device 2.
Preferably, reference picture 5, by taking corresponding pad on pad 3 as an example, multiple pads 5 (in figure inside square frame) edge
The surface of pad 3 is uniformly distributed.
It should be noted that reference picture 3 and Fig. 5, to ensure fixed fixing, on the premise of using multi-point welding,
Can also be in the bottom edge welding resistance of electronic device 2.
As a result of the mode of multi-point welding, and pad 3 is provided with elongated slot 4, in order that pad 5 is accurate with pad 3
Positioning, it is thus necessary to determine that relative position when electronic device 2 is fixed with pad 3, therefore, pad 3 is provided with position limiting structure 6, spacing
Structure 6 can limit the relative position of electronic device 2 and pad 3.
Specifically, as shown in figure 4, position limiting structure 6 is the baffle plate 61 for being arranged on the two neighboring side edge of pad 3, baffle plate
The 61 two side walls adjacent with electronic device 2 against.Using baffle plate 61 by two adjacent side walls of electronic device 2 against, and then
When electronic device 2 and pad 3 are fixed, electronic device 2 can be promoted towards baffle plate 61, make two sides that electronic device 2 is adjacent
Wall is with baffle plate 61 against with the relative position restriction of just electronic device 2 and pad 3.
It should be noted that the baffle plate 61 shown in Fig. 4 is that preferably production method, i.e. baffle plate 61 can one with pad 3
Punch forming, and bending line 62 is provided with the junction of baffle plate 61 and pad 3, after punch forming, can be by baffle plate 61 along bending
90 ° of the upward bending of line 62, with the lateral wall with electronic device 2 against.
Reference picture 3 and Fig. 6, electronic device 2 are provided with contact 21, and contact 21 can be by the position of elongated slot 4 and circuit board 1
Conductiving point 11 is connected, i.e. contact 21 is abutted through elongated slot 4 with the conductiving point 11 of circuit board 1, and contact 21 passes through table with circuit board 1
SMT is fixed.Surface mounting technique has compact conformation, small volume, vibration resistance, shock resistance, and high frequency characteristics is good, production
The advantages of efficiency high, it is therefore preferable that being fixed using surface mounting technique.
More than, specific embodiment only of the present utility model, but protection domain of the present utility model is not limited thereto,
Any one skilled in the art the change that can readily occur in or replaces in the technical scope that the utility model is disclosed
Change, should all cover within protection domain of the present utility model.Therefore, protection domain of the present utility model should be with claim
Protection domain is defined.
Claims (12)
1. the mounting structure of the onboard electronic device of a kind of circuit, it is characterised in that including circuit board and electronic device, its feature exists
In the electronic device is fixed by pad with the circuit board, and the pad is provided with elongated slot.
2. the mounting structure of the onboard electronic device of circuit according to claim 1, it is characterised in that the shape of the pad
Bottom profile with the electronic device is adapted, and the elongated slot is opened to the outward flange of the pad.
3. the mounting structure of the onboard electronic device of circuit according to claim 2, it is characterised in that the elongated slot is two
It is individual, and the bearing of trend of two elongated slots is orthogonal.
4. the mounting structure of the onboard electronic device of circuit according to claim 3, it is characterised in that the elongated slot is many
Individual, multiple elongated slots are uniformly distributed for one week along the outward flange of the pad.
5. the mounting structure of the onboard electronic device of circuit according to claim 4, it is characterised in that the pad is rectangle
Structure, two short sides of the pad are respectively equipped with an elongated slot vertical with the short side, and two of the pad are long
While be respectively equipped with it is multiple with it is described long while the vertical elongated slot.
6. the mounting structure of the onboard electronic device of circuit according to claim 1, it is characterised in that the material of the pad
Thermal coefficient of expansion is less than or equal to 1e with the difference of the material thermal expansion coefficient of the electronic device-6/℃。
7. the mounting structure of the onboard electronic device of circuit according to claim 6, it is characterised in that the electronic device by
Ceramic material, the pad is made by metal material.
8. the mounting structure of the onboard electronic device of circuit according to claim 7, it is characterised in that the pad with it is described
Circuit board, and the pad is fixed with the electronic device by way of multi-point welding.
9. the mounting structure of the onboard electronic device of circuit according to claim 8, it is characterised in that multiple pads
It is uniformly distributed along the surface of the pad.
10. the mounting structure of the onboard electronic device of circuit according to claim 8, it is characterised in that set on the pad
Limited bit architecture, the position limiting structure can limit the electronic device with the relative position of the pad.
The mounting structure of the 11. onboard electronic devices of circuit according to claim 10, it is characterised in that the position limiting structure
To be arranged on the baffle plate of the two neighboring side edge of the pad, the baffle plate two side walls adjacent with the electronic device are supported
Lean on.
The mounting structure of the 12. onboard electronic devices of circuit according to claim 1, it is characterised in that the electronic device
Contact is provided with, the contact is abutted through the elongated slot with the conductiving point of the circuit board, the contact is logical with the circuit board
Surface mounting technique is crossed to fix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621174829.4U CN206272960U (en) | 2016-10-26 | 2016-10-26 | A kind of mounting structure of the onboard electronic device of circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621174829.4U CN206272960U (en) | 2016-10-26 | 2016-10-26 | A kind of mounting structure of the onboard electronic device of circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206272960U true CN206272960U (en) | 2017-06-20 |
Family
ID=59037832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621174829.4U Active CN206272960U (en) | 2016-10-26 | 2016-10-26 | A kind of mounting structure of the onboard electronic device of circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206272960U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021190241A1 (en) * | 2020-03-27 | 2021-09-30 | 深圳顺络电子股份有限公司 | Ceramic filter having cte compensation function |
| WO2021244076A1 (en) * | 2020-06-04 | 2021-12-09 | 深圳顺络电子股份有限公司 | Ceramic dielectric filter |
-
2016
- 2016-10-26 CN CN201621174829.4U patent/CN206272960U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021190241A1 (en) * | 2020-03-27 | 2021-09-30 | 深圳顺络电子股份有限公司 | Ceramic filter having cte compensation function |
| WO2021244076A1 (en) * | 2020-06-04 | 2021-12-09 | 深圳顺络电子股份有限公司 | Ceramic dielectric filter |
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