CN209367813U - A kind of silane thermal decomposition process production electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck - Google Patents

A kind of silane thermal decomposition process production electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck Download PDF

Info

Publication number
CN209367813U
CN209367813U CN201821850986.1U CN201821850986U CN209367813U CN 209367813 U CN209367813 U CN 209367813U CN 201821850986 U CN201821850986 U CN 201821850986U CN 209367813 U CN209367813 U CN 209367813U
Authority
CN
China
Prior art keywords
thermal decomposition
holding holes
polycrystalline silicon
tapered portion
backup pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201821850986.1U
Other languages
Chinese (zh)
Inventor
李红彬
许�鹏
杨鹏举
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henan Silane Science And Technology Development Ltd By Share Ltd
Original Assignee
Henan Silane Science And Technology Development Ltd By Share Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henan Silane Science And Technology Development Ltd By Share Ltd filed Critical Henan Silane Science And Technology Development Ltd By Share Ltd
Priority to CN201821850986.1U priority Critical patent/CN209367813U/en
Application granted granted Critical
Publication of CN209367813U publication Critical patent/CN209367813U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00Technologies relating to chemical industry
    • Y02P20/10Process efficiency
    • Y02P20/129Energy recovery, e.g. by cogeneration, H2recovery or pressure recovery turbines

Landscapes

  • Silicon Compounds (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

The utility model discloses a kind of silane thermal decomposition processes to produce electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck, including graphite base, tapered portion, cylindrical portion and annular backup pad, graphite base lower part is provided with electrode jack, graphite base top is provided with slot, it is communicated between jack and jack by connecting hole, tapered portion is adapted with slot, tapered portion top is fixedly connected with cylindrical portion, annular backup pad is fixedly connected on the outside of cylindrical portion, annular backup pad lateral surface is provided with clamp groove, tapered portion interior bottom portion is provided with the first holding holes, the second holding holes are provided with above first holding holes, cylindrical portion is internally provided with third holding holes, first holding holes, it is communicated inside second holding holes and third holding holes and stepped setting;Total, the utility model has the advantages that firm support, effective protection, easy to disassemble.

Description

A kind of silane thermal decomposition process production electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck
Technical field
The utility model relates to a kind of graphite chucks, and in particular to a kind of silane thermal decomposition process production electronic-grade polycrystalline silicon thermal decomposition furnace Use graphite chuck.
Background technique
Preparing method used by polysilicon at this stage is mainly improved Siemens, but there are energy consumption height, pollution weight The problem of, and low energy consumption, environmentally friendly for silane decomposition, preparing polysilicon using silane decomposition is to replace improvement west The inexorable trend of Men Zifa.Wherein, polysilicon is prepared using silane decomposition, be by silane air lift obtained it is pure after heat point It solves and produces the higher rod-like polycrystal silicon of purity in the conduction oil jacketed pipe of furnace.
Wherein, silicon core is fixed on graphite base by graphite chuck, connects copper electricity with graphite base by graphite chuck Pole, existing graphite chuck are primarily present following problems: firstly, silicon rod surface deposition silicon, and the part that graphite chuck clamps Because not reaching material, also just without deposition silicon, silicon core diameter does not become larger, and with the continuous deposition of silicon, silicon rod is continuous Thicker, silicon rod and graphite chuck junction are thinner, are in the presence of upper coarse and lower fine, and the part that grips are lived is with very thin straight Diameter carries thicker, longer silicon rod, is easy to appear rodlike condition;Secondly, polysilicon is during the deposition process, silicon can be deposited constantly Onto silicon core and graphite components, or even the silicon having can deposit on graphite base, cause graphite base disposable, increase Production cost is added, while the cleaning for also resulting in crystal bar is difficult;Furthermore as the growth weight of silicon rod constantly becomes larger, graphite folder Back taper connection structure between head and graphite base to block between collet and pedestal relatively tight, causes disassembly difficult, even Damage graphite base and collet.
So to solve the above problems, developing a kind of silane thermal decomposition process production electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck It is necessary to.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, and it is more to provide a kind of silane thermal decomposition process production electron level Crystal silicon thermal decomposition furnace graphite chuck, the collet can stablize carrying silicon rod, play protective action to graphite base, prevent siliceous deposits Onto graphite base, and it is easy to disassemble, graphite base is not damaged, so that graphite base is reusable, reduces production cost.
Purpose of the utility model is realized as follows: a kind of silane thermal decomposition process produces electronic-grade polycrystalline silicon thermal decomposition furnace graphite Collet, including graphite base, tapered portion, cylindrical portion and annular backup pad, wherein the setting of graphite base lower central position Have a conical electrode jack, graphite base central upper portion position is provided with inverted conical shape slot, the jack and slot it Between communicated by axial connecting hole, the tapered portion is adapted with the slot, and the tapered portion top is fixedly connected Cylindrical portion is stated, is fixedly connected with the annular backup pad on the outside of the cylindrical portion, the annular backup pad lateral surface is provided with folder Groove is held, the tapered portion interior bottom portion is provided with the first holding holes, is provided with the second holding holes above first holding holes, The cylindrical portion is internally provided with third holding holes, communicates inside first holding holes, the second holding holes and third holding holes And stepped setting, first holding holes and third holding holes are cylindrical structure, and second holding holes are back taper Structure, and the basal diameter of second holding holes is greater than the first clamping bore dia, the top surface of second holding holes is straight Diameter is less than third and clamps bore dia.
The tapered portion, cylindrical portion and annular backup pad are an integral structure setting.
The clamp groove inner surface is provided with anti-skid chequer.
The Basolateral of the annular backup pad is also fixedly connected with annular side plate.
The medial surface of the annular side plate is adjacent to the lateral surface top end face of the graphite base and connect, or passes through spiral shell Line connection.
The annular backup pad and annular side plate are an integral structure setting.
The tapered portion taper is 6-10 degree.
By adopting the above-described technical solution, the beneficial effects of the utility model are:
(1) it is arranged by the cavity of graphite chuck internal step ladder configuration, so that silicon can also be deposited in collet interior, gradually Increase the diameter of silicon rod bottom deposit, so that post-depositional silicon rod is more firm, while the setting of step structure, reduces carbon The loss of head material;
(2) by the setting of annular backup pad, the supporting role to bottom silicon rod can be not only played, so that silicon rod is more It is firm, while overprotection can be carried out to graphite base, it prevents on siliceous deposits to graphite base, graphite base is allowed to repeat benefit With reduction production cost;
(3) by the setting of anti-skidding clamp groove, so that it is easy for assemble or unload, the damage to graphite base is reduced, so that The recycling rate of waterused of graphite base further increases.
Detailed description of the invention
Fig. 1 is the schematic cross-sectional view of the utility model.
Fig. 2 is the schematic cross-sectional view of another embodiment of the utility model.
In figure: 1, graphite base 11, jack 12, slot 13, connecting hole 2, tapered portion 3, cylindrical portion 4, Annular backup pad 5, clamp groove 6, the first holding holes 7, the second holding holes 8, third holding holes 9, annular side plate.
Specific embodiment
The technical solution of the utility model is described in further detail with reference to the accompanying drawing.
As shown in Figure 1 and Figure 2, a kind of silane thermal decomposition process produces electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck, including graphite bottom Seat 1, tapered portion 2, cylindrical portion 3 and annular backup pad 4.
Wherein, 1 lower central position of graphite base is provided with conical electrode jack 11, the electrode jack 11 and electrode phase Adaptation, to connect electrode, 1 central upper portion position of graphite base is provided with inverted conical shape slot 12, and the slot 12 is to connect Tapered portion 2 is communicated between jack 11 and slot 12 by axial connecting hole 13, using inverted cone-shaped structure, in polycrystalline silicon growth In the process, the self weight of silicon core generates downward pressure so that graphite base 1 and tapered portion 2 contact it is even closer.
Wherein, tapered portion 2 is adapted with slot 12, and 2 top of tapered portion is fixedly connected with cylindrical portion 3, is consolidated on the outside of cylindrical portion 3 Surely it is connected with annular backup pad 4,4 lateral surface of annular backup pad is provided with clamp groove 5, and 5 inner surface of clamp groove is provided with anti- Sliding line, the setting of anti-skid chequer can effectively prevent when being dismantled, slide when using extracting tools such as pipe wrench, inconvenience is torn open It unloads, tapered portion 2, cylindrical portion 3 and annular backup pad 4 are an integral structure setting, more durable, it is preferred that tapered portion cone Degree is 6-10 degree.
Wherein, the Basolateral of annular backup pad 4 is also fixedly connected with annular side plate 9, it is preferred that 4 He of annular backup pad Annular side plate 9 is an integral structure setting, and the medial surface of annular side plate 9 and the lateral surface top end face of graphite base 1 are adjacent to company Connect, or be connected through a screw thread, the setting of annular side plate 9 can institute's graphite base 1 further effective protection is provided, improve graphite The reusable rate of pedestal 1.
Wherein, 2 interior bottom portion of tapered portion is provided with the first holding holes 6, is provided with the second holding holes above the first holding holes 6 7, cylindrical portion 3 is internally provided with third holding holes 8, communicated inside the first holding holes 6, the second holding holes 7 and third holding holes 8 and Stepped setting, the first holding holes 6 and third holding holes 8 are cylindrical structure, and the second holding holes 7 are inverted cone-shaped structure, and The basal diameter of second holding holes 7 is greater than 6 diameter of the first holding holes, and the top surface diameter of the second holding holes 7 is less than third holding holes 8 Stair-stepping holding holes are arranged in diameter inside tapered portion, and with the continuous deposition of silicon, silicon rod constantly becomes during siliceous deposits Slightly, silicon rod bottom area constantly increases, and silicon rod foundation is more firm, and silicon rod is stronger after deposition.
The utility model when it is implemented, the electrode jack 11 of 1 bottom of graphite base is connected with electrode, insert by top Slot 12 is connected with tapered portion, and 4 bottom surface of annular backup pad and 1 top surface of graphite base fit closely connection, 9 medial surface of annular side plate Connection is fitted closely with 1 side top of graphite base or is closely connected by screw thread, so that graphite chuck and pedestal can consolidate Connection, annular backup pad 4 and annular side plate 9 can protect graphite base 1, prevent on siliceous deposits to graphite base 1, simultaneously Silicon rod bottom is effectively supported, the generation for the situation of falling stick is prevented, the setting of ladder-like holding holes in tapered portion 2, so that silicon Stick foundation is more firm, and silicon rod is stronger after deposition, can be facilitated by clamp groove 5 and be torn open to graphite base 1 and collet It unloads, realizes the recycling of graphite base 1.
The foregoing is merely the better embodiments of the utility model, are not intended to limit the utility model, all in this reality Within novel spirit and principle, any modification, equivalent replacement, improvement and so on should be included in the utility model Within protection scope.

Claims (7)

1. a kind of silane thermal decomposition process produces electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck, it is characterised in that: including graphite base (1), tapered portion (2), cylindrical portion (3) and annular backup pad (4), wherein graphite base (1) the lower central position is provided with Conical electrode jack (11), graphite base (1) the central upper portion position are provided with inverted conical shape slot (12), the jack (11) it being communicated between slot (12) by axial connecting hole (13), the tapered portion (2) is adapted with the slot (12), Tapered portion (2) top is fixedly connected with the cylindrical portion (3), is fixedly connected with the annular on the outside of the cylindrical portion (3) Support plate (4), annular backup pad (4) lateral surface are provided with clamp groove (5), tapered portion (2) the interior bottom portion setting Have the first holding holes (6), be provided with the second holding holes (7) above first holding holes (6), is set inside the cylindrical portion (3) It is equipped with third holding holes (8), communicates inside first holding holes (6), the second holding holes (7) and third holding holes (8) and be in Ladder-like setting, first holding holes (6) and third holding holes (8) are cylindrical structure, and second holding holes (7) are to fall Pyramidal structure, and the basal diameter of second holding holes (7) is greater than the first holding holes (6) diameter, second clamping The top surface diameter in hole (7) is less than third holding holes (8) diameter.
2. a kind of silane thermal decomposition process according to claim 1 produces electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck, feature Be: the tapered portion (2), cylindrical portion (3) and annular backup pad (4) are an integral structure setting.
3. a kind of silane thermal decomposition process according to claim 1 produces electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck, feature Be: clamp groove (5) inner surface is provided with anti-skid chequer.
4. a kind of silane thermal decomposition process according to claim 1 produces electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck, feature Be: the Basolateral of the annular backup pad (4) is also fixedly connected with annular side plate (9).
5. a kind of silane thermal decomposition process according to claim 4 produces electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck, feature Be: the medial surface of the annular side plate (9) is adjacent to the lateral surface top end face of the graphite base (1) and connect, Huo Zhetong Cross threaded connection.
6. a kind of silane thermal decomposition process according to claim 1 or 4 produces electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck, special Sign is: the annular backup pad (4) and annular side plate (9) are an integral structure setting.
7. a kind of silane thermal decomposition process according to claim 4 produces electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck, feature Be: the tapered portion taper is 6-10 degree.
CN201821850986.1U 2018-11-12 2018-11-12 A kind of silane thermal decomposition process production electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck Active CN209367813U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821850986.1U CN209367813U (en) 2018-11-12 2018-11-12 A kind of silane thermal decomposition process production electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821850986.1U CN209367813U (en) 2018-11-12 2018-11-12 A kind of silane thermal decomposition process production electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck

Publications (1)

Publication Number Publication Date
CN209367813U true CN209367813U (en) 2019-09-10

Family

ID=67836461

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821850986.1U Active CN209367813U (en) 2018-11-12 2018-11-12 A kind of silane thermal decomposition process production electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck

Country Status (1)

Country Link
CN (1) CN209367813U (en)

Similar Documents

Publication Publication Date Title
CN103014852B (en) A kind of method for casting efficient polycrystalline silicon ingot
CN109338462B (en) Diameter-variable seed crystal for Czochralski single crystal and seeding method
CN102041550A (en) Method for prolonging service life of single crystal furnace thermal field crucible, and Czochralski crystal growing furnace
CN209367813U (en) A kind of silane thermal decomposition process production electronic-grade polycrystalline silicon thermal decomposition furnace graphite chuck
CN201988668U (en) Oxide skin cleaning device for crankshaft thermal correction die
CN201626998U (en) Thermal field of czochralski silicon monocrystal
CN107059112A (en) Semiconductor grade monocrystal stove bottom heater
CN207294190U (en) The high polycrystalline silicon rod of cutting accuracy
CN211005718U (en) Crystal taking-out device
CN201634792U (en) Straight-pull single crystal furnace
CN202595336U (en) Seed crystal clamping structure
CN107538631B (en) Small-sized side's silicon core hi-precision cutting technique
CN202272987U (en) Molybdenum seed crystal gripper for single crystal furnace
CN102011175A (en) Flow guide cylinder used for czochralski silicon single crystal growth finance
CN204803434U (en) A crucible for crystal growth
CN201627000U (en) Silicon seed crystal for monocrystal silicon growth by straight pull process
CN209635909U (en) Graphite components are used in a kind of silane thermal decomposition process production electronic-grade polycrystalline silicon thermal decomposition furnace
CN211438125U (en) Mounting tool rest for automatic alloy blade
CN201962415U (en) Graphite electrode structure capable of reducing inner surface quality defects of electric arc quartz crucible
CN101691221A (en) Self-locking graphite violet gold chuck
CN204938991U (en) A kind of graphite components
CN210438862U (en) Diameter-variable seed crystal for pulling single crystal
CN206200162U (en) A kind of drill bushing
CN214612851U (en) A outer honeycomb duct for monocrystalline silicon draws
CN105271242A (en) Graphite shield of graphite assembly for polycrystalline silicon reduction furnace

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant