CN209298082U - Substrate cleaning machine - Google Patents
Substrate cleaning machine Download PDFInfo
- Publication number
- CN209298082U CN209298082U CN201920196484.XU CN201920196484U CN209298082U CN 209298082 U CN209298082 U CN 209298082U CN 201920196484 U CN201920196484 U CN 201920196484U CN 209298082 U CN209298082 U CN 209298082U
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- CN
- China
- Prior art keywords
- substrate
- cleaning
- cleaning machine
- cleaning member
- passed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims abstract description 182
- 239000000758 substrate Substances 0.000 title claims abstract description 109
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 239000008367 deionised water Substances 0.000 claims description 19
- 229910021641 deionized water Inorganic materials 0.000 claims description 19
- 239000007789 gas Substances 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 10
- 239000007921 spray Substances 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 239000000443 aerosol Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 5
- 230000007246 mechanism Effects 0.000 claims description 5
- 239000002699 waste material Substances 0.000 claims description 3
- 230000002000 scavenging effect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Abstract
The utility model relates to a kind of substrate cleaning machines, and for carrying out wet-cleaning to substrate, the substrate has each other relative first surface and second surface, and substrate cleaning machine includes: cavity；And it is set to the intracorporal bearing structure of the chamber, the first cleaning member and the second cleaning member, wherein, the bearing structure is used to limit the position of the substrate and exposes the first surface and the second surface, first cleaning member includes moveable first jet, first cleaning member is located at the side of the first surface direction, second cleaning member includes moveable first contact cleaning brush, and second cleaning member is located at the side of the second surface direction.The utility model limits position and the exposure first surface and second surface of substrate by using bearing structure, and the first surface of substrate, second surface and the cleaning of side are placed in the same cleaning chamber and carried out simultaneously to realize, improves cleaning efficiency.
Description
Technical field
The utility model relates to field of semiconductor devices more particularly to a kind of substrate cleaning machines.
Background technique
With the development of semiconductor technology, the integrated level of semiconductor devices is higher and higher, to substrate (such as silicon wafer, glass
Deng) cleaning requirement on surface is also higher and higher.
Current substrate cleaning machine is as follows to substrate progress cleaning step, and S1: substrate enters substrate cleaning machine；S2:
The substrate is overturn for the first time；S3: the of the substrate is cleaned using brush and DIW (deionized water) in first cleaning chamber
Two surfaces；S4: the substrate is overturn for the second time；S5: DIW (deionized water) and nitrogen are combined in second cleaning chamber and is formed
Water mist rinses the first surface of the substrate, and the side of the substrate is scrubbed using brush.
In this cleaning process, the substrate have passed through two cleaning chamber and be reversed twice, greatly increase clear
The time washed.For such situation, it is necessary to a kind of improved substrate cleaning machine is provided, by the first surface of the substrate,
The cleaning of second surface and side is put into a cleaning chamber and carries out, and can so be significantly reduced scavenging period, and promoted
The production capacity of substrate cleaning machine.
Utility model content
The purpose of this utility model is to provide a kind of substrate cleaning machine, by by the first surface of the substrate,
The cleaning of two surfaces and side is put into a cleaning chamber and carries out, and can be significantly reduced scavenging period, and improve substrate
The production capacity of cleaning machine.
In order to achieve the above object, the utility model provides a kind of substrate cleaning machine, for carrying out wet process to substrate
Cleaning, the substrate have each other relative first surface and second surface, comprising:
Cavity；And it is set to the intracorporal bearing structure of the chamber, the first cleaning member and the second cleaning member,
In, the bearing structure is used to limit the position of the substrate and the exposure first surface and second surface, and described the
One cleaning member includes moveable first jet, and first cleaning member is located at the side of the first surface direction, institute
Stating the second cleaning member includes moveable first contact cleaning brush, and second cleaning member is located at the second surface court
To side.
Optionally, in the substrate cleaning machine, the substrate also has positioned at the first surface and described second
The side of surface junction, the bearing structure include multiple support rods, and the multiple support rod is along the side of substrate institute
The circumferential setting surrounded, the multiple support rod is by stopping the side of the substrate to limit the position of the substrate.
Optionally, in the substrate cleaning machine, the multiple support rod collectively constitutes a transmission mechanism, the transmission
Mechanism rotates the substrate with the perpendicular bisector axis of the first surface by the rotation of the multiple support rod.
Optionally, in the substrate cleaning machine, the bearing structure includes at least two support rods.
Optionally, in the substrate cleaning machine, further includes: be set to the intracorporal second contact cleaning of the chamber
Brush, the second contact cleaning brush is located at the side of the side direction, to scrub the side of the substrate.
Optionally, in the substrate cleaning machine, the first jet be aerial fog nozzle, the first jet for pair
The first surface carries out aerosol cleaning.
Optionally, in the substrate cleaning machine, first cleaning member further includes that be passed through mouth and gas logical for liquid
Entrance, the liquid are passed through mouth and are passed through mouth for being passed through nitrogen for being passed through deionized water, the gas.
Optionally, in the substrate cleaning machine, further includes: the second nozzle being set to right above the substrate, institute
Second nozzle is stated for providing deionized water to the first surface, the second surface and the side.
Optionally, in the substrate cleaning machine, second cleaning member further include: third nozzle, the third
Nozzle is located at the side of the second surface direction and is higher than the first contact cleaning brush, for the second surface and
The first contact cleaning brush provides cleaning solution.
Optionally, in the substrate cleaning machine, the cavity is additionally provided with a discharge outlet and an exhaust outlet, with discharge
Waste liquid and exhaust gas in cleaning process.
In substrate cleaning machine provided by the utility model, in cavity be arranged bearing structure, the first cleaning member with
And second cleaning member, position and the exposure first surface and second table of substrate are limited by the bearing structure
Face, and base is cleaned towards the first cleaning member of side and the second cleaning member using first surface and second surface are located at
The first surface and second surface at bottom, so as to realize two surfaces for cleaning substrate in same cleaning chamber.Using institute
Substrate cleaning machine is stated, the first surface can be rinsed using first cleaning member in the cavity same
When, also the second surface is scrubbed using second cleaning member, avoids shifting between different cleaning chamber
The process on two surfaces is cleaned, scavenging period can be so significantly reduced, improves cleaning efficiency.
Detailed description of the invention
Fig. 1 is substrate cleaning machine side view provided by the embodiment of the utility model.
Fig. 2 is substrate-loading schematic diagram provided by the embodiment of the utility model.
Description of symbols:
10- substrate cleaning machine；11- cavity；12- discharge outlet；13- exhaust outlet；14- substrate；15- deionized water；20-
One cleaning member；21- liquid is passed through mouth；22- gas is passed through mouth；23- first jet；The second cleaning member of 30-；31- first connects
Touch cleaning brush；32- third nozzle；40- bearing structure；41- support rod；42- second nozzle；43- the second contact cleaning brush.
Specific embodiment
It is carried out below in conjunction with specific embodiment of the schematic diagram to the substrate cleaning machine of the utility model more detailed
Description.According to following description, will be become apparent from the advantages of substrate cleaning machine with feature in the utility model.It should be noted that attached
Figure is all made of very simplified form and using non-accurate ratio, only to convenient, lucidly aid illustration is originally practical new
The purpose of type embodiment.
Hereinafter, term " first " " second " etc. is used between similar element distinguish, and is not necessarily for retouching
State certain order or time sequencing.It is appreciated that in the appropriate case, these terms so used are replaceable.
With the development of semiconductor technology, the integrated level of semiconductor devices is higher and higher, the cleaning requirement to substrate surface
Also higher and higher.Currently, the substrate is needed by two cleaning chamber and is reversed twice, greatly increase cleaning when
Between, and keep cleaning process more complicated.
In order to reduce the scavenging period of the substrate, and the production capacity of substrate cleaning machine is promoted, the utility model provides
A kind of new substrate cleaning machine, for substrate carry out wet-cleaning, the substrate have each other relative first surface and
Second surface.Fig. 1 is substrate cleaning machine side view provided by the embodiment of the utility model, as shown in Figure 1, the substrate is cleaned
Board 10 includes: cavity 11, the bearing structure 40 being set in the cavity 11, and the bearing structure 40 is for limiting the base
The position at bottom 14 simultaneously exposes the first surface and the second surface；The first cleaning member being set in the cavity 11
20, first cleaning member 20 includes moveable first jet 23, and first cleaning member 20 is located at first table
Facing towards side；The second cleaning member 30 being set in the cavity 11, second cleaning member 30 include removable
The first contact cleaning brush 31, second cleaning member 30 is located at the second surface towards side.
Bearing structure 40, the first cleaning member 20 and the second cleaning member 30 is arranged in the utility model in cavity 11,
The position of substrate 14 is limited by the bearing structure 40 and exposes the first surface and the second surface, and utilizes difference
Positioned at first surface and second surface towards the of the first cleaning member 20 of side and the second cleaning member 30 cleaning substrate 14
One surface and second surface, so as to realize two surfaces for cleaning substrate 14 in same cleaning chamber 11.Using described
Substrate cleaning machine 10 can be rinsed the first surface using first cleaning member 20 in the cavity 11
While, also the second surface is scrubbed using second cleaning member 30, is avoided in different cleaning chamber 11
Between two surfaces of transfer cleaning process, can so be significantly reduced scavenging period, improve cleaning efficiency.
Specifically, the substrate 14 also has positioned at the side of the first surface and the second surface junction.Fig. 2
For substrate-loading schematic diagram provided by the embodiment of the utility model, as shown in Fig. 2, in one embodiment, the bearing structure
40 include multiple support rods 41, and the circumferential setting that the multiple support rod 41 is surrounded along the side of the substrate 14 is described more
A support rod 41 is by stopping the side of the substrate 14 to limit the position of the substrate 14.Further, the multiple branch
Strut 41 collectively constitutes a transmission mechanism, the transmission mechanism by the rotation of the multiple support rod 41 make the substrate 14 with
The perpendicular bisector of the first surface is axis rotation；The bearing structure 40 includes at least two support rods 41, preferably described
Bearing structure 40 includes three support rods 41.In another embodiment, the bearing structure 40 and the substrate 14
Side can also be contacted by a conveyer belt, and the conveyer belt can be using the perpendicular bisector of the first surface as the center of circle, be formed
One section of circular arc conveyer belt, the angle of the circular arc is 30 °~180 °；Preferably, a groove is formed in the conveyer belt, it is described
Substrate 14 is placed in the groove.The conveyer belt is for driving the substrate 14 using the perpendicular bisector of the first surface as axis
Rotation.
Further, the substrate cleaning machine 10 further include: the second contact cleaning being set in the cavity 11
Brush 43, the second contact cleaning brush 43 is located at the side of the side direction, to scrub the side of the substrate 14.It is described
Second contact cleaning brush 43 can be set in any position in the circumferential direction that the side of the substrate 14 is surrounded, and described second
43 position of contact cleaning brush can be motionless, is rotated by the substrate 14, to make the second contact cleaning brush 43 certainly
360 ° of side of the dynamic cleaning substrate 14.
In the present embodiment, the first contact cleaning brush 31 can move, and the first contact cleaning brush 31
The second surface is scrubbed at work, can be shunk when not working to store the first contact cleaning brush 31.Specifically,
In embodiment provided by the utility model, when work described in the first contact cleaning brush 31 can be towards the second surface
Any movement is carried out, the moving range of the first contact cleaning brush 31 can preferably be greater than or equal to the second surface
Areal extent, so as to clean whole positions of the second surface.In one embodiment, the first contact cleaning
Brush 31 can be mobile towards any direction, such as upwards, downwards, to the left, to the right, forward or backward etc., but no matter described first connects
How touch cleaning brush 31 moves, and the first contact cleaning brush 31 can scrub the second surface when working.
Further, second cleaning member 30 further include: third nozzle 32, the third nozzle 32 are located at described the
The side of two surface directions is simultaneously higher than the first contact cleaning brush 31, for contacting to the second surface and described first
Formula cleaning brush 31 provides cleaning solution.The third nozzle 32 cleans described in the uppermost spray of the first contact cleaning brush 31
Liquid, the first contact cleaning brush 31 is scrubbed on the second surface for being sprayed with the cleaning solution, to clean
State second surface.
In one embodiment, first cleaning member 20 further includes that liquid is passed through mouth 21 and gas is passed through mouth 22, institute
It states liquid and is passed through mouth 21 for being passed through deionized water 15 (deionized water, abbreviation DIW) etc., the deionized water 15 is
It is bordering on pure water obtained from the impurity in ionized state removed in water as ion exchange resin, is commonly used in cleaning in semiconductor
The substrates such as wafer 14；The gas is passed through mouth 22 for being passed through the gas that nitrogen or inert gas etc. are not easy to react.The liquid
It is passed through deionized water 15 that mouth 21 is passed through and the gas is passed through the nitrogen that mouth 22 is passed through and is sprayed by the first jet 23.Its
In, the first jet 23 is aerial fog nozzle, and the first jet 23 can be the nozzle comprising multiple small spray holes, and it is sprayed
The direction spilt fans out, and the first jet 23 is used to carry out aerosol cleaning to the first surface, as shown in Figure 1, this
The aerosol of the sprinkling of first jet 23 described in embodiment can be 15 aerosol of deionized water.
Further, first cleaning member 20 can be moved arbitrarily at work, first cleaning member 20
Moving range can preferably be greater than or equal to the areal extent of the first surface, so as to clean the complete of the first surface
Portion position.In one embodiment, first cleaning member 20 can be mobile towards any direction, for example, upwards, downwards, to
It is left, to the right, forward or backward etc., but no matter how first cleaning member 20 moves, the side of first cleaning member 20
To constant, i.e., the described first jet 23, the liquid are passed through mouth 21 and gas be passed through mouth 22 direction it is constant, and first spray
Sprinkling direction when mouth 23 works is always towards the first surface.
In the present embodiment, the substrate cleaning machine 10 further include: be set to right above the side of the substrate 14
Second nozzle 42, the second nozzle 42 be used for the first surface, the second surface and the side provide go from
Sub- water 15 (deionized water, abbreviation DIW) solution.The second nozzle 42 is also possible to comprising multiple small spray holes
Spray head, and the direction of its sprinkling fans out, as shown in Figure 1, therefore its spraying range is wider.In one embodiment,
If the deionized water 15 of the first surface or the second surface is insufficient, one or more second nozzles can be added
42 only spray the first surface or the second surface.First surface described in individually cleaning or described second are needed if it exists
The case where surface, then can respectively install one towards the top of side and the top of the second surface towards side in the first surface
A second nozzle 42, and control respectively the first surface towards side top and the second surface towards side top
The second nozzle 42.Preferably, the second nozzle 42 can move, and can rotate it and spray direction.
In the present embodiment, the cavity 11 is additionally provided with a discharge outlet 12 and an exhaust outlet 13, and the discharge outlet 12 is used
Waste liquid (cleaning solution and deionized water 15 etc.) in discharge cleaning process, the exhaust outlet 13 is for being discharged in cleaning process
Exhaust gas (nitrogen and/or inert gas etc.).
To sum up, substrate cleaning machine provided by the utility model, by the way that bearing structure, the first cleaning section are arranged in cavity
Part and the second cleaning member limit position and the exposure first surface and described second of substrate by the bearing structure
Surface, and cleaned using first surface and second surface are located at towards the first cleaning member of side and the second cleaning member
The first surface and second surface of substrate, so as to realize two surfaces for cleaning substrate in same cleaning chamber.It utilizes
The substrate cleaning machine can in the cavity be rinsed the first surface using first cleaning member
Meanwhile also the second surface is scrubbed using second cleaning member, it avoids turning between different cleaning chamber
The process for moving two surfaces of cleaning can so be significantly reduced scavenging period, improve cleaning efficiency.
Illustrate the principle and effect of the utility model to being given for example only property of above-described embodiment, not for limiting this reality
With novel.Any person of ordinary skill in the field can be to this reality under the spirit and scope without prejudice to the utility model
Any type of equivalent replacement or modification etc. are made with the technical solution of novel exposure and technology contents to change, and are still fallen within practical
Within novel protection scope.
Claims (10)
1. a kind of substrate cleaning machine, for carrying out wet-cleaning to substrate, the substrate has each other relative first surface
And second surface characterized by comprising
Cavity；And
It is set to the intracorporal bearing structure of the chamber, the first cleaning member and the second cleaning member, wherein the bearing structure
For limiting the position of the substrate and exposing the first surface and the second surface, first cleaning member includes can
Mobile first jet, first cleaning member are located at the side of the first surface direction, the second cleaning member packet
Moveable first contact cleaning brush is included, second cleaning member is located at the side of the second surface direction.
2. substrate cleaning machine as described in claim 1, which is characterized in that the substrate also has positioned at the first surface
With the side of the second surface junction, the bearing structure includes multiple support rods, and the multiple support rod is along the base
The circumferential setting that the side at bottom is surrounded, the multiple support rod is by stopping the side of the substrate to limit the substrate
Position.
3. substrate cleaning machine as claimed in claim 2, which is characterized in that the multiple support rod collectively constitutes a driver
Structure, the transmission mechanism turn the substrate with the perpendicular bisector axis of the first surface by the rotation of the multiple support rod
It is dynamic.
4. substrate cleaning machine as claimed in claim 3, which is characterized in that the bearing structure includes at least two branch
Strut.
5. substrate cleaning machine as claimed in claim 2, which is characterized in that further include: it is set to the chamber intracorporal second
Contact cleaning brush, the second contact cleaning brush is located at the side of the side direction, to scrub the side of the substrate.
6. substrate cleaning machine as described in claim 1, which is characterized in that the first jet is aerial fog nozzle, described the
One nozzle is used to carry out aerosol cleaning to the first surface.
7. substrate cleaning machine as claimed in claim 6, which is characterized in that first cleaning member further includes that liquid is passed through
Mouth and gas are passed through mouth, and the liquid is passed through mouth and is passed through mouth for being passed through nitrogen for being passed through deionized water, the gas.
8. substrate cleaning machine as claimed in claim 2, which is characterized in that further include: it is set to right above the substrate
Second nozzle, the second nozzle are used to provide deionized water to the first surface, the second surface and the side.
9. substrate cleaning machine as described in claim 1, which is characterized in that second cleaning member further include: third spray
Mouth, the third nozzle are located at the side of the second surface direction and are higher than the first contact cleaning brush, be used for institute
It states second surface and the first contact cleaning brush provides cleaning solution.
10. substrate cleaning machine as described in claim 1, which is characterized in that the cavity is additionally provided with a discharge outlet and one
Exhaust outlet, with the waste liquid and exhaust gas being discharged in cleaning process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920196484.XU CN209298082U (en) | 2019-02-14 | 2019-02-14 | Substrate cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920196484.XU CN209298082U (en) | 2019-02-14 | 2019-02-14 | Substrate cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209298082U true CN209298082U (en) | 2019-08-23 |
Family
ID=67643068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920196484.XU Expired - Fee Related CN209298082U (en) | 2019-02-14 | 2019-02-14 | Substrate cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209298082U (en) |
-
2019
- 2019-02-14 CN CN201920196484.XU patent/CN209298082U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190823 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |