CN208637388U - A kind of protective plate of wafer cleaning equipment - Google Patents
A kind of protective plate of wafer cleaning equipment Download PDFInfo
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- CN208637388U CN208637388U CN201821392952.2U CN201821392952U CN208637388U CN 208637388 U CN208637388 U CN 208637388U CN 201821392952 U CN201821392952 U CN 201821392952U CN 208637388 U CN208637388 U CN 208637388U
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- wafer
- protective plate
- face
- cleaning solution
- fluid injector
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Abstract
The utility model provides a kind of protective plate of wafer cleaning equipment, comprising: cleaning sprayer, cleaning sprayer include gas nozzle face and fluid injector face；Wherein, fluid injector bread contains for several fluid injectors to the upper surface of wafer spraying cleaning solution, gas nozzle bread is containing several gas nozzles for cleaning solution to be atomized, and projection of the cleaning solution through being atomized in the upper surface of wafer at least covers the radius of wafer.Expand the range of atomized flow of cleaning solution, reduces cleaning solution consumption, shorten processing time, improve wafer cleanliness, reduce production cost, improve product yield and product turnout amount.
Description
Technical field
The utility model belongs to semiconductor manufacturing facility technical field, is related to a kind of protective plate of wafer cleaning equipment.
Background technique
The manufacturing process of wafer generally includes all multi-process such as photoetching, ion implanting, etching, heat treatment, vapor deposition.?
Carry out concerned process steps after, such as to wafer carry out photoetching after, need to clean wafer, to remove on crystal column surface
Impurity.According to statistics, wafer cleaning technique accounts for about the 20%~30% of whole wafer manufacturing process.If insufficient to wafer cleaning,
So that crystal column surface residual impurity, then in subsequent processing, it is possible to damage wafer, lead to wafer loss.
Traditional wafer cleaning equipment uses wet bench equipment, can handle several batches of wafers simultaneously in same processing procedure,
But wet bench equipment processing time is longer, in order to shorten the processing time of wet bench equipment, has used at present
Single wafer cleaning equipment, to replace traditional wet bench equipment.
Fig. 1 and Fig. 2 is please referred to, structural schematic diagram and the existing wafer for being shown as existing single wafer cleaning equipment are clear
Wash the structural schematic diagram of the protective plate in equipment.The wafer cleaning equipment includes base station 110, workbench 210, chemicals cup
410, protective plate 510, fluid reservoir 610 and air accumulator 710.Wherein, the workbench 210 above base station 110 is for carrying
And absorption wafer 310, and wafer 310 is driven to be rotated；Chemicals cup 410 surrounds base station 110, to stop by wafer 310
The cleaning solution that edge splashes；Protective plate 510 include a fluid injector 611 and a gas nozzle 711, fluid injector 611 be used for
The upper surface of wafer 310 sprays cleaning solution, and gas nozzle 711 is for the cleaning solution sprayed from fluid injector 611 to be atomized.
It is shown in Fig. 1, after the effect of gas nozzle 711, the distribution pattern 612 and gas of the cleaning solution formed above wafer 310
Body is distributed pattern 712.As shown in fig. 1, due to the fluid injector being located on protective plate 510 in single wafer cleaning equipment
611 and gas nozzle 711 design, the distribution pattern 612 and gas of the cleaning solution formed above wafer 310 are distributed pattern
712 are in the form of a column the upper surface for being sprayed at wafer 310.For the cleaning effect for reaching the upper surface to wafer 310, the protective plate 510
Structure cleaning solution consumption is increased, processing time is opposite extends and the upper surface of wafer 310 is caused not wash clean clearly
Defect eventually leads to the problems such as the production cost increases, product yield declines and product turnout amount reduces.
It can be seen that the structure of the protective plate in existing wafer cleaning equipment there will naturally be defect, provide a kind of novel
Wafer cleaning equipment protective plate, cleaned with the upper surface to wafer, while solving in existing wafer cleaning equipment
The consumption of cleaning solution caused by the structure of protective plate is high, processing time is long, the sordid defect of wafer cleaning, is produced into reducing
Originally, product yield and product turnout amount are improved, it has also become this field technical problem urgently to be resolved.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of wafer cleaning equipments
Protective plate, for solving in the prior art due to the fault of construction of the protective plate in wafer cleaning equipment, caused is a series of
The above problem.
In order to achieve the above objects and other related objects, the utility model provides a kind of protective plate of wafer cleaning equipment,
The protective plate includes:
Cleaning sprayer, the cleaning sprayer include gas nozzle face and fluid injector face；Wherein, the fluid injector bread
Containing for the upper surface of wafer spraying cleaning solution several fluid injectors, the gas nozzle bread contain for will it is described clearly
Several gas nozzles that washing lotion is atomized, and the cleaning solution through being atomized the upper surface of the wafer projection at least
Cover the radius of the wafer.
Optionally, the gas nozzle face and fluid injector face include one of plane and curved surface or combination.
Optionally, the longitudinal section pattern of the cleaning sprayer includes anti-" V " font, the model of the angle of described anti-" V " font
It encloses including 95~145 °
Optionally, the fluid injector face includes N number of, wherein N >=2, and N number of fluid injector face has phase similar shape
Looks.
Optionally, including 2 fluid injector faces, and it is symmetrical along the gas nozzle face.
Optionally, the fluid injector equidistantly distributed, and there is identical pattern.
Optionally, the gas nozzle equidistantly distributed, and there is identical pattern.
Optionally, the protective plate further includes laminar flow hood air outlet.
Optionally, the protective plate further includes fluid purification portion.
As described above, the protective plate of the wafer cleaning equipment of the utility model, has the advantages that and 1) passes through cleaning
Spray head increases the contact surface between cleaning solution and the upper surface of wafer so that expanding the range of atomized flow of cleaning solution during processing procedure
Product reduces cleaning solution consumption and shortens processing time；2) by the laminar flow hood air outlet being located on protective plate, wafer is improved
The cleanliness of upper surface；3) by fluid purification portion, convenient for being purified to the chemicals cup in wafer cleaning equipment.
Detailed description of the invention
Fig. 1 is shown as the structural schematic diagram of wafer cleaning equipment in the prior art.
Fig. 2 is shown as the structural schematic diagram of protective plate in the prior art.
Fig. 3 is shown as the structural schematic diagram of the protective plate in the utility model.
Fig. 4 is shown as the structural schematic diagram of one of the utility model cleaning sprayer.
Fig. 5 is shown as the structural schematic diagram of the wafer cleaning equipment in the utility model.
Fig. 6 is shown as the schematic cross-sectional view in Fig. 3 along A-A '.
Fig. 7 is shown as the distribution signal for the cleaning solution that the cleaning sprayer in the utility model is formed in the upper surface of wafer
Figure.
Component label instructions
110,100 base station
210,200 workbench
310,300 wafer
410,400 chemicals cup
510,500 protective plate
610,600 fluid reservoir
611,601 fluid injector
612, the distribution pattern of 822,832 cleaning solutions
710,700 air accumulator
711,701 gas nozzle
712 gases are distributed pattern
800 cleaning sprayers
810 gas nozzle faces
811 gas nozzles
820 first fluid injector faces
821,831 fluid injector
830 second liquid nozzle faces
900 laminar flow hood air outlets
111 fluid purification portions
Specific embodiment
The embodiments of the present invention is illustrated by particular specific embodiment below, those skilled in the art can be by this
Content disclosed by specification understands other advantages and effect of the utility model easily.
Fig. 3 is please referred to Fig. 7.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to
Cooperate the revealed content of specification, so that those skilled in the art understands and reads, is not intended to limit the utility model
Enforceable qualifications, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or size
Adjustment, in the case where not influencing the effect of the utility model can be generated and the purpose that can reach, should all still fall in the utility model
Revealed technology contents obtain in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", " left side ",
The term on " right side ", " centre " and " one " etc. is merely convenient to being illustrated for narration, rather than enforceable to limit the utility model
Range, relativeness are altered or modified, under the content of no substantial changes in technology, enforceable when being also considered as the utility model
Scope.
As shown in figure 3, the utility model provides a kind of protective plate 500 of wafer cleaning equipment, the protective plate 500 is wrapped
Include: cleaning sprayer 800, the cleaning sprayer 800 include gas nozzle face and fluid injector face；Wherein, the fluid injector face
Comprising for several fluid injectors to the upper surface of wafer spraying cleaning solution, the gas nozzle bread contains for will be described
Several gas nozzles that cleaning solution is atomized, and the cleaning solution through being atomized the upper surface of the wafer projection extremely
The radius of the wafer is covered less.The pattern of the cleaning sprayer 800 include it is rodlike, those skilled in the art can also be according to specific
Demand selects the specific pattern of the cleaning sprayer 800, herein with no restriction.
As the further embodiment of the embodiment, the gas nozzle face and fluid injector face include in plane and curved surface
One kind or combination；The fluid injector face may include N number of, wherein N >=2, and N number of fluid injector face has phase similar shape
Looks.
Specifically, as shown in figure 3, illustrating the structural schematic diagram of the protective plate in the present embodiment.The protective plate 500
Include 1 gas nozzle face 810 and 2 fluid injector faces including cleaning sprayer 800 described in cleaning sprayer 800, i.e.,
First fluid injector face 820 and second liquid nozzle face 830, first fluid injector face 820 and second liquid nozzle face 830
For providing cleaning solution to the upper surface of the wafer, the gas nozzle face 810 is used for will be via first fluid injector
The cleaning solution atomization that face 820 and second liquid nozzle face 830 spray, and the cleaning solution through being atomized is in the wafer
The projection of upper surface at least covers the radius of the wafer, so as to expand between the cleaning solution and the upper surface of the wafer
Contact area, reduce the cleaning solution consumption and shorten processing time.For convenient for preparation, the fluid injector face is preferably
With identical pattern, specific pattern, number and the distribution in the gas nozzle face and fluid injector face, herein with no restriction, such as
It only include 1 gas nozzle face and 1 fluid injector face, or comprising described in 1 gas nozzle face and encirclement
The fluid injector face of 4 of gas nozzle face, as shown in Figure 4.
As the further embodiment of the embodiment, the longitudinal section pattern of the cleaning sprayer 800 includes anti-" V " font,
The range of the angle of described anti-" V " font includes 95~145 °.
Specifically, such as Fig. 6, cleaning sprayer 800 described in Fig. 3 is illustrated along the schematic cross-sectional view of A-A ', it is described clear
Spray head 800 is washed to be encircled by first fluid injector face 820, gas nozzle face 810 and 830 groups of second liquid nozzle face, and
First fluid injector face 820, gas nozzle face 810 and second liquid nozzle face 830 are all made of relatively simple planar shaped
Looks, first fluid injector face 820 and second liquid nozzle face 830 have identical pattern and along the gas nozzle faces 810
It is symmetrical, so that the longitudinal section pattern of the cleaning sprayer 800 is anti-" V " font, to improve the cleaning solution meeting
Range of atomized flow while, reduce and prepare the process complexity of the cleaning sprayer 800.It sprays in first fluid injector face 820
The cleaning solution applied forms the distribution pattern 822 of cleaning solution, second liquid via the effect in the gas nozzle face 810
The cleaning solution that body nozzle face 830 sprays forms the distribution pattern of cleaning solution via the effect in the gas nozzle face 810
832, therefore the range of atomized flow of the cleaning solution can be expanded.
As the further embodiment of the embodiment, the range of the angle of described anti-" V " font includes 95~145 °, thus
Be conducive to further increase the atomizing effect of the cleaning solution, reduce the difficulty being atomized to the cleaning solution.In the present embodiment, by
The model for the angle that first fluid injector face 820 and second liquid nozzle face 830 and the gas nozzle face 810 are formed
Preferably 120 ° are enclosed, in another embodiment, the angle can also be other angles, herein with no restriction.
As the further embodiment of the embodiment, the protective plate 500 further includes that laminar flow hood air outlet 900 and liquid are net
Change portion 111, the laminar flow hood air outlet 900 include in nitrogen air outlet, carbon dioxide air outlet and inert gas air outlet
A kind of or combination, the projection of the fluid purification portion 111 in the horizontal direction exceed the edge of the wafer.
Specifically, as shown in figure 3, the laminar flow hood air outlet 900 is located on the surface of the protective plate 500, preferably
Center in the protective plate 500, the cleanliness of the upper surface for improving wafer 300；The fluid purification portion 111 is located at
The edge of the protective plate 500, the projection of the preferably described fluid purification portion 111 in the horizontal direction exceed the side of the wafer
Edge, the fluid purification portion 111 may include fluid purification portion spout, so that when the wafer cleaning equipment is in standby shape
When state, the scavenging solution including hot deionized water sprayed from fluid purification portion spout can directly carry out chemicals cup net
Change, effectively to clean the chemicals cup.The type in the laminar flow hood air outlet 900 and the fluid purification portion 111, number,
Pattern and specific distribution, herein with no restriction.In the present embodiment, the protective plate 500 is due to being the knot in existing protective plate
It is improved in structure, therefore can still retain original fluid injector 601 and gas nozzle 701, in another embodiment, it can not also wrap
Include the fluid injector 601 and gas nozzle 701.
In Fig. 5, the structural schematic diagram of the wafer cleaning equipment in the utility model, the wafer cleaning equipment packet are illustrated
Include base station 100, workbench 200, chemicals cup 400, fluid reservoir 600, air accumulator 700 and the protective plate 500.Wherein, position
For the workbench 200 above the base station 100 for carrying and adsorbing the wafer 300, the workbench 200 can
The wafer 300 is prevented including the suction tray with stomata or groove in order to which the wafer 300 is adsorbed and discharged
Landing causes fragment；The workbench 200 can also drive the wafer 300 to be rotated, to promote the cleaning solution equal
The even upper surface for being sprayed at the wafer 300.The upper surface of the chemicals cup 400 exceeds the upper surface of the wafer 300,
To the cleaning solution for stopping to be splashed by 300 edge of wafer, to prevent the cleaning solution from setting to the wafer cleaning
Standby pollution.The protective plate 500 is located at the top of the wafer 300, is connected with the fluid reservoir 600 and air accumulator 700,
It is corresponding described clear for being provided to first fluid injector face 820, gas nozzle face 810 and second liquid nozzle face 830
Gas needed for washing lotion and the atomization cleaning solution.The cleaning solution through being atomized is preferably wafer 300 described in uniform fold
Radius and range above, and after the rotation through the workbench 200 so that the upper surface of the wafer 300 uniformly coats mist
The cleaning solution changed, to be cleaned to the upper surface of the wafer 300, to increase the cleaning solution and the wafer
Contact area between 300 upper surface reduces the cleaning solution consumption and shortens processing time.
As an example, first fluid injector face 820 and second liquid nozzle face 830 separately include 2~30 liquid
Nozzle 821 and 831,821 and 831 equidistantly distributed of fluid injector, and there is identical pattern.The fluid injector 821 and
831 include sulfate liquid nozzle, hydrochloric acid fluid injector, nitric acid fluid injector, hydrogen peroxide liquid nozzle, liquid HF acid nozzle
And one of deionized water fluid injector or combination.
Specifically, the cleaning solution being located in the fluid reservoir 600 is sprayed at institute through the fluid injector 821 and 831
It the upper surface for stating wafer 300 can be to the upper surface of the wafer 300 when the fluid injector 821 and 831 equidistantly distributed
Spray the uniform cleaning solution.Institute according to the type of the impurity of the upper surface of the wafer 300, in the fluid reservoir 600
State cleaning solution may include in sulfuric acid, hydrochloric acid, nitric acid, hydrogen peroxide, hydrofluoric acid and deionized water one in or combine, therefore to prolong
The service life of the long cleaning sprayer 800, the fluid injector 821 and 831 can be selected according to the type of the cleaning solution, be wrapped
It includes sulfate liquid nozzle, hydrochloric acid fluid injector, nitric acid fluid injector, hydrogen peroxide liquid nozzle, liquid HF acid nozzle and goes
One of ionized water fluid injector or combination.Fluid injector 821 described in the present embodiment and 831 number are both preferably 10
A, the Cross Section Morphology of the fluid injector 821 and 831 is all selected as circle, in another embodiment, the fluid injector 821 and
831 number, pattern, type and distribution, those skilled in the art select according to specific needs, herein with no restriction.
As an example, the gas nozzle face 810 include 2~30 gas nozzles 811, and the gas nozzle 811 it
Between there is identical pattern and equidistantly distributed.
Specifically, in the present embodiment, the surface of the gas nozzle 811 in the gas nozzle face 810 and institute
The upper surface for stating wafer 300 is parallel, and the gas in the air accumulator 700 is through the gas nozzle 811 to described
The upper surface of wafer 300 is sprayed, so that spraying in first fluid injector face 820 and second liquid nozzle face 830
Cleaning solution atomization out can provide uniform when equidistantly distributed between the gas nozzle 811 to the cleaning solution
The gas, to form the cleaning solution of equally distributed atomization.The type of the gas nozzle 811 can be according to the storage
The type of the gas in gas tank 700 is selected, herein with no restriction.Of gas nozzle 811 described in the present embodiment
Number is 10, and the Cross Section Morphology of the gas nozzle 811 is all circle, in another embodiment, of the gas nozzle 811
Number, pattern, type and distribution, those skilled in the art select according to specific needs, herein with no restriction.
In Fig. 5 and Fig. 7, the distribution schematic diagram of the cleaning solution formed in the upper surface of the wafer 300, warp are illustrated
The projection of the cleaning solution of atomization in the horizontal direction covers the radius of the wafer 300, thus clear described in further expansion
The range of atomized flow of washing lotion increases the contact area between the cleaning solution and the upper surface of the wafer 300, reduces the cleaning
Liquid consumption and shortening processing time.
In conclusion 1) protective plate of the circle cleaning equipment of the utility model, has the advantages that through cleaning spray
Head increases the contact surface between cleaning solution and the upper surface of wafer so that can expand the range of atomized flow of cleaning solution during processing procedure
Product reduces cleaning solution consumption and shortens processing time；2) by the laminar flow hood air outlet being located on protective plate, wafer is improved
The cleanliness of upper surface；3) by fluid purification portion, convenient for being purified to the chemicals cup in wafer cleaning equipment.So
The utility model effectively overcomes various shortcoming in the prior art and has high industrial utilization value.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (9)
1. a kind of protective plate of wafer cleaning equipment, which is characterized in that the protective plate includes:
Cleaning sprayer, the cleaning sprayer include gas nozzle face and fluid injector face；Wherein, the fluid injector bread is containing use
In several fluid injectors to the upper surface of wafer spraying cleaning solution, the gas nozzle bread contains for by the cleaning solution
Several gas nozzles being atomized, and projection of the cleaning solution through being atomized in the upper surface of the wafer at least covers
The radius of the wafer.
2. the protective plate of wafer cleaning equipment according to claim 1, it is characterised in that: the gas nozzle face and liquid
Nozzle face includes one of plane and curved surface or combination.
3. the protective plate of wafer cleaning equipment according to claim 1, it is characterised in that: the longitudinal section of the cleaning sprayer
Pattern includes anti-" V " font, and the range of the angle of described anti-" V " font includes 95~145 °.
4. the protective plate of wafer cleaning equipment according to claim 1, it is characterised in that: the fluid injector face includes N
It is a, wherein N >=2, and N number of fluid injector face has identical pattern.
5. the protective plate of wafer cleaning equipment according to claim 4, it is characterised in that: including 2 fluid injectors
Face, and it is symmetrical along the gas nozzle face.
6. the protective plate of wafer cleaning equipment according to claim 1, it is characterised in that: the fluid injector equidistantly divides
Cloth, and there is identical pattern.
7. the protective plate of wafer cleaning equipment according to claim 1, it is characterised in that: the gas nozzle equidistantly divides
Cloth, and there is identical pattern.
8. the protective plate of wafer cleaning equipment according to claim 1, it is characterised in that: the protective plate further includes laminar flow
Cover air outlet.
9. the protective plate of wafer cleaning equipment according to claim 1, it is characterised in that: the protective plate further includes liquid
Purification portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821392952.2U CN208637388U (en) | 2018-08-27 | 2018-08-27 | A kind of protective plate of wafer cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821392952.2U CN208637388U (en) | 2018-08-27 | 2018-08-27 | A kind of protective plate of wafer cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208637388U true CN208637388U (en) | 2019-03-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821392952.2U Active CN208637388U (en) | 2018-08-27 | 2018-08-27 | A kind of protective plate of wafer cleaning equipment |
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| Country | Link |
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| CN (1) | CN208637388U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112786492A (en) * | 2020-12-30 | 2021-05-11 | 上海至纯洁净系统科技股份有限公司 | Spraying equipment for wafer cleaning and wafer cleaning method |
| CN112845298A (en) * | 2020-12-31 | 2021-05-28 | 至微半导体(上海)有限公司 | Nitrogen protection cleaning method for nano wafer product |
-
2018
- 2018-08-27 CN CN201821392952.2U patent/CN208637388U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112786492A (en) * | 2020-12-30 | 2021-05-11 | 上海至纯洁净系统科技股份有限公司 | Spraying equipment for wafer cleaning and wafer cleaning method |
| CN112845298A (en) * | 2020-12-31 | 2021-05-28 | 至微半导体(上海)有限公司 | Nitrogen protection cleaning method for nano wafer product |
| CN112845298B (en) * | 2020-12-31 | 2022-07-15 | 至微半导体(上海)有限公司 | Nitrogen protection cleaning method for nano wafer product |
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