CN209282188U - A kind of diode package structure with electro-magnetic screen function - Google Patents
A kind of diode package structure with electro-magnetic screen function Download PDFInfo
- Publication number
- CN209282188U CN209282188U CN201920097630.3U CN201920097630U CN209282188U CN 209282188 U CN209282188 U CN 209282188U CN 201920097630 U CN201920097630 U CN 201920097630U CN 209282188 U CN209282188 U CN 209282188U
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- Prior art keywords
- conductive pin
- insulation
- electro
- magnetic screen
- package structure
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model system provides a kind of diode package structure with electro-magnetic screen function, including insulating base and insulation-encapsulated body, cathode conductive pin and anode conductive pin are equipped between insulating base and insulation-encapsulated body, being conductively connected in cathode conductive pin has diode wafer, the anode of diode wafer is connected by conducting wire with anode conductive pin, and metallic shield and protection insulating cover are successively arranged on insulation-encapsulated body；The top of insulation-encapsulated body is equipped with n locating slot, the bottom of one of locating slot is communicated with earth lug, earth lug is connected with cathode conductive pin, insulating ceramics block is equipped between earth lug and diode wafer, metallic shield includes shielding cover board and n shielding side plate, it shields in side plate insertion locating slot, one of shielding side plate is connected with earth lug.The utility model has good electromagnetic shielding performance, and electromagnetic armouring structure is connected with reliable insulation protection structure, can be avoided and cause short circuit.
Description
Technical field
The utility model relates to diodes, specifically disclose a kind of diode package structure with electro-magnetic screen function.
Background technique
Diode is a kind of electronic device that can unidirectionally conduct electric current, is equipped with PN junction inside diode, the two of PN junction
End is equipped with lead terminal, if having the unilateral conductivity of electric current according to the direction of applied voltage, most of diode is had
Current direction we be normally referred to as rectification function.
SOD is a kind of surface-pasted packing forms, there are two pin is set.Diode package mainly includes diode core
Piece, positive and negative anodes conductive pin and packaging body, main body of the packaging body as chip diode can effectively ensure integrally-built
Stability.Chip diode is usually used in integrated circuit, can there is signal interference, chip diode work between each electric device
The interference by other electric devices is easy when making, it is also possible to the normal work of other electric devices can be interfered.
Utility model content
Based on this, it is necessary to be directed to prior art problem, provide a kind of diode package knot with electro-magnetic screen function
Structure has good electromagnetic shielding performance, can effectively ensure that applied electronic product can work normally.
To solve prior art problem, the utility model discloses a kind of diode package knot with electro-magnetic screen function
Structure, including insulating base and insulation-encapsulated body are equipped with non-touching negative conductive and draw between insulating base and insulation-encapsulated body
Foot and anode conductive pin, being conductively connected in cathode conductive pin has diode wafer, and the anode of diode wafer passes through conducting wire
It is connected with anode conductive pin conduction, metallic shield and protection insulating cover is successively arranged on insulation-encapsulated body, protects insulating cover
Cover the top and side of metallic shield；
The top of insulation-encapsulated body is equipped with n locating slot, and n is the integer greater than 1, the bottom connection of one of locating slot
Have earth lug, the bottom of earth lug is connected with cathode conductive pin conduction, earth lug and diode wafer it
Between be equipped with insulating ceramics block, metallic shield includes shielding cover board and n shielding side plate, shield side plate and be inserted into locating slot,
In a shielding side plate be connected with earth lug conduction.
Further, it shields between side plate and earth lug and is connected with conductive silver glue-line.
Further, be connected with conductive connected structure between conducting wire and anode conductive pin, conducting wire and diode wafer it
Between be also connected with conductive connected structure.
Further, conductive connected structure includes soldering tin block, is equipped with several reinforcement copper particles in soldering tin block.
Further, conducting wire is gold thread, copper wire or alloy wire.
Further, metallic shield is aluminium shielding case.
Further, protection insulating cover is heat conductive silica gel lid.
The utility model has the following beneficial effects: the utility model discloses a kind of diode package with electro-magnetic screen function
Special electromagnetic armouring structure is arranged in structure, can eliminate the electromagnetic signal of interference, has good electromagnetic shielding performance, can
Avoid other electronic components in diode or institute's application product by electromagnetic interference, to effectively ensure applied electronic product
It can work normally, electromagnetic armouring structure is connected with reliable insulation protection structure, can be avoided electromagnetic armouring structure to other
Route causes short circuit, in addition, the process operation of overall package structure is simple, processing cost is lower.
Detailed description of the invention
Fig. 1 is the overlooking structure diagram of the utility model.
Fig. 2 is that the utility model removes the stereochemical structure signal after insulation-encapsulated body, metallic shield and protection insulating cover
Figure.
Fig. 3 is the schematic diagram of the section structure of the utility model A-A ' along Fig. 1.
Appended drawing reference are as follows: insulating base 10, insulation-encapsulated body 20, locating slot 21, earth lug 22, conductive silver glue-line
23, cathode conductive pin 31, anode conductive pin 32, diode wafer 40, conducting wire 41, insulating ceramics block 42, conduction are connected
Structure 43, soldering tin block 431 reinforce copper particle 432, metallic shield 50, shielding cover board 51, shielding side plate 52, protection insulating cover 60.
Specific embodiment
For the feature, technological means and specific purposes achieved, function that can further appreciate that the utility model, below
The utility model is described in further detail in conjunction with attached drawing and specific embodiment.
Referring to figs. 1 to Fig. 3.
The utility model embodiment discloses a kind of diode package structure with electro-magnetic screen function, including insulating base
10 and insulation-encapsulated body 20, non-touching cathode conductive pin 31 and just is equipped between insulating base 10 and insulation-encapsulated body 20
Pole conductive pin 32, cathode conductive pin 31 and anode conductive pin 32 are all set on insulating base 10, and are all located at absolutely
In the bottom of edge packaging body 20, cathode conductive pin 31 and anode conductive pin 32 have one end to be pierced by insulation-encapsulated body 20
Outside, being conductively connected in cathode conductive pin 31 has diode wafer 40, the cathode and cathode conductive pin 31 of diode wafer 40
It is weldingly connected, the anode of diode wafer 40 is connected by conducting wire 41 with 32 conduction of anode conductive pin, on insulation-encapsulated body 20
It is successively arranged metallic shield 50 and protection insulating cover 60, protection insulating cover 60 covers the top and side of metallic shield 50,
That is the projected area of protection insulating cover 60 in the horizontal plane is greater than the projected area of metallic shield 50 in the horizontal plane, Neng Gouyou
Effect avoids metallic shield 50 from contacting other electronic components in institute's applying electronic product, to avoid inside electronic product
Short circuit occurs for circuit structure；
The top of insulation-encapsulated body 20 is equipped with n locating slot 21, and n is integer greater than 1, i.e. n minimum 2, one of them
The bottom of locating slot 21 is communicated with earth lug 22, i.e. the top of earth lug 22 is arranged through the bottom of locating slot 21,
The bottom of earth lug 22 is connected with 31 conduction of cathode conductive pin, is equipped between earth lug 22 and diode wafer 40
Insulating ceramics block 42, insulating ceramics block 42, which can be avoided, occurs short circuit between earth lug 22 and diode wafer 40, simultaneously
The radiating efficiency of diode wafer 40 can be effectively improved, the working performance of diode wafer 40 is improved, metallic shield 50 wraps
Shielding cover board 51 and n shielding side plate 52 are included, shielding side plate 52 is inserted into locating slot 21, and setting locating slot 21 can facilitate installation
Metallic shield 50 can effectively simplify the step of encapsulating structure is processed, to improve processing efficiency, reduce processing cost, wherein
One shielding side plate 52 is connected with 22 conduction of earth lug, and diode wafer 40 is positioned close to the one of earth lug 22
Side, can effectively improve effect of 40 side of diode wafer to shielding, and metallic shield 50 is negative by the connection of earth lug 22
Pole conductive pin 31 can effectively ensure that the electromagnetic interference signal on metallic shield 50 can be effectively eliminated.
Special electromagnetic armouring structure is arranged in the utility model, can eliminate the electromagnetic signal of interference, has good electricity
Magnetic shield performance can avoid other electronic components in diode or institute's application product by electromagnetic interference, to effectively ensure institute
The electronic product of application can work normally, and electromagnetic armouring structure is connected with reliable insulation protection structure, can be avoided electromagnetism
Shielding construction causes short circuit to All other routes, in addition, the process operation of overall package structure is simple, processing cost is lower.
In the present embodiment, it shields between side plate 52 and earth lug 22 and is connected with conductive silver glue-line 23, conductive silver glue
With good electrical and thermal conductivity performance and adhesive property, shielding side plate 52 and earth lug 22, while energy can be effectively connected
It is enough effectively to ensure to shield the conductive communication performance between side plate 52 and earth lug 22, metallic shield 50 can be effectively improved
Effectiveness.
In the present embodiment, be connected with conductive connected structure 43 between conducting wire 41 and anode conductive pin 32, conducting wire 41 with
Also conductive connected structure 43 is connected between diode wafer 40, can effectively improve conducting wire 41 respectively with diode wafer 40 and
The stability of connection structure between anode conductive pin 32.
Based on the above embodiment, conductive connected structure 43 includes soldering tin block 431, is equipped with several reinforcement copper in soldering tin block 431
Particle 432, soldering tin block 431 are used for connecting wire 41 and diode wafer 40 or connecting wire 41 and anode conductive pin 32,
The hardness for reinforcing copper particle 432 is larger, can effectively improve the integrally-built fastness of conductive connected structure 43.
In the present embodiment, conducting wire 41 is gold thread, copper wire or alloy wire, and cost is relatively low for copper wire, the electric conductivity of gold thread
By force, the mechanical performance of alloy wire is strong.
In the present embodiment, metallic shield 50 is aluminium shielding case, and aluminum metal has good electromagnetic shielding performance.
In the present embodiment, protection insulating cover 60 is heat conductive silica gel lid, and heat conductive silica gel has good heating conduction, insulation
Performance and cushion performance, can further increase the radiating efficiency of overall package structure, while can be improved package body structure
Crashworthiness.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (7)
1. a kind of diode package structure with electro-magnetic screen function, including insulating base (10) and insulation-encapsulated body (20),
It is characterized in that, being equipped with non-touching cathode conductive pin between the insulating base (10) and the insulation-encapsulated body (20)
(31) and anode conductive pin (32), being conductively connected on the cathode conductive pin (31) has diode wafer (40), and described two
The anode of pole pipe chip (40) is connected by conducting wire (41) with the anode conductive pin (32) conduction, the insulation-encapsulated body
(20) metallic shield (50) and protection insulating cover (60) are successively arranged on, the protection insulating cover (60) covers the metal screen
Cover the top and side of cover (50)；
The top of the insulation-encapsulated body (20) is equipped with n locating slot (21), and n is the integer greater than 1, one of them described positioning
The bottom of slot (21) is communicated with earth lug (22), the bottom of the earth lug (22) and the cathode conductive pin
(31) conductive to be connected, insulating ceramics block (42) are equipped between the earth lug (22) and the diode wafer (40), institute
Stating metallic shield (50) includes shielding cover board (51) and n shielding side plate (52), and shielding side plate (52) insertion is described fixed
In position slot (21), one of them described shielding side plate (52) is connected with the earth lug (22) conduction.
2. a kind of diode package structure with electro-magnetic screen function according to claim 1, which is characterized in that described
Conductive silver glue-line (23) are connected between shielding side plate (52) and the earth lug (22).
3. a kind of diode package structure with electro-magnetic screen function according to claim 1, which is characterized in that described
It is connected between conducting wire (41) and the anode conductive pin (32) conductive connected structure (43), the conducting wire (41) and described two
Also the conductive connected structure (43) is connected between pole pipe chip (40).
4. a kind of diode package structure with electro-magnetic screen function according to claim 3, which is characterized in that described
Conductive connected structure (43) includes soldering tin block (431), and several reinforcement copper particles (432) are equipped in the soldering tin block (431).
5. a kind of diode package structure with electro-magnetic screen function according to claim 1, which is characterized in that described
Conducting wire (41) is gold thread, copper wire or alloy wire.
6. a kind of diode package structure with electro-magnetic screen function according to claim 1, which is characterized in that described
Metallic shield (50) is aluminium shielding case.
7. a kind of diode package structure with electro-magnetic screen function according to claim 1, which is characterized in that described
Protecting insulating cover (60) is heat conductive silica gel lid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920097630.3U CN209282188U (en) | 2019-01-21 | 2019-01-21 | A kind of diode package structure with electro-magnetic screen function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920097630.3U CN209282188U (en) | 2019-01-21 | 2019-01-21 | A kind of diode package structure with electro-magnetic screen function |
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| Publication Number | Publication Date |
|---|---|
| CN209282188U true CN209282188U (en) | 2019-08-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920097630.3U Active CN209282188U (en) | 2019-01-21 | 2019-01-21 | A kind of diode package structure with electro-magnetic screen function |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110752205A (en) * | 2019-09-03 | 2020-02-04 | 江西驰宇光电科技发展有限公司 | Shielding structure and shielding method of photodiode based on laser gyroscope |
| CN110808240A (en) * | 2019-10-31 | 2020-02-18 | 北京燕东微电子有限公司 | Package-on-package structure and method for manufacturing the same |
| CN113851447A (en) * | 2021-09-23 | 2021-12-28 | 先之科半导体科技(东莞)有限公司 | Schottky diode without gold wire and manufacturing method thereof |
-
2019
- 2019-01-21 CN CN201920097630.3U patent/CN209282188U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110752205A (en) * | 2019-09-03 | 2020-02-04 | 江西驰宇光电科技发展有限公司 | Shielding structure and shielding method of photodiode based on laser gyroscope |
| CN110752205B (en) * | 2019-09-03 | 2021-07-20 | 江西驰宇光电科技发展有限公司 | Shielding structure and shielding method of photodiode based on laser gyroscope |
| CN110808240A (en) * | 2019-10-31 | 2020-02-18 | 北京燕东微电子有限公司 | Package-on-package structure and method for manufacturing the same |
| CN113851447A (en) * | 2021-09-23 | 2021-12-28 | 先之科半导体科技(东莞)有限公司 | Schottky diode without gold wire and manufacturing method thereof |
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| CP03 | Change of name, title or address |
Address after: Room 103, building 1, No.76, Baiye Road, Liaobu Town, Dongguan City, Guangdong Province 523430 Patentee after: Xianzhike semiconductor technology (Dongguan) Co.,Ltd. Address before: No. 18, Baiye Avenue, shangtun Industrial Zone, Liaobu Town, Dongguan City, Guangdong Province, 523430 Patentee before: Zhongzhi Semiconductor Technology (Dongguan) Co.,Ltd. |