CN209281425U - Optical finger print chip-packaging structure under a kind of screen - Google Patents
Optical finger print chip-packaging structure under a kind of screen Download PDFInfo
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- CN209281425U CN209281425U CN201822171810.XU CN201822171810U CN209281425U CN 209281425 U CN209281425 U CN 209281425U CN 201822171810 U CN201822171810 U CN 201822171810U CN 209281425 U CN209281425 U CN 209281425U
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- glass
- finger print
- chip
- packaging structure
- optical finger
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Abstract
The utility model discloses optical finger print chip-packaging structures under a kind of screen comprising glass, the upper surface of glass are equipped with light shield layer, and light shield layer is equipped with several through-holes, and a micro lens is equipped in each through-hole, and the lower surface of glass is equipped with supporting element；Optical sensor chip is connect by supporting element with glass, and cavity is equipped between glass, and the upper surface of optical sensor chip is equipped with weld pad, and the lower surface of optical sensor chip is equipped with the rewiring layer being electrically connected with weld pad.Optical finger print chip-packaging structure is simple under the screen of the utility model, it is easy to assembly, it is by being arranged light shield layer in the upper surface of glass, setting accommodates the through-hole of several micro lens on light shield layer, supporting element is equipped in the lower surface of glass to connect with optical sensor chip, it is big to solve single camera lens volume, the big problem of package thickness.Package thickness is substantially reduced, the growth requirement that nowadays smart machine is increasingly lightening can be met.
Description
Technical field
The utility model relates to technical field of biometric identification, in particular to optical finger print chip-packaging structure under a kind of screen.
Background technique
With the development of communication technology, mobile terminal is just being widely used in daily life and work.Currently,
Fingerprint identification device is both provided in mobile terminal, be unlocked by fingerprint recognition, password setting etc. all multioperations.In fingerprint
In identification device, capacitance type fingerprint identification device and optical fingerprint identification device are two kinds of more common fingerprint identification devices.
Optical finger print chip is the core component of fingerprint identification device, is set to below terminal screen, it can be achieved that concealed
Optical finger print function.The encapsulating structure of existing optical finger print chip has the following problems: structure is complicated, and assembling is inconvenient, and big
Mostly using single camera lens, when assembling, needs to be arranged bracket and is supported to camera lens, since single camera lens volume itself is larger, then plus
Upper bottom portion bracket, causes package thickness big, is not able to satisfy the growth requirement that nowadays smart machine (such as mobile phone) is increasingly lightening.
Utility model content
In view of the deficiencies of the prior art, the utility model aim, which is to provide, is to provide that a kind of structure is simple, assembling side
Just optical finger print chip-packaging structure, adopts the following technical scheme that under screen
Optical finger print chip-packaging structure under a kind of screen comprising:
Glass, the upper surface of the glass are equipped with light shield layer, and the light shield layer is equipped with several through-holes, sets in each through-hole
There is a micro lens, the lower surface of the glass is equipped with supporting element；
Optical sensor chip is connect by the supporting element with the glass, and cavity, institute are equipped between the glass
The upper surface for stating optical sensor chip is equipped with weld pad, and the lower surface of the optical sensor chip is equipped with to be electrically connected with the weld pad
Rewiring layer.
The rewiring layer is equipped with several tin balls, the flexible circuit board as a further improvement of the utility model,
It is welded by the tin ball and optical sensor chip.
The supporting element is cofferdam as a further improvement of the utility model, and the cofferdam is pressed together on the weld pad.
The micro lens arrays setting, the height of the micro lens are 1- as a further improvement of the utility model,
100um, diameter 5-1000um, the spacing between micro lens are 10-10000um.
The upper surface or/and lower surface of the glass are additionally provided with filter layer as a further improvement of the utility model,.
The upper surface or/and lower surface of the glass are additionally provided with antireflection layer as a further improvement of the utility model,.
It as a further improvement of the utility model, further include flexible circuit board, the flexible circuit board is set to the light
It learns below induction chip and is electrically connected with the rewiring layer.
The lower surface of the flexible circuit board is equipped with reinforcing chip as a further improvement of the utility model,.
It as a further improvement of the utility model, further include light shield layer, the light shield layer is set to the glass and optics
The side of induction chip.
The bracket and terminal screen are Nian Jie by glue as a further improvement of the utility model, the bracket and
Glass is bonded by glue.
The utility model has the beneficial effects that
Optical finger print chip-packaging structure is simple under the screen of the utility model, easy to assembly, passes through the upper table in glass
Light shield layer is arranged in face, and setting accommodates the through-hole of several micro lens on light shield layer, is equipped with supporting element and light in the lower surface of glass
Induction chip connection is learned, it is big to solve single camera lens volume, the big problem of package thickness.Package thickness is substantially reduced, can be expired
The sufficient nowadays increasingly lightening growth requirement of smart machine.
The above description is merely an outline of the technical solution of the present invention, in order to better understand the skill of the utility model
Art means, and being implemented in accordance with the contents of the specification, and in order to allow the above and other purpose, feature of the utility model
It can be more clearly understood with advantage, it is special below to lift preferred embodiment, and attached drawing is matched, detailed description are as follows.
Detailed description of the invention
Fig. 1 is the overall structure diagram for shielding lower optical finger print chip-packaging structure in the utility model embodiment one；
Fig. 2 is the partial structural diagram for shielding lower optical finger print chip-packaging structure in the utility model embodiment one；
Fig. 3 is the overall structure diagram for shielding lower optical finger print chip-packaging structure in the utility model embodiment two；
Fig. 4 is the partial structural diagram for shielding lower optical finger print chip-packaging structure in the utility model embodiment two；
Fig. 5 is the overall structure diagram for shielding lower optical finger print chip-packaging structure in the utility model embodiment three；
Fig. 6 is the partial structural diagram for shielding lower optical finger print chip-packaging structure in the utility model embodiment three；
Fig. 7 is the machining sketch chart of micro lens and optical sensor chip in the utility model embodiment one to three.
Description of symbols: 10, glass；11, bracket；12, filter layer；13, light shield layer；14, micro lens；15, cofferdam；20, eventually
Hold screen；30, optical sensor chip；31, induction region；32, weld pad；33, layer is rerouted；34, tin ball；40, flexible circuit board；
41, reinforcing chip；50, light shield layer.
Specific embodiment
The utility model is described in further detail in the following with reference to the drawings and specific embodiments, so that those skilled in the art
The utility model may be better understood and can be practiced, but illustrated embodiment is not as the restriction to the utility model.
It as shown in Figs. 1-2, is optical finger print chip-packaging structure under the screen in the present embodiment one, optical finger print core under the screen
Chip package includes glass 10, is set to 20 lower section of terminal screen and can be connect by bracket 11 with terminal screen 20, glass 10
Upper surface be equipped with light shield layer 13, light shield layer 13 is equipped with several through-holes, and a micro lens 14, micro lens are equipped in each through-hole
14 for changing light route, help to be imaged., the lower surface of glass 10 is equipped with supporting element, it is preferred that supporting element is cofferdam
15。
Specifically, several through-holes array on light shield layer 13 is arranged, i.e., 14 array of micro lens is arranged, the bottom of micro lens 14
Shape is round or rectangular.Preferably, the bottom shape of micro lens 14 is circle, and the height of micro lens 14 is 1-100um, diameter
For 5-1000um, the spacing between micro lens 14 is 10-10000um.Preferably, the thickness of light shield layer 13 is generally 0.1um-
20um.The manufacture craft of light shield layer 13 can be vapor deposition, silk-screen printing, rotary coating, spraying, the single technique such as semiconductor lithography
Or the compound realization of kinds of processes.
Preferably, glass 10 with a thickness of 0.1-1.5mm, the upper surface or/and lower surface of glass 10 are additionally provided with filter layer
12, the main function of filter layer 12 is the light for filtering out special wavelength range, and the light of its all band can be entered.Preferably,
The upper surface or/and lower surface of glass 10 are additionally provided with antireflection layer, for reducing light in the reflection at 10 interface of glass, increase light
Amount of incident.
Optical finger print chip-packaging structure further includes optical sensor chip 30 under the screen, and optical sensor chip 30 passes through cofferdam
15 connect with glass 10, and cavity is equipped between glass 10, and the upper surface of optical sensor chip 30 is equipped with 31 He of induction region
Weld pad 32, the lower surface of optical sensor chip 30 are equipped with the rewiring layer 33 being electrically connected with weld pad 32.Preferably, cofferdam is pressed
It closes on weld pad 32, the height in cofferdam 15 is generally 5-500um, and the material in cofferdam 15 can be photosensitive-ink, dry film, glass,
Silicon substrate, organic substrate etc..
Preferably, optical finger print chip-packaging structure further includes flexible circuit board 40 under the screen, is set to optical sensor chip
30 lower sections are simultaneously electrically connected with layer 33 is rerouted.The lower surface of flexible circuit board 40 is equipped with reinforcing chip 41.Preferably, layer is rerouted
33 are equipped with several tin balls 34, and flexible circuit board 40 is welded by tin ball 34 and optical sensor chip 30, tin ball 34 can facilitate with
The welding of flexible circuit board 40.
Optical finger print chip-packaging structure further includes light shield layer 50 under the screen, and light shield layer 50 is set to glass 10 and optical sensor
The side of chip 30 prevents side light from penetrating and enters inside optical sensor chip 30.
Preferably, bracket 11 is Nian Jie by glue with terminal screen 20, and bracket 11 is Nian Jie by glue with glass 10.
Preferably, the back side of optical sensor chip 30 carries out silicon face by way of mechanical lapping thinned, makes target silicon
Thickness is reduced between 50um-300um, and is exposed weld pad 15 by techniques such as photoetching and dry etchings, the exposure of weld pad 15
Mode is multi-step structure, as shown in Figs. 1-2, and completes to reroute layer 33 by photoetching, wet etching process, by weld pad signal
It draws, the production of tin ball 34 is finally completed on rerouting layer 33.
As shown in Figure 3-4, for optical finger print chip-packaging structure under the screen in the present embodiment two, the area with embodiment one
It is not, the exposure chamber of weld pad 15 is separate unit stage structure.It is all low packaging cost scheme with embodiment one, but to collection
Want high at the requirement of circuit design.
As seen in figs. 5-6, for optical finger print chip-packaging structure under the screen in the present embodiment three, the area with embodiment one
It is not, the exposure chamber of weld pad 15 is single hole arrangements.Its packaging cost is relatively high, but the requirement to IC design
It is low.
Specifically encapsulating structure of the selection example one into embodiment three can be required according to different encapsulation.Embodiment one is to reality
The encapsulating structure thickness in example three is applied in 0.5-0.8mm, greatly reduces the occupancy for shielding lower design space.
As shown in fig. 7, the encapsulation of micro lens 14 and optical sensor chip 30 is all made of big machining process, divide again after the completion
It is cut into single small unit, the mode of cutting can be break bar machine cuts, or laser cutting, and more meeting mass production needs
It asks.
Optical finger print chip-packaging structure is simple under the screen of the utility model, easy to assembly, passes through the upper table in glass
Light shield layer is arranged in face, and setting accommodates the through-hole of several micro lens on light shield layer, is equipped with supporting element and light in the lower surface of glass
Induction chip connection is learned, it is big to solve single camera lens volume, the big problem of package thickness.Package thickness is substantially reduced, can be expired
The sufficient nowadays increasingly lightening growth requirement of smart machine.
Above embodiments are only preferred embodiments for fully illustrating the utility model, the guarantor of the utility model
It is without being limited thereto to protect range.Those skilled in the art made equivalent substitute or transformation on the basis of the utility model,
It is within the protection scope of the utility model.The protection scope of the utility model is subject to claims.
Claims (9)
1. optical finger print chip-packaging structure under a kind of screen characterized by comprising
Glass, the upper surface of the glass are equipped with light shield layer, and the light shield layer is equipped with several through-holes, is equipped with one in each through-hole
The lower surface of a micro lens, the glass is equipped with supporting element；
Optical sensor chip is connect by the supporting element with the glass, and cavity, the light are equipped between the glass
The upper surface for learning induction chip is equipped with weld pad, and the lower surface of the optical sensor chip is equipped with the weight being electrically connected with the weld pad
Wiring layer.
2. as described in claim 1 shield lower optical finger print chip-packaging structure, which is characterized in that the rewiring layer is equipped with
Several tin balls, flexible circuit board are welded by the tin ball and optical sensor chip.
3. as described in claim 1 shield lower optical finger print chip-packaging structure, which is characterized in that the supporting element is cofferdam,
The cofferdam is pressed together on the weld pad.
4. as described in claim 1 shield lower optical finger print chip-packaging structure, which is characterized in that the micro lens arrays are set
It sets, the height of the micro lens is 1-100um, diameter 5-1000um, and the spacing between micro lens is 10-10000um.
5. as described in claim 1 shield lower optical finger print chip-packaging structure, which is characterized in that the upper surface of the glass
Or/and lower surface is additionally provided with filter layer.
6. as described in claim 1 shield lower optical finger print chip-packaging structure, which is characterized in that the upper surface of the glass
Or/and lower surface is additionally provided with antireflection layer.
7. as described in claim 1 shield lower optical finger print chip-packaging structure, which is characterized in that it further include flexible circuit board,
The flexible circuit board is set to the optical sensor beneath chips and is electrically connected with the rewiring layer.
8. as claimed in claim 7 shield lower optical finger print chip-packaging structure, which is characterized in that under the flexible circuit board
Surface is equipped with reinforcing chip.
9. as described in claim 1 shield lower optical finger print chip-packaging structure, which is characterized in that it further include light shield layer, it is described
Light shield layer is set to the side of the glass and optical sensor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822171810.XU CN209281425U (en) | 2018-12-24 | 2018-12-24 | Optical finger print chip-packaging structure under a kind of screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822171810.XU CN209281425U (en) | 2018-12-24 | 2018-12-24 | Optical finger print chip-packaging structure under a kind of screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209281425U true CN209281425U (en) | 2019-08-20 |
Family
ID=67606822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822171810.XU Active CN209281425U (en) | 2018-12-24 | 2018-12-24 | Optical finger print chip-packaging structure under a kind of screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209281425U (en) |
-
2018
- 2018-12-24 CN CN201822171810.XU patent/CN209281425U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215000 Fangqiao Road, Caohu Street, Xiangcheng Economic and Technological Development Zone, Suzhou City, Jiangsu Province, 568 Patentee after: Suzhou Keyang Semiconductor Co., Ltd Address before: 215000 Fangqiao Road, Caohu Street, Xiangcheng Economic and Technological Development Zone, Suzhou City, Jiangsu Province, 568 Patentee before: SUZHOU KEYANG PHOTOELECTRIC TECHNOLOGY CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |