CN209169175U - A kind of LED encapsulation structure with high brightness - Google Patents
A kind of LED encapsulation structure with high brightness Download PDFInfo
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- CN209169175U CN209169175U CN201822032731.0U CN201822032731U CN209169175U CN 209169175 U CN209169175 U CN 209169175U CN 201822032731 U CN201822032731 U CN 201822032731U CN 209169175 U CN209169175 U CN 209169175U
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- red phosphor
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Abstract
The utility model provides a kind of LED encapsulation structure with high brightness, including a metal lead wire frame, the resin filling bed of material is enclosed on the metal lead wire frame, a recessed bowl shape groove is equipped in the middle part of the resin filling bed of material, a blue-light LED chip is provided in the bowl shape groove of the resin filling bed of material, one layer of Red phosphor layer is evenly distributed on the blue-light LED chip, the thickness of the Red phosphor layer is in 0.5mm ~ 1.5mm, one layer of yellow fluorescence bisque is evenly distributed on the Red phosphor layer, the thickness of the yellow fluorescence bisque is in 2 ~ 3mm；The surface of the Red phosphor layer is arc.The utility model improves the brightness of LED.
Description
Technical field
The utility model relates to LED encapsulation technology field, especially a kind of LED encapsulation structure with high brightness.
Background technique
Present technical solution is glimmering using blue chip excitation yellow fluorescent powder and red fluorescence powder, yellow fluorescent powder and red
Light powder random-number distribution is in packaging adhesive material.This mode will cause blue light excitation yellow fluorescent powder after yellow light by red fluorescence
Powder is absorbed, and the reduction of yellow light efficiency is caused, and influences LED luminance reduction.
Summary of the invention
In order to overcome the problems referred above, the purpose of the utility model is to provide a kind of LED encapsulation structures with high brightness, increase
Yellow light efficiency promotes LED overall brightness.
The utility model is realized using following scheme: a kind of LED encapsulation structure with high brightness, including a metal lead wire
Frame, the resin filling bed of material is enclosed on the metal lead wire frame, and it is recessed to be equipped with one in the middle part of the resin filling bed of material
Bowl shape groove is provided with a blue-light LED chip, the blue-light LED chip in the bowl shape groove of the resin filling bed of material
On be evenly distributed with one layer of Red phosphor layer, the thickness of the Red phosphor layer is in 0.5mm ~ 1.5mm, the red fluorescence
One layer of yellow fluorescence bisque is evenly distributed on bisque, the thickness of the yellow fluorescence bisque is in 2 ~ 3mm；The red fluorescence powder
The surface of layer is arc.
Further, the partial size of the red fluorescence powder in the Red phosphor layer is 1um ~ 20um.
Further, the partial size of the yellow fluorescent powder in the yellow fluorescence bisque is 10 ~ 30um.
The utility model has the beneficial effects that: the utility model can allow red fluorescence powder and yellow fluorescent powder to separate
The probability that yellow light is absorbed by red fluorescence powder can be greatly reduced in different zones, mention whole yellow light launching efficiency, so that LED light is whole
Luminance raising.
Detailed description of the invention
Fig. 1 is the schematic diagram of the section structure of the utility model.
Specific embodiment
The utility model is described further with reference to the accompanying drawing.
Refering to Figure 1, the utility model provides a kind of LED encapsulation structure with high brightness, including a metal
Lead frame 1, the metal lead wire frame provide the pin with electrical power contacts for blue LED die；On the metal lead wire frame 1
It is enclosed with the resin filling bed of material 2, is equipped with a recessed bowl shape groove 21 in the middle part of the resin filling bed of material 2, which fills out
Charge layer can safeguard the air-tightness of LED, and be protected from the influence of humidity and temperature in ambient enviroment, and prevent the electricity of LED
Sub-component is generated variation that is damaged and causing component characteristic by mechanical oscillation, impact；The bowl shape of the resin filling bed of material 2
It is provided with a blue-light LED chip 3 in groove 21, one layer of Red phosphor layer 4, institute are evenly distributed on the blue-light LED chip 3
The thickness for stating Red phosphor layer 4 is evenly distributed with one layer of yellow fluorescence on 0.5mm ~ 1.5mm, the Red phosphor layer 4
Bisque 5, the thickness of the yellow fluorescence bisque 5 is in 2 ~ 3mm；The surface of the Red phosphor layer is arc.It can allow in this way
Red fluorescence powder and yellow fluorescent powder are separated in different zones, and the probability that yellow light is absorbed by red fluorescence powder can be greatly reduced, mention
Whole yellow light launching efficiency, so that LED light overall brightness is promoted.
Wherein, Red phosphor layer is to be mixed with red fluorescence powder in packaging plastic and be made, and yellow fluorescence bisque is encapsulation
Yellow fluorescent powder is mixed in glue and is made.The partial size of red fluorescence powder in the Red phosphor layer is 1um ~ 20um.Institute
The partial size for stating the blue colour fluorescent powder in blue phosphor layer is 10 ~ 30um.
In short, the utility model can allow red fluorescence powder and yellow fluorescent powder to separate in different zones, can be greatly reduced
The probability that yellow light is absorbed by red fluorescence powder mentions whole yellow light launching efficiency, so that LED light overall brightness is promoted.
The above is only the preferred embodiment of the present invention, it is all done according to present utility model application the scope of the patents it is equal
Deng variation and modification, it should all belong to the covering scope of the utility model.
Claims (3)
1. a kind of LED encapsulation structure with high brightness, including a metal lead wire frame, it is characterised in that: the metal lead wire
It is enclosed with the resin filling bed of material on frame, is equipped with a recessed bowl shape groove, the tree in the middle part of the resin filling bed of material
Rouge filling the bed of material bowl shape groove in be provided with a blue-light LED chip, be evenly distributed on the blue-light LED chip one layer it is red
The thickness of color phosphor powder layer, the Red phosphor layer is evenly distributed with one on 0.5mm ~ 1.5mm, the Red phosphor layer
Layer yellow fluorescence bisque, the thickness of the yellow fluorescence bisque is in 2 ~ 3mm；The surface of the Red phosphor layer is arc.
2. a kind of LED encapsulation structure with high brightness according to claim 1, it is characterised in that: the red fluorescence
The partial size of red fluorescence powder in bisque is 1um ~ 20um.
3. a kind of LED encapsulation structure with high brightness according to claim 1, it is characterised in that: the yellow fluorescence
The partial size of yellow fluorescent powder in bisque is 10 ~ 30um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822032731.0U CN209169175U (en) | 2018-12-05 | 2018-12-05 | A kind of LED encapsulation structure with high brightness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822032731.0U CN209169175U (en) | 2018-12-05 | 2018-12-05 | A kind of LED encapsulation structure with high brightness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209169175U true CN209169175U (en) | 2019-07-26 |
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ID=67342201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822032731.0U Active CN209169175U (en) | 2018-12-05 | 2018-12-05 | A kind of LED encapsulation structure with high brightness |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209169175U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114578613A (en) * | 2020-11-30 | 2022-06-03 | 优美特创新材料股份有限公司 | Backlight module containing fluorescent powder and quantum dots |
-
2018
- 2018-12-05 CN CN201822032731.0U patent/CN209169175U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114578613A (en) * | 2020-11-30 | 2022-06-03 | 优美特创新材料股份有限公司 | Backlight module containing fluorescent powder and quantum dots |
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